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© Semiconductor Components Industries, LLC, 2007
April, 2007 − Rev. 3
1 Publication Order Number:
MPSA05/D
NPN − MPSA05, MPSA06*;
PNP − MPSA55, MPSA56*
*Preferred Devices
Amplifier Transistors
Voltage and Current are Negative
for PNP Transistors
Features
• Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−Emitter Voltage
MPSA05, MPSA55
MPSA06, MPSA56
VCEO
60
80
Vdc
Collector−Base Voltage
MPSA05, MPSA55
MPSA06, MPSA56
VCBO
60
80
Vdc
Emitter−Base Voltage VEBO 4.0 Vdc
Collector Current − Continuous IC 500 mAdc
Total Device Dissipation @ TA = 25°C
Derate above 25°C
PD 625
5.0
W
mW/°C
Total Device Dissipation @ TC = 25°C
Derate above 25°C
PD 1.5
12
W
mW/°C
Operating and Storage Junction
Temperature Range
TJ, Tstg −55 to +150 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient
(Note 1)
RqJA 200 °C/W
Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. RqJA is measured with the device soldered into a typical printed circuit board.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
http://onsemi.com
COLLECTOR
3
2
BASE
1
EMITTER
NPN
COLLECTOR
3
2
BASE
1
EMITTER
PNP
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
1 2
3
1
2
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
TO−92
CASE 29
STYLE 1
MARKING DIAGRAM
MPS
Axx
AYWW G
G
xx = 05, 06, 55, or 56
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56*
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage (Note 2)
(IC = 1.0 mAdc, IB = 0) MPSA05, MPSA55
MPSA06, MPSA56
V(BR)CEO
60
80
−
−
Vdc
Emitter−Base Breakdown Voltage
(IE = 100 mAdc, IC = 0)
V(BR)EBO 4.0 − Vdc
Collector Cutoff Current
(VCE = 60 Vdc, IB = 0)
ICES − 0.1 mAdc
Collector Cutoff Current
(VCB = 60 Vdc, IE = 0) MPSA05, MPSA55
(VCB = 80 Vdc, IE = 0) MPSA06, MPSA56
ICBO
−
−
0.1
0.1
mAdc
ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
hFE
100
100
−
−
−
Collector−Emitter Saturation Voltage
(IC = 100 mAdc, IB = 10 mAdc)
VCE(sat) − 0.25 Vdc
Base−Emitter On Voltage
(IC = 100 mAdc, VCE = 1.0 Vdc)
VBE(on) − 1.2 Vdc
SMALL−SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product (Note 3)
(IC = 10 mA, VCE = 2.0 V, f = 100 MHz) MPSA05
MPSA06
(IC = 100 mAdc, VCE = 1.0 Vdc, f = 100 MHz) MPSA55
MPSA56
fT
100
50
−
−
MHz
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
3. fT is defined as the frequency at which |hfe| extrapolates to unity.
Figure 1. Switching Time Test Circuits
OUTPUT
TURN−ON TIME
−1.0 V VCC
+40 V
RL
* CS t 6.0 pF
RB
100
100
Vin
5.0 mF
tr = 3.0 ns
0
+10 V
5.0 ms
OUTPUT
TURN−OFF TIME
+VBB VCC
+40 V
RL
* CS t 6.0 pF
RB
100
100
Vin
5.0 mF
tr = 3.0 ns
5.0 ms
*Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All Voltage Polarities
NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56*
http://onsemi.com
3
Figure 2. MPSA05/06 Current−Gain —
Bandwidth Product
Figure 3. MPSA55/56 Current−Gain —
Bandwidth Product
Figure 4. MPSA05/06 Capacitance Figure 5. MPSA55/56 Capacitance
Figure 6. MPSA05/06 Switching Time Figure 7. MPSA55/56 Switching Time
100 2002.0
IC, COLLECTOR CURRENT (mA)
300
200
100
70
50
30
IC, COLLECTOR CURRENT (mA)
−100 −200−10
200
100
70
50
20
10 1000.1
VR, REVERSE VOLTAGE (VOLTS)
80
60
40
20
10
8.0
VR, REVERSE VOLTAGE (VOLTS)
−1.0 −100−0.1
100
70
50
30
20
10
−2.020
VCE = 2.0 V
TJ = 25°C
VCE = −2.0 V
TJ = 25°C
TJ = 25°C fT,CURRENT−GAIN−BANDWIDTHPRODUCT(MHz)
NPN PNP
C,CAPACITANCE(pF)
3.0 5.0 7.0 10 20 30 50 70 −2.0 −3.0 −5.0 −7.0 −20 −30 −50 −70
30
fT,CURRENT−GAIN−BANDWIDTHPRODUCT(MHz)
501.0 2.0 5.00.2 0.5
6.0
4.0
Cibo
Cobo 7.0
5.0
−0.2 −0.5 −5.0 −10 −20 −50
TJ = 25°C
Cibo
Cobo
2010
IC, COLLECTOR CURRENT (mA)
200
100
50
20
10
IC, COLLECTOR CURRENT (mA)
−10−5.0
500
200
100
50
20
10
−100100
t,TIME(ns)
t,TIME(ns)
50 200 500
1.0 k
500
VCC = 40 V
IC/IB = 10
IB1 = IB2
TJ = 25°C
ts
tf
tr
−50 −200 −500
1.0 k
5.0 7.0
30
70
300
700
30 70
td @ VBE(off) = 0.5 V
300
700
70
30
−7.0 −300−70−20 −30
VCC = −40 V
IC/IB = 10
IB1 = IB2
TJ = 25°C
ts
tf
trtd @ VBE(off) = −0.5 V
C,CAPACITANCE(pF)
300
NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56*
http://onsemi.com
4
Figure 8. MPSA05/06 Active−Region Safe
Operating Area
Figure 9. MPSA55/56 Active−Region Safe
Operating Area
Figure 10. MPSA05/06 DC Current Gain Figure 11. MPSA55/56 DC Current Gain
Figure 12. MPSA05/06 “ON” Voltages Figure 13. MPSA55/56 “ON” Voltages
2.0 5000.5
IC, COLLECTOR CURRENT (mA)
400
200
100
80
60
40
10
,DCCURRENTGAIN
NPN PNP
TJ = 125°C
10 5001.0
IC, COLLECTOR CURRENT (mA)
1.0
0.8
0.6
0.4
0.2
0
100
TJ = 25°C
V,VOLTAGE(VOLTS)
V,VOLTAGE(VOLTS)
VBE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 10
VBE(on) @ VCE = 1.0 V
101.0
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
500
200
100
50
20
10
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
−10 −50−1.0
−500
−200
−100
−50
−20
−10
−2030
IC,COLLECTORCURRENT(mA)
−2.0 −5.0
−1.0 k
2.0 5.0 50
1.0 k
IC,COLLECTORCURRENT(mA)
1.0 ms
1.0 s
TA = 25°C
MPSA05
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPSA06
10070203.0 7.0
100 ms
TC = 25°C
1.0 3.0 5.0
VCE = 1.0 V
20 10030 50 200 300
hFE
25°C
−55°C
0.5 2.0 5.0 20020 50
−2.0 −500−0.5
IC, COLLECTOR CURRENT (mA)
400
200
100
80
60
40
−10
,DCCURRENTGAIN
TJ = 125°C
−1.0 −5.0
VCE = −1.0 V
−20 −100−50 −200
hFE
25°C
−55°C
−10 −500−1.0
IC, COLLECTOR CURRENT (mA)
−1.0
−0.8
−0.6
−0.4
−0.2
0
−100
TJ = 25°C
VBE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 10
VBE(on) @ VCE = −1.0 V
−0.5 −2.0 −5.0 −200−20 −50
700
300
30
70
1.0 ms
1.0 s
TA = 25°C
MPSA55
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPSA56
100 ms
TC = 25°C
−3.0 −7.0 −30 −100−70
−30
−70
−300
−700
NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56*
http://onsemi.com
5
Figure 14. MPSA05/06 Collector Saturation
Region
Figure 15. MPSA55/56 Collector Saturation
Region
Figure 16. MPSA05/06 Base−Emitter
Temperature Coefficient
Figure 17. MPSA55/56 Base−Emitter
Temperature Coefficient
100 5000.5
IC, COLLECTOR CURRENT (mA)
−0.8
−1.2
−1.6
−2.0
−2.4
−2.8
IC, COLLECTOR CURRENT (mA)
0.1 100.05
IB, BASE CURRENT (mA)
1.0
0.8
0.6
0.4
0.2
0
IB, BASE CURRENT (mA)
1.0
TJ = 25°C
RVB,TEMPERATURECOEFFICIENT(mV/C)
NPN PNP
10
RqVB for VBE
q°
RVB,TEMPERATURECOEFFICIENT(mV/C)q°
50
IC =
100 mA
IC =
50 mA
IC =
250 mA
IC =
500 mA
IC =
10 mA
,COLLECTOR−EMITTERVOLTAGE(VOLTS)VCE
,COLLECTOR−EMITTERVOLTAGE(VOLTS)VCE
1.0 2.0 5.0 20 50 200
202.0 5.00.2 0.5
−100 −500−0.5
−0.8
−1.2
−1.6
−2.0
−2.4
−2.8
−10
RqVB for VBE
−1.0 −2.0 −5.0 −20 −50 −200
−0.1 −10−0.05
−1.0
−0.8
−0.6
−0.4
−0.2
0
−1.0
TJ = 25°C
−50
IC =
−100 mA
IC =
−50 mA
IC =
−250 mA
IC =
−500 mA
IC =
−10 mA
−20−2.0 −5.0−0.2 −0.5
Figure 18. MPSA05, MPSA06, MPSA55 and MPSA56 Thermal Response
t, TIME (ms)
1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
0.03
0.02
0.1
0.07
0.05
0.01
0.3
0.2
1.0
0.7
0.5
r(t),NORMALIZEDTRANSIENT
THERMALRESISTANCE
ZqJC(t) = r(t) • RqJC
TJ(pk) − TC = P(pk) ZqJC(t)
ZqJA(t) = r(t) • RqJA
TJ(pk) − TA = P(pk) ZqJA(t)
D CURVES APPLY FOR
POWER PULSE TRAIN
SHOWN READ TIME AT t1
(SEE AN469)
t1
t2
DUTY CYCLE, D = t1/t2
P(pk)
D = 0.5
0.2
0.1
0.02 0.01
SINGLE PULSE
SINGLE PULSE
0.05
NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56*
http://onsemi.com
6
ORDERING INFORMATION
Device Package Shipping†
MPSA05 TO−92 5000 Units / Bulk
MPSA05G TO−92
(Pb−Free)
5000 Units / Bulk
MPSA05RLRA TO−92 2000 / Tape & Reel
MPSA05RLRAG TO−92
(Pb−Free)
2000 / Tape & Reel
MPSA05RLRM TO−92 2000 / Ammo Pack
MPSA05RLRMG TO−92
(Pb−Free)
2000 / Ammo Pack
MPSA06 TO−92 5000 Units / Bulk
MPSA06G TO−92
(Pb−Free)
5000 Units / Bulk
MPSA06RL1G TO−92
(Pb−Free)
2000 / Tape & Reel
MPSA06RLG TO−92
(Pb−Free)
2000 / Tape & Reel
MPSA06RLRA TO−92 2000 / Tape & Reel
MPSA06RLRAG TO−92
(Pb−Free)
2000 / Tape & Reel
MPSA06RLRM TO−92 2000 / Ammo Pack
MPSA06RLRMG TO−92
(Pb−Free)
2000 / Ammo Pack
MPSA06RLRP TO−92 2000 / Ammo Pack
MPSA06RLRPG TO−92
(Pb−Free)
2000 / Ammo Pack
MPSA55G TO−92
(Pb−Free)
5000 Units / Bulk
MPSA55RLRA TO−92 2000 / Tape & Reel
MPSA55RLRAG TO−92
(Pb−Free)
2000 / Tape & Reel
MPSA56 TO−92 5000 Units / Bulk
MPSA56G TO−92
(Pb−Free)
5000 Units / Bulk
MPSA56RLRA TO−92 2000 / Tape & Reel
MPSA56RLRAG TO−92
(Pb−Free)
2000 / Tape & Reel
MPSA56RLRM TO−92 2000 / Ammo Pack
MPSA56RLRMG TO−92
(Pb−Free)
2000 / Ammo Pack
MPSA56RLRP TO−92 2000 / Ammo Pack
MPSA56RLRPG TO−92
(Pb−Free)
2000 / Ammo Pack
MPSA56ZL1 TO−92 2000 / Ammo Pack
MPSA56ZL1G TO−92
(Pb−Free)
2000 / Ammo Pack
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56*
http://onsemi.com
7
PACKAGE DIMENSIONS
TO−92 (TO−226)
CASE 29−11
ISSUE AM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION X−X
CV
D
N
N
X X
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
G 0.045 0.055 1.15 1.39
H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50
K 0.500 −−− 12.70 −−−
L 0.250 −−− 6.35 −−−
N 0.080 0.105 2.04 2.66
P −−− 0.100 −−− 2.54
R 0.115 −−− 2.93 −−−
V 0.135 −−− 3.43 −−−
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
R
A
P
J
B
K
G
SECTION X−X
C
V
D
N
X X
SEATING
PLANE DIM MIN MAX
MILLIMETERS
A 4.45 5.20
B 4.32 5.33
C 3.18 4.19
D 0.40 0.54
G 2.40 2.80
J 0.39 0.50
K 12.70 −−−
N 2.04 2.66
P 1.50 4.00
R 2.93 −−−
V 3.43 −−−
1
T
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
MPSA05/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative

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Original Transistor NPN MPS A06 MPSA06 TO 92 New

  • 1. © Semiconductor Components Industries, LLC, 2007 April, 2007 − Rev. 3 1 Publication Order Number: MPSA05/D NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* *Preferred Devices Amplifier Transistors Voltage and Current are Negative for PNP Transistors Features • Pb−Free Packages are Available* MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage MPSA05, MPSA55 MPSA06, MPSA56 VCEO 60 80 Vdc Collector−Base Voltage MPSA05, MPSA55 MPSA06, MPSA56 VCBO 60 80 Vdc Emitter−Base Voltage VEBO 4.0 Vdc Collector Current − Continuous IC 500 mAdc Total Device Dissipation @ TA = 25°C Derate above 25°C PD 625 5.0 W mW/°C Total Device Dissipation @ TC = 25°C Derate above 25°C PD 1.5 12 W mW/°C Operating and Storage Junction Temperature Range TJ, Tstg −55 to +150 °C THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 200 °C/W Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. RqJA is measured with the device soldered into a typical printed circuit board. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Preferred devices are recommended choices for future use and best overall value. http://onsemi.com COLLECTOR 3 2 BASE 1 EMITTER NPN COLLECTOR 3 2 BASE 1 EMITTER PNP See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. ORDERING INFORMATION 1 2 3 1 2 BENT LEAD TAPE & REEL AMMO PACK STRAIGHT LEAD BULK PACK 3 TO−92 CASE 29 STYLE 1 MARKING DIAGRAM MPS Axx AYWW G G xx = 05, 06, 55, or 56 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
  • 2. NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* http://onsemi.com 2 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Collector−Emitter Breakdown Voltage (Note 2) (IC = 1.0 mAdc, IB = 0) MPSA05, MPSA55 MPSA06, MPSA56 V(BR)CEO 60 80 − − Vdc Emitter−Base Breakdown Voltage (IE = 100 mAdc, IC = 0) V(BR)EBO 4.0 − Vdc Collector Cutoff Current (VCE = 60 Vdc, IB = 0) ICES − 0.1 mAdc Collector Cutoff Current (VCB = 60 Vdc, IE = 0) MPSA05, MPSA55 (VCB = 80 Vdc, IE = 0) MPSA06, MPSA56 ICBO − − 0.1 0.1 mAdc ON CHARACTERISTICS DC Current Gain (IC = 10 mAdc, VCE = 1.0 Vdc) (IC = 100 mAdc, VCE = 1.0 Vdc) hFE 100 100 − − − Collector−Emitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc) VCE(sat) − 0.25 Vdc Base−Emitter On Voltage (IC = 100 mAdc, VCE = 1.0 Vdc) VBE(on) − 1.2 Vdc SMALL−SIGNAL CHARACTERISTICS Current−Gain − Bandwidth Product (Note 3) (IC = 10 mA, VCE = 2.0 V, f = 100 MHz) MPSA05 MPSA06 (IC = 100 mAdc, VCE = 1.0 Vdc, f = 100 MHz) MPSA55 MPSA56 fT 100 50 − − MHz 2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%. 3. fT is defined as the frequency at which |hfe| extrapolates to unity. Figure 1. Switching Time Test Circuits OUTPUT TURN−ON TIME −1.0 V VCC +40 V RL * CS t 6.0 pF RB 100 100 Vin 5.0 mF tr = 3.0 ns 0 +10 V 5.0 ms OUTPUT TURN−OFF TIME +VBB VCC +40 V RL * CS t 6.0 pF RB 100 100 Vin 5.0 mF tr = 3.0 ns 5.0 ms *Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All Voltage Polarities
  • 3. NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* http://onsemi.com 3 Figure 2. MPSA05/06 Current−Gain — Bandwidth Product Figure 3. MPSA55/56 Current−Gain — Bandwidth Product Figure 4. MPSA05/06 Capacitance Figure 5. MPSA55/56 Capacitance Figure 6. MPSA05/06 Switching Time Figure 7. MPSA55/56 Switching Time 100 2002.0 IC, COLLECTOR CURRENT (mA) 300 200 100 70 50 30 IC, COLLECTOR CURRENT (mA) −100 −200−10 200 100 70 50 20 10 1000.1 VR, REVERSE VOLTAGE (VOLTS) 80 60 40 20 10 8.0 VR, REVERSE VOLTAGE (VOLTS) −1.0 −100−0.1 100 70 50 30 20 10 −2.020 VCE = 2.0 V TJ = 25°C VCE = −2.0 V TJ = 25°C TJ = 25°C fT,CURRENT−GAIN−BANDWIDTHPRODUCT(MHz) NPN PNP C,CAPACITANCE(pF) 3.0 5.0 7.0 10 20 30 50 70 −2.0 −3.0 −5.0 −7.0 −20 −30 −50 −70 30 fT,CURRENT−GAIN−BANDWIDTHPRODUCT(MHz) 501.0 2.0 5.00.2 0.5 6.0 4.0 Cibo Cobo 7.0 5.0 −0.2 −0.5 −5.0 −10 −20 −50 TJ = 25°C Cibo Cobo 2010 IC, COLLECTOR CURRENT (mA) 200 100 50 20 10 IC, COLLECTOR CURRENT (mA) −10−5.0 500 200 100 50 20 10 −100100 t,TIME(ns) t,TIME(ns) 50 200 500 1.0 k 500 VCC = 40 V IC/IB = 10 IB1 = IB2 TJ = 25°C ts tf tr −50 −200 −500 1.0 k 5.0 7.0 30 70 300 700 30 70 td @ VBE(off) = 0.5 V 300 700 70 30 −7.0 −300−70−20 −30 VCC = −40 V IC/IB = 10 IB1 = IB2 TJ = 25°C ts tf trtd @ VBE(off) = −0.5 V C,CAPACITANCE(pF) 300
  • 4. NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* http://onsemi.com 4 Figure 8. MPSA05/06 Active−Region Safe Operating Area Figure 9. MPSA55/56 Active−Region Safe Operating Area Figure 10. MPSA05/06 DC Current Gain Figure 11. MPSA55/56 DC Current Gain Figure 12. MPSA05/06 “ON” Voltages Figure 13. MPSA55/56 “ON” Voltages 2.0 5000.5 IC, COLLECTOR CURRENT (mA) 400 200 100 80 60 40 10 ,DCCURRENTGAIN NPN PNP TJ = 125°C 10 5001.0 IC, COLLECTOR CURRENT (mA) 1.0 0.8 0.6 0.4 0.2 0 100 TJ = 25°C V,VOLTAGE(VOLTS) V,VOLTAGE(VOLTS) VBE(sat) @ IC/IB = 10 VCE(sat) @ IC/IB = 10 VBE(on) @ VCE = 1.0 V 101.0 VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS) 500 200 100 50 20 10 VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS) −10 −50−1.0 −500 −200 −100 −50 −20 −10 −2030 IC,COLLECTORCURRENT(mA) −2.0 −5.0 −1.0 k 2.0 5.0 50 1.0 k IC,COLLECTORCURRENT(mA) 1.0 ms 1.0 s TA = 25°C MPSA05 CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT MPSA06 10070203.0 7.0 100 ms TC = 25°C 1.0 3.0 5.0 VCE = 1.0 V 20 10030 50 200 300 hFE 25°C −55°C 0.5 2.0 5.0 20020 50 −2.0 −500−0.5 IC, COLLECTOR CURRENT (mA) 400 200 100 80 60 40 −10 ,DCCURRENTGAIN TJ = 125°C −1.0 −5.0 VCE = −1.0 V −20 −100−50 −200 hFE 25°C −55°C −10 −500−1.0 IC, COLLECTOR CURRENT (mA) −1.0 −0.8 −0.6 −0.4 −0.2 0 −100 TJ = 25°C VBE(sat) @ IC/IB = 10 VCE(sat) @ IC/IB = 10 VBE(on) @ VCE = −1.0 V −0.5 −2.0 −5.0 −200−20 −50 700 300 30 70 1.0 ms 1.0 s TA = 25°C MPSA55 CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT MPSA56 100 ms TC = 25°C −3.0 −7.0 −30 −100−70 −30 −70 −300 −700
  • 5. NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* http://onsemi.com 5 Figure 14. MPSA05/06 Collector Saturation Region Figure 15. MPSA55/56 Collector Saturation Region Figure 16. MPSA05/06 Base−Emitter Temperature Coefficient Figure 17. MPSA55/56 Base−Emitter Temperature Coefficient 100 5000.5 IC, COLLECTOR CURRENT (mA) −0.8 −1.2 −1.6 −2.0 −2.4 −2.8 IC, COLLECTOR CURRENT (mA) 0.1 100.05 IB, BASE CURRENT (mA) 1.0 0.8 0.6 0.4 0.2 0 IB, BASE CURRENT (mA) 1.0 TJ = 25°C RVB,TEMPERATURECOEFFICIENT(mV/C) NPN PNP 10 RqVB for VBE q° RVB,TEMPERATURECOEFFICIENT(mV/C)q° 50 IC = 100 mA IC = 50 mA IC = 250 mA IC = 500 mA IC = 10 mA ,COLLECTOR−EMITTERVOLTAGE(VOLTS)VCE ,COLLECTOR−EMITTERVOLTAGE(VOLTS)VCE 1.0 2.0 5.0 20 50 200 202.0 5.00.2 0.5 −100 −500−0.5 −0.8 −1.2 −1.6 −2.0 −2.4 −2.8 −10 RqVB for VBE −1.0 −2.0 −5.0 −20 −50 −200 −0.1 −10−0.05 −1.0 −0.8 −0.6 −0.4 −0.2 0 −1.0 TJ = 25°C −50 IC = −100 mA IC = −50 mA IC = −250 mA IC = −500 mA IC = −10 mA −20−2.0 −5.0−0.2 −0.5 Figure 18. MPSA05, MPSA06, MPSA55 and MPSA56 Thermal Response t, TIME (ms) 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k 0.03 0.02 0.1 0.07 0.05 0.01 0.3 0.2 1.0 0.7 0.5 r(t),NORMALIZEDTRANSIENT THERMALRESISTANCE ZqJC(t) = r(t) • RqJC TJ(pk) − TC = P(pk) ZqJC(t) ZqJA(t) = r(t) • RqJA TJ(pk) − TA = P(pk) ZqJA(t) D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 (SEE AN469) t1 t2 DUTY CYCLE, D = t1/t2 P(pk) D = 0.5 0.2 0.1 0.02 0.01 SINGLE PULSE SINGLE PULSE 0.05
  • 6. NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* http://onsemi.com 6 ORDERING INFORMATION Device Package Shipping† MPSA05 TO−92 5000 Units / Bulk MPSA05G TO−92 (Pb−Free) 5000 Units / Bulk MPSA05RLRA TO−92 2000 / Tape & Reel MPSA05RLRAG TO−92 (Pb−Free) 2000 / Tape & Reel MPSA05RLRM TO−92 2000 / Ammo Pack MPSA05RLRMG TO−92 (Pb−Free) 2000 / Ammo Pack MPSA06 TO−92 5000 Units / Bulk MPSA06G TO−92 (Pb−Free) 5000 Units / Bulk MPSA06RL1G TO−92 (Pb−Free) 2000 / Tape & Reel MPSA06RLG TO−92 (Pb−Free) 2000 / Tape & Reel MPSA06RLRA TO−92 2000 / Tape & Reel MPSA06RLRAG TO−92 (Pb−Free) 2000 / Tape & Reel MPSA06RLRM TO−92 2000 / Ammo Pack MPSA06RLRMG TO−92 (Pb−Free) 2000 / Ammo Pack MPSA06RLRP TO−92 2000 / Ammo Pack MPSA06RLRPG TO−92 (Pb−Free) 2000 / Ammo Pack MPSA55G TO−92 (Pb−Free) 5000 Units / Bulk MPSA55RLRA TO−92 2000 / Tape & Reel MPSA55RLRAG TO−92 (Pb−Free) 2000 / Tape & Reel MPSA56 TO−92 5000 Units / Bulk MPSA56G TO−92 (Pb−Free) 5000 Units / Bulk MPSA56RLRA TO−92 2000 / Tape & Reel MPSA56RLRAG TO−92 (Pb−Free) 2000 / Tape & Reel MPSA56RLRM TO−92 2000 / Ammo Pack MPSA56RLRMG TO−92 (Pb−Free) 2000 / Ammo Pack MPSA56RLRP TO−92 2000 / Ammo Pack MPSA56RLRPG TO−92 (Pb−Free) 2000 / Ammo Pack MPSA56ZL1 TO−92 2000 / Ammo Pack MPSA56ZL1G TO−92 (Pb−Free) 2000 / Ammo Pack †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
  • 7. NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56* http://onsemi.com 7 PACKAGE DIMENSIONS TO−92 (TO−226) CASE 29−11 ISSUE AM NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J L B K G H SECTION X−X CV D N N X X SEATING PLANE DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 −−− 12.70 −−− L 0.250 −−− 6.35 −−− N 0.080 0.105 2.04 2.66 P −−− 0.100 −−− 2.54 R 0.115 −−− 2.93 −−− V 0.135 −−− 3.43 −−− 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J B K G SECTION X−X C V D N X X SEATING PLANE DIM MIN MAX MILLIMETERS A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G 2.40 2.80 J 0.39 0.50 K 12.70 −−− N 2.04 2.66 P 1.50 4.00 R 2.93 −−− V 3.43 −−− 1 T STRAIGHT LEAD BULK PACK BENT LEAD TAPE & REEL AMMO PACK STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 MPSA05/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative