The document discusses implementation strategies for high bandwidth imaging in automotive ADAS applications using MIPI CSI-2SM. It describes challenges like high bandwidth requirements for multi-camera systems and SoC design constraints. Example solutions presented include using an FPD link deserializer chip and vision processor compliant with CSI-2SM to interface multiple cameras. Benefits of CSI-2SM discussed include its high speed, low pin count, support for virtual channels and data types, and ability to interface a variety of imaging and non-imaging devices like radar.
MPI DevCon Hsinchu City 2017: Introduction and Overview of the Forthcoming MI...MIPI Alliance
James Goel of Qualcomm Technologies provides an overview of both the new Touch Command Set, Abstract Layer and the Link-Layer protocol for I3C. This presentation is targeted to engineers interested in learning more about MIPI touch topologies and direct application of the I3C interface.
MPI DevCon Hsinchu City 2017: Building Intelligent, High-Speed Sensor Connect...MIPI Alliance
MIPI I3C enables multiple sensor connectivity using a single integrated bus with minimal pin count and throughput up to 33 Mbps. This presentation briefly describes I3C and its key features, and through examples details how I3C can be used in IoT and automotive systems to enable a more intelligent sensor connectivity.
Vassilis Androutsopoulos, Ph.D., of Arm, describes a Synopsys and Arm co-developed display solution that improves visual quality and reduces overall SoC power consumption while meeting the requirements of 4K high-resolution embedded displays in new applications beyond mobile.
MPI DevCon Hsinchu City 2017: Accelerating System Level Verification of SOC D...MIPI Alliance
Yafit Snir and Arindam Guha of Cadence Design Systems Inc. discuss Acceleration for system level verification, for benefiting from both simulation and emulation advantages.
MIPI CSI-2 (Camera Serial Interface) and MIPI DSI (Display Serial Interface) specifications are well adopted, and are integrated in many mobile and automotive complex systems. Pre-silicon verification of those systems is challenging, time consuming, and requires significant effort and resources.
MPI DevCon Hsinchu City 2017: Create Higher Resolution Displays With VESA Dis...MIPI Alliance
Alain Legault of Hardent discusses the challenges of designing products to meet the demands of current and future displays and highlights how DSC compression offers an innovative solution to deal with these challenges.
MPI DevCon Hsinchu City 2017: Mobile Influenced Markets – Evolution of Camera...MIPI Alliance
Tom Watzka of Lattice Semiconductor discusses the evolution of innovative mobile-influenced applications (such as AR/VR and drones), including the unique issues faced by system and software developers.
MPI DevCon Hsinchu City 2017: Enabling Higher Data Rates and Variety of Chann...MIPI Alliance
Hezi Saar of Synopsys describes MIPI D-PHY’s flexibility, speed, power and cost benefits for cameras and displays in mobile applications. The presentation illustrates common use cases, and details how MIPI D-PHY can operate at 2.5 Mbps over multiple lanes to enable higher performance. The presentation also gives a brief roadmap of the D-PHY specification.
MPI DevCon Hsinchu City 2017: Powering Imaging Applications with MIPI CSI-2MIPI Alliance
Hezi Saar of Synopsys describes the MIPI CSI-2 standard and illustrates its benefits and use cases in mobile applications and beyond. MIPI CSI-2-based image sensors are now seeing wider adoption in markets like automotive – more specifically autonomous driving applications.
MPI DevCon Hsinchu City 2017: Introduction and Overview of the Forthcoming MI...MIPI Alliance
James Goel of Qualcomm Technologies provides an overview of both the new Touch Command Set, Abstract Layer and the Link-Layer protocol for I3C. This presentation is targeted to engineers interested in learning more about MIPI touch topologies and direct application of the I3C interface.
MPI DevCon Hsinchu City 2017: Building Intelligent, High-Speed Sensor Connect...MIPI Alliance
MIPI I3C enables multiple sensor connectivity using a single integrated bus with minimal pin count and throughput up to 33 Mbps. This presentation briefly describes I3C and its key features, and through examples details how I3C can be used in IoT and automotive systems to enable a more intelligent sensor connectivity.
Vassilis Androutsopoulos, Ph.D., of Arm, describes a Synopsys and Arm co-developed display solution that improves visual quality and reduces overall SoC power consumption while meeting the requirements of 4K high-resolution embedded displays in new applications beyond mobile.
MPI DevCon Hsinchu City 2017: Accelerating System Level Verification of SOC D...MIPI Alliance
Yafit Snir and Arindam Guha of Cadence Design Systems Inc. discuss Acceleration for system level verification, for benefiting from both simulation and emulation advantages.
MIPI CSI-2 (Camera Serial Interface) and MIPI DSI (Display Serial Interface) specifications are well adopted, and are integrated in many mobile and automotive complex systems. Pre-silicon verification of those systems is challenging, time consuming, and requires significant effort and resources.
MPI DevCon Hsinchu City 2017: Create Higher Resolution Displays With VESA Dis...MIPI Alliance
Alain Legault of Hardent discusses the challenges of designing products to meet the demands of current and future displays and highlights how DSC compression offers an innovative solution to deal with these challenges.
MPI DevCon Hsinchu City 2017: Mobile Influenced Markets – Evolution of Camera...MIPI Alliance
Tom Watzka of Lattice Semiconductor discusses the evolution of innovative mobile-influenced applications (such as AR/VR and drones), including the unique issues faced by system and software developers.
MPI DevCon Hsinchu City 2017: Enabling Higher Data Rates and Variety of Chann...MIPI Alliance
Hezi Saar of Synopsys describes MIPI D-PHY’s flexibility, speed, power and cost benefits for cameras and displays in mobile applications. The presentation illustrates common use cases, and details how MIPI D-PHY can operate at 2.5 Mbps over multiple lanes to enable higher performance. The presentation also gives a brief roadmap of the D-PHY specification.
MPI DevCon Hsinchu City 2017: Powering Imaging Applications with MIPI CSI-2MIPI Alliance
Hezi Saar of Synopsys describes the MIPI CSI-2 standard and illustrates its benefits and use cases in mobile applications and beyond. MIPI CSI-2-based image sensors are now seeing wider adoption in markets like automotive – more specifically autonomous driving applications.
MPI DevCon Hsinchu City 2017: Practical Experiences in MIPI D-PHY & C-PHY Rec...MIPI Alliance
Steven Chiang of Trust-Tek Corporation addresses the challenges implementers face adhering to certain key requirements defined in the specifications, such as receiver stressed eye testing, while operating within contexts that do not warrant a literal interpretation of the methodology described in these specifications. He also offers best practices in test and focuses on contextual requirements and separating component-level testing/characterization needs from system-level ones.
MPI DevCon Hsinchu City 2017: Power, Performance and Security Advantages of U...MIPI Alliance
Qi Wang of Synopsys describes a UFS implementation leveraging the MIPI M-PHY/UniPro specifications, and outlines the unique advantages of the UFS standard for mobile applications.
MPI DevCon Hsinchu City 2017: MIPI Alliance Extends Interface Standards to Su...MIPI Alliance
Peter Lefkin of MIPI Alliance outlines the development, activities and approach off the new Automotive sub-Group (AsG), which is now in the process of gathering requirements for implementing next generation high speed data communications links in Automobiles.
MIPI DevCon Seoul 2018: Next Generation Verification Process for Automotive a...MIPI Alliance
With MIPI CSI-2℠ integrated in many complex systems, this presentation from Thierry Berdah and Yafit Snir, both of Cadence Design Systems, Inc., focuses on methodology for a full verification flow, from the IP level to the SOC level.
MPI DevCon Hsinchu City 2017: MIPI I3C High Data Rate Modes: How to Speed up ...MIPI Alliance
Steve (CY) Wang of Cadence Design Systems presents I3C interface basics and focuses on various verification aspects of I3C High Data Rate modes through an advanced verification methodology based on coverage driven verification and real-life scenarios.
MPI DevCon Hsinchu City 2017: MIPI High Speed Serial Technologies: Debug & Co...MIPI Alliance
David Yang of Tektronix covers the three high-speed serial standards: D-PHY, M-PHY and C-PHY, which have similarities in terms of target segment and application use cases, but have wide contrasts with respect to electrical specifications. He discusses real-world problems and the process of uncovering them early on using the test and measurement equipment & solutions. In addition, this session highlights the test solutions needed to support the upcoming revisions of these PHY specifications.
MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mob...MIPI Alliance
Presented by James Goel, MIPI Technical Steering Group Chair
Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.
This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets.
MIPI DevCon Seoul 2018: Troubleshooting MIPI M-PHY Link and Protocol IssuesMIPI Alliance
Gordon Getty and Juhyun Yang, both of Teledyne LeCroy, discuss how higher-layer protocols, including UniPro® and UFS, use MIPI M-PHY® to provide an efficient, low-power storage protocol to be enabled on mobile platforms.
MIPI DevCon Seoul 2018: Integrating Image, Radar, IR and TOF Sensors: Develop...MIPI Alliance
In this presentation, Tom Watzka of Lattice Semiconductor Corp. provides an overview of the architectures and tradeoffs in mission-critical vision applications and the details of combining and tagging multiple data streams, including Camera Control Interface (CCI) integration.
MIPI DevCon Taipei 2019: New Trends in the High-Volume Manufacturing Test of ...MIPI Alliance
Mohamed Hafed, Ph.D., chief executive officer at Introspect Technology, summarizes the fundamental requirements for quality assurance and testing methods for high-speed interfaces including MIPI D-PHY℠, C-PHY℠ and M-PHY®. The presentation includes practical examples of test cell design, test program development and multi-site screening techniques.
MIPI DevCon Seoul 2018: Mobile Technologies for a Smart World MIPI Alliance
In the MIPI DevCon Seoul keynote address, Jongshin Shin, vice president at Samsung Electronics Co., focuses on technologies such as 5G, ADAS and IoT, with MIPI solutions.
Matt Ronning, director of engineering at Sony Corporation, and Raj Kumar Nagpal, senior staff engineer at Synopsys, provide an update on how MIPI specifications are being leveraged into automotive systems today and offer a detailed look at the upcoming MIPI A-PHY specification, which is being designed to solve the long-reach, high-speed challenge of connecting the highest speed electronic components throughout a vehicle.
MPI DevCon Hsinchu City 2017: MIPI VGI for Sideband GPIO and Messaging Consol...MIPI Alliance
Satwant Singh of Lattice Semiconductor discusses the use of sideband GPIOs in a typical mobile influenced system, which adds to package size and cost. FSM based MIPI VGI aims to consolidate these sideband GPIOs and low speed messaging over a 2- or 3-wire interface. VGI FSM could also be used behind a suitable serial interface, such as I3C. MIPI VGI v1.0 spec is nearing its completion and is expected to be released next year.
MIPI DevCon Seoul 2018: MIPI – Making the 5G Vision a RealityMIPI Alliance
Kenneth Ma of Huawei/HiSilicon and chair of MIPI's Technical Steering Group, and Kevin Yee of Cadence Design Systems, Inc. and chair of MIPI's Marketing Steering Group team up to discuss the implications of 5G mobile and beyond-mobile technologies and use cases.
MPI DevCon Hsinchu City 2017: Using the Protocol To Simplify PHY Testing: A P...MIPI Alliance
Victor Sanchez-Rico of BitifEye Digital Test Solutions GmbH demonstrates how to enable Physical Layer testing with help from the Protocol Layer. In particular, he focuses on MIPI UniPro and UFS devices, which can be easily tested through the UniPro Test Mode.
MIPI DevCon Seoul 2018: Powering AI and Automotive Applications with the MIPI...MIPI Alliance
Hyoung-Bae Choi of Synopsys, Inc. discusses use cases and the implementation of MIPI's camera interface in automotive and AI applications, along with the benefits of MIPI I3C℠ in the MIPI camera solution.
James Goel, MIPI Technical Steering Group chair, shares a state-of-the-art MASS (MIPI Automotive SerDes Solutions) display architecture that leverages the latest MIPI DSI-2℠ protocols using VDC-M visually lossless compression algorithms to optimize pixel bandwidth within tightly constrained display systems.
Presented by Shiou Mei Huang, automotive processor hardware applications engineer at Texas Instruments, and Mayank Mangla, imaging architect at Texas Instruments.
MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is EssentialMIPI Alliance
Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.
MPI DevCon Hsinchu City 2017: Practical Experiences in MIPI D-PHY & C-PHY Rec...MIPI Alliance
Steven Chiang of Trust-Tek Corporation addresses the challenges implementers face adhering to certain key requirements defined in the specifications, such as receiver stressed eye testing, while operating within contexts that do not warrant a literal interpretation of the methodology described in these specifications. He also offers best practices in test and focuses on contextual requirements and separating component-level testing/characterization needs from system-level ones.
MPI DevCon Hsinchu City 2017: Power, Performance and Security Advantages of U...MIPI Alliance
Qi Wang of Synopsys describes a UFS implementation leveraging the MIPI M-PHY/UniPro specifications, and outlines the unique advantages of the UFS standard for mobile applications.
MPI DevCon Hsinchu City 2017: MIPI Alliance Extends Interface Standards to Su...MIPI Alliance
Peter Lefkin of MIPI Alliance outlines the development, activities and approach off the new Automotive sub-Group (AsG), which is now in the process of gathering requirements for implementing next generation high speed data communications links in Automobiles.
MIPI DevCon Seoul 2018: Next Generation Verification Process for Automotive a...MIPI Alliance
With MIPI CSI-2℠ integrated in many complex systems, this presentation from Thierry Berdah and Yafit Snir, both of Cadence Design Systems, Inc., focuses on methodology for a full verification flow, from the IP level to the SOC level.
MPI DevCon Hsinchu City 2017: MIPI I3C High Data Rate Modes: How to Speed up ...MIPI Alliance
Steve (CY) Wang of Cadence Design Systems presents I3C interface basics and focuses on various verification aspects of I3C High Data Rate modes through an advanced verification methodology based on coverage driven verification and real-life scenarios.
MPI DevCon Hsinchu City 2017: MIPI High Speed Serial Technologies: Debug & Co...MIPI Alliance
David Yang of Tektronix covers the three high-speed serial standards: D-PHY, M-PHY and C-PHY, which have similarities in terms of target segment and application use cases, but have wide contrasts with respect to electrical specifications. He discusses real-world problems and the process of uncovering them early on using the test and measurement equipment & solutions. In addition, this session highlights the test solutions needed to support the upcoming revisions of these PHY specifications.
MIPI DevCon 2021: The MIPI Specification Roadmap: Driving Advancements in Mob...MIPI Alliance
Presented by James Goel, MIPI Technical Steering Group Chair
Despite the many challenges over the past year, MIPI Alliance is on track to release more specifications in 2021 than in any other year in the organization's history. This packed schedule covers updates to many of MIPI's most popular specifications, including all physical layer specifications, MIPI I3C® and I3C Basic℠, and those for camera and display, in addition to introducing several new specifications. James Goel, chair of the MIPI Technical Steering Group, highlights some of the key specifications released over the past year and then provides a look at what's still to come. He' also provides an overview of MIPI's development activity in particular focus areas, such as automotive, IoT, 5G and security.
This presentation, from Gregor Sievers, Ph.D., of dSPACE GmbH, addresses how the MIPI CSI-2℠, D-PHY℠, CCS, and A-PHY℠ specifications simplify validation and testing and help bring autonomous driving to the streets.
MIPI DevCon Seoul 2018: Troubleshooting MIPI M-PHY Link and Protocol IssuesMIPI Alliance
Gordon Getty and Juhyun Yang, both of Teledyne LeCroy, discuss how higher-layer protocols, including UniPro® and UFS, use MIPI M-PHY® to provide an efficient, low-power storage protocol to be enabled on mobile platforms.
MIPI DevCon Seoul 2018: Integrating Image, Radar, IR and TOF Sensors: Develop...MIPI Alliance
In this presentation, Tom Watzka of Lattice Semiconductor Corp. provides an overview of the architectures and tradeoffs in mission-critical vision applications and the details of combining and tagging multiple data streams, including Camera Control Interface (CCI) integration.
MIPI DevCon Taipei 2019: New Trends in the High-Volume Manufacturing Test of ...MIPI Alliance
Mohamed Hafed, Ph.D., chief executive officer at Introspect Technology, summarizes the fundamental requirements for quality assurance and testing methods for high-speed interfaces including MIPI D-PHY℠, C-PHY℠ and M-PHY®. The presentation includes practical examples of test cell design, test program development and multi-site screening techniques.
MIPI DevCon Seoul 2018: Mobile Technologies for a Smart World MIPI Alliance
In the MIPI DevCon Seoul keynote address, Jongshin Shin, vice president at Samsung Electronics Co., focuses on technologies such as 5G, ADAS and IoT, with MIPI solutions.
Matt Ronning, director of engineering at Sony Corporation, and Raj Kumar Nagpal, senior staff engineer at Synopsys, provide an update on how MIPI specifications are being leveraged into automotive systems today and offer a detailed look at the upcoming MIPI A-PHY specification, which is being designed to solve the long-reach, high-speed challenge of connecting the highest speed electronic components throughout a vehicle.
MPI DevCon Hsinchu City 2017: MIPI VGI for Sideband GPIO and Messaging Consol...MIPI Alliance
Satwant Singh of Lattice Semiconductor discusses the use of sideband GPIOs in a typical mobile influenced system, which adds to package size and cost. FSM based MIPI VGI aims to consolidate these sideband GPIOs and low speed messaging over a 2- or 3-wire interface. VGI FSM could also be used behind a suitable serial interface, such as I3C. MIPI VGI v1.0 spec is nearing its completion and is expected to be released next year.
MIPI DevCon Seoul 2018: MIPI – Making the 5G Vision a RealityMIPI Alliance
Kenneth Ma of Huawei/HiSilicon and chair of MIPI's Technical Steering Group, and Kevin Yee of Cadence Design Systems, Inc. and chair of MIPI's Marketing Steering Group team up to discuss the implications of 5G mobile and beyond-mobile technologies and use cases.
MPI DevCon Hsinchu City 2017: Using the Protocol To Simplify PHY Testing: A P...MIPI Alliance
Victor Sanchez-Rico of BitifEye Digital Test Solutions GmbH demonstrates how to enable Physical Layer testing with help from the Protocol Layer. In particular, he focuses on MIPI UniPro and UFS devices, which can be easily tested through the UniPro Test Mode.
MIPI DevCon Seoul 2018: Powering AI and Automotive Applications with the MIPI...MIPI Alliance
Hyoung-Bae Choi of Synopsys, Inc. discusses use cases and the implementation of MIPI's camera interface in automotive and AI applications, along with the benefits of MIPI I3C℠ in the MIPI camera solution.
James Goel, MIPI Technical Steering Group chair, shares a state-of-the-art MASS (MIPI Automotive SerDes Solutions) display architecture that leverages the latest MIPI DSI-2℠ protocols using VDC-M visually lossless compression algorithms to optimize pixel bandwidth within tightly constrained display systems.
Presented by Shiou Mei Huang, automotive processor hardware applications engineer at Texas Instruments, and Mayank Mangla, imaging architect at Texas Instruments.
MIPI DevCon 2020 | Why an Integrated MIPI C-PHY/D-PHY IP is EssentialMIPI Alliance
Licinio Sousa of Synopsys describes the key advantages of the latest MIPI C-PHY℠ and D-PHY℠ specifications and how designers are implementing them in multipixel cameras and high-resolution displays targeting mobile, drone and automotive applications.
MIPI DevCon Taipei 2019: Enabling MIPI Camera Applications Including Automoti...MIPI Alliance
Kelvin Xu, product marketing manager at Synopsys, describes automotive ADAS designs with MIPI camera interface solutions such as CSI-2℠ and D-PHY℠, and outlines other MIPI automotive protocols, including I3C® and DSI℠.
The transformation of the car into a connected mobile device is occurring from the inside out, and is a perfect setting for leveraging the work done in the MIPI Alliance. The intimate (vendor controlled) system interfaces of a smartphone supplier mirror those developing to serve the auto industry. Mixel Inc.'s Ashraf Takla discusses this transformation, and how MIPI Alliance and its member companies are helping to make it happen.
Alain Legault, VP IP Products at Hardent, discusses how the combination of VDC-M and MIPI DSI-2℠ can support the development of sophisticated mobile, AR/VR and automotive displays, provides an overview of the VDC-M algorithm and use cases.
MIPI DevCon Bangalore 2017: MIPI CSI-2 for Multi-Camera, Long-Range Use Cases...MIPI Alliance
Kondalarao Polisetti of Xilinx details some of the multi-camera, long distance use case scenarios, along with the role and value addition of FPGAs to implement these systems. MIPI specifications, being mature, relatively simple to use and well proven in mobile segment, the ability to combine multiple camera data streams over a single CSI-2 channel, supporting long distance using bridge functions, make MIPI CSI-2 image sensors a best bet for product segments.
Autonomous vehicles: becoming economically feasible through improvements in l...Jeffrey Funk
These slides use concepts from my (Jeff Funk) course entitled analyzing hi-tech opportunities to analyze how autonomous vehicles are becoming economically feasible throug through improvements in lasers, microelectronic mechanical systems (MEMS), integrated circuits (ICs), and other components. Although the cost of the Google Car is currently about 150,000 USD, 30% annual improvements in lasers, MEMS, and ICs will make these economically feasible for a broad number of users in the next ten years. A key issue is when certain lanes, roads or even entire highway systems are restricted to automated vehicles. This would enable collision avoidance to rely more on between-vehicle communications. This would further reduce the cost of automated vehicles, stimulate diffusion, and also reduce transportation time and increase fuel efficiency.
Applying MBSE to the Industrial IoT: Using SysML with Connext DDS and SimulinkGerardo Pardo-Castellote
The benefits of Model-Based Systems Engineering (MBSE) and SysML are well established. As a result, users want to apply MBSE to larger and more complex Industrial IoT applications.
Industrial IoT applications can be very challenging: They are distributed. They deploy components across nodes spanning from small Devices to Edge computers to the Cloud. They often need mathematically-complex software. Moreover, they have strict requirements in terms of performance, robustness, and security.
SysML can model requirements, system components, behavior, interactions, and more. However, SysML does not provide a robust way to connect components running across different computers, especially when the security and quality of service of individual data-flows matter. SysML also does not provide all the tools needed to model and generate the (mathematical) code for complex dynamic systems.
A new “DDS + Simulink” MagicDraw SysML plugin has been developed to addresses these needs. It brings to MagicDraw users the capabilities of Connext DDS from RTI and Simulink from Mathworks:
The OMG Data-Distribution Service (DDS) is a secure and Qos-aware connectivity “databus”. DDS is considered the core connectivity framework for Software Integration and Autonomy by the Industrial Internet Consortium. Connext DDS is the leading implementation of the DDS standard, proven in 1000s of critical deployments.
Simulink is a tool for modeling and implementing the code needed for complex dynamic systems. It is widely deployed in many application domains including Automotive, Robotics, and Control Systems.
The new MagicDraw plugin defines a “DDS profile” for SysML that can model a distributed application connected using the DDS databus. The plugin can also generate the artifacts that configure the DDS databus (Topics, Data Types, Qos, etc.) and the adapters to Simulink and native code (e.g. C++ or Java).
By integrating three best-of class technologies: SysML, DDS and Simulink it is now possible to do MBSE for a wide range of Industrial IoT applications.
MIPI DevCon 2021: Meeting the Needs of Next-Generation Displays with a High-P...MIPI Alliance
Presented by Alain Legault, Hardent Inc.; Joe Rodriguez, Rambus Inc.; and Justin Endo, Mixel, Inc.
Next-generation display applications have an insatiable appetite for bandwidth. Using a combination of VESA Display Stream Compression (DSC) and MIPI DSI-2℠ technology, designers can achieve display resolutions up to 8K without compromise to video quality, battery life or cost. This presentation discusses a fully integrated, off-the-shelf display IP subsystem solution, consisting of Mixel (MIPI C-PHY℠/D-PHY℠ combo), Rambus (MIPI DSI-2® controller) and Hardent (VESA DSC) IP, that can deliver this state-of-the-art performance in a power-efficient and compact footprint.
MIPI DevCon 2016: MIPI CSI-2 Application for Vision and Sensor Fusion SystemsMIPI Alliance
The expanding demand for imaging- and vision-based systems in mobile, IoT and automotive products is making the need for multi camera and sensor fusion systems look for novel ways to gather and process multiple data streams while still fitting into the mobile interface. The CSI-2 protocol allows camera sensor and processed image data to be combined into a single data stream using interleaving, allowing the application processor to extract the image data using the virtual channel or data type information. In this presentation, Richard Sproul of Cadence Design Systems will highlight some of the key details and requirements for a system with image processing of multi camera/sensor systems.
Presented by Licinio Sousa, Synopsys, Inc., and Edo Cohen, Valens Semiconductor
Synopsys and Valens Semiconductor outline how MIPI automotive solutions can enable safe and robust long-reach connectivity for cameras and sensors. The ability for high volumes of data to travel at a fast rate over a long reach infrastructure is now mandatory in automotive vision applications. In addition, maintaining a reliable link can be the difference between successful operation and system failure in a car. In this presentation, Synopsys and Valens present a Valens MIPI A-PHY℠ design for in-vehicle connectivity using Synopsys’ ISO 26262-ready MIPI CSI-2® and MIPI C-PHY℠/D-PHY℠ IP in the FinFET process to meet their latency and bandwidth requirements. The presentation also previews examples of display applications that can benefit from the same architecture.
MIPI DevCon Taipei 2019 Keynote: Technologies for Automated DrivingMIPI Alliance
Simon Teng, assistant general nanager of the Intelligent Automotive Business Unit at MediaTek, discusses the mega trends of automotive, the kinds of technologies needed to realize these mega trends, and how SoC solutions with these technologies will become the foundation of automated driving systems.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2023/10/mipi-csi-2-image-sensor-interface-standard-features-enable-efficient-embedded-vision-systems-a-presentation-from-the-mipi-alliance/
Haran Thanigasalam, Camera and Imaging Consultant to the MIPI Alliance, presents the “MIPI CSI-2 Image Sensor Interface Standard Features Enable Efficient Embedded Vision Systems” tutorial at the May 2023 Embedded Vision Summit.
As computer vision applications continue to evolve rapidly, there’s a growing need for a smarter standardized interface connecting multiple image sensors to processors for real-time perception and decision-making. In this presentation, Thanigasalam provides a deep dive into the latest version of the widely implemented CSI-2 v4.0 interface from MIPI Alliance.
This new version includes key features specifically designed to support computer vision applications, including democratized Smart Region of Interest, Always-On Sentinel Conduit, Multi-Pixel Compression and Latency Reduction and Transport Efficiency. These novel features enable sophisticated machine awareness with reduced system power and processing needs, making them well suited for consumer, commercial and infrastructure platforms.
MIPI DevCon Seoul 2018: Dual Mode C-PHY/D-PHY Use in VR Display IC MIPI Alliance
This co-presentation from Ahmed Ella of Mixel, Inc., and Jeffrey Lukanc of Synaptics, will cover Synaptics VXR7200 DisplayPort to Dual MIPI VR Bridge IC, integrating a Mixel C-PHY℠/D-PHY℠ Combo IP and controller.
MIPI DevCon Seoul 2018: MIPI Alliance Meets the Needs of Autonomous DrivingMIPI Alliance
The chair of MIPI's Automotive Working Group, Matt Ronning of Sony Corporation, provides a status update on MIPI's requirements gathering and specification development efforts to support the automotive market.
MIPI DevCon Bangalore 2017: Mobile Influenced Markets – Evolution of Camera a...MIPI Alliance
Tom Watzka and Satwant Singh of Lattice Semiconductor highlight the evolution of innovative applications in mobile-influenced markets, including the unique issues faced by system and software developers. Examples of end applications and extrapolated architectural trends for several use cases will also be explored.
MIPI DevCon 2021: MIPI Security for Automotive and IoT – Initial Focus on MASSMIPI Alliance
Presented by Philip Hawkes and Rick Wietfeldt, co-chairs of the MIPI Security Working Group
MIPI Automotive SerDes Solutions (MASS) allows transmission of sensor and display data between sensors, electronic control units (ECUs) and displays distributed around a vehicle. The MIPI Security Working Group is developing a MASS security framework for protecting this data against malicious attacks.
This session covers the objectives of the security framework and explains how the framework achieves those objectives.
Presented by James Goel, MIPI Technical Steering Group chair, and Rick Wietfeldt, Security Working Group co-chair
This session brings you up to speed on all the latest developments within MIPI Automotive SerDes Solutions (MASS) – a framework that provides a full-stack, end-to-end sensor/display-to-ECU solution for autonomous driving and ADAS systems that leverage existing MIPI CSI-2®, DSI-2℠ and VESA eDP/DP protocols running over MIPI A-PHY℠. The presentation also explains how recent developments make it easier for you to integrate MIPI A-PHY into your next automotive E/E architecture and how, through A-PHY's adoption as an IEEE standard, it can be accessed for evaluation without MIPI membership.
In addition, the presenters discuss how recently released MIPI Camera and Display Service Extensions (CSE and DSE) and their associated protocol adaptation layers (PALs) work together to embed functional safety and security enablers natively at the "edge" – ultimately within the sensor, display and ECU components themselves.
Similar to MPI DevCon Hsinchu City 2017: ADAS High Bandwidth Imaging Implementation Strategies (20)
MIPI DevCon 2021: MIPI I3C Under the Spotlight: A Fireside Chat with the I3C ...MIPI Alliance
Panel discussion with Tim McKee, MIPI I3C Working Group chair; Matthew Schnoor; Eyuel Zewdu Teferi, MIPI I3C Basic Ad-hoc Working Group vice chair; and Radu Pitigoi-Aron
This session puts MIPI I3C® "under the spotlight" by assembling a panel of experts to talk about the latest developments in the world of I3C. The panel discusses the latest I3C specifications (including the latest HCI specification), how to address conformance in the absence of face-to-face plug fests, and how the MIPI I3C interface is being leveraged by other standards organizations.
MIPI DevCon 2021: MIPI I3C Application and Validation Models for IoT Sensor N...MIPI Alliance
Presented by Eyuel Zewdu Teferi, David Schumacher and Souha Kouki, STMicroelectronics
This presentation provides a global overview of using MIPI I3C® protocol for on-board communication among subsystems of an IoT sensor node. It includes adoption of MIPI CTS by using SysML models of requirements and test cases as an approach to manage I3C application use cases requirement validation.
MIPI DevCon 2021: MIPI I3C Signal Integrity Challenges on DDR5-based Server P...MIPI Alliance
Presented by Azusena Lupercio Ramirez, Juan Orozco and Nestor Hernandez Cruz, Intel Corporation
The MIPI I3C® protocol is first used in a server application for the DDR5 DIMM SPD function. MIPI I3C was defined for low capacitance applications, while DDR5 SPD exceeds by far the bus capacitance specification. This presentation covers the interoperability challenges of the dynamic push-pull and open-drain operating modes, on server applications with an in-depth analysis of the implications of long PCB traces, multiple DIMM routing branches, and multiple loads to the electrical and timing parameters.
MIPI DevCon 2021: MIPI I3C interface for the ETSI Smart Secure PlatformMIPI Alliance
Presented by Gulio Follero, ETSI
The ETSI Technical Committee Smart Card Platform (TC SCP) is developing the specification of the next generation secure element, the Smart Secure Platform (SSP). SCP is standardizing the MIPI I3C interface for SSP. This presentation describes the SSP architecture and its main use cases, followed by a discussion of how the MIPI I3C interface is adapted to the SSP and the main benefits in terms of speed, power and efficiency.
MIPI DevCon 2021: MIPI HTI, PTI and STP: The Bases for Next-Generation Online...MIPI Alliance
Presented by Thomas B. Preußer and Alexander Weiss, Accemic Technologies GmbH
The key challenge for testing and debugging embedded multicore systems is their limited observability. MIPI trace protocols provide essential operational insights non-intrusively, and this presentation advocates for the continuous online analysis of these trace data. It also contrasts the challenges posed by the vigorously compressed MIPI trace protocols with the enormous benefits that can be gained by online processing.
MIPI DevCon 2021: MIPI CSI-2 v4.0 Panel Discussion with the MIPI Camera Worki...MIPI Alliance
Panel discussion with Haran Thanigasalam, Intel Corporation, MIPI Camera Working Group chair; Natsuko Ibuki, Google, LLC;
Yuichi Mizutani, Sony Corporation; and Wonseok Lee, Samsung Electronics, Co.
MIPI DevCon 2021: MIPI D-PHY and MIPI CSI-2 for IoT: AI Edge DevicesMIPI Alliance
Presented by Ashraf Takla, Mixel Inc.
This presentation covers the deployment of MIPI D-PHY℠ and MIPI CSI-2® in IoT and edge devices. While many mobile-influenced applications benefit from the low-power, small-form factor of MIPI specifications, AI edge processors in particular are seeing a surge in the use of MIPI specifications for their sensors as market trends shift from processing in the cloud or central location, to processing at the edge.
This presentation includes a high-level system overview of a specific use case, Perceive Ergo edge inference processor, and how Mixel was able to meet Perceive’s stringent requirements with its MIPI D-PHY CSI-2 TX and D-PHY CSI-2 RX IPs.
MIPI DevCon 2021: State of the AllianceMIPI Alliance
Get an update on MIPI Alliance priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G. Peter Lefkin, MIPI managing director, discusses collaborative efforts within the Alliance and industry, as well as progress toward strategic priorities, including the development of key specifications and resources, education opportunities, outreach and other activities to support the MIPI member ecosystem.
MIPI DevCon 2020 | Snapshot of MIPI RFFE v3.0 from a System-Architecture Per...MIPI Alliance
Lalan Mishra, vice-chair of the MIPI RFFE Working Group, presents the new features of MIPI RFFE v3.0 to help architecture and design engineers understand how the triggering features in the latest version work together to improve performance and to switch quickly among the various bands and band combinations in a 5G system.
MIPI DevCon 2020 | The Story Behind the MIPI I3C HCI Driver for LinuxMIPI Alliance
Nicolas Pitre of BayLibre covers the work that has been done to date to plan Linux support when new technology is developed and a quick overview of future development.
MIPI DevCon 2020 | Interoperability Challenges and Solutions for MIPI I3CMIPI Alliance
This presentation from Geoffrey Duerden of Introspect Technology features a case study of several specific interoperability challenges and solutions in terms of circuit and layout guidelines, protocol implementations and target applications.
MIPI DevCon 2020 | MIPI to Bluetooth LE: Leveraging Mobile Technology for Wir...MIPI Alliance
Grant Jennings of GOWIN Semiconductor shares use case examples in the wireless IoT space found while helping customers develop new types of solutions with the first SoC FPGA with built in Bluetooth Low Energy (LE) transceiver.
Kevin Yee, chair of MIPI Marketing Steering Group, and Ian Smith, MIPI technical content manager and author of the MIPI Alliance IoT White Paper, explain the advantages of using MIPI specifications within IoT devices and provide an overview of the MIPI specifications that are most relevant to the IoT market.
This joint presentation from Ahmed Ella of Mixel and Serge Di Matteo of Renesas covers the deployment of MIPI D-PHY℠ in an autonomous driving use-case and the advantages of using MIPI specifications in functional safety applications.
MIPI DevCon 2020 | MIPI A-PHY: Laying the Groundwork for MIPI’s Automotive Se...MIPI Alliance
MIPI board member Ariel Lasry and A-PHY subgroup vice lead Edo Cohen share technical details of MIPI A-PHY, the cornerstone of MIPI Automotive SerDes Solutions (MASS).
MIPI DevCon 2020 | State of the AllianceMIPI Alliance
MIPI Managing Director Peter Lefkin shares an overview of progress on priority initiatives in mobile and in the beyond-mobile focus areas of automotive, IoT and 5G.
MIPI DevCon Taipei 2019: An Introduction to MIPI I3C® v1.1 and What's NextMIPI Alliance
Ken Foust, principal engineer at Intel Corporation, focuses on the new features available in MIPI I3C® v1.1 and the efforts MIPI is taking to advance I3C for broad, long-term adoption across multiple industries and usages.
MIPI DevCon Taipei 2019: Addressing 5G RFFE Control Challenges with MIPI RFFE...MIPI Alliance
Andrew Scott-Mackie, RF control systems engineer at Intel Corporation, discusses how MIPI RFFE℠ 3.0 aims to meet the new 5G control timing requirements and adds several enhancements to the RFFE-Trigger specification to meet 5G use cases.
MIPI DevCon Taipei 2019: PHY Testing Challenges and Opportunities: The Need F...MIPI Alliance
Victor Sanchez-Rico, project manager MIPI at BitifEye Digital Test Solutions GmbH, highlights the challenges observed and the lessons learned from BitifEye's experience with testing of high-speed digital interconnect busses, with a focus on the complex high-speed electrical PHY layer receiver conformance tests.