SPICE MODEL of OSWT5161A , TA=25 degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of RB051L-40 (Standard Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Schottky rectifier diode with part number RB051L-40 from manufacturer ROHM. It describes the PSpice model parameters for the diode and shows simulation results that compare well with measurements of the diode's forward current, reverse breakdown voltage, and junction capacitance characteristics. Simulation error is generally within 5% across all testing conditions.
SPICE MODEL of 5GWJZ47 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 5GWJZ47 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of HRU0203A (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the specifications and simulation results of a Schottky rectifier diode with part number HRU0203A made by Hitachi. It includes the key parameters of the PSpice model, evaluation of the forward current and junction capacitance characteristics through circuit simulation, and comparison of the simulation results to measurements with less than 2% error.
SPICE MODEL of CRG02 (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the specifications and simulation results of a diode component. It includes the part number, manufacturer, and SPICE model parameters. Simulation circuits evaluate the forward current, junction capacitance, and reverse recovery characteristics. Graphs compare the measurement and simulation results, showing good agreement with less than 5% error.
FREE SPICE MODEL of CRG02 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of S5277G (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the specifications and simulation results of a diode component. It includes:
- Component details: Diode part number S5277G from manufacturer Toshiba
- SPICE model parameters used for simulation
- Simulation results comparing forward current, junction capacitance, and reverse recovery characteristics to measurements
- Reverse recovery simulation showing less than 0.1% error between measured and simulated reverse recovery time
SPICE MODEL of D2S6M (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of D2S6M (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version
ishttp://www.spicepark.com by Bee Technologies.
SPICE MODEL of RB051L-40 (Standard Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Schottky rectifier diode with part number RB051L-40 from manufacturer ROHM. It describes the PSpice model parameters for the diode and shows simulation results that compare well with measurements of the diode's forward current, reverse breakdown voltage, and junction capacitance characteristics. Simulation error is generally within 5% across all testing conditions.
SPICE MODEL of 5GWJZ47 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 5GWJZ47 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of HRU0203A (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the specifications and simulation results of a Schottky rectifier diode with part number HRU0203A made by Hitachi. It includes the key parameters of the PSpice model, evaluation of the forward current and junction capacitance characteristics through circuit simulation, and comparison of the simulation results to measurements with less than 2% error.
SPICE MODEL of CRG02 (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the specifications and simulation results of a diode component. It includes the part number, manufacturer, and SPICE model parameters. Simulation circuits evaluate the forward current, junction capacitance, and reverse recovery characteristics. Graphs compare the measurement and simulation results, showing good agreement with less than 5% error.
FREE SPICE MODEL of CRG02 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of S5277G (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the specifications and simulation results of a diode component. It includes:
- Component details: Diode part number S5277G from manufacturer Toshiba
- SPICE model parameters used for simulation
- Simulation results comparing forward current, junction capacitance, and reverse recovery characteristics to measurements
- Reverse recovery simulation showing less than 0.1% error between measured and simulated reverse recovery time
SPICE MODEL of D2S6M (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of D2S6M (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version
ishttp://www.spicepark.com by Bee Technologies.
SPICE MODEL of 11EQ04 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 11EQ04 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of CRS04 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of CRS04 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DE10SC4 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of DE10SC4 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of M1FS4 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of M1FS4 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TVR1G (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TVR1G (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of D3FS4A (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of D3FS4A (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DE5SC4M (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Schottky diode component. It describes the key parameters in the SPICE model, and compares the simulation results to measurement data for forward current, reverse breakdown voltage, and junction capacitance characteristics. The simulation matches the measurement data to within 3% for most test points.
SPICE MODEL of 1SS396 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1SS396 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of RHRG75120 , TC=110degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of RHRG75120 , TC=110degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of D5S4M (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of D5S4M (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is
http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1SS393 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1SS393 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of D5SC4M (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of D5SC4M (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of HN2S01FU (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of HN2S01FU (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
FREE SPICE MODEL of S5688G in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DG1H3 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of DG1H3 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of HRW0203A (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of HRW0203A (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of S5688G (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of S5688G (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DE3S6M (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of DE3S6M (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1SS385F (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the components, parameters, and simulation results of a PSpice model for a 1SS385F Schottky rectifier diode from Toshiba. It describes the diode model parameters, shows forward and reverse current characteristics from circuit simulations, and compares the simulation results to measurement data, with errors generally less than 1%.
SPICE MODEL of CMS06 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of CMS06 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of OSWT5111A , White ,TA=60degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of OSWT5111A , White ,TA=60degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
This document appears to be a record containing a date, a series of numbers that could be an identification code, another date two years later, and a name. In a few sentences it provides basic identifying information but no other context or details about the purpose or content of the recorded information.
SPICE MODEL of 11EQ04 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 11EQ04 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of CRS04 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of CRS04 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DE10SC4 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of DE10SC4 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of M1FS4 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of M1FS4 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TVR1G (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TVR1G (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of D3FS4A (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of D3FS4A (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DE5SC4M (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Schottky diode component. It describes the key parameters in the SPICE model, and compares the simulation results to measurement data for forward current, reverse breakdown voltage, and junction capacitance characteristics. The simulation matches the measurement data to within 3% for most test points.
SPICE MODEL of 1SS396 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1SS396 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of RHRG75120 , TC=110degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of RHRG75120 , TC=110degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of D5S4M (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of D5S4M (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is
http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1SS393 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 1SS393 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of D5SC4M (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of D5SC4M (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of HN2S01FU (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of HN2S01FU (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
FREE SPICE MODEL of S5688G in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DG1H3 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of DG1H3 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of HRW0203A (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of HRW0203A (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of S5688G (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of S5688G (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of DE3S6M (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of DE3S6M (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 1SS385F (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the components, parameters, and simulation results of a PSpice model for a 1SS385F Schottky rectifier diode from Toshiba. It describes the diode model parameters, shows forward and reverse current characteristics from circuit simulations, and compares the simulation results to measurement data, with errors generally less than 1%.
SPICE MODEL of CMS06 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of CMS06 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of OSWT5111A , White ,TA=60degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of OSWT5111A , White ,TA=60degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
This document appears to be a record containing a date, a series of numbers that could be an identification code, another date two years later, and a name. In a few sentences it provides basic identifying information but no other context or details about the purpose or content of the recorded information.
Este documento contiene instrucciones para realizar varias tareas en Windows 10 como restaurar el sistema a su estado de fábrica, particionar el disco duro, comprobar los controladores, crear puntos de restauración y crear una imagen del sistema con Clonezilla.
This document is a CompTIA certification for Aron Meyer with an identification number of COMP001020886399 and an expiration date of July 16, 2018. It includes a verification code that can be used to validate the certification online at a CompTIA website.
El documento describe los pasos para realizar un proyecto escolar que involucra crear una empresa ficticia. Los pasos incluyen crear un nombre, logo y sitio web para la empresa, desarrollar un catálogo de productos, facturas y materiales de marketing, y organizar una fiesta de inauguración para la nueva empresa. El proyecto tiene varias fechas límite para completar cada tarea asignada.
The document outlines learning objectives for demonstrating an understanding of addition and subtraction of 1 and 2-digit numerals up to 100. Students are expected to represent strategies concretely, pictorially and symbolically, create and solve problems, estimate, use personal strategies with or without manipulatives, analyze the effect of adding or subtracting zero, and analyze the effect of quantity ordering in addition and subtraction statements.
This document appears to contain the name "Gurdarshan Kaur" written in an artistic format across three lines. It displays the name stretched out with spacing between each letter and line. The overall content seems to be introducing or identifying an individual named Gurdarshan Kaur.
Präsentation zum Thema "Datenhandling im Web 2.0" im Rahmen des Seminars Web 2.0 und die Gesellschaft an der Beuth Hochschule für Technik in Berlin.
- Web 2.0 und die Gesellschaft
- Entstehung der Datenflut
- Chancen für Diversität
- Risiken der Spaltung
- Erfolgreiches Datenhandling
- Work-Life-Balance
Weiterführende Informationen und Begleit-Blog unter:
https://fernowkabeuthweb20.wordpress.com/
Präsentiert und erstellt von Nadine Edelmann und Klaudia Fernowka (2013).
SPICE MODEL of TLWH1100 , White ,TA=40degree (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TLWH1100 , White ,TA=40degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
Andrea Floyd has created several technical documents for internal use at her company, including instructions for an open script and collection call list. She has also completed courses to earn her Associate of Applied Science degree in Business Management, taking classes in performance management and public speaking. Floyd performed a behavioral analysis on her Accounts Receivable department using a DISC assessment tool to help the team understand strengths and weaknesses. She has participated in volunteer mentoring programs and joined an internal team focused on improving company culture. Floyd is also working towards her Project Management Professional certification.
The Maiasaura was a plant-eating duck-billed dinosaur that lived between 80-65 million years ago in the Cretaceous period. It laid grapefruit-sized eggs in nests that were 6 feet by 6 feet and fed its young for up to a year, eating over 200 pounds of vegetation per day. Adults grew up to 30 feet long and weighed around 6 tons.
SPICE MODEL of TLWH1100 , White ,TA=-40degree (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TLWH1100 , White ,TA=-40degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of OSWT5111A , White ,TA=60degree (Professional Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key parameters and performance specifications of an LED component from test results. It includes:
1) Component details and manufacturer specifications.
2) Results of PSpice modeling showing forward voltage characteristics matched simulation to within 1%.
3) Capacitance measurements matched simulation to within 0.3% over the voltage range.
4) Reverse recovery time constants from simulation matched measurements to within 0.3 ns.
SPICE MODEL of OSWT5111A , White ,TA=0degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of OSWT5111A , White ,TA=0degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
Eduardo Guillén explica cómo cambiar el boot de arranque en 3 pasos: 1) Entrar en la BIOS durante el arranque y seleccionar la opción de arranque, 2) Designar el dispositivo de arranque deseado como la primera opción de arranque, 3) Guardar los cambios y reiniciar para que el nuevo dispositivo de arranque sea el predeterminado.
Este documento resume varios estándares y tipos de conexiones para cables UTP. Describe el estándar ANSI C para el lenguaje de programación C, los estándares TIA/EIA-568 para cableado estructurado, y el papel del Instituto de Ingenieros Eléctricos y Electrónicos (IEEE) en definir estándares de redes de área local (LAN). También menciona el estándar EIA para sistemas de cableado estructurado.
El documento describe diferentes tipos de búsquedas que se pueden realizar en Google, incluyendo búsquedas de frases exactas, con restricciones de palabras, por rangos de fecha, de definiciones, por tipo de archivo, en sitios específicos y por país. Proporciona ejemplos de búsquedas realizadas sobre "valoración de ecosistemas" para ilustrar los diferentes tipos de búsquedas.
The Tyrannosaurus rex was a massive carnivorous dinosaur that lived approximately 68 million years ago. It could grow up to 40 feet long and 15-20 feet tall, weighing up to 10,000 pounds. The T-rex had over 50 banana-sized sharp teeth and preyed upon other dinosaurs like the Triceratops and Edmontosaurus. It roamed areas of North America such as South Dakota, Montana, and Canada during the late Cretaceous period.
How Unilever transformed its finance structure, leading to involvement of CFO with CEO for major decision making processes of the company. Unilever being one of the biggest FMCG company needed the finance structure to be modified because of the globalization.
SPICE MODEL of OSWT5161A , White ,TA=25degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of OSWT5161A , White ,TA=25degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SLP-WB89A-51 , White ,TA=-40degree (Professional Model) in SPI...Tsuyoshi Horigome
SPICE MODEL of SLP-WB89A-51 , White ,TA=-40degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SLP-WB89A-51 , White ,TA=25degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SLP-WB89A-51 , White ,TA=25degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SLP-WB89A-51 , White ,TA=-40degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SLP-WB89A-51 , White ,TA=-40degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SLP-WB89A-51 , White ,TA=0degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SLP-WB89A-51 , White ,TA=0degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SLP-WB89A-51 , White ,TA=25degree (Professional Model) in SPIC...Tsuyoshi Horigome
SPICE MODEL of SLP-WB89A-51 , White ,TA=25degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of OSWT5111A , White ,TA=25degree (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the PSpice model and characterization of an LED component. It includes 3 sections: [1] an overview of the PSpice model parameters; [2] simulation results showing the forward current, capacitance, and reverse recovery characteristics match measurements within 1%; [3] reference graphs of the measurement setups and characteristics.
SPICE MODEL of OSWT5161A , White ,TA=-40degree (Professional Model) in SPICE ...Tsuyoshi Horigome
SPICE MODEL of OSWT5161A , White ,TA=-40degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of OSWT5111A , White ,TA=0degree (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of OSWT5111A , White ,TA=0degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SLP-WB89A-51 , White ,TA=0degree (Professional Model) in SPICE...Tsuyoshi Horigome
This document summarizes the key parameters and simulation results of a PSpice model for an SLP-WB89A-51 LED manufactured by SANYO. It includes 3 sections: 1) Component details and model parameters, 2) Forward current characteristic simulation and comparison with measurement data, and 3) Reverse recovery characteristic simulation and comparison with measurement data. Simulation results show good agreement with measurement data across operating conditions.
SPICE MODEL of OSWT5161A , White ,TA=0degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of OSWT5161A , White ,TA=0degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of OSWT5161A , White ,TA=60degree (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of OSWT5161A , White ,TA=60degree (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of EFR5365S , RED , (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of EFR5365S , RED , (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of EP204K-35G1R1B1-CA , RED (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of EP204K-35G1R1B1-CA , RED (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of OSWT5111A , White ,TA=40degree (Standard Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for an LED component. It describes the key parameters in the PSpice model, shows simulation results for forward current, capacitance, and reverse recovery characteristics that compare favorably to measurements, and provides reference data for the reverse recovery times.
SPICE MODEL of OSWT5111A , White ,TA=25degree (Professional Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of OSWT5111A , White ,TA=25degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of OSWT5161A , White ,TA=-20degree (Professional Model) in SPICE ...Tsuyoshi Horigome
SPICE MODEL of OSWT5161A , White ,TA=-20degree (Professional Model) in SPICE PARK. English Version is http://www.spicepark.net.Japanese
Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of EP05Q04 (Standard Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of EP05Q04 (Standard Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of GT10J321 (Standard+FWDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of GT10J321 (Standard+FWDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
Similar to SPICE MODEL of OSWT5161A , TA=25 degree (Professional Model) in SPICE PARK (20)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
The document provides an inventory update from March 2024 of parts in the Spice Park warehouse. It lists 6,725 total parts across various categories including semiconductors, passive parts, batteries, mechanical parts, motors, and lamps. The semiconductor section lists 652 general purpose rectifier diodes from 18 different manufacturers with quantities ranging from 2 to 145 pieces.
This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
How information systems are built or acquired puts information, which is what they should be about, in a secondary place. Our language adapted accordingly, and we no longer talk about information systems but applications. Applications evolved in a way to break data into diverse fragments, tightly coupled with applications and expensive to integrate. The result is technical debt, which is re-paid by taking even bigger "loans", resulting in an ever-increasing technical debt. Software engineering and procurement practices work in sync with market forces to maintain this trend. This talk demonstrates how natural this situation is. The question is: can something be done to reverse the trend?
inQuba Webinar Mastering Customer Journey Management with Dr Graham HillLizaNolte
HERE IS YOUR WEBINAR CONTENT! 'Mastering Customer Journey Management with Dr. Graham Hill'. We hope you find the webinar recording both insightful and enjoyable.
In this webinar, we explored essential aspects of Customer Journey Management and personalization. Here’s a summary of the key insights and topics discussed:
Key Takeaways:
Understanding the Customer Journey: Dr. Hill emphasized the importance of mapping and understanding the complete customer journey to identify touchpoints and opportunities for improvement.
Personalization Strategies: We discussed how to leverage data and insights to create personalized experiences that resonate with customers.
Technology Integration: Insights were shared on how inQuba’s advanced technology can streamline customer interactions and drive operational efficiency.
This talk will cover ScyllaDB Architecture from the cluster-level view and zoom in on data distribution and internal node architecture. In the process, we will learn the secret sauce used to get ScyllaDB's high availability and superior performance. We will also touch on the upcoming changes to ScyllaDB architecture, moving to strongly consistent metadata and tablets.
What is an RPA CoE? Session 1 – CoE VisionDianaGray10
In the first session, we will review the organization's vision and how this has an impact on the COE Structure.
Topics covered:
• The role of a steering committee
• How do the organization’s priorities determine CoE Structure?
Speaker:
Chris Bolin, Senior Intelligent Automation Architect Anika Systems
Taking AI to the Next Level in Manufacturing.pdfssuserfac0301
Read Taking AI to the Next Level in Manufacturing to gain insights on AI adoption in the manufacturing industry, such as:
1. How quickly AI is being implemented in manufacturing.
2. Which barriers stand in the way of AI adoption.
3. How data quality and governance form the backbone of AI.
4. Organizational processes and structures that may inhibit effective AI adoption.
6. Ideas and approaches to help build your organization's AI strategy.
5th LF Energy Power Grid Model Meet-up SlidesDanBrown980551
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
-Insightful presentations covering two practical applications of the Power Grid Model.
-An update on the latest advancements in Power Grid -Model technology during the first and second quarters of 2024.
-An interactive brainstorming session to discuss and propose new feature requests.
-An opportunity to connect with fellow Power Grid Model enthusiasts and users.
Dandelion Hashtable: beyond billion requests per second on a commodity serverAntonios Katsarakis
This slide deck presents DLHT, a concurrent in-memory hashtable. Despite efforts to optimize hashtables, that go as far as sacrificing core functionality, state-of-the-art designs still incur multiple memory accesses per request and block request processing in three cases. First, most hashtables block while waiting for data to be retrieved from memory. Second, open-addressing designs, which represent the current state-of-the-art, either cannot free index slots on deletes or must block all requests to do so. Third, index resizes block every request until all objects are copied to the new index. Defying folklore wisdom, DLHT forgoes open-addressing and adopts a fully-featured and memory-aware closed-addressing design based on bounded cache-line-chaining. This design offers lock-free index operations and deletes that free slots instantly, (2) completes most requests with a single memory access, (3) utilizes software prefetching to hide memory latencies, and (4) employs a novel non-blocking and parallel resizing. In a commodity server and a memory-resident workload, DLHT surpasses 1.6B requests per second and provides 3.5x (12x) the throughput of the state-of-the-art closed-addressing (open-addressing) resizable hashtable on Gets (Deletes).
Northern Engraving | Modern Metal Trim, Nameplates and Appliance PanelsNorthern Engraving
What began over 115 years ago as a supplier of precision gauges to the automotive industry has evolved into being an industry leader in the manufacture of product branding, automotive cockpit trim and decorative appliance trim. Value-added services include in-house Design, Engineering, Program Management, Test Lab and Tool Shops.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/temporal-event-neural-networks-a-more-efficient-alternative-to-the-transformer-a-presentation-from-brainchip/
Chris Jones, Director of Product Management at BrainChip , presents the “Temporal Event Neural Networks: A More Efficient Alternative to the Transformer” tutorial at the May 2024 Embedded Vision Summit.
The expansion of AI services necessitates enhanced computational capabilities on edge devices. Temporal Event Neural Networks (TENNs), developed by BrainChip, represent a novel and highly efficient state-space network. TENNs demonstrate exceptional proficiency in handling multi-dimensional streaming data, facilitating advancements in object detection, action recognition, speech enhancement and language model/sequence generation. Through the utilization of polynomial-based continuous convolutions, TENNs streamline models, expedite training processes and significantly diminish memory requirements, achieving notable reductions of up to 50x in parameters and 5,000x in energy consumption compared to prevailing methodologies like transformers.
Integration with BrainChip’s Akida neuromorphic hardware IP further enhances TENNs’ capabilities, enabling the realization of highly capable, portable and passively cooled edge devices. This presentation delves into the technical innovations underlying TENNs, presents real-world benchmarks, and elucidates how this cutting-edge approach is positioned to revolutionize edge AI across diverse applications.
AppSec PNW: Android and iOS Application Security with MobSFAjin Abraham
Mobile Security Framework - MobSF is a free and open source automated mobile application security testing environment designed to help security engineers, researchers, developers, and penetration testers to identify security vulnerabilities, malicious behaviours and privacy concerns in mobile applications using static and dynamic analysis. It supports all the popular mobile application binaries and source code formats built for Android and iOS devices. In addition to automated security assessment, it also offers an interactive testing environment to build and execute scenario based test/fuzz cases against the application.
This talk covers:
Using MobSF for static analysis of mobile applications.
Interactive dynamic security assessment of Android and iOS applications.
Solving Mobile app CTF challenges.
Reverse engineering and runtime analysis of Mobile malware.
How to shift left and integrate MobSF/mobsfscan SAST and DAST in your build pipeline.
Have you ever been confused by the myriad of choices offered by AWS for hosting a website or an API?
Lambda, Elastic Beanstalk, Lightsail, Amplify, S3 (and more!) can each host websites + APIs. But which one should we choose?
Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
"Scaling RAG Applications to serve millions of users", Kevin GoedeckeFwdays
How we managed to grow and scale a RAG application from zero to thousands of users in 7 months. Lessons from technical challenges around managing high load for LLMs, RAGs and Vector databases.
Conversational agents, or chatbots, are increasingly used to access all sorts of services using natural language. While open-domain chatbots - like ChatGPT - can converse on any topic, task-oriented chatbots - the focus of this paper - are designed for specific tasks, like booking a flight, obtaining customer support, or setting an appointment. Like any other software, task-oriented chatbots need to be properly tested, usually by defining and executing test scenarios (i.e., sequences of user-chatbot interactions). However, there is currently a lack of methods to quantify the completeness and strength of such test scenarios, which can lead to low-quality tests, and hence to buggy chatbots.
To fill this gap, we propose adapting mutation testing (MuT) for task-oriented chatbots. To this end, we introduce a set of mutation operators that emulate faults in chatbot designs, an architecture that enables MuT on chatbots built using heterogeneous technologies, and a practical realisation as an Eclipse plugin. Moreover, we evaluate the applicability, effectiveness and efficiency of our approach on open-source chatbots, with promising results.
The Department of Veteran Affairs (VA) invited Taylor Paschal, Knowledge & Information Management Consultant at Enterprise Knowledge, to speak at a Knowledge Management Lunch and Learn hosted on June 12, 2024. All Office of Administration staff were invited to attend and received professional development credit for participating in the voluntary event.
The objectives of the Lunch and Learn presentation were to:
- Review what KM ‘is’ and ‘isn’t’
- Understand the value of KM and the benefits of engaging
- Define and reflect on your “what’s in it for me?”
- Share actionable ways you can participate in Knowledge - - Capture & Transfer
Monitoring and Managing Anomaly Detection on OpenShift.pdfTosin Akinosho
Monitoring and Managing Anomaly Detection on OpenShift
Overview
Dive into the world of anomaly detection on edge devices with our comprehensive hands-on tutorial. This SlideShare presentation will guide you through the entire process, from data collection and model training to edge deployment and real-time monitoring. Perfect for those looking to implement robust anomaly detection systems on resource-constrained IoT/edge devices.
Key Topics Covered
1. Introduction to Anomaly Detection
- Understand the fundamentals of anomaly detection and its importance in identifying unusual behavior or failures in systems.
2. Understanding Edge (IoT)
- Learn about edge computing and IoT, and how they enable real-time data processing and decision-making at the source.
3. What is ArgoCD?
- Discover ArgoCD, a declarative, GitOps continuous delivery tool for Kubernetes, and its role in deploying applications on edge devices.
4. Deployment Using ArgoCD for Edge Devices
- Step-by-step guide on deploying anomaly detection models on edge devices using ArgoCD.
5. Introduction to Apache Kafka and S3
- Explore Apache Kafka for real-time data streaming and Amazon S3 for scalable storage solutions.
6. Viewing Kafka Messages in the Data Lake
- Learn how to view and analyze Kafka messages stored in a data lake for better insights.
7. What is Prometheus?
- Get to know Prometheus, an open-source monitoring and alerting toolkit, and its application in monitoring edge devices.
8. Monitoring Application Metrics with Prometheus
- Detailed instructions on setting up Prometheus to monitor the performance and health of your anomaly detection system.
9. What is Camel K?
- Introduction to Camel K, a lightweight integration framework built on Apache Camel, designed for Kubernetes.
10. Configuring Camel K Integrations for Data Pipelines
- Learn how to configure Camel K for seamless data pipeline integrations in your anomaly detection workflow.
11. What is a Jupyter Notebook?
- Overview of Jupyter Notebooks, an open-source web application for creating and sharing documents with live code, equations, visualizations, and narrative text.
12. Jupyter Notebooks with Code Examples
- Hands-on examples and code snippets in Jupyter Notebooks to help you implement and test anomaly detection models.
Essentials of Automations: Exploring Attributes & Automation ParametersSafe Software
Building automations in FME Flow can save time, money, and help businesses scale by eliminating data silos and providing data to stakeholders in real-time. One essential component to orchestrating complex automations is the use of attributes & automation parameters (both formerly known as “keys”). In fact, it’s unlikely you’ll ever build an Automation without using these components, but what exactly are they?
Attributes & automation parameters enable the automation author to pass data values from one automation component to the next. During this webinar, our FME Flow Specialists will cover leveraging the three types of these output attributes & parameters in FME Flow: Event, Custom, and Automation. As a bonus, they’ll also be making use of the Split-Merge Block functionality.
You’ll leave this webinar with a better understanding of how to maximize the potential of automations by making use of attributes & automation parameters, with the ultimate goal of setting your enterprise integration workflows up on autopilot.
Essentials of Automations: Exploring Attributes & Automation Parameters
SPICE MODEL of OSWT5161A , TA=25 degree (Professional Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: Light-Emitting Diode (LED) Professional
PART NUMBER: OSWT5161A
MANUFACTURER: OPTO SUPPLY
REMARK: 25 degree C
COLER: WHITE
Bee Technologies Inc.
All Rights Reserved Copyright (C) Bee Technologies Inc. 2005
2. PSpice model
Model description
parameter
IS Saturation Current
N Emission Coefficient
RS Series Resistance
IKF High-injection Knee Current
CJO Zero-bias Junction Capacitance
M Junction Grading Coefficient
VJ Junction Potential
ISR Recombination Current Saturation Value
BV Reverse Breakdown Voltage(a positive value)
IBV Reverse Breakdown Current(a positive value)
TT Transit Time
EG Energy-band Gap
All Rights Reserved Copyright (C) Bee Technologies Inc. 2005
8. Reverse Recovery Characteristic
Circuit Simulation Result
Evaluation Circuit
Compare Measurement vs. Simulation
Symbol Measurement Unit Simulation Unit %Error
trj 12.4 ns 12.45 ns 0.05
trb 11.6 ns 11.58 ns - 0.02
All Rights Reserved Copyright (C) Bee Technologies Inc. 2005
9. Reverse Recovery Characteristic Reference
TA=25C
Measurement
Trj =12.4ns)
Trb=11.6(ns)
Conditions: Ifwd=Irev=0.02(A), Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (C) Bee Technologies Inc. 2005