Dr. Prasad Godavarti has over 20 years of experience in process, product, quality and systems engineering for space launch systems, ruggedized products, and aerospace and defense systems. He has led teams in manufacturing management, failure investigations, supplier qualification, and developing mitigation plans for issues like tin whiskers. Dr. Godavarti has held several engineering and management roles with companies like Orbital Sciences Corporation, Honeywell Aerospace, Motorola, and Flip Chip Technologies. He has a PhD in Materials Science and Engineering from Northwestern University.

1. P. Godavarti
Dr. PRASAD S. GODAVARTI
3839 E. Timberline Court
Gilbert, AZ 85297
pgodavarti@yahoo.com
Phone: (480) 306-6173(Home), (480) 584-7839 (Mobile)
OBJECTIVE Provide twenty years of process, product, quality and systems engineering
experience to a high performance organization
ACCOMPLISHMENTS • Manufacturing.
Assembly and Test processes
for Space Launch Systems
and ruggedized products:
MIL-STD-1540, MIl-STD-
810
• Design, production and
test challenges for MDA,
NASA and commercial
products using DFMEA and
Fault-tree tools
• Employed complex
engineering principles,
procedures for complex aircraft
and space systems
• Subject Matter Expert for
Supplier and Process/Product
Qualification for COTS, M
COTS and Mil-Spec electronics
and mechanical products: GMD
PMP requirements, ISO-9001,
IPC and JEDEC standards
• Working with
customers to resolve
technical and
programmatic
challenges
• Patented novel
assembly techniques
for MEMS.
• Quality Process- 8-
D, Ishikawa diagrams,
RCCA
OTHER SKILLS • Project Management
• Earned Valued Costing
• MS Office
• Team Leadership
• Presentations
• Supervision
EXPERIENCE 5/2007-Current InPlay Technologies Inc. Scottsdale, AZ
Manufacturing Manager
• Managed Test Engineering, Quality and Manufacturing high reliability Tablet
PCs and Touch PC products in a start-up environment
• Qualified and manage supply chain, quality, reliability and yield improvement
at contract manufacturers
• Released test methods for optimized product and system performance
7/2006 – 5/2007 Honeywell Aerospace Phoenix, AZ
Staff Engineer: Advanced Manufacturing Engineering
• Developed mitigation plans for identification, inspection and control for Tin
whiskers in aerospace and space hardware that impact systems and product
performance.
• Develop systems based cost models for aircraft engines ensure quality
assurance, systems performance and costs goals are met.
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2. P. Godavarti
• Developed product requirement, design limitations and process capability
models to optimize product costs for coatings, forgings and special processes
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3. P. Godavarti
7/2002 – 7/2006 Orbital Sciences Corporation Chandler, AZ
Senior Principal PM&P Systems Engineer
As Parts, Materials and Process Lead for Orbital –GMD Program, led a team of
technologists to respond to issues of parts (electronic and mechanical),
manufacturing processes and materials on at least two major DoD contracts.
Responsibility also included parts data base management, supplier audits.
• Led several failure investigations on hybrids, EEE parts failures, Printed
Circuit Boards (PCB), PCB assembly (PCBA) and mechanical parts
• Developed and presented technical and programmatic issues to senior
management, customer's chief engineer and the DoD customer.
• Considered as subject matter expert in ablatives coatings, castings, forgings,
RoHS, tin whiskers and PCB and PCBA assembly
• Developed supplier product/process evaluation process for MDA program
• Worked with customer, MDA and other DoD partners to identify service life
issues and developed a accelerated evacuation program
• Developed program milestones, deliverables and budget for upgrading of
MDA hardware to meet quality assurance and systems performance targets.
9/2001 - 7/2002 Magfusion Chandler, AZ
Packaging and Test Specialist
• Led Packaging Design, Manufacturing and Test and Implementation efforts in
a MEMS startup company developing high Speed RF MEMS Devices for
Telecommunications and High Speed Digital Networks.
• Patented low cost packaging schemes for MeMS .
9/2000 - 9/2001 Flip Chip Technologies Phoenix, Az
Senior Member of Technical Staff, Advanced Technology
• Identified, incubated and nurtured several new semiconductor back end
assembly processes (wafer level packaging) aimed at maintaining FlipChip
Technologies' global leadership position as the premier bumping technology.
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9/1997 – 9/2000 Motorola - Semiconductor
Product Sector
Chandler, AZ & Austin,
TX
Principal Engineer
• Responsible for successful implementation of wafer level burn-in known good
die on 5” and 8” wafers
• Led a large cross-function team of technologists and customers to ensure
timely, high-quality product qualification for next generation automotive
electronics..
9/1994 - 9/1997 Motorola-Automotive and
Industrial Electronics Group
Seguin, Texas
Member, Technical Staff, Advanced Processes & Technology Development
• Completed product development of new laser welding assembly processes for
hermetic electronic assemblies for high volume manufacturing.
• Led a large cross-function team of technologists and customers in the project
development phase for lead-free solders.
2/1993 - 9/1994 Orbital Science Corporation,
Launch Services Group
Chandler, AZ
Materials and Process Engineer
• Championed, managed and completed product demonstration project
involving advanced composite manufacturing methods and avionics for next
generation space launch product in six months.
7/1987 - 7/1992 Allied Signal Aerospace Phoenix, AZ, United
States
Senior Materials Engineer
• Completed a $300K DoD sponsored program on advanced titanium alloys for
high performance engine demonstration product.
EDUCATION: Professional: Project Management Diploma, Georgetown University, 2000
Doctorate: 1979 -1983 Ph.D. Materials Science and Engineering, Northwestern
University, Evanston, Ill
Master of Technology: 1977 -1979 Indian Institute of Science, Bangalore, India
Bachelor of Technology: 1972 - 1977, Benaras Hindu University, India
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