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2011-09-091
BC847...-BC850...
NPN Silicon AF Transistors
• For AF input stages and driver applications
• High current gain
• Low collector-emitter saturation voltage
• Low noise between 30 Hz and 15 kHz
• Complementary types:
BC857...-BC860...(PNP)
• Pb-free (RoHS compliant) package
• Qualified according AEC Q1011)
1BC847BL3 is not qualified according AEC Q101
Type Marking Pin Configuration Package
BC847A
BC847B
BC847BL3*
BC847BW
BC847C
BC847CW
BC848A
BC848B
BC848BL3
BC848BW
BC848C
BC848CW
BC849B
BC849C
BC849CW
BC850B
BC850BW
BC850C
BC850CW
1Es
1Fs
1F
1Fs
1Gs
1Gs
1Js
1Ks
1K
1Ks
1Ls
1Ls
2Bs
2Cs
2Cs
2Fs
2Fs
2Gs
2Gs
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
1=B
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
2=E
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
3=C
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SOT23
SOT23
TSLP-3-1
SOT323
SOT23
SOT323
SOT23
SOT23
TSLP-3-1
SOT323
SOT23
SOT323
SOT23
SOT23
SOT323
SOT23
SOT323
SOT23
SOT323
* Not qualified according AEC Q101
2011-09-092
BC847...-BC850...
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage
BC847..., BC850...
BC848..., BC849...
VCEO
45
30
V
Collector-emitter voltage
BC847..., BC850...
BC848..., BC849...
VCES
50
30
Collector-base voltage
BC847..., BC850...
BC848..., BC849...
VCBO
50
30
Emitter-base voltage
BC847..., BC850...
BC848..., BC849...
VEBO
6
6
Collector current IC 100 mA
Peak collector current, tp ≤ 10 ms ICM 200
Total power dissipation-
TS ≤ 71 °C, BC847-BC850
TS ≤ 135 °C, BC847BL3-BC848BL3
TS ≤ 124 °C, BC847W-BC850W
Ptot
330
250
250
mW
Junction temperature Tj 150 °C
Storage temperature Tstg -65 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BC847-BC850
BC847BL3-BC848BL3
BC847W-BC850W
RthJS
≤ 240
≤ 60
≤ 105
K/W
1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation)
2011-09-093
BC847...-BC850...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 10 mA, IB = 0 , BC847..., BC850...
IC = 10 mA, IB = 0 , BC848..., BC849...
V(BR)CEO
45
30
-
-
-
-
V
Collector-base breakdown voltage
IC = 10 µA, IE = 0 , BC847..., BC850...
IC = 10 µA, IE = 0 , BC848..., BC849...
V(BR)CBO
50
30
-
-
-
-
Emitter-base breakdown voltage
IE = 0 , IC = 10 µA
V(BR)EBO - 6 -
Collector-base cutoff current
VCB = 45 V, IE = 0
VCB = 30 V, IE = 0 , TA = 150 °C
ICBO
-
-
0.015
5
-
-
µA
DC current gain1)
IC = 10 µA, VCE = 5 V, hFE-grp.A
IC = 10 µA, VCE = 5 V, hFE-grp.B
IC = 10 µA, VCE = 5 V, hFE-grp.C
IC = 2 mA, VCE = 5 V, hFE-grp.A
IC = 2 mA, VCE = 5 V, hFE-grp.B
IC = 2 mA, VCE = 5 V, hFE-grp.C
hFE
-
-
-
110
200
420
140
250
480
180
290
520
-
-
-
220
450
800
-
Collector-emitter saturation voltage1)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
VCEsat
-
-
90
200
250
600
mV
Base emitter saturation voltage1)
IC = 10 mA, IB = 0.5 mA
IC = 100 mA, IB = 5 mA
VBEsat
-
-
700
900
-
-
Base-emitter voltage1)
IC = 2 mA, VCE = 5 V
IC = 10 mA, VCE = 5 V
VBE(ON)
580
-
660
-
700
770
1Pulse test: t < 300µs; D < 2%
2011-09-094
BC847...-BC850...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
AC Characteristics
Transition frequency
IC = 10 mA, VCE = 5 V, f = 100 MHz
fT - 250 - MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz
Ccb - 0.95 - pF
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz
Ceb - 9 -
Short-circuit input impedance
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
h11e
-
-
-
2.7
4.5
8.7
-
-
-
kΩ
Open-circuit reverse voltage transf. ratio
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
h12e
-
-
-
1.5
2
3
-
-
-
10-4
Short-circuit forward current transf. ratio
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
h21e
-
-
-
200
330
600
-
-
-
Open-circuit output admittance
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B
IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C
h22e
-
-
-
18
30
60
-
-
-
µS
Noise figure
IC = 200 µA, VCE = 5 V, f = 1 kHz,
∆ f = 200 Hz, RS = 2 kΩ, BC849..., BC850...
F - 1.2 4 dB
Equivalent noise voltage
IC = 200 µA, VCE = 5 V, RS = 2 kΩ,
f = 10 ... 50 Hz , BC850...
Vn - - 0.135 µV
2011-09-095
BC847...-BC850...
DC current gain hFE = ƒ(IC)
VCE = 5 V
10 10 10 10
EHP00365
h
mA-2 -1 1 2
FE
310
102
010
5
5
101
010
5
5 5 5
100
25
-50
ΙC
C
C
C
Collector-emitter saturation voltage
IC = ƒ(VCEsat), hFE = 20
10
0
EHP00367
VCEsat
10
mA
10
Ι C
10
2
1
0
-1
5
5
V0.3 0.5
100
25
-50
0.1 0.2 0.4
C
C
C
Base-emitter saturation voltage
IC = ƒ(VBEsat), hFE = 20
0
10
EHP00364
BEsatV
0.6 V 1.2
-1
100
101
2
10
5
5
Ι C mA
0.2 0.4 0.8
C25
C100 C
-50 C
Collector cutoff current ICBO = ƒ(TA)
VCB = 30 V
10
0 50 100 150
EHP00415
TA
10
nA
10
Ι CB0
10
10
4
3
2
1
0
max
typ
5
5
5
˚C
2011-09-096
BC847...-BC850...
Transition frequency fT = ƒ(IC)
VCE = 5 V
10 10 10 10
EHP00363
f
mA
MHz
-1 0 1 25
T
310
102
110
5
5
5
Ι C
Collector-base capacitance Ccb = ƒ(VCB)
Emitter-base capacitance Ceb = ƒ(VEB)
0 4 8 12 16 V 22
VCB/VEB
0
1
2
3
4
5
6
7
8
9
10
11
pF
13
CCB/CEB
CCB
CEB
Total power dissipation Ptot = ƒ(TS)
BC847-BC850
0 15 30 45 60 75 90 105 120 °C 150
TS
0
30
60
90
120
150
180
210
240
270
300
mW
360
Ptot
Total power dissipation Ptot = ƒ(TS)
BC847BL3/BC848BL3
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
2011-09-097
BC847...-BC850...
Total power dissipation Ptot = ƒ(TS)
BC847W-BC850W
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BC847/W-BC850/W
10
EHP00362
-6
0
10
5
D =
5
101
102
3
10
10-5
10-4
10-3
10-2
100
s
0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
t p
=D
T
t p
T
totmax
totP DC
P
pt
Permissible Puls Load RthJS = ƒ (tp)
BC847BL3, BC848BL3
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
0
s
tp
-1
10
0
10
1
10
2
10
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BC847BL3, BC848BL3
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
0
s
tp
0
10
1
10
2
10
3
10
Ptotmax/PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2011-09-098
BC847...-BC850...
Noise figure F = ƒ(VCE)
IC = 0.2mA, RS = 2kΩ , f = 1kHz
0
10 10 10 10
BC 846...850 EHP00370
VCE
F
V
10
5
15
dB
20
-1 0 1 25
Noise figure F = ƒ(f)
IC = 0.2 mA, VCE = 5V, RS = 2 kΩ
10 10 10 10
BC 846...850 EHP00371
F
kHz
dB
-2 -1 1 2
20
10
0
5
15
f
010
Noise figure F = ƒ(IC)
VCE = 5V, f = 120Hz
10 10 10 10
BC 846...850 EHP00372
F
mA-3 -2 0 1
20
10
0
5
15
-110
= 1 M 100 k 10 k
dB
500
1 k
Ω Ω ΩSR
Ω
Ω
CΙ
Noise figure F = ƒ(IC)
VCE = 5V, f = 1kHz
10 10 10 10
BC 846...850 EHP00373
F
mA-3 -2 0 1
20
10
0
5
15
-110
= 1 M 100 k 10 k
dB
500
1 k
Ω Ω ΩSR
Ω
Ω
CΙ
2011-09-099
BC847...-BC850...
Noise figure F = ƒ(IC)
VCE = 5V, f = 10kHz
10 10 10 10
BC 846...850 EHP00374
F
mA-3 -2 0 1
20
10
0
5
15
-110
= 1 M
100 k
10 k
dB
500
1 k
Ω
Ω
Ω
SR
Ω
Ω
CΙ
2011-09-0910
BC847...-BC850...Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EHs
BCW66
Type code
Pin 1
0.8
0.90.91.3
0.8 1.2
0.25 M B C
1.9
-0.05
+0.1
0.4
±0.12.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚MAX.
0.08...0.15
1.3±0.1
10˚MAX.
M
2.4±0.15
±0.11
A
0.15MIN.
1)
1) Lead width can be 0.6 max. in dambar area
1 2
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15Pin 1
Manufacturer
2005, June
Date code (YM)
2011-09-0911
BC847...-BC850...Package SOT323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.25±0.1
0.1 MAX.
2.1±0.1
0.15+0.1
-0.05
0.3+0.1
±0.10.9
1 2
3
A
±0.22
-0.05
0.650.65
M
3x
0.1
0.1MIN.
0.1
M0.2 A
0.24
2.15 1.1
8
2.3
Pin 1
Pin 1
2005, June
Date code (YM)
BCR108W
Type code
0.6
0.8
1.6
0.65
0.65
Manufacturer
2011-09-0912
BC847...-BC850...Package TSLP-3-1
2
3
1
0.4+0.1
BFR193L3
Type code
Pin 1 marking
Laser marking
0.76
4
1.16
0.5
Pin 1
marking
8
Reel ø180 mm = 15.000 Pieces/Reel
For board assembly information please refer to Infineon website "Packages"
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Stencil aperturesCopper Solder mask
0.275
0.2
0.315
0.945
0.45
0.17
0.355
0.2
0.35
0.225
1
0.6
0.225
0.15
0.35
0.3
R0.1
12
±0.050.35
±0.0352x0.15
1)
Top view Bottom view
1) Dimension applies to plated terminal
±0.0350.5
1)
±0.050.6
3
±0.050.65
±0.0352x0.25
1)
±0.0350.25
1)
1±0.05
Pin 1
marking
0.05 MAX.
2011-09-0913
BC847...-BC850...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.

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NPN Silicon AF Transistors | Infineon Technologies

  • 1. 2011-09-091 BC847...-BC850... NPN Silicon AF Transistors • For AF input stages and driver applications • High current gain • Low collector-emitter saturation voltage • Low noise between 30 Hz and 15 kHz • Complementary types: BC857...-BC860...(PNP) • Pb-free (RoHS compliant) package • Qualified according AEC Q1011) 1BC847BL3 is not qualified according AEC Q101 Type Marking Pin Configuration Package BC847A BC847B BC847BL3* BC847BW BC847C BC847CW BC848A BC848B BC848BL3 BC848BW BC848C BC848CW BC849B BC849C BC849CW BC850B BC850BW BC850C BC850CW 1Es 1Fs 1F 1Fs 1Gs 1Gs 1Js 1Ks 1K 1Ks 1Ls 1Ls 2Bs 2Cs 2Cs 2Fs 2Fs 2Gs 2Gs 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 1=B 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 2=E 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C 3=C - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - SOT23 SOT23 TSLP-3-1 SOT323 SOT23 SOT323 SOT23 SOT23 TSLP-3-1 SOT323 SOT23 SOT323 SOT23 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 * Not qualified according AEC Q101
  • 2. 2011-09-092 BC847...-BC850... Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage BC847..., BC850... BC848..., BC849... VCEO 45 30 V Collector-emitter voltage BC847..., BC850... BC848..., BC849... VCES 50 30 Collector-base voltage BC847..., BC850... BC848..., BC849... VCBO 50 30 Emitter-base voltage BC847..., BC850... BC848..., BC849... VEBO 6 6 Collector current IC 100 mA Peak collector current, tp ≤ 10 ms ICM 200 Total power dissipation- TS ≤ 71 °C, BC847-BC850 TS ≤ 135 °C, BC847BL3-BC848BL3 TS ≤ 124 °C, BC847W-BC850W Ptot 330 250 250 mW Junction temperature Tj 150 °C Storage temperature Tstg -65 ... 150 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) BC847-BC850 BC847BL3-BC848BL3 BC847W-BC850W RthJS ≤ 240 ≤ 60 ≤ 105 K/W 1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation)
  • 3. 2011-09-093 BC847...-BC850... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage IC = 10 mA, IB = 0 , BC847..., BC850... IC = 10 mA, IB = 0 , BC848..., BC849... V(BR)CEO 45 30 - - - - V Collector-base breakdown voltage IC = 10 µA, IE = 0 , BC847..., BC850... IC = 10 µA, IE = 0 , BC848..., BC849... V(BR)CBO 50 30 - - - - Emitter-base breakdown voltage IE = 0 , IC = 10 µA V(BR)EBO - 6 - Collector-base cutoff current VCB = 45 V, IE = 0 VCB = 30 V, IE = 0 , TA = 150 °C ICBO - - 0.015 5 - - µA DC current gain1) IC = 10 µA, VCE = 5 V, hFE-grp.A IC = 10 µA, VCE = 5 V, hFE-grp.B IC = 10 µA, VCE = 5 V, hFE-grp.C IC = 2 mA, VCE = 5 V, hFE-grp.A IC = 2 mA, VCE = 5 V, hFE-grp.B IC = 2 mA, VCE = 5 V, hFE-grp.C hFE - - - 110 200 420 140 250 480 180 290 520 - - - 220 450 800 - Collector-emitter saturation voltage1) IC = 10 mA, IB = 0.5 mA IC = 100 mA, IB = 5 mA VCEsat - - 90 200 250 600 mV Base emitter saturation voltage1) IC = 10 mA, IB = 0.5 mA IC = 100 mA, IB = 5 mA VBEsat - - 700 900 - - Base-emitter voltage1) IC = 2 mA, VCE = 5 V IC = 10 mA, VCE = 5 V VBE(ON) 580 - 660 - 700 770 1Pulse test: t < 300µs; D < 2%
  • 4. 2011-09-094 BC847...-BC850... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics Transition frequency IC = 10 mA, VCE = 5 V, f = 100 MHz fT - 250 - MHz Collector-base capacitance VCB = 10 V, f = 1 MHz Ccb - 0.95 - pF Emitter-base capacitance VEB = 0.5 V, f = 1 MHz Ceb - 9 - Short-circuit input impedance IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C h11e - - - 2.7 4.5 8.7 - - - kΩ Open-circuit reverse voltage transf. ratio IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C h12e - - - 1.5 2 3 - - - 10-4 Short-circuit forward current transf. ratio IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C h21e - - - 200 330 600 - - - Open-circuit output admittance IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C h22e - - - 18 30 60 - - - µS Noise figure IC = 200 µA, VCE = 5 V, f = 1 kHz, ∆ f = 200 Hz, RS = 2 kΩ, BC849..., BC850... F - 1.2 4 dB Equivalent noise voltage IC = 200 µA, VCE = 5 V, RS = 2 kΩ, f = 10 ... 50 Hz , BC850... Vn - - 0.135 µV
  • 5. 2011-09-095 BC847...-BC850... DC current gain hFE = ƒ(IC) VCE = 5 V 10 10 10 10 EHP00365 h mA-2 -1 1 2 FE 310 102 010 5 5 101 010 5 5 5 5 100 25 -50 ΙC C C C Collector-emitter saturation voltage IC = ƒ(VCEsat), hFE = 20 10 0 EHP00367 VCEsat 10 mA 10 Ι C 10 2 1 0 -1 5 5 V0.3 0.5 100 25 -50 0.1 0.2 0.4 C C C Base-emitter saturation voltage IC = ƒ(VBEsat), hFE = 20 0 10 EHP00364 BEsatV 0.6 V 1.2 -1 100 101 2 10 5 5 Ι C mA 0.2 0.4 0.8 C25 C100 C -50 C Collector cutoff current ICBO = ƒ(TA) VCB = 30 V 10 0 50 100 150 EHP00415 TA 10 nA 10 Ι CB0 10 10 4 3 2 1 0 max typ 5 5 5 ˚C
  • 6. 2011-09-096 BC847...-BC850... Transition frequency fT = ƒ(IC) VCE = 5 V 10 10 10 10 EHP00363 f mA MHz -1 0 1 25 T 310 102 110 5 5 5 Ι C Collector-base capacitance Ccb = ƒ(VCB) Emitter-base capacitance Ceb = ƒ(VEB) 0 4 8 12 16 V 22 VCB/VEB 0 1 2 3 4 5 6 7 8 9 10 11 pF 13 CCB/CEB CCB CEB Total power dissipation Ptot = ƒ(TS) BC847-BC850 0 15 30 45 60 75 90 105 120 °C 150 TS 0 30 60 90 120 150 180 210 240 270 300 mW 360 Ptot Total power dissipation Ptot = ƒ(TS) BC847BL3/BC848BL3 0 15 30 45 60 75 90 105 120 °C 150 TS 0 25 50 75 100 125 150 175 200 225 250 mW 300 Ptot
  • 7. 2011-09-097 BC847...-BC850... Total power dissipation Ptot = ƒ(TS) BC847W-BC850W 0 15 30 45 60 75 90 105 120 °C 150 TS 0 25 50 75 100 125 150 175 200 225 250 mW 300 Ptot Permissible Pulse Load Ptotmax/PtotDC = ƒ(tp) BC847/W-BC850/W 10 EHP00362 -6 0 10 5 D = 5 101 102 3 10 10-5 10-4 10-3 10-2 100 s 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 t p =D T t p T totmax totP DC P pt Permissible Puls Load RthJS = ƒ (tp) BC847BL3, BC848BL3 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp -1 10 0 10 1 10 2 10 RthJS 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0 Permissible Pulse Load Ptotmax/PtotDC = ƒ(tp) BC847BL3, BC848BL3 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp 0 10 1 10 2 10 3 10 Ptotmax/PtotDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
  • 8. 2011-09-098 BC847...-BC850... Noise figure F = ƒ(VCE) IC = 0.2mA, RS = 2kΩ , f = 1kHz 0 10 10 10 10 BC 846...850 EHP00370 VCE F V 10 5 15 dB 20 -1 0 1 25 Noise figure F = ƒ(f) IC = 0.2 mA, VCE = 5V, RS = 2 kΩ 10 10 10 10 BC 846...850 EHP00371 F kHz dB -2 -1 1 2 20 10 0 5 15 f 010 Noise figure F = ƒ(IC) VCE = 5V, f = 120Hz 10 10 10 10 BC 846...850 EHP00372 F mA-3 -2 0 1 20 10 0 5 15 -110 = 1 M 100 k 10 k dB 500 1 k Ω Ω ΩSR Ω Ω CΙ Noise figure F = ƒ(IC) VCE = 5V, f = 1kHz 10 10 10 10 BC 846...850 EHP00373 F mA-3 -2 0 1 20 10 0 5 15 -110 = 1 M 100 k 10 k dB 500 1 k Ω Ω ΩSR Ω Ω CΙ
  • 9. 2011-09-099 BC847...-BC850... Noise figure F = ƒ(IC) VCE = 5V, f = 10kHz 10 10 10 10 BC 846...850 EHP00374 F mA-3 -2 0 1 20 10 0 5 15 -110 = 1 M 100 k 10 k dB 500 1 k Ω Ω Ω SR Ω Ω CΙ
  • 10. 2011-09-0910 BC847...-BC850...Package SOT23 Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel EHs BCW66 Type code Pin 1 0.8 0.90.91.3 0.8 1.2 0.25 M B C 1.9 -0.05 +0.1 0.4 ±0.12.9 0.95 C B 0...8˚ 0.2 A 0.1 MAX. 10˚MAX. 0.08...0.15 1.3±0.1 10˚MAX. M 2.4±0.15 ±0.11 A 0.15MIN. 1) 1) Lead width can be 0.6 max. in dambar area 1 2 3 3.15 4 2.65 2.13 0.9 8 0.2 1.15Pin 1 Manufacturer 2005, June Date code (YM)
  • 11. 2011-09-0911 BC847...-BC850...Package SOT323 Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 1.25±0.1 0.1 MAX. 2.1±0.1 0.15+0.1 -0.05 0.3+0.1 ±0.10.9 1 2 3 A ±0.22 -0.05 0.650.65 M 3x 0.1 0.1MIN. 0.1 M0.2 A 0.24 2.15 1.1 8 2.3 Pin 1 Pin 1 2005, June Date code (YM) BCR108W Type code 0.6 0.8 1.6 0.65 0.65 Manufacturer
  • 12. 2011-09-0912 BC847...-BC850...Package TSLP-3-1 2 3 1 0.4+0.1 BFR193L3 Type code Pin 1 marking Laser marking 0.76 4 1.16 0.5 Pin 1 marking 8 Reel ø180 mm = 15.000 Pieces/Reel For board assembly information please refer to Infineon website "Packages" Package Outline Foot Print Marking Layout (Example) Standard Packing Stencil aperturesCopper Solder mask 0.275 0.2 0.315 0.945 0.45 0.17 0.355 0.2 0.35 0.225 1 0.6 0.225 0.15 0.35 0.3 R0.1 12 ±0.050.35 ±0.0352x0.15 1) Top view Bottom view 1) Dimension applies to plated terminal ±0.0350.5 1) ±0.050.6 3 ±0.050.65 ±0.0352x0.25 1) ±0.0350.25 1) 1±0.05 Pin 1 marking 0.05 MAX.
  • 13. 2011-09-0913 BC847...-BC850... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.