Presentacion english 20200714_tfg_sergio_garcia

DISEÑO DE PLACAS DE CIRCUITO IMPRESO
PARA CONVERTIDORES ELECTRÓNICOS DE
POTENCIA BASADO EN EL USO DEL
SOFTWARE ADS
Trabajo fin de grado
Grado en Ingeniería Electrónica Industrial y Automática
2019-2020
AUTOR: Sergio García López
TUTOR: Andrés Barrado Bautista

SERGIO GARCÍA LÓPEZ
DISEÑO DE PLACAS DE CIRCUITO IMPRESO PARA CONVERTIDORES ELECTRÓNICOS DE POTENCIA BASADO EN EL USO DEL SOFTWARE ADS
TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
5. INTERFERENCE COUPLING
6. TECHNIQUES FOR DESIGNING THE LAYOUT OF A PCB
7. PCB DESIGN OF SWITCHING CONVERTERS
8. PLANNING AND BUDGET
9. CONCLUSIONS
10. FURTHER WORK
2

1. INTRODUCTION
3
Motivation and context
Currently, there are many devices and equipment that emit
electromagnetic waves
Poor design = consequences

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
9. CONCLUSIONS
10. FURTHER WORK
4

2. OBJECTIVES
5
• Graphically display the effects of
electromagnetic interferences
• Checking the effect of the measures
taken
Printed circuit boards
Analysis and comparison

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
‒ EMI influence on the environment
‒ EMI studies
‒ Advanced Design System (ADS)
4. EMC INTRODUCTION
9. CONCLUSIONS
10. FURTHER WORK
6

3. STATE OF THE ART
7
EMI influence on the environment
5G Technology
Drones
• Saturation of the electromagnetic spectrum
• More sophisticated electromagnetic emissions
• Increased exposure to electronic warfare
Wi-Fi Networks

3. STATE OF THE ART
8
EMI studies
Mathematical and theoretical studies
EMI/EMC testing
There are different
ways to study
interferences
Graphic interference simulationGraphic interference simulation

3. STATE OF THE ART
9
Advanced Design System (ADS)
Layout
Schematic
Substrate
• Electromagnetic field simulation environment
• Printed circuit board design
• Visual and intuitive
• No need for a physical prototype
• Realistic physics
• Low cost Microwave
FEM

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
‒ Electromagnetic compatibility problems
‒ Electromagnetic interference coupling modes and electromagnetic fields
9. CONCLUSIONS
10. FURTHER WORK
10

4. EMC INTRODUCTION
11
Electromagnetic compatibility problems
• The circuits must not cause interference that
will cause other equipment to malfunction The three essential elements of
an EMC problem
• They must be immune to emissions from other
electronic circuits
• They must not cause interference that affects
their own operation
1 32

4. EMC INTRODUCTION
12
Electromagnetic interference coupling modes and electromagnetic fields
Coupling
mechanisms
Conductive
coupling
Field
coupling
Capacitive coupling
Inductive coupling
Electromagnetic
waves
• Near field
• Far field
The disturbances which affect
electronic equipment are of
different nature

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
‒ Capacitive coupling
‒ Inductive coupling
‒ Common impedance coupling
‒ Antenna effect
9. CONCLUSIONS
10. FURTHER WORK
13

14
Capacitive coupling
• Cause: voltage variation
• Propagation: electric field
• Consequence: unwanted currents in the victim
Schematic
Victim
Source

I_victim
V_victim
0 µA
0 mV
15
Capacitive coupling
High frequency (10 MHz) vs. Low frequency (50 Hz)
10 MHz 50 Hz
V_source V_victim
I_source I_victim500 µA
3 mV
35 mA
5 V

16
Capacitive coupling
Distance increase (10 MHz) and Ground plane (10 MHz)
V_source
I_source
V_victim
I_victim
V_source
I_source
85 µA
1,25 mV
130 µA
2,5 mV
35 mA
5 V
10 MHz10 MHz

17
Capacitive coupling
Electromagnetic
fields
Resume
Increased distance between traces and the
ground plane reduce capacitive coupling
effectively.
constant
magnetic field

18
Inductive coupling
• Cause: current variation
• Propagation: magnetic field
• Consequence: a potential, U, appears in the victim
Schematic
Victim
Source

I_victim
V_victim
0,3 µA
0,022 mV
19
Inductive coupling
10 MHz 50 Hz
V_source V_victim
I_source I_victim7,5 µA
0,6 mV
35 mA
5 V

d
20
Inductive coupling
Loop reduction (10 MHz) and Ground plane (10 MHz)
V_source
I_source
V_victim
I_victim
V_source
I_source
0,5 µA
0,04 mV
0 µA
0 mV
35 mA
5 V
10 MHz10 MHz

21
Inductive coupling
Electromagnetic
fields
Resume
Inner loop reduction and the ground plane
reduce inductive coupling effectively
constant electrical
field

22
Common impedance coupling
• Cause: 2 circuits share same Rload
• Propagation: conduction
• Consequence: voltage drop in the common section
Schematic
Victim
Source

23
V_source
I_source I_victim25 µA35 mA
5 V
3,5 mV V_victim
10 MHz 50 Hz
0,5 mV
5 µA I_victim
V_victim
7,5 mV V_common 1,25 mV V_common

24
Ground plane (10 MHz)
V_source
I_source
V_victim
I_victim
0 µA
0 mV
35 mA
5 V
distributed grounding

25
Electromagnetic fields
Resume
A ground plane and distributed connection
reduces common impedance coupling
effectively

26
Antenna effect
• Cause: the length of a cable is: 𝑙(𝑚) < 10 / 𝑓 (𝑀𝐻𝑧)
• Propagation: electromagnetic field
• Consequence: EMI emission
Schematic

27
Antenna effect
Resistance increase (10 MHz) and Frequency increase
Critical frequency =
66,67 MHz
• variable resistor
• frequency = 10 MHz
• variable frequency
• length = 150 mm

28
Antenna effect
Length increase (100 MHz)
• variable length
• frequency = 100 MHz
Critical length =
100 mm
Resume
For a particular trace length, it is
necessary to limit the resistor and
the operating frequency, in order to
avoid electromagnetic emissions

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
‒ Path of the return current
‒ Cable type analysis evaluating the coupling
‒ Bonding effect
‒ Routing effects
9. CONCLUSIONS
10. FURTHER WORK
29

30
Path of the return current
vs.
path of least resistance
path of least inductance
Case 1
Pista de la corriente de salida por la
fuente
Camino de retorno min. inductancia
Camino de retorno min. resistencia
Case 2
The return current always returns by
the path of least impedance

Fuente
Carga
31
Case 1: Current return path through a ground plane
Microwave
FEM

Camino de
retorno de la
corriente
Camino de
retorno de la
corriente
32
Case 2: Current return path between two traces
Microwave
FEM
The path of least impedance depends on the frequency,
coinciding at low frequencies with the path of least resistance
and at high frequencies with the path of least inductance

33
Cable type analysis evaluating the coupling
Case 1
A flat/ribbon cable consists of many wires
arranged in parallel in the same plane
Case 2
Case 3

34
Case 1: Flat cable with a single ground trace
Case 3: Flat cable with a ground plane
Pines
Cargas
Case 2: Flat cable with pairs grounding traces
Microwave
A flat cable with ground plane improves
the current return path
10 MHz

35
Case 1: Flat cable with a single ground trace
Case 3: Flat cable with a ground plane
Case 2: Flat cable with pairs grounding traces
Microwave
In a flat cable with ground plane the
couplings and EMI emissions are much lower
10 MHz

36
Bonding effect Case 1
𝜆 =
300
𝑓(𝑀𝐻𝑧) × 𝜀 𝑟
Case 2
𝒅 =
𝝀
𝟐𝟎
The bonding effect helps to
reduce unwanted inductances

37
Bonding effect
Case 1: Non-bonded circuit
Case 2: Bonded circuit at a distance d = 23,43 cm
Microwave
Bonds help the current return path
64 MHz

38
Bonding effect
Case 1: Non-bonded circuit
Case 2: Bonded circuit at a distance d = 23,43 cm
Microwave
By adding bonds, EMI emissions are
effectively reduced
64 MHz

39
Routing effects
Case 1
Case 2
There are some recommendations in the
routing that improve the design of PCBs

30 k
40
Routing effects
Case 1: traces are routed too close to antipads, plane splits or edges
Microwave FEM
It is necessary to keep the
traces away from possible
obstacles that interfere with
the current return path

41
Routing effects
Case 2: Splitting and cutoffs in ground plane (stitching capacitors)
Microwave FEM
The stitching capacitor is a
good solution if in the circuit
design it is necessary to
isolate certain areas
I_Stitching = 0 A
I_Stitching = 10 nA
I_Stitching = 30 mA
I_source = 40 mA

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
‒ Buck converter
‒ Flyback converter
9. CONCLUSIONS
10. FURTHER WORK
42

43
Buck converter
• The buck converter keeps an output voltage
lower than the input voltage
• Converter static gain:
𝑉𝑜 = 𝑉𝑒 × 𝐷

44
Buck converter
Buck converter
schematic
Cin Cout
L source

45
Buck converter: basic layout I
Cin
Cout
Microwave
Layout I
Electrical
simulation
Ripple noise = 4,292 Vpp

46
Buck converter: basic layout II
Cin
Cout
Microwave
Layout II
Electrical
simulation

47
Buck converter: basic layout III
Cin Cout
Microwave
Layout III
Electrical
simulation
Ripple noise = 8,773 mVpp

48
Buck converter: routing areas
GND
GND
GND
Cin
Cout
Layout IV Microwave
Electrical
simulation

49
Buck converter: routing areas and ground plane
Cin
Cout
Layout V Microwave
Electrical
simulation

50
Buck converter: routing areas, ground plane and displaced Cout
Cin
Cout
Layout VI Microwave
Electrical
simulation

51
Buck converter: routing areas, ground plane, displaced Cout and bonds
Cin
Cout
Layout VII Microwave
Electrical
simulation

52
Buck converter: electromagnetic fields
Areas
Areas + ground plane
Areas + ground plane + Cout
Areas + ground plane + Cout + bonds
1
electric electricmagnetic magnetic
2
3
4

53
Buck converter: distribution of the energy accumulated by the converter
Areas Areas + ground plane + Cout Areas + ground plane + Cout + bonds

54
Buck converter: resume
• The use of a ground plane greatly reduces ripple noise
• Adding bonds, through the bonding effect, reduces EMI emissions and ripple noise

55
Flyback converter
To maintain the galvanic isolation
offered by this converter, it is
important to separate the transformer
windings in different ground planes

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
‒ Project planning
‒ Budget
9. CONCLUSIONS
10. FURTHER WORK
56

57
Mes 1 Mes 2 Mes 3 Mes 4 Mes 5 Mes 6
0 50 100 150 200 250 300
Concepción del proyecto
Búsqueda de información general
Revisión de manuales sobre ADS
Pruebas 1, con ADS
Pruebas 2, con ADS
Desarrollo de las simulaciones
Depuración de errores
Organización del contenido
Selección de las fuentes de información
Realización de la memoria: fase 1
Realización de la memoria: fase 2
Correción de errores y modificaciones
Horas del proyecto
Documentation
Simulation
Writting
Project planning

58
Budget
9.850,00 €
644,80 €
TOTAL 10.494,80 €
RESUMEN DEL PRESUPUESTO
CAPÍTULO I. COSTE de RECURSOS HUMANOS
CAPÍTULO II. COSTE de SOFTWARE

59
Budget
Human resource costs
Software cost

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
9. CONCLUSIONS
10. FURTHER WORK
60

8. CONCLUSIONS
61
Interference coupling
• Capacitive coupling → maximize distance between traces
• Inductive coupling → use a ground plane
• Common impedance coupling → distributed connection to ground plane
• Antenna effect → evaluate the cable length, its resistance and operation frequency

8. CONCLUSIONS
62
Layout effects
• Current return path → path of least resistance vs. path of least inductance
• Cable type analysis → flat cables with ground plane
• Bonding effect → reduces couplings and inductances
• Routing effects → move obstacles away from traces, use stitching capacitors, and design
with short traces and as wide as possible

8. CONCLUSIONS
63
Switching converters
• Using routing areas
• Using ground plane and adding bonds in GND areas by the bonding effect
• Place the components that improve the distribution of the energy accumulated by the converter
• Flyback case, isolate the transformer windings with two different ground planes

TABLE OF CONTENTS
1. INTRODUCTION
2. OBJECTIVES
3. STATE OF THE ART
4. EMC INTRODUCTION
9. CONCLUSIONS
10. FURTHER WORK
64

10. FURTHER WORK
65
• Experimental testing
• Optimisation of switching converters
• EMI filter design for switching converters

Thank you for your
attention!
Questions …

Presentacion english 20200714_tfg_sergio_garcia

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