This document discusses optical inspection technologies for 3D packaging. It describes Frontier Semiconductor's Virtual Interface Technology (VIT) and 3D Inspection (3DI) which allow for high-throughput metrology of features used in 3D packaging. VIT enables measurement of through-silicon via depth and profile, remaining silicon thickness, and copper heights. 3DI enables simultaneous height measurement of bumps, pillars and other interconnect features. Scanning white light interferometry is also discussed as another metrology technique for measuring surface topography.
This document describes a new 3D Areal Image (3D-AI) sensor that can measure the heights of hundreds of micro-scale bumps or other interconnect features simultaneously. The sensor uses phase imaging to measure the height of each feature in its field of view in parallel. Initial tests show it can accurately measure features from a few microns like copper nails to tens of microns like solder bumps used in chip packaging. The sensor provides both 3D metrology for height and coplanarity inspection as well as 2D defect detection in a single tool, offering high throughput needed for production. Measurements of micro bumps, C4 bumps, and copper nails demonstrate its capability and correlation to other metrology tools
This document proposes a blind, robust watermarking technique for 3D triangular mesh models using neural networks. It selects optimal watermark carrier vertices using self-organizing maps (SOM) neural networks to cluster vertices by smoothness. Watermark bits are embedded in the selected vertices using local statistical measures. Experimental results show the watermarks can be extracted without re-alignment or re-meshing after various attacks, demonstrating the technique's robustness. The approach is compared to other blind 3D watermarking methods and proves efficient in terms of robustness and imperceptibility.
Laboratory X-ray CT Applied to the Characterisation of Tubular Composite Spec...Fabien Léonard
This study used X-ray computed tomography (XCT) to characterize defects in a tubular composite specimen. Standard measurements found voids made up 3.1% of the specimen volume. Advanced analysis mapped voids spatially, finding they were concentrated in three radial locations. Vertical cracks near the inner surface were attributed to removal from the manufacturing mandrel, while circumferential cracks further out were linked to thermal stresses during manufacturing. Overall, the study demonstrated how XCT can provide both standard and advanced 3D characterization of defects in tubular composites.
Rician Noise Reduction with SVM and Iterative Bilateral Filter in Different T...IJMERJOURNAL
ABSTRACT: Parallel magnetic resonance imaging (pMRI) techniques can speed up MRI scan through a multi-channel coil array receiving signal simultaneously. Nevertheless, noise amplification and aliasing artifacts are serious in pMRI reconstructed images at high accelerations. Image Denoising is one of the most challenging task because image denoising techniques not only poised some technical difficulties, but also may result in the destruction of the image (i.e. making it blur) if not effectively and adequately applied to image. This study presents a patch-wise de-noising method for pMRI by exploiting the rank deficiency of multi-Channel coil images and sparsity of artifacts. For each processed patch, similar patches a researched in spatial domain and through-out all coil elements, and arranged in appropriate matrix forms. Then, noise and aliasing artifacts are removed from the structured Matrix by applying sparse and low rank matrix decomposition method. The proposed method has been validated using both phantom and in vivo brain data sets, producing encouraging results. Specifically, the method can effectively remove both noise and residual aliasing artifact from pMRI reconstructed noisy images, and produce higher peak signal noise rate (PSNR) and structural similarity index matrix (SSIM) than other state-of-the-art De-noising methods. We propose image de-noising using low rank matrix decomposition (LMRD) and Support vector machine (SVM). The aim of Low Rank Matrix approximation based image enhancement is that it removes the various types of noises in the contaminated image simultaneously. The main contribution is to explore the image denoising low-rank property and the applications of LRMD for enhanced image Denoising, Then support vector machine is applied over the result.
Comparative studies of multiscale edge detection using different edge detecto...journalBEEI
The document presents a comparative study of multiscale edge detection using different edge detectors for MRI thigh images. It proposes a multiscale edge detection method that uses averaging filters at three scales to smooth images. Edges are then extracted from the smoothed images using Prewitt, Sobel, and Laplacian detectors. The edges extracted from each scale are combined to form the final multiscale edge detection. Experimental results found Prewitt and Sobel extracted clear boundaries, while Laplacian extracted more fine details but with more discontinuities and noise. The proposed multiscale method extracts edges at different scales and combines them to provide more robust edge detection for MRI thigh images.
1. Digital Image Correlation (DIC) is an optical full field measurement technique that can measure shape, deformation, and strain without contact.
2. DIC works by tracking subsets between images from two cameras to reconstruct the contour and calculate displacement and strain fields.
3. DIC has been used to measure major and minor strains inside and outside necking zones of plastics under tension, and to measure average strain of aluminum during edge stretching limit tests.
Formation and morphology of architectural surfaces designIJSRED
This document summarizes a study that examines the relationship between the fractal dimension of solid surfaces and the size and composition of particles that form the surfaces. Specifically, the study experimentally determines how the fractal dimension of surfaces formed from cement-stone dust mixtures varies with the surface area and composition of the stone dust particles. The fractal dimension, a measure of surface roughness, was calculated from images of 12 sample surfaces that varied in particle size and cement concentration. Statistical analysis found the fractal dimension was significantly influenced by the specific surface area of particles but not their composition.
This document discusses lithography techniques used in integrated circuit manufacturing. It begins by providing an analogy between lithography in art and lithography in semiconductor manufacturing. It then describes optical lithography techniques including proximity printing and projection printing. Proximity printing uses masks placed near wafers, while projection printing uses an imaging system between masks and wafers to achieve higher resolution. Key parameters like numerical aperture and depth of focus that determine achievable resolution are defined.
This document describes a new 3D Areal Image (3D-AI) sensor that can measure the heights of hundreds of micro-scale bumps or other interconnect features simultaneously. The sensor uses phase imaging to measure the height of each feature in its field of view in parallel. Initial tests show it can accurately measure features from a few microns like copper nails to tens of microns like solder bumps used in chip packaging. The sensor provides both 3D metrology for height and coplanarity inspection as well as 2D defect detection in a single tool, offering high throughput needed for production. Measurements of micro bumps, C4 bumps, and copper nails demonstrate its capability and correlation to other metrology tools
This document proposes a blind, robust watermarking technique for 3D triangular mesh models using neural networks. It selects optimal watermark carrier vertices using self-organizing maps (SOM) neural networks to cluster vertices by smoothness. Watermark bits are embedded in the selected vertices using local statistical measures. Experimental results show the watermarks can be extracted without re-alignment or re-meshing after various attacks, demonstrating the technique's robustness. The approach is compared to other blind 3D watermarking methods and proves efficient in terms of robustness and imperceptibility.
Laboratory X-ray CT Applied to the Characterisation of Tubular Composite Spec...Fabien Léonard
This study used X-ray computed tomography (XCT) to characterize defects in a tubular composite specimen. Standard measurements found voids made up 3.1% of the specimen volume. Advanced analysis mapped voids spatially, finding they were concentrated in three radial locations. Vertical cracks near the inner surface were attributed to removal from the manufacturing mandrel, while circumferential cracks further out were linked to thermal stresses during manufacturing. Overall, the study demonstrated how XCT can provide both standard and advanced 3D characterization of defects in tubular composites.
Rician Noise Reduction with SVM and Iterative Bilateral Filter in Different T...IJMERJOURNAL
ABSTRACT: Parallel magnetic resonance imaging (pMRI) techniques can speed up MRI scan through a multi-channel coil array receiving signal simultaneously. Nevertheless, noise amplification and aliasing artifacts are serious in pMRI reconstructed images at high accelerations. Image Denoising is one of the most challenging task because image denoising techniques not only poised some technical difficulties, but also may result in the destruction of the image (i.e. making it blur) if not effectively and adequately applied to image. This study presents a patch-wise de-noising method for pMRI by exploiting the rank deficiency of multi-Channel coil images and sparsity of artifacts. For each processed patch, similar patches a researched in spatial domain and through-out all coil elements, and arranged in appropriate matrix forms. Then, noise and aliasing artifacts are removed from the structured Matrix by applying sparse and low rank matrix decomposition method. The proposed method has been validated using both phantom and in vivo brain data sets, producing encouraging results. Specifically, the method can effectively remove both noise and residual aliasing artifact from pMRI reconstructed noisy images, and produce higher peak signal noise rate (PSNR) and structural similarity index matrix (SSIM) than other state-of-the-art De-noising methods. We propose image de-noising using low rank matrix decomposition (LMRD) and Support vector machine (SVM). The aim of Low Rank Matrix approximation based image enhancement is that it removes the various types of noises in the contaminated image simultaneously. The main contribution is to explore the image denoising low-rank property and the applications of LRMD for enhanced image Denoising, Then support vector machine is applied over the result.
Comparative studies of multiscale edge detection using different edge detecto...journalBEEI
The document presents a comparative study of multiscale edge detection using different edge detectors for MRI thigh images. It proposes a multiscale edge detection method that uses averaging filters at three scales to smooth images. Edges are then extracted from the smoothed images using Prewitt, Sobel, and Laplacian detectors. The edges extracted from each scale are combined to form the final multiscale edge detection. Experimental results found Prewitt and Sobel extracted clear boundaries, while Laplacian extracted more fine details but with more discontinuities and noise. The proposed multiscale method extracts edges at different scales and combines them to provide more robust edge detection for MRI thigh images.
1. Digital Image Correlation (DIC) is an optical full field measurement technique that can measure shape, deformation, and strain without contact.
2. DIC works by tracking subsets between images from two cameras to reconstruct the contour and calculate displacement and strain fields.
3. DIC has been used to measure major and minor strains inside and outside necking zones of plastics under tension, and to measure average strain of aluminum during edge stretching limit tests.
Formation and morphology of architectural surfaces designIJSRED
This document summarizes a study that examines the relationship between the fractal dimension of solid surfaces and the size and composition of particles that form the surfaces. Specifically, the study experimentally determines how the fractal dimension of surfaces formed from cement-stone dust mixtures varies with the surface area and composition of the stone dust particles. The fractal dimension, a measure of surface roughness, was calculated from images of 12 sample surfaces that varied in particle size and cement concentration. Statistical analysis found the fractal dimension was significantly influenced by the specific surface area of particles but not their composition.
This document discusses lithography techniques used in integrated circuit manufacturing. It begins by providing an analogy between lithography in art and lithography in semiconductor manufacturing. It then describes optical lithography techniques including proximity printing and projection printing. Proximity printing uses masks placed near wafers, while projection printing uses an imaging system between masks and wafers to achieve higher resolution. Key parameters like numerical aperture and depth of focus that determine achievable resolution are defined.
Spectroscopic reflectance is a powerful method for thickness and n&k measurement of the translucent film. MProbe system makes this measurement easy and reliable
http://www.semiconsoft.com/wp/mprobe20desktop/
A NOVEL APPROACH TO SMOOTHING ON 3D STRUCTURED ADAPTIVE MESH OF THE KINECT-BA...csandit
3-dimensional object modelling of real world objects in steady state by means of multiple point
cloud (pcl) depth scans taken by using sensing camera and application of smoothing algorithm
are suggested in this study. Polygon structure, which is constituted by coordinates of point
cloud (x,y,z) corresponding to the position of 3D model in space and obtained by nodal points
and connection of these points by means of triangulation, is utilized for the demonstration of 3D
models. Gaussian smoothing and developed methods are applied to the mesh consisting of
merge of these polygons, and a new mesh simplification and augmentation algorithm are
suggested for the over the 3D modelling. Mesh consisting of merge of polygons can be
demonstrated in a more packed, smooth and fluent way. In this study is shown that applied the
triangulation and smoothing method for 3D modelling, perform to a fast and robust mesh
structures compared to existing methods therewithal no remeshing is necessary for refinement
and reduction.
This document describes a computational endomicroscopy platform that uses compressed sensing to achieve higher resolution images than the physical sensor resolution allows. It uses a digital micromirror device as a spatial light modulator to modulate scenes at a conjugate image plane. A camera then collects multiple coded measurements to reconstruct higher resolution images through compressed sensing algorithms. Experiments demonstrate reconstructing higher resolution images than the individual fiber spacing of fiber optic bundles used in endomicroscopy. Future work aims to further reduce measurements needed and apply the techniques to fiber bundle platforms.
This document summarizes a paper that proposes an automated method for segmenting lungs from digital tomosynthesis (DTS) images. DTS produces blurred slice images of the chest that are harder to segment than CT images. The proposed method combines three approaches: intensity-based segmentation, gradient-based segmentation, and energy-based segmentation. It starts from a previously published gradient-based dynamic programming approach but adds improvements to increase robustness. Experimental results on simulated DTS images generated from CT images show the combined method reduces incorrectly segmented lung regions compared to previous methods.
Compact lpf design with low cutoff frequency using v shaped dgs structureIAEME Publication
This document describes a compact microstrip low pass filter (LPF) design with a low cutoff frequency, broad stopband, and high stopband attenuation. It introduces a new V-shaped defected ground structure (DGS) to reduce the cutoff frequency compared to a previous design using a double U-shaped DGS, while maintaining the same compact size. Simulations show the V-shaped DGS design can achieve 3dB cutoff frequencies as low as 1.2 GHz, compared to 2.7 GHz for the previous design. Measured results for a fabricated filter match well with simulations, validating the compact low frequency LPF design enabled by the V-shaped DGS structure.
BAYESIAN CLASSIFICATION OF FABRICS USING BINARY CO-OCCURRENCE MATRIXijistjournal
Classification of fabrics is usually performed manually which requires considerable human efforts. The goal of this paper is to recognize and classify the types of fabrics, in order to identify a weave pattern automatically using image processing system. In this paper, fabric texture feature is extracted using Grey Level Co-occurrence Matrices as well as Binary Level Co-occurrence Matrices. The Co-occurrence matrices functions characterize the texture of an image by calculating how often pairs of pixel with specific values and in a specified spatial relationship occur in an image, and then extracting statistical measures from this matrix. The extracted features from GLCM and BLCM are used to classify the texture by Bayesian classifier to compare their effectiveness.
International Journal of Engineering Research and DevelopmentIJERD Editor
This document summarizes a study on context-based image segmentation of radiography images to detect defects in welds. The researchers developed a simple image processing technique that uses contextual knowledge about radiography images rather than standard techniques. They first identify regions of interest using edge detection. They then segment potential flaws from the image using a statistical threshold based on the mean and standard deviation of pixel values in neighboring regions, rather than global thresholding. They show their technique successfully segments flaws like porosity and fine cracks from test images. Future work will involve extracting features of segmented flaws and using machine learning for classification.
This document summarizes research using x-ray tomography to characterize the 3D structure of paper at the micrometer scale. Key findings include: (1) The structure is similar across samples with minor variations in properties like porosity and formation; (2) Pore size distributions match those from fiber deposition simulations; and (3) Layered deposition with pore filling in simulations better matches experimental measurements of formation and pore structure than uniform deposition alone. Future work will combine macro- and micro-scale models to study size-dependent properties and add fiber interactions between layers.
Noise reduction based on partial reference, dual-tree complex wavelet transfo...JPINFOTECH JAYAPRAKASH
This paper proposes a novel method for reducing noise introduced by image enhancement methods such as random spray sampling. The method uses the dual-tree complex wavelet transform to analyze the luma channel of the original non-enhanced image and enhanced noisy image. It computes the standard deviation of coefficients across orientations in the original image to create a directional structure map. This map is used to shrink the coefficients of the enhanced image before mixing with the original image coefficients based on orientation. This allows noise reduction without assumptions about the noise statistics, using the original image as a partial reference. Evaluation shows the validity of the approach.
This document discusses fingerprint identification and reconstruction from minutiae points. It begins with an introduction to fingerprint identification and the minutiae features used for comparison. It then outlines the hardware and software requirements for the project, including the use of MATLAB. The main body of the document describes the process of minutiae extraction from fingerprints and using the minutiae points to reconstruct fingerprint images through estimating ridge orientation, constructing streamlines, and enhancing the ridge structure. Implementation details are provided for image enhancement, thinning, and minutiae extraction steps. The document concludes by noting the scope for further improvements and accuracy.
Coastal erosion management using image processing and Node Oriented Programming AbdAllah Aly
Presentation of my Thesis with the title "Coastal erosion management using image processing and Node Oriented Programming" for achieving my Masters Degree in Computer and Automation Engineering from Siena University, Italy.
EVP Plus Software delivers state-of-the-art image processing for CR and DR sy...Carestream
Radiographic technologists expect a high degree of
automation and efficiency in the technology they use in their
daily workflow, which means they expect minimal interaction
with the technology’s modality software. At the same time,
radiologists also need the flexibility to specify their site’s
individualized diagnostic viewing preferences. The CARESTREAM DirectView EVP Plus Software successfully
overcomes this challenge for digital-projection radiography.
EVP Plus automatically processes and delivers diagnostic-quality DR and CR images to PACS, based on look preferences that can be uniquely specified by each site.
A Novel 2D Feature Extraction Method for Fingerprints Using Minutiae Points a...IJECEIAES
The field of biometrics has evolved tremendously for over the last century. Yet scientists are still continuing to come up with precise and efficient algorithms to facilitate automatic fingerprint recognition systems. Like other applications, an efficient feature extraction method plays an important role in fingerprint based recognition systems. This paper proposes a novel feature extraction method using minutiae points of a fingerprint image and their intersections. In this method, initially, it calculates the ridge ends and ridge bifurcations of each fingerprint image. And then, it estimates the minutiae points for the intersection of each ridge end and ridge bifurcation. In the experimental evaluation, we tested the extracted features of our proposed model using a support vector machine (SVM) classifier and experimental results show that the proposed method can accurately classify different fingerprint images.
Pamela Armbrister is seeking a position that allows her to utilize her 15 years of experience in real estate, mortgage lending, and small business ownership. She has held roles organizing mortgage files, researching property records, and ensuring documentation compliance. Armbrister also has experience listing, selling, and marketing real estate and REO properties. She is proficient in various software programs and possesses strong customer service, communication, and teamwork skills.
Woody Williams is an experienced project manager seeking new opportunities. He has over 10 years of experience successfully delivering projects exceeding $1 billion on budget and achieving ROI goals. His skills in organization, leadership, and using a repeatable methodology have led to saving costs and resolving issues more quickly. He has extensive experience managing complex projects across several industries.
Spectroscopic reflectance is a powerful method for thickness and n&k measurement of the translucent film. MProbe system makes this measurement easy and reliable
http://www.semiconsoft.com/wp/mprobe20desktop/
A NOVEL APPROACH TO SMOOTHING ON 3D STRUCTURED ADAPTIVE MESH OF THE KINECT-BA...csandit
3-dimensional object modelling of real world objects in steady state by means of multiple point
cloud (pcl) depth scans taken by using sensing camera and application of smoothing algorithm
are suggested in this study. Polygon structure, which is constituted by coordinates of point
cloud (x,y,z) corresponding to the position of 3D model in space and obtained by nodal points
and connection of these points by means of triangulation, is utilized for the demonstration of 3D
models. Gaussian smoothing and developed methods are applied to the mesh consisting of
merge of these polygons, and a new mesh simplification and augmentation algorithm are
suggested for the over the 3D modelling. Mesh consisting of merge of polygons can be
demonstrated in a more packed, smooth and fluent way. In this study is shown that applied the
triangulation and smoothing method for 3D modelling, perform to a fast and robust mesh
structures compared to existing methods therewithal no remeshing is necessary for refinement
and reduction.
This document describes a computational endomicroscopy platform that uses compressed sensing to achieve higher resolution images than the physical sensor resolution allows. It uses a digital micromirror device as a spatial light modulator to modulate scenes at a conjugate image plane. A camera then collects multiple coded measurements to reconstruct higher resolution images through compressed sensing algorithms. Experiments demonstrate reconstructing higher resolution images than the individual fiber spacing of fiber optic bundles used in endomicroscopy. Future work aims to further reduce measurements needed and apply the techniques to fiber bundle platforms.
This document summarizes a paper that proposes an automated method for segmenting lungs from digital tomosynthesis (DTS) images. DTS produces blurred slice images of the chest that are harder to segment than CT images. The proposed method combines three approaches: intensity-based segmentation, gradient-based segmentation, and energy-based segmentation. It starts from a previously published gradient-based dynamic programming approach but adds improvements to increase robustness. Experimental results on simulated DTS images generated from CT images show the combined method reduces incorrectly segmented lung regions compared to previous methods.
Compact lpf design with low cutoff frequency using v shaped dgs structureIAEME Publication
This document describes a compact microstrip low pass filter (LPF) design with a low cutoff frequency, broad stopband, and high stopband attenuation. It introduces a new V-shaped defected ground structure (DGS) to reduce the cutoff frequency compared to a previous design using a double U-shaped DGS, while maintaining the same compact size. Simulations show the V-shaped DGS design can achieve 3dB cutoff frequencies as low as 1.2 GHz, compared to 2.7 GHz for the previous design. Measured results for a fabricated filter match well with simulations, validating the compact low frequency LPF design enabled by the V-shaped DGS structure.
BAYESIAN CLASSIFICATION OF FABRICS USING BINARY CO-OCCURRENCE MATRIXijistjournal
Classification of fabrics is usually performed manually which requires considerable human efforts. The goal of this paper is to recognize and classify the types of fabrics, in order to identify a weave pattern automatically using image processing system. In this paper, fabric texture feature is extracted using Grey Level Co-occurrence Matrices as well as Binary Level Co-occurrence Matrices. The Co-occurrence matrices functions characterize the texture of an image by calculating how often pairs of pixel with specific values and in a specified spatial relationship occur in an image, and then extracting statistical measures from this matrix. The extracted features from GLCM and BLCM are used to classify the texture by Bayesian classifier to compare their effectiveness.
International Journal of Engineering Research and DevelopmentIJERD Editor
This document summarizes a study on context-based image segmentation of radiography images to detect defects in welds. The researchers developed a simple image processing technique that uses contextual knowledge about radiography images rather than standard techniques. They first identify regions of interest using edge detection. They then segment potential flaws from the image using a statistical threshold based on the mean and standard deviation of pixel values in neighboring regions, rather than global thresholding. They show their technique successfully segments flaws like porosity and fine cracks from test images. Future work will involve extracting features of segmented flaws and using machine learning for classification.
This document summarizes research using x-ray tomography to characterize the 3D structure of paper at the micrometer scale. Key findings include: (1) The structure is similar across samples with minor variations in properties like porosity and formation; (2) Pore size distributions match those from fiber deposition simulations; and (3) Layered deposition with pore filling in simulations better matches experimental measurements of formation and pore structure than uniform deposition alone. Future work will combine macro- and micro-scale models to study size-dependent properties and add fiber interactions between layers.
Noise reduction based on partial reference, dual-tree complex wavelet transfo...JPINFOTECH JAYAPRAKASH
This paper proposes a novel method for reducing noise introduced by image enhancement methods such as random spray sampling. The method uses the dual-tree complex wavelet transform to analyze the luma channel of the original non-enhanced image and enhanced noisy image. It computes the standard deviation of coefficients across orientations in the original image to create a directional structure map. This map is used to shrink the coefficients of the enhanced image before mixing with the original image coefficients based on orientation. This allows noise reduction without assumptions about the noise statistics, using the original image as a partial reference. Evaluation shows the validity of the approach.
This document discusses fingerprint identification and reconstruction from minutiae points. It begins with an introduction to fingerprint identification and the minutiae features used for comparison. It then outlines the hardware and software requirements for the project, including the use of MATLAB. The main body of the document describes the process of minutiae extraction from fingerprints and using the minutiae points to reconstruct fingerprint images through estimating ridge orientation, constructing streamlines, and enhancing the ridge structure. Implementation details are provided for image enhancement, thinning, and minutiae extraction steps. The document concludes by noting the scope for further improvements and accuracy.
Coastal erosion management using image processing and Node Oriented Programming AbdAllah Aly
Presentation of my Thesis with the title "Coastal erosion management using image processing and Node Oriented Programming" for achieving my Masters Degree in Computer and Automation Engineering from Siena University, Italy.
EVP Plus Software delivers state-of-the-art image processing for CR and DR sy...Carestream
Radiographic technologists expect a high degree of
automation and efficiency in the technology they use in their
daily workflow, which means they expect minimal interaction
with the technology’s modality software. At the same time,
radiologists also need the flexibility to specify their site’s
individualized diagnostic viewing preferences. The CARESTREAM DirectView EVP Plus Software successfully
overcomes this challenge for digital-projection radiography.
EVP Plus automatically processes and delivers diagnostic-quality DR and CR images to PACS, based on look preferences that can be uniquely specified by each site.
A Novel 2D Feature Extraction Method for Fingerprints Using Minutiae Points a...IJECEIAES
The field of biometrics has evolved tremendously for over the last century. Yet scientists are still continuing to come up with precise and efficient algorithms to facilitate automatic fingerprint recognition systems. Like other applications, an efficient feature extraction method plays an important role in fingerprint based recognition systems. This paper proposes a novel feature extraction method using minutiae points of a fingerprint image and their intersections. In this method, initially, it calculates the ridge ends and ridge bifurcations of each fingerprint image. And then, it estimates the minutiae points for the intersection of each ridge end and ridge bifurcation. In the experimental evaluation, we tested the extracted features of our proposed model using a support vector machine (SVM) classifier and experimental results show that the proposed method can accurately classify different fingerprint images.
Pamela Armbrister is seeking a position that allows her to utilize her 15 years of experience in real estate, mortgage lending, and small business ownership. She has held roles organizing mortgage files, researching property records, and ensuring documentation compliance. Armbrister also has experience listing, selling, and marketing real estate and REO properties. She is proficient in various software programs and possesses strong customer service, communication, and teamwork skills.
Woody Williams is an experienced project manager seeking new opportunities. He has over 10 years of experience successfully delivering projects exceeding $1 billion on budget and achieving ROI goals. His skills in organization, leadership, and using a repeatable methodology have led to saving costs and resolving issues more quickly. He has extensive experience managing complex projects across several industries.
The document discusses coordinate measuring machines (CMMs). It describes CMMs as machines that use probes to precisely and accurately measure the geometry of physical parts. CMMs allow for fast, automated inspection and can provide measurements with micron-level accuracy. The document outlines the key components of CMMs, including their rigid base structures, probing systems, computer controls, and inspection software. It also discusses how CMMs are integrated into computer-aided manufacturing systems to enable bi-directional communication between design and inspection data.
A coordinate measuring machine is a device used to precisely measure the geometry of physical objects using probes attached to three orthogonal axes. It works by probing points on an object placed on the machine table and mapping their x, y, z coordinates, which are then uploaded to computer software for analysis and quality inspection. Common components include a main structure with three motion axes, a probing system, and a data collection system with controller and software.
CMM is a 3D measuring device used to measure dimensional characteristics of objects. It has three main components - a structure, probe system, and controller/software. Traditional CMMs have a fixed gantry structure and use touch probes to manually or automatically measure points. New developments include non-contact probes, faster computing, and portable CMMs suited for shopfloor use.
Visual inspection is commonly used for quality control and can be manual or automated using machine vision. Manual inspection relies on human vision using light and the eyes to examine products for defects. It is applicable to many materials and can check for dimensional accuracy, discontinuities, fit and wear. Automated inspection uses machine vision systems for rapid, consistent inspection of specific component details in production applications. Both methods are affected by lighting, detector quality, data processing ability, and training level.
Mechanical engineering involves understanding core concepts in mechanics, kinematics, thermodynamics, materials science, and structural analysis. Mechanical engineers design and analyze machines, manufacturing plants, engines, transport systems, medical devices, and more. Examples of mechanical engineering include bicycles, CD players, video game consoles, snowmobiles, microelectromechanical systems, robotics, composite materials, biomechanics, aerospace engineering, and careers in automotive, manufacturing, utilities, HVAC, and space research industries.
This document provides an overview of nanotechnology. It defines nanotechnology as the study and engineering of matter at the nanoscale, or atomic level. The document outlines the history of nanotechnology from its conception in 1959 to modern applications. Key tools used in nanotechnology like atomic force microscopes and carbon nanotubes are described. The document also discusses different approaches (top-down vs bottom-up), materials used, and applications of nanotechnology in areas like drugs, fabrics, electronics, and computers. It provides examples of how nanotechnology is enhancing performance in these domains.
This document discusses dimensionality reduction techniques for hyperspectral images. It proposes using k-means clustering based on statistical measures like variance, standard deviation, and mean absolute deviation to select bands from hyperspectral images. The number of bands is first estimated using virtual dimensionality. Bands are then clustered based on their statistical properties and one band is selected from each cluster with the maximum value of the statistical measure. Finally, endmembers are extracted from the selected bands using N-FINDR.
In this paper, we analyze and compare the performance of fusion methods based on four different
transforms: i) wavelet transform, ii) curvelet transform, iii) contourlet transform and iv) nonsubsampled
contourlet transform. Fusion framework and scheme are explained in detail, and two different sets of
images are used in our experiments. Furthermore, eight different performancemetrics are adopted to
comparatively analyze the fusion results. The comparison results show that the nonsubsampled contourlet
transform method performs better than the other three methods, both spatially and spectrally. We also
observed from additional experiments that the decomposition level of 3 offered the best fusion performance,
anddecomposition levels beyond level-3 did not significantly improve the fusion results.
IRJET- Synchronization Scheme of MIMO-OFDM using Monte Carlo MethodIRJET Journal
This document proposes a synchronization scheme for MIMO-OFDM using the Monte Carlo method. It involves using an iterative turbo receiver with two levels - a soft-input soft-output SSMC detector followed by a soft channel decoder. The detector and decoder exchange information iteratively to reduce the bit error rate. Simulation results show that the proposed Monte Carlo simulation method decreases error rate as the number of transmitters and receivers increases. Bit error rate and mean squared error rate are compared for different signal-to-noise ratios to demonstrate the performance of the system.
EFFICIENT IMAGE COMPRESSION USING LAPLACIAN PYRAMIDAL FILTERS FOR EDGE IMAGESijcnac
This project presents a new image compression technique for the coding of retinal and
fingerprint images. Retinal images are used to detect diseases like diabetes or
hypertension. Fingerprint images are used for the security purpose. In this work, the
contourlet transform of the retinal and fingerprint image is taken first. The coefficients of
the contourlet transform are quantized using adaptive multistage vector quantization
scheme. The number of code vectors in the adaptive vector quantization scheme depends
on the dynamic range of the input image.
This document discusses cone-beam computed tomography (CBCT) and its applications in dental practice. CBCT provides sub-millimeter resolution images of the maxillofacial skeleton in a fraction of the time and radiation dose of conventional CT. It allows reconstruction of 3D volumetric data into multiplanar reformatted images. Specific applications discussed include implant planning, pathology assessment, temporomandibular joint imaging, and orthodontics. Advanced display modes like curved planar reformation and volume rendering provide familiar views useful for clinical evaluation and measurement.
Deep Convolutional Neural Networks (CNNs) have achieved impressive performance in
edge detection tasks, but their large number of parameters often leads to high memory and energy
costs for implementation on lightweight devices. In this paper, we propose a new architecture, called
Efficient Deep-learning Gradients Extraction Network (EDGE-Net), that integrates the advantages of Depthwise Separable Convolutions and deformable convolutional networks (DeformableConvNet) to address these inefficiencies. By carefully selecting proper components and utilizing
network pruning techniques, our proposed EDGE-Net achieves state-of-the-art accuracy in edge
detection while significantly reducing complexity. Experimental results on BSDS500 and NYUDv2
datasets demonstrate that EDGE-Net outperforms current lightweight edge detectors with only
500k parameters, without relying on pre-trained weights.
Deep Convolutional Neural Networks (CNNs) have achieved impressive performance in
edge detection tasks, but their large number of parameters often leads to high memory and energy
costs for implementation on lightweight devices. In this paper, we propose a new architecture, called
Efficient Deep-learning Gradients Extraction Network (EDGE-Net), that integrates the advantages of Depthwise Separable Convolutions and deformable convolutional networks (DeformableConvNet) to address these inefficiencies. By carefully selecting proper components and utilizing
network pruning techniques, our proposed EDGE-Net achieves state-of-the-art accuracy in edge
detection while significantly reducing complexity. Experimental results on BSDS500 and NYUDv2
datasets demonstrate that EDGE-Net outperforms current lightweight edge detectors with only
500k parameters, without relying on pre-trained weights.
Steganography is the art and science of hiding the
existence of information. In computer-based steganography,
several forms of digital media may be used as “cover” for hidden
information. Photos, documents, web pages and even MP3 music
files may all serve as innocuous looking hosts for secret messages.
In this paper, we generate a ECG signal of patient and hide this
ECG signal in the image of patient i.e. patient photo is used as a
cover for hiding the ECG signal. Steganography is done using the
Contourlet transform. To hide the data in image Singular Value
Decomposition (SVD) is used. The contourlet transform provides
higher correlation coefficient. The results are comparing with the
wavelet transform. The proposed system provides a better PSNR
value than the wavelet transform.
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
This document summarizes JPEG image compression techniques. It discusses how images are divided into blocks and transformed from the spatial domain to the frequency domain using the Discrete Cosine Transform (DCT). It then describes how the DCT coefficients are quantized and arranged in zigzag order before entropy encoding with Huffman coding. The goal of JPEG compression is to store image data using as little space as possible while maintaining enough visual detail. The techniques discussed aim to remove irrelevant and redundant image data through DCT, quantization, and entropy encoding.
CT-SVD and Arnold Transform for Secure Color Image WatermarkingAM Publications,India
Watermarking is used for protecting copyright of digital images. In this paper, we propose a novel technique for watermarking using Contourlet Transform (CT) and Singular Value Decomposition (SVD). CT ensures imperceptibility of the watermark and SVD ensures its robustness against attacks. Arnold transform is used for scrambling watermark pixels to ensure watermark security. Watermark extraction is semi-blind, which avoids the need for original image for extraction. Both watermark and cover image are color images. Performance of the system is judged by using PSNR and Correlation Coefficient (CC) values. System shows good robustness against noise, JPEG compression, filtering and cropping
Image compression by ezw combining huffman and arithmetic encoderIAEME Publication
This document summarizes an article that proposes combining Embedded Zero tree Wavelet (EZW) image compression with Huffman and arithmetic encoders to achieve additional compression. EZW is an effective wavelet-based image compression algorithm that encodes coefficients in order of importance. The paper argues that applying Huffman coding followed by arithmetic encoding to the output of an EZW compressor provides around 15% extra compression with minimal quality loss. It describes the EZW encoding process, including the concept of zero trees that allows efficient coding of significance maps, and how discrete wavelet transforms decompose images into frequency subbands.
Digital Image Correlation (DIC) is a non-contact technique that uses cameras to measure surface deformation in 2D or 3D. It was developed in the 1980s and has since revolutionized mechanical testing. DIC provides more comprehensive analysis than traditional methods by measuring full-field deformation over entire sample surfaces. It can be used across industries from medical implants to aircraft wings to transform design, validation, and testing methods.
A Novel Technique for Multi User Multiple Access Spatial Modulation Using Ada...ijtsrd
The need for high peak data rates with the corresponding need for signi cantly increased spectral e ciencies, and the support for service speci c quality of service QoS requirements are the key elements that drive the research in the area of wireless communication access technologies Since space constellations and signal constellations are orthogonal, the well known digital signal modulation schemes can be used on top. The spatial multiplexing gain comes from the simultaneous transmission of spatially encoded bits. Analytical and numerical performance of SM in di erent channel conditions, including practical channel considerations, are studied and compared to existing MIMO techniques in this thesis. Results show that SM achieve low BER bit error ratio with a tremendous reduction in receiver complexity without sacri cing spectral e ciency. Anshul Sengar | Gaurav Morghare "A Novel Technique for Multi User Multiple Access Spatial Modulation Using Adaptive Coding and Modulation" Published in International Journal of Trend in Scientific Research and Development (ijtsrd), ISSN: 2456-6470, Volume-6 | Issue-1 , December 2021, URL: https://www.ijtsrd.com/papers/ijtsrd47856.pdf Paper URL: https://www.ijtsrd.com/engineering/electronics-and-communication-engineering/47856/a-novel-technique-for-multi-user-multiple-access-spatial-modulation-using-adaptive-coding-and-modulation/anshul-sengar
Abstract:
This paper demonstrates overcoming of the Abbe diffraction limit (ADL) on image resolution. Here, terahertz multispectral reconstructive imaging has been described and used for analyzing nanometer size metal lines fabricated on a silicon wafer. It has also been demonstrated that while overcoming the ADL is a required condition, it is not sufficient to achieve sub-nanometer image resolution with longer wavelengths. A nanoscanning technology has been developed that exploits the modified Beer-Lambert’s law for creating a measured reflectance data matrix and utilizes the ‘inverse distance to power equation’ algorithm for achieving 3D, sub-nanometer image resolution. The nano-lines images reported herein, were compared to SEM images. The terahertz images of 70 nm lines agreed well with the TEM images. The 14 nm lines by SEM were determined to be 15 nm. Thus, the wavelength dependent Abbe diffraction limit on image resolution has been overcome. Layer-by-layer analysis has been demonstrated where 3D images are analyzed on any of the three orthogonal planes. Images of grains on the metal lines have also been analyzed. Unlike electron microscopes, where the samples must be in the vacuum chamber and must be thin enough for electron beam transparency, terahertz imaging is non-destructive, non-contact technique without laborious sample preparation.
Abstract— This paper demonstrates overcoming of the Abbe diffraction limit (ADL) on image resolution. Here, terahertz multispectral reconstructive imaging has been described and used for analyzing nanometer size metal lines fabricated on a silicon wafer. It has also been demonstrated that while overcoming the ADL is a required condition, it is not sufficient to achieve sub-nanometer image resolution with longer wavelengths. A nanoscanning technology has been developed that exploits the modified Beer-Lambert’s law for creating a measured reflectance data matrix and utilizes the ‘inverse distance to power equation’ algorithm for achieving 3D, sub-nanometer image resolution. The nano-lines images reported herein, were compared to SEM images. The terahertz images of 70 nm lines agreed well with the TEM images. The 14 nm lines by SEM were determined to be ~15 nm. Thus, the wavelength dependent Abbe diffraction limit on image resolution has been overcome. Layer-by-layer analysis has been demonstrated where 3D images are analyzed on any of the three orthogonal planes. Images of grains on the metal lines have also been analyzed. Unlike electron microscopes, where the samples must be in the vacuum chamber and must be thin enough for electron beam transparency, terahertz imaging is non-destructive, non-contact technique without laborious sample preparation.
This document presents a dual transform method for medical image compression that uses both singular value decomposition (SVD) and Haar wavelet transform. It compares the proposed dual transform method to existing Haar wavelet-SPIHT and DCT-SPIHT compression methods on 3 medical images. The dual transform method achieved higher compression ratios and PSNR values at 0.4 bits per pixel compared to the other methods, indicating better preservation of image quality at higher compression. The dual transform is thus concluded to be suitable for compressing medical images where no deterioration of image quality is acceptable.
Medical image analysis and processing using a dual transformeSAT Journals
Abstract The demand for images in medical field has increased drastically over the years. The need for reducing the storage space has resulted in image compression. This paper presents a dual transform for medical image compression algorithm. The experimental results determines how the compression ratio (CR), peak signal to noise ratio (PSNR) and SNR (signal to noise ratio) of different compression algorithms responds to dual transform algorithm. Keywords: DCT, SPIHT, Haar Wavelet, Linear approximation transform, image compression, Singular Value Decomposition (SVD).
Enhanced Watemarked Images by Various Attacks Based on DWT with Differential ...IRJET Journal
This document describes a new watermarking technique that uses a combined approach of SVD with differential evolution for watermark scrambling. The proposed technique aims to improve imperceptibility and robustness in watermarked images. It applies discrete wavelet transform (DWT) to generate sub-bands of an image, then uses singular value decomposition (SVD) on the low-frequency sub-band to embed the watermark. Differential evolution is used for watermark scrambling to improve security. The technique is said to lead to improved visual quality of watermarked images compared to other techniques. Several watermarking attacks like sharpening, gamma correction, and histogram equalization are also discussed.
Similar to Optical inspection technologies for 3D packaging (20)
Enhanced Watemarked Images by Various Attacks Based on DWT with Differential ...
Optical inspection technologies for 3D packaging
1. 11Chip Scale Review July • August • 2015 [ChipScaleReview.com]
Optical inspection technologies for 3D packaging
By Arun A. Aiyer, Tianheng Wang, Helen Simson [Frontier Semiconductor, Inc. (FSM)]
n the realm of 2.5D/3D packaging,
a high-throughput/production-
ready metrology tool with a single
high-performance sensor that addresses
multiple measurement needs throughout
the process flow, i.e., from front-end-
of-line (FEOL) to back-end-of-line
(BEOL), can be very valuable in terms
of yield improvement, cost-of-ownership
reduction, and tool utilization. FEOL
metrology related to through-silicon via
(TSV) creation and BEOL metrology
related to remaining Si thickness (RST)
and Cu reveal are addressed by our
Virtual Interface Technology (VIT).
Substrate thicknesses ranging from a
few microns to several millimeters, TSV
depth and profile, RST and Cu nail height,
can be measured by a single sensor.
This technology provides tool-to-tool
compatibility at different measurement
points along a die stacking process line.
All commercially viable packaging that
uses chip stacking and/or die stacking
requires that conductors such as Cu
nail, or Cu pillar, or solder bumps, be
placed on the chip or die I/Os to act
as the interconnection.Measuring co-
planarity of these µFeatures is important
in enhancing device yield. Miniaturization
in 3D packaging along with demand
for higher density I/Os are challenging
inspection and metrology approaches
to higher measurement capability and
throughput. Therefore, a high-throughput,
production-ready metrology tool with a
high-performance sensor that can measure
C4 bumps to Cu reveal height and capable
of 100% height inspection, will be very
valuable in terms of yield improvement.
Measurement of surface topography
in MEMS wafers and measurement
of z-dimension of high-aspect ratio
features in semiconductor wafers can be
accomplished with scanning white light
interferometry (SWLI). Additionally, it
is quite effective in measuring surface
roughness of optically smooth surfaces
with a resolution ~1nm or better. Other
applications include measuring machined
surfaces, micro-fluidic devices, optics and
fibers, ceramics, glass, paper, thin films,
and polymers.
Measuring with VIT
VIT is a Fourier domain technique
that utilizes temporal phase shear of
the measurement beam for thickness
measurement of thick substrates. The
unique sensor configuration enables
creation of non-physical interfaces that
enhance a tool’s measurement capabilities
in terms of measurement range, accuracy
and repeatability. One example of how
this technology is used in thick substrate
measurement is demonstrated with the
help of Figures 1-5. The sample can be
illuminated from either side.
In non-VIT mode, spectral fringe
frequency increases with sample thickness.
For thicker substrates, fringe crowding
similar to that seen in Figure 2 occurs.
Measurement in VIT mode, however,
leads to low-frequency fringes for the
same sample (Figure 4). Preventing fringe
crowding enables better fringe sampling,
which in turn avoids aliasing error, thereby
improving measurement accuracy and
repeatability. The latter two are the result
of improved signal/noise ratio (S/N) in the
fast Fourier transform (FFT) spectrum as
can be seen from the signal amplitudes in
Figures 3 and 5.
When VIT is enabled, signal pairs are
used in determining wafer thickness and
I
Figure 1: Schematic of a TSV sample under
illumination.
Figure 2: Wavelength spectrum corresponding to a
sample shown in Figure 1
Figure 3: Thickness spectrum corresponding to the
wavelength spectrum.
Figure 4: Wavelength spectrum corresponding to a sample shown in Figure 1 with VIT mode turned “on.”
2. 22 Chip Scale Review July • August • 2015 [ChipScaleReview.com]
thickness under the TSV or RST. Referring
to Figure 5, wafer thickness is obtained
by adding optical path difference (OPD)
corresponding to peaks B and D, and
the RST is determined by adding OPDs
at peaks A and D. These peaks are 5x
or more stronger than amplitudes of the
signals (seen inside the red box in Figure
5) obtained without VIT. Stronger signals
improve measurement accuracy and
repeatability. Thickness and RST mapping
of a 300mm wafer is shown in Figures 6
and 7. The 1σ standard deviation achieved
by this technique is approximately in the
nanometer range and is 5x to 10x better
than what is achieved in non-VIT mode. In
Figures 6 and 7, wafer thickness and RST
measured in a 300mm wafer are mapped
out. Such maps are useful in visualizing
process variations that may exist across the
processed substrate.
The parameters to be measured are depth,
top CD (TCD), bottom CD (BCD), and side
wall angle (SWA).
Depth. The VIT-enabled thickness
spectrum is displayed in Figure 5. This
signal signature is typical from a sample
like that shown in Figure 1. Peaks A,
B, C, D and E appear only when VIT is
enabled. It is important to note that the
separation between peaks A/B, C/D, and
D/E is the same as the TSV depth value,
which is independently given by the first
peak in the spectrum. VIT, therefore,
has a self-checking mechanism built
into it when measuring via depth. Via
depth obtained from a TSV sample
with dimensions ~12µmx70µm has
been mapped out in Figure 8. These
m e a s u r e m e n t s w e r e m a d e w i t h
repeatability and reproducibility on the
order of nanometers.
T S V b o t t o m C D . P e a k D i n
Figure 5 results from virtual interfaces,
while peaks C and E are from the coherent
interaction of virtual interface with the
interface defined by via bottom. Knowing
the areas under these peaks, “optical”
bottom CD (BCD) is calculated using
the expression:
BCD α 2* AD
1/2
x (PSDC/ PSDD)1/4
Where AD is an area proportional to the
measurement beam spot, and PSDC and
PSDD, respectively, are the areas under
peak C and peak D. Therefore, this is not a
model-based approach.
We used the above approach to
measure BCDs of a 5x50µm via farm.
The result of 49-point measurement is
shown in the chart in Figure 9. Figure
10 shows the TCD of some of the vias
in the farm, and Figure 11 gives the
infrared (IR) image of the bottom of
a few of these vias. The average BCD
calculated in VIT mode is 4.47µm,
and that estimated from the NIR image
is 4.38µm. Knowing top and bottom
Figure 6: Thickness map of a 300mm wafer
(TTV=0.515µm).
Figure 8: TSV depth map across a 300mm wafer.Figure 7: RST map from a 300mm wafer. (Avg. RST=711.28µm,TTV ~1.0.)
Figure 5: Thickness spectrum with VIT that facilitates simultaneous measurement of thickness, depth, and via profile.
3. 33Chip Scale Review July • August • 2015 [ChipScaleReview.com]
CDs, the sidewall angle (SWA) can be
determined. VIT can be engineered to
measure TSV parameters either from
the wafer front side and/or back side.
Therefore, a bottom probe may be used
for profile measurement even if the via
is filled.
Measuring with 3DI
3DI is an imaging technique that captures
phase shift introduced by µFeatures
such as µBumps, C4 bumps, Cu pillars,
redistribution layer (RDL) bumps, etc., in
the measurement beam. Use of a source-
sensor configuration enables creation of
a phase map of the features, from which
their height information can be deduced.
Additionally, this technique allows
all features in the field of view to be
measured simultaneously, thus enabling
massively parallel measurement of all
individual features imaged by the sensor.
Figure 12 shows, in schematic
format, some of the features that are
measured. Figure 13 compares the
three different tools based on three
different technologies that we offer for
3D inspection of these µFeatures. Of the
three, the 3D inspector offers the shortest
measurement time, which enables 100%
inspection of every wafer at an industry-
acceptable throughput rate. Figure 14
gives an example of 3DI’s ability to
measure Cu nails after Cu reveal, while
in Figure 15, its capability to do both
3DI and 2DI is shown.
Scanning white light interferometer
Scanning white light interferometry
(SWLI) is a versatile interference
microscopy technology that provides a non-
contact, 3-D method of measuring surface
topography and roughness. Illumination
from a white light beam passes through a
microscope objective lens to the sample
surface. The objective lens is coupled
with a beam splitter so some of the light is
reflected from a reference mirror. The light
reflecting back from the surface recombines
with the reference beam. The recombined
beams create bright and dark bands called
fringes, which make up the interferogram.
Fringes represent the object’s topography.
Figure 9: Top and bottom CDs of 5x50µm TSVs in a 300mm wafer. TCD measurement via imaging and BCD
measurement via VIT mode.
Figure 10: Top CDs from a 5x50µm TSV farm.
Figure 11: NIR image of 5x50µm TSV bottom.
(Resolution: 0.3µm/pixel.)
Figure 12: Array of µFeatures to be measured.
Figure 13: Schematic representation of three different techniques available for measuring µFeatures used
in 3D packaging.
4. 44 Chip Scale Review July • August • 2015 [ChipScaleReview.com]
makes the tool capable of monitoring
several FEOL and BEOL processes in 3D
packaging applications. These include
TSV depth and profile measurements,
bonded wafer stacks measurement, RST
and thinned Si wafer measurements,
after-reveal Cu nail co-planarity
measurement, and C4 bumps, µBumps
and Cu pillar height measurements. In
Si, the measurement range spans from
4µm to 5mm. This new tool provides
tool-to-tool compatibility at different
measurement points along a die stacking
Figure 16: Vertical scanning white light
interferometer.
By scanning the object or the objective in
the z-direction, several interferograms are
captured by the CCD camera, which are
analyzed to recreate the sample surface.
In Figure 17, topography of a feature in a
product wafer as measured by FSM’s SWLI
is shown. This low aspect ratio feature is
25µm in diameter and 5µm deep. The various
parameters that characterize roughness of a Si
wafer, obtained by employing phase shifting
feature in WLI, are given in Table 1. These
numbers pertain to a scan line that spans
across the FoV of the instrument. Profile
along this scan line is given in Figure 18.
Summary
The tool based on VIT has a depth/
thickness measurement range spanning
a few microns to a few millimeters. This
Figure 14: An example of massively parallel 3DI of Cu nails after Cu reveal.
Figure 15: An example of massively parallel 3DI and 2D inspection of µBumps.
Table 2: Data in this table corresponds to the
measurements shown in Figure 20.
Table 1: Various parameters that characterize the
roughness of a Si wafer, obtained using the phase
shifting feature in WLI.
Definitions: Ra=average roughness; Rq=RMS
roughness; Rv=max valley depth; Rp=max peak
height; Rt=max height of the profile.
5. 55Chip Scale Review July • August • 2015 [ChipScaleReview.com]
process line. Measurement repeatability
shows that the tool is robust and is ideal
for production environment. These
factors in turn minimize cost incurred
in Operations & Service training
and lessens spare parts inventory.
Consequently, tool downtime is reduced
leading to better cost-of-ownership. The
tool based on 3DI technology allows
for 100% 3D inspection of Cu nails,
C4 bumps, µBumps and Cu pillars at a
throughput acceptable to industry.
FSM’s microscope-based white light
optical profiler is used in applications
such as surface topography measurement,
surface roughness measurement, step-
height measurement, and more. High
spatial resolution and z-resolution achieved
with WLI is well-suited for roughness
measurement of smoother surfaces.
Acknowledgements
The authors would like to acknowledge
the support given by Ann Koo during the
development of these tools and Nikos Jaeger
for providing some of the schematics used
in the article.
Biographies
Arun A. Aiyer received his PhD in
Applied Physics from the U. of Hull,
in U.K. and his MS and BS in Physics
from the U. of Kerala, India. He is
CTO at Frontier Semiconductor; email
aruna@frontiersemi.com
Tianheng Wang received his PhD in
Electrical Engineering from the Optical
and Ultrasound Imaging Lab at the U.
of Connecticut, and BS and MS degrees
from National Key Laboratory of Tunable
Laser Technology at Harbin Institute
of Technology, China. He is an Optical
Engineer at Frontier Semiconductor.
Helen Simson received her PhD in
Applied Optics (Physics) from the Indian
Institute of Technology (IIT) Madras,
India and is an Optical Engineer at
Frontier Semiconductor.
Figure 17: Surface topography measurement using a scanning white light interferometer.
Figure 18: Surface roughness of a polished Si wafer measured by the WLI.
Figure 20: Measuring µBumps using WLI. The data correlates to 3DI and VIT measurements.
Figure 19: White light interferogram taken during
a flat µBump (rectangular features in the figure)
height measurement.