The document outlines the basic fabrication steps used in manufacturing integrated circuits: 1) Oxidation grows a silicon dioxide layer on the wafer which functions as an insulator and barrier for diffusion and implantation. Two common oxidation methods are dry and wet oxidation. 2) Lithography coats the wafer with photoresist which is exposed to ultraviolet light to define the geometry of the P-N junction. 3) Diffusion and ion implantation introduce opposite type impurities into the semiconductor to form the P-N junction, either through solid state diffusion or by accelerating impurity ions. 4) Metallization deposits metal films using physical or chemical vapor deposition to form contacts and interconnections, completing the P-N