Developed 2D CAD model of flip chip package using Hypermesh
Fatigue analysis using ABAQUS CAE was done, predicting the life of solder balls in completely-filled clean and non-clean flip-chip packages
Assessed and identified the fatigue life of a completely clean model is higher than that of incomplete non-clean model
Diseno en ingenieria mecanica de Shigley - 8th ---HDes
descarga el contenido completo de aqui http://paralafakyoumecanismos.blogspot.com.ar/2014/08/libro-para-mecanismos-y-elementos-de.html
Diseno en ingenieria mecanica de Shigley - 8th ---HDes
descarga el contenido completo de aqui http://paralafakyoumecanismos.blogspot.com.ar/2014/08/libro-para-mecanismos-y-elementos-de.html
Se presenta la solución de varios problemas sobre el análisis de esfuerzos en vigas, normales por flexión y cortante, aplicando los conceptos básicos de la mecánica de materiales
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This presentation is the extension of the first presentation of the same title. It describes the design, mathematically equation, PDF table generation for combustion, simulation, and results of it.
Finite Element Analysis of Skirt to Dished junction in a Pressure VesselIJMER
International Journal of Modern Engineering Research (IJMER) is Peer reviewed, online Journal. It serves as an international archival forum of scholarly research related to engineering and science education.
International Journal of Modern Engineering Research (IJMER) covers all the fields of engineering and science: Electrical Engineering, Mechanical Engineering, Civil Engineering, Chemical Engineering, Computer Engineering, Agricultural Engineering, Aerospace Engineering, Thermodynamics, Structural Engineering, Control Engineering, Robotics, Mechatronics, Fluid Mechanics, Nanotechnology, Simulators, Web-based Learning, Remote Laboratories, Engineering Design Methods, Education Research, Students' Satisfaction and Motivation, Global Projects, and Assessment…. And many more.
Episode 39 : Hopper Design
Problem:
1 -experiments with shear box jenike on a particulate catalyst to give the family
yield locus as in 1. given that the bulk density is 1000 kg/m3 particulates and wall friction angle is 15
a-from design chart silo cone, do design a mass flow hopper for the material.
b-if the average size is 100 um, calculate the discharge flow rate passing through the discharge opening
2 - For the above materials using stainless steel is required to store 1000 tons of particulate in it. Coefficient of friction at the wall is given as 0.45 for each value and the formula that you use the appropriate justify the design.
a - draw the dimensions of the silo you and draw a vertical stress profile and the wall of the silo whole time say powerful particle
b- specify the maximum vertical stress and the wall of the silo you
c - if you use several different approaches in the design you provide appropriate recommendations to your employer for work before the end of the casting device fabrication started.
d - if problems such as the formation of the entrance are available after a certain time interval suggest measures - flow improvement measures to be taken to your employer
SAJJAD KHUDHUR ABBAS
Ceo , Founder & Head of SHacademy
Chemical Engineering , Al-Muthanna University, Iraq
Oil & Gas Safety and Health Professional – OSHACADEMY
Trainer of Trainers (TOT) - Canadian Center of Human
Development
Laser Metal Deposition of Inconel 625 & Rene 80Pratik Saxena
Deposited gradient sample of two superalloys, Inconel 625 and Rene 80 using Directed Laser Deposition
Performed Hot Mounting, Grinding, polishing to improve surface finish and Optical Microscopy for the verification of the grain structure
Performed heat treatment at different temperatures improving the overall structure of the deposited samples
Conducted hardness measurements for each gradient sample using Wilson Rockwell Tester.
Drop Test Simulation on Front, Left Lateral & Right Lateral of GHBMC Head Model was carried out using Hyper mesh, LS-Dyna to replicate test performed at Medical College of Wisconsin.
Rear crush analysis for Fuel Spillage Optimization Pratik Saxena
Optimization for Rear impact under section FMVSS-301. Performed analysis to avoid fueling spillage of 28g in the car model when impacted with a moving deformable barrier model. Performed optimization to reduced fuel spillage by 29%.
Roof Crush Analysis For occupant safety and ProtectionPratik Saxena
Optimization for Roof Crush Analysis under section FMVSS-216. Performed this test on the passenger’s side using Hypermesh and LS-Dyna placed the dummy (Hybrid III 50th percentile), seat, seat belt and side airbag on passenger’s side to perform the analysis. Performed optimization to reduce the chances of injury.
Optimization for Frontal Impact under section FMVSS-208 and IIHS criteria in which analysis carried on Fixed barrier with 100%, 40% collision and small offset rigid barrier with 25% collision. Done simulation to see how well a passenger vehicle would protect its occupants in the event of a serious real-world frontal crash.
Design of Equal Channel Angular Extrusion For Grain Refinement Pratik Saxena
Equal Channel Angular Extrusion Grain refinement by severe deformation and FEA of ECAE deformation was carried out using Hyper mesh, Abaqus for optimization of Billet.
Tasks Performed
Effect of friction on Strain
Effect of die angle on Strain
Effect of Fillet radius on Strain
Effect of Thickness on Strain
The Laboratory experiment was conducted to get hands-on experience in Ultrasonic NDE Method to obtain some indications of the hidden profiles of the samples using A-scan, C-scan methods.
A Pocket AE DAS was used to measure simulated acoustic emissions from two thin plate specimens composed of homogeneous, isotropic materials. The first specimen was made of aluminum, and the second specimen was made of polyethylene. The results of the tests demonstrate not only the practical use of acoustic emission testing but also the effect of the material properties of the specimen on the raw data acquired by the DAS.
Analysis of Bracket for stress performancePratik Saxena
Using Hyper mesh - Optistruct, Bracket was redesigned and meshed. Material & properties were assigned along with loads, load collectors and simulation was carried out to reduced overall stress in the bracket by 10%. Result shows that Von Mises stress of the redesigned bracket reduced from 66.8 to 49.8 when compared to the original model.
Overview of the fundamental roles in Hydropower generation and the components involved in wider Electrical Engineering.
This paper presents the design and construction of hydroelectric dams from the hydrologist’s survey of the valley before construction, all aspects and involved disciplines, fluid dynamics, structural engineering, generation and mains frequency regulation to the very transmission of power through the network in the United Kingdom.
Author: Robbie Edward Sayers
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Hybrid optimization of pumped hydro system and solar- Engr. Abdul-Azeez.pdffxintegritypublishin
Advancements in technology unveil a myriad of electrical and electronic breakthroughs geared towards efficiently harnessing limited resources to meet human energy demands. The optimization of hybrid solar PV panels and pumped hydro energy supply systems plays a pivotal role in utilizing natural resources effectively. This initiative not only benefits humanity but also fosters environmental sustainability. The study investigated the design optimization of these hybrid systems, focusing on understanding solar radiation patterns, identifying geographical influences on solar radiation, formulating a mathematical model for system optimization, and determining the optimal configuration of PV panels and pumped hydro storage. Through a comparative analysis approach and eight weeks of data collection, the study addressed key research questions related to solar radiation patterns and optimal system design. The findings highlighted regions with heightened solar radiation levels, showcasing substantial potential for power generation and emphasizing the system's efficiency. Optimizing system design significantly boosted power generation, promoted renewable energy utilization, and enhanced energy storage capacity. The study underscored the benefits of optimizing hybrid solar PV panels and pumped hydro energy supply systems for sustainable energy usage. Optimizing the design of solar PV panels and pumped hydro energy supply systems as examined across diverse climatic conditions in a developing country, not only enhances power generation but also improves the integration of renewable energy sources and boosts energy storage capacities, particularly beneficial for less economically prosperous regions. Additionally, the study provides valuable insights for advancing energy research in economically viable areas. Recommendations included conducting site-specific assessments, utilizing advanced modeling tools, implementing regular maintenance protocols, and enhancing communication among system components.
HEAP SORT ILLUSTRATED WITH HEAPIFY, BUILD HEAP FOR DYNAMIC ARRAYS.
Heap sort is a comparison-based sorting technique based on Binary Heap data structure. It is similar to the selection sort where we first find the minimum element and place the minimum element at the beginning. Repeat the same process for the remaining elements.
Forklift Classes Overview by Intella PartsIntella Parts
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1. PRATIK SAXENA GD8959
Reliability of Flip-Chip
Packages
INDIVIDUAL PROJECT
ME 7680 MANUFACTURING PROCESSING
MECHANICS
PRATIK SAXENA | GD8959 | April 30, 2017
2. PRATIK SAXENA GD8959
Problem Statement
Individual Project Code: - P9N2
Dimensions of Flip-Chip Package
Flip-Chip Model with dimension
3. PRATIK SAXENA GD8959
Thermal loading cycle:
Cyclic thermal load from -40ᵒ C (233K) to 125ᵒ C (398K)
Properties of Flip-Chip Components
Component MATERIAL PROPERTIES
SILICON CHIP Silicon Isotropic, Elastic with temperature dependent
Coefficient thermal Expansion (CTE).
SUBSTRATE FR-4 Orthotropic, Elastic with constant Coefficient
Thermal Expansion (CTE) in terms of
temperature.
SOLDER Eutectic
Isotropic, Elastic-Plastic (strain rate
BALL
Solder dependent) with temperature dependent
Coefficient Thermal Expansion (CTE).
Alloy
UNDER FILL Epoxy Isotropic, Elastic-Plastic (strain rate
dependent) with temperature dependent
Coefficient Thermal Expansion (CTE).
4. PRATIK SAXENA GD8959
Modelling and Pre-Processing
The Flip-Chipmodel wasmodelledwithappropriate dimensionsinmm, andas the critical regionsare Solder
ball and Underfill,theywere finelymeshedcomparedtootherregions.Also,care wastakenwhile meshing,
such that onlyquadelementswere created.
The elementtype used for modellingwas CPE8 which is Continuum 2nd
order Plain Strain 8 nodded
element.
5. PRATIK SAXENA GD8959
Following is the Procedure involved: -
1. The geometryforbothmodelscompletelyfilledandunfilledwere createdwithappropriate dimensionsin
mm.
2. The ‘mat_milli.inp’file wasimportedandthe propertiesandmaterialswere assignedtoChip,solderballs,
underfillandsubstrate.
3. Meshing- Asmentionedabove 2-DquadmeshwascreatedwithCPE8 elementtype,concentratedmesh
was createdincritical areasand coarse meshin non-concernareasandfor continuitybetweencoarse mesh
and fine meshbiasingandadjustingmeshdensitywasdone.
4. The componentswere nodal equivalence.Andthe elementnormal were adjustedin‘+ve’Z-direction
5. Boundaryconditions- Constraintthe leftvertical side withDOF-1,bottomhorizontal side withDOF-2
6. Appropriate thermal loadcollectorswere createdforapplyingthe thermal loadsof Initialconditionat
230C (296K), and temperature variationfrom - 40oC (233K) tempand 125oC (398k) temp.
7. The loadstepsfordifferentloadingconditionswerecreatedandLoadingwasassignedusingloadstepsto
assignvariationof temperature andcyclicloading.
Step1: Anincrementof 10 overthe periodof 600 secs at temperature of 233 K
Step2: Anincrementof 10 overthe periodof 900 secs at temperature of 398 K
Step3: we againgive the incrementof 10 overthe periodof 900 secsat temperature of 233 K.
8. When we applythese conditionandloadstepswe getthe cyclicthermal loadingforthe flipchipasgiven
inthe problem.
9. The ‘.inp’file wasexportedfromhypermeshandthenimportedtothe Abaqusforanalysis.
10. The same model isrepeatedfornon-cleanmodel.
Cleaned Situation mode
Non-cleaned situation model with gaps in underfill near solder ball.
7. PRATIK SAXENA GD8959
Thus, the values of PEEQ obtained at the end of each step is shown below
Step 1 Solder Ball 1 Solder Ball 2
A 0.00976957 0.00981717
B 0.00655985 0.00975423
C 0.00863323 0.00787514
D 0.00865754 0.00820041
Step 2 Solder Ball 1 Solder Ball 2
A 0.0153944 0.015042
B 0.0097726 0.014954
C 0.0135969 0.012753
D 0.0146645 0.013256
Step 3 Solder Ball 1 Solder Ball 2
A 0.029848 0.0296366
B 0.019861 0.0296587
C 0.027302 0.0283539
D 0.032486 0.0287295
Non-Cleaned Situation Model
STEP 1 - PEEQ Valuesfor solder balls with gap.
STEP 2 - PEEQ Valuesfor solder balls with gap.
8. PRATIK SAXENA GD8959
STEP 3 - PEEQ Valuesfor solder balls with gap.
Thus, the values of PEEQ obtained at the end of each step is shown below
Step 1 Solder Ball 1 Solder Ball 2
A 0.00130356 0.00306766
B 0.00298461 0.00271752
C 0.00310662 0.00236528
D 0.00220359 0.00268751
Step 2 Solder Ball 1 Solder Ball 2
A 0.0017144 0.0040108
B 0.0039505 0.0035083
C 0.0042498 0.0032076
D 0.0030076 0.0036964
Step 3 Solder Ball 1 Solder Ball 2
A 0.0022040 0.00554792
B 0.0055195 0.00434429
C 0.0061759 0.00423043
D 0.0041816 0.00524395
Fatigue Life Analysis
The PEEQ value for complete and incomplete model at three different step condition were calculated at
four corners of the solderball i.e.H, G, E & F to calculate the fatigue life and resultswere tabulated based
on Coffin Manson’s equation.
Solder ball (ABCD) Nomenclature
A B
D C
9. PRATIK SAXENA GD8959
The fatigue life of a flipchip package is given by Coffin- Manson's equation
(N f)
= C
Where,
β= Fatigue ductility exponent(β= 0.51) Nf= Fatigue life
ΔγP
= Appliedplastic/inelastic strain range CP
= Fatigue ductilitycoefficient. (CP
= 1.14)
Applied plastic / inelastic strain range, Δγp
= (value of step 2) – (value at step 1) & (value of step 3) –
(value at step 2) of each of the four corners of the solder ball (H, G, E, F respectively).
Thus, the tabulated values are given below,calculations are done in excel
For Solder Ball 1
FATIGUE LIFE: STEP 2 – STEP 1:
A B C D
Cleaned 33352.43 14161.68 42619.75 29319.48
Non-Cleaned 56409.41 105543.30 75850.34 15124.88
FATIGUE LIFE: STEP 3 – STEP 2:
A B C D
Cleaned 5241.64 10608.54 5817.67 3476.15
Non-Cleaned 4000.38 4077.34 2727.40 7199.17
For Solder Ball 2
FATIGUE LIFE: STEP 2 – STEP 1:
A B C D
Cleaned 38543.01 38908.08 44102.28 41113.60
Non-Cleaned 11059.04 15623.86 13804.57 9691.54
FATIGUE LIFE: STEP 3 – STEP 2:
A B C D
Cleaned 5142.81 5067.58 4512.54 4585.68
Non-Cleaned 4244.97 1401.22 9434.79 4188.68
10. PRATIK SAXENA GD8959
Conclusion:
a) From the above table, it can be inferred that, the fatigue life of completely clean model is
higher than that of incomplete non-clean model. This proves that the non-cleaning model
decreases the mechanical stability and, shortens the life time of flip-chip package
b) The fatigue life is decreased due to the gaps present in the incomplete non-clean model.
Thus, manufacturing defects such as gaps, voids create more plastic/ inelastic strains i.e.
reduces the mechanical stability of the flip chip and reduces the fatigue life of the structure.
c) Since all the four components are having differentmaterials, which have differentcoefficient
of thermal expansion, and as flip chip is subjected to temperature variation it results into
different thermal stresses
d) From the above analysis, it can be inferred that perfect under-fill layers will have good
reliability of flip-packages
e) Though in real world situation it is almost impossible to achieve the ideal completely
filledflipchip package so reducing the manufacturing defects we can increase the
fatigue life of the package.
Reference:
1. Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren and Sheng Liu, Effect of
Manufacturing Induced Defects on The Reliabilityof Flip-ChipPackages,” ASME 1998,
pp.35-42.
2. Class Notes for flip-chip packaging.