This document is a resume for Damone R. Phanavong seeking a position as an innovative manufacturing engineer. It summarizes his experience over 25 years working in manufacturing engineering roles for companies like Benchmark Electronics, Flextronics International, and Venture Manufacturing Services. It highlights his expertise in areas like PCB assembly, process development, lean manufacturing, and problem solving.

1. Damone R. Phanavong
2514 First Hill Circle SW Phone: 256-665-2152
Huntsville, AL. 35803 Email: yam6rider@gmail.com
OBJECTIVE: Innovative Manufacturing Engineer. Profession seeking position with company requires a dynamic,
team oriented, individual to enhance business operations.
SUMMARY:
Diversified manufacturing experience in high mix and low volume production with an extensive
background in manufacturing and years of experience as a process engineer; with proven expertise in
the process industry. Demonstrated success in introducing new products into production, and in
developing, implementing and managing new processes to improve quality and productivity. Hands-on
experience in PCB assembly, machining, and lean manufacturing. Creative analytical problem solver
with excellent team-building skills; excellent interpersonal skills; communication skills both in oral and in
writing.
EDUCATION: Cal Poly State University, San Luis Obispo, CA
Engineering Technology (Electronics) BS March 1993
Heald Institute of Technology, Rancho Cordova, CA
Engineer Technology (Electronics) (AAS) Degree April 1991.
Spokane Community College, Spokane, WA.
Associate Art (AA) Degree in June 1989
WORK
EXPERIENCE: Benchmark Electronics, Huntsville, AL. 04/08 – Present
Sr. Manufacture/Process Engineer – Direct hand-on engineer support of PCB assembly include
leading the development and implementation of products/processes methods and controls in
accordance with quality standards in the most cost effective manner. Implement new NPI, MPI included
equipment selection, Stencil Printer Reflow profile, Wave profile, Selective Solder, Rework process,
and support and maintains of current products. Perform continuous process improvement by
implement new materials, processes, tools, and jigs / fixtures that will increase yield or reduce labor
time.
OTHER RESPONSIBILITIES INCLUDE, BUT MAY NOT BE LIMITED TO, THE FOLLOWING:
 Responsible for all aspects of Manufacturing including, but not limited to; Supporting/Operating
equipment, improving yield and quality, driving material cost reduction and increase efficiency in
all area of manufacture
 Responsible for working with customer Design Engineer to improve manufacturability
 Program and Operate Screen Printer to print solder on PCB and inspect using SPI machine
 Program and Operate Convection Oven/Develop Oven Profile
 Ensure production capacity and processes meet business requirements
 Responsible for Continuous Production Manufacturability Improvements including Corrective
Action and other problems solving methodologies in manufacturing environment
 Write, Evaluate and Control process control production procedures.
 BGA Rework process included equipment selection
 BGA reball process
 BGA underfill process
 Conformal Coating
 Potting
 Process development for new and existing manufacturing technologies
 Suggest and approved DFM processes
 Tooling design and development ;
 Ability to use GC-Prevue,CAD/CAM tools and Gerber editors for tooling, stencils and process
development; SolidWork, 3D printer design
 Knowledge of Agile, ECO implement, BAAN,

2. Damone R. Phanavong
2514 First Hill Circle SW Phone: 256-665-2152
Huntsville, AL. 35803 Email: yam6rider@gmail.com
 ITAR certify for government clearance
Flextronics International, San Jose, CA. 8/04 –4/08
Process Development Engineer- Advanced Assembly Process Technologies.
 Research & Development: Key member of joint research team for Corporate Advanced Assembly
Technologies.
o Global factories capabilities qualification for Equipment, Components and other processes
o Work direct with China, Malaysia, Singapore and Mexico factories to ensure high
productivity and robust processes during process transferred.
o Conducts DOE to optimize manufacturing process.
o Develops assembly work instruction to ensure processes and improve productivity and
quality
o Design special tooling and Jigs for the assemblies as needed.
o Paste qualification and recommendation for factories uses.
 Lead Free Rework Study –Research and develop Lead Free rework for HDPUG (High Density
Package User Group). To determine the capability of rework equipment used to meet a lead-free
profile.
 Development rework profile for various lead-free components, evaluating the effect of the Lead
Free packages and the effect of PCB. Investigate differential temperature on adjacent components
on both Sn/Pb vs Lead-Free rework process. To improving the Lead Free BGA, CSP rework.
 Equipment Qualification – Rework, X-Ray equipments qualification and technology transfer to
Flextronics International factories around the world.
 Underfill Evaluation – Develop a standard rework process for Flip-Chip, CSP, and BGA
application with reworkable underfill and asses the reliability of the packages before and after
rework.
 Rework Process –Develop standard BGA,CSP rework process.
 Designs and qualifies fixtures by running repeatability and reproducibility studies.
Venture Manufacturing Services, Inc., Newark, CA. 12/02 – 8/04
Process/Manufacture Engineer -NPI/MPI. NPI-Mfg Process and Tooling Development. Responsible
for create and development New Products Instructions (NPI) and Manufacture Process Instructions
(MPI). Define requirements and specifications equipment for new products line. Customer feedback on
NPI. Task included, Lead Free implementation, 5DX BGA X-ray inspection Program Development,
Wave Profile, Heller Reflow Profile experience in KIC, ECD MOLE, BGA Rework Profile, Equipment
Standard Procedure, Stencil design order, all other SMT tooling, NPI/MPI, FA report, DFM, Implement
SPC, Six Sigma, Cpk process continues improvement, DE process development, BOM, ECO
verifications and provided day-to-day production support.
 Implemented Equipment Stardard Procedure.
* Training production Operators
* Program and train BGA rework.
* Created and rework SMT process.
COHERENT LASER INC., Auburn Ca. 3/99 – 2002
OEM of Medical devices, Class 2, 3. PCB and final integration Box Build
Engineering, Sr. Assoc. Process Support -NPI. Responsible for the planning, development,
implementation, and maintenance of manufacturing processes and methods development for new and
existing products. Analyst and provide new PCB layout given by R&D Engineer. Ensure the design
meets the DFM requirement for Surface Mount Technology, and ISO 9001, 2. Conduct detailed design
reviews with the appropriate analysis tools (Agile-engineer tooling, doc eco etc.., CAM350-cad, gerber
tooling etc.., Circuit CAM-electronic MPI, machine interface, documentation etc..). Order New PCB,
Stencil, Process Carrier base on Gerber and design CAD given by R&D dept. Using CircuitCam to
created and developed methods for new products. Principal duties and responsibilities was essentially
being drawing board operator for developing new product introduction. Program high-speed pick/place
SMT machine such as (Quad QSP2, Mydata, Ekra Stencil printer, Asymtek, Heller 1800W and

3. Damone R. Phanavong
2514 First Hill Circle SW Phone: 256-665-2152
Huntsville, AL. 35803 Email: yam6rider@gmail.com
created developed reflow profile using KIC, ECD M.O.L.E for all products. Responsible for both
hardware and material issues found during pilots and control builds as well as issues those arise after
the new product is released. Verify Accuracy of all BOM/ECO production release. Maintain a current,
prioritized list of all project issue, status, and owners. Support Surface Mouth Technology and new
product introduction in PCB manufacturing.
COMTEK COMPUTER SYSTEM/HEWLETT PACKARD Co., Roseville, CA. 9/98 - 3/99
Contract Manufacture of PCB Assembly. Assemble High End products for HP and Dell
Computer Server, Service and repair.
Support Technician. Perform troubleshoot and repair Hewlett Packard High-End HP9000 K-class
servers. Verify and confirm customers CPUs return, and debugs system to levels components.
Manually decode HEX decimal to binary to troubleshoot SRAM. Using HP-UNIX Rev 10, 11 to
diagnose the system. Give customer feedback and the status of the boards. Involved developed and
implement new process.
IMAGINE MANUFACTURING SOLUTIONS. Rocklin, CA. 2/98 - 9/98
Contract Manufacture of PCB Assembly. Assemble board for class 2 IPC-A-610, Medicals:
(Coherent, Stryker), Server: (HP,IBM, NEC,), Telecom: (Airespace,Fluke,)
Surface Mount Technology (SMT) Supervisor. Provide general management to skill nonexpexampt
employees. Task included planning production schedules, Productions labor hours, to ensure the timely
completion of all necessary documentation, providing leadership through coaching goal setting and
performance feedback. Responsible for all customer accounts and to ensure all production is in
compliance with the customer schedules. Operated and program the SMT equipment (Fuji, Quad 4c,
Panasonic) using F4G system and Quad program.
PACKARD BELL ELECTRONIC 5/95 - 2/98
OEM - Class 2. PCB assemblies and final integration Box Build. Design and Manufacture to
IPC-A-610 Standard.
Engineer SMT Process Support. Responsible for the planning, development, implementation,
maintenance for mfg. methods, process and program (FUJI, CP6, and IP3) machine for new and
existing products. Managing the designing and maintaining factory processes. Responsible for the
physical control to ensure of all products to support the manufacturing activities. Perform factory
layout, productivity improvements. Support Functional, MDA test.
REFERENCES Available on request