Introduction to
Laser Total Solution
www.ltsolution.com
Company Profile
Company Profile
COMPANY
PRESIDENT
FOUNDATION
ADDRESS
EMPLOYEE
SCALE
QUALITY MANAGEMENT SYSTEM
CERTIFICATION
LTS Co., Ltd. (Laser Total Solution)
Ph. D. Hongjin Park
2003. Feb. 14th
38-13, Ojeon-dong, Uiwang-si, Gyeonggi-do, Korea
214 (standard 2013. January. 7th)
Total 4,500㎡ (Factory 2,500㎡/ Office 2,000㎡
ISO 9001: 2008/ISO 14001:2004
Ventures, INNI-Biz, Main-Biz, CE Certified
 Revenue : 63.3 billion (74.2%
growth)
- AMOLED Cell Sealing System
- LGP Laser Engraving System
- Solar-Cell Selective Emitter
 Technology Available : Patent
Application 52 cases
 Has Laser Source
Manufacturing Technology
 R&D Center : 61 people
2
World Class 300 (Ministry of Knowledge Economy)
Organization
CEO
DISPLAY
STRATE
G Y
LED/BLU
SEMICO
NDUCTO
R
N E W
TECHNO
L O G Y
MANAG
EMENT
On the
Fly
T/F
COO
Software
Hardware
Mechanical Design
Optics Design
17%
12%
21%
15%
CustomerService
Management
Sales
20%
8%
7%
Doctor Master B.A. College TOTAL
10 14 142 48 214
3
‘13. 01. 07
R & D
CENTER
Cutting
T / F
Planning
Marketin
g
L a s e r
Q .A.
T E A M
S / W
H / W
SA LE S
Company History
Establishment Steps
(‘03∼’05)
Customer and Market
Application Discovery
- 2003. 02. LTS established
- 2003. 05. BLU Laser Engraver developed
- 2004. 07. UV Laser Dry Etcher developed : Touch Screen用
- 2005. 01. High Speed CMP Pad用 Laser Driller
Market Entry Steps
(‘06∼’07)
Reference Ensure Specialty
Products
- 2006. 02. PDP Glass用 Laser Driller
- 2006. 05. Laser Sealing System Developed : AMOLED用
- 2007. 06. Solar cell Edge Isolation
- 2007. 08. Relocated Office to Gyeonggi-do, Uiwang-si
Growth Steps
(‘08∼’09)
Business Capacity and
Growth Engine
- 2008. 03. Laser ITO Section Etching Machine
- 2008. 03. DSSC Scribing & Sealing System
- 2008. 06. Laser Ablation Layer System
- 2008. 07. Laser BLU Mold Pattering System
- 2008. 10. Laser Area Dry Etching System
- 2009. 02. Laser Polarizing Film Cutter
- 2009. 03. AMOLED In-Glass Marker(Galaxy S)
Stabilization Steps
(‘10∼’Present)
M/S and Expanding
New Business Areas
Prepared Based on
Global Business
- 2010. 02. Pico Second Laser Drilling
- 2010. 04. High Speed Laser Engraver (LGP用)
- 2010. 10. Ochang Ofiice produce LGP
- 2011. 03. Solar cell Laser Selective Emitter Doping System
- 2011. 06. Registered on KOSDAQ
- 2011. 09. 2ND Battery Foil Cutting & Welding System
- 2011. 10. OLED Lighting Laser Sealing System
- 2011. 12. Ceramic Laser Drilling / Full Cutting System
- 2012. 02. Jang Youngsil Prize
4
Flagship Product Configuration
Laser Cell Sealing M/C
Laser Repair M/C
Laser Cutting M/C
LGP Engraving M/C
LGP Cutting M/C
LGP Laser Serration
M/C
Selective Emitter Laser
Doping M/C
Solar Cell Scribing M/C
Solar Cell Drilling M/C
AMOLED LED TV
Film Laser Cutter
Display Energy
Battery Foil Cutting
Lift-Off M/C
Flexible (Marking)
Battery Welding
Flexible M/C
Solar Cell Battery
5
Laser Frit Cell Sealing System for AM-OLED
 AMOLED Sealing Process Equipment - SMD Exclusive Supply
- SMART Phone, Tablet PC for AMOLED Equipment Supply in Priority
- Exclusive Supply for S company AMOLED Sealing Equipment (in 2011)
 S Company AMOLED M/S – More than 98%.
- Completed the Development of Large AMOLED (8.5G)
- Features
 High Throughput
 High Accuracy Stage
 High Resolution
 Fine Align Function
Frit
GLASS
접착제
Laser sealing
합착 및 Sealing Cutting
6
Laser OLED Thin Film Layer Isolation & In-Glass Marking
Laser Cutting System For Glass (LCD, AMOLED)
Laser CuttingEdge Grinding
- Mass Production & Engineering Work : 3G ~ 8G AMOLED & TFT LCD. Solar Cell
- Pssible to the Tempered Glass (Max DOL 20um)
- Clean/Fine Images of the Cutting Edges (No Particle)
Laser OLED Thin Film Layer Isolation & In-Glass Marking
Laser Cutting System For Glass (LCD, AMOLED)
7
Laser Cutting System for Glass (Tempered Glass)
[Gorilla Tempered Galss Cutting (DOL 40um)]
[Straight Line] [Round Line] [Circle Line]
① ② ③
General Specification
- Laser : Picosecond Laser
- Cutting speed : min 200mm/sec (外形 )
- Chipping : ±50μm
- Burr : ±50μm
Feature
- Mass Production & Engineering Work
: AMOLED. TFT LCD. Tempered Glass DOL
40um
- Easy & Low Maintenance Cost
- Eco_Friendly : Dry Process (no Particle)
8
Laser Lift-Off System for Flexible Display
Excimer Laser Application
Flexible Display Laser Lift-Off (OLED,LCD, E-Paper)
Excimer Laser Application
Lift-Off by Laser Absorption
DPSS SHG Green Laser
LED Laser Lift-Off Laser Cutting of Wafer
 Fine Control : Ultra Narrow Width
 Lowest Thermal Damage
 Dry Process / Edge Sintering
9
Laser Engraver of the LGP for LED TV
The World First
Laser LGP
Engraver
for LED TV
Max 100” Inch
· LGP Laser Patterning for LED TV M/S 90% (in 2011)
- Supply of New Production Equipment in Companies Affiliate
S Company (150 Units)
- Production for the TV LGP To SONY and GA (in 2011 - 350K)
: Has Production Capacity
- Complete the LGP Development for Monitor (0.8T) and Lighting
- New Equipment Supply Related Display Company
: LGP Cutting System, Serration System Developing Supply
- Feature
 Engraving speed : 4,000 mm/sec
 High Brightness (Best Light Efficiency)
 High Throughput & Performance
 Flexibility : Variable Size
 User Friendly & Editing Software
 Easy & Low Maintenance Cost
 Eco-Friendly : Dry Process (no Chemicals)
 Multi Line
The World First
Laser LGP Cutter
for LED TV
Max 63” Inch
10
POL Film Laser Cutting System for LCD TV / Monitor
Narrow Bezel· L Company Bezel-Less Process Equipment
- Cutting POL Film accurately by Laser
- Released in LGD CES1212 (Bezel 1mm)
- Work size : Min7”~ Max 23”
- Work Process :
LD→ POL Pick Up → POL Stage Loading → Vision Align
→ Laser Cutting → Pickup /ULD
- Feature
 High throughput
 High Accuracy Stage
 High Cutting Quality
(minimize the yellow band & burr)
 Easy operation & maintenance
11
Laser ITO Patterning, Film Cutting and
Ag paste Direct Patterning for Touch Screen Panel
Capacitive Touch Screen
Resistive Touch Screen
Laser Bonding System Laser Film Cutting System
The World First
Area Laser
Patterning
for Touch Panel
12
Laser Repair System for AM-OLED
Laser System for Dye Sensitized Solar Cells
Working
Table
Coaxial
Type Light
Laser
SourceMotorized
Slit
Linear
Motor
Lens
Granite Base
Vision
illumination
Attenuator
Main X, Y Table
Isolator
System
- Cutting
- Firing
- Welding / Bonding
- Deposition
Glass Cutting TCO Isolation Hole Drilling
Catalyst
Deposition
Interconnect & 1st
Seal Attachment
Hole Sealing
Residual Dye
Removal
Dye
ApplicationCohesion Tio2 Deposition
2nd Sealing
Wire
Connection
Electrolyte
Injection
Sinterin
g
TCO Isolation
Hole Drilling
Laser Sintering
Laser Frit Sealing
Laser Repair System for AM-OLED Laser System for Dye Sensitized Solar Cells
13
Laser System for CIGS Solar Cells
 Inner Glass Marker
 P1,P2,P3 Laser Scriber
 Laser Edge Deletion
14
P2 (left) P3(right)
Pico-second laser scribing
(Reference from Industrial Laser Solutions)
Pico-second laser
(F = 0.72 J/cm2, v = 20 mm/s).
P1 Pico-second laser scribing
Laser Selective Emitter for Bulk Type Si Solar Cells
Damage Free
UPH World Record
: Max 3,600!!
· Entry Japanese Solar Cell Market
- Exclusive supply to Japan K company,
Selective Emitter one of the Laser Doping process equipment.
 Evaluation : Increase Solar cell efficiency
/ Saving investment costs
LTS Laser Doping M/C
Available apply in Existing line
Solar Cell Efficiency
1% Synergy
3~4% overall equipment
investment cost savings
15
Laser Tabbing Machine for Si Wafer Solar Cells
Laser Edge Isolation System for Bulk Type Si Solar Cells
전극
Laser
Head
Laser
Head
Up/Down Jig
고정용 Pin
Work (Wafer)
Heater
Main X Axis Table
Working
Table &
Clamping Jig
Laser #1
Laser #2
Focusing
Head #2
Fiber
Fiber
Focusing
Head #1
Mono or Polycrystalline Silicon
Isolation Cut
(Reduction of Recombination Losses)
Front
Contact
n
Si
(p)
Rear Side Contact
Laser Tabbing Machine
Laser Edge Isolation System
16
Rechargeable Battery Cutting System
Roll to Roll Type Roll to Cell Type
 Roll to Roll System : Max speed 30m/min
 Scanner speed : 1,000mm/s
 Max Capability : 30매/min (300×300)
 Roll to Cell System : Max speed 20m/min
 Scanner speed : 1,000mm/s
 Max Capability : 20매/min (350×350)
- Cell unit Loading of Electrode
 Inspection 기능 추가 가능(Option)
 2 Moving Stage 적용 시 Max 35매 생산가능
17
Rechargeable Battery Welding System
Multi-Cell Foil Welding
Pack (Between dissimilar
metals Welding) Features : Welding between electrode parts and Tab
- Improve the internal resistance
- Improve the upper and lower bonding strength
 Use Scanners : High Speed Welding Implementation
 Spatter Protection : sealed Chamber + Suction
 Inert Gas Blowing
 Available 60 sheets electrode Tab welding
 Important Component
- Laser : According to customer spec.
- Expression Jig Unit
- Isolated 2 Chamber
- 3 Axis Motion Unit
 Related Patent Applications : 2 cases
 Features : Between dissimilar metals Welding
(Anode-Cathode/ Cell- Busbar)
- Reduce contact electrical resistance
 Improved heat issues
- Minimize Intermetallic Compound
 Spatter Suction
 Inert Gas Blowing
 Use welding parts vision checker(Option)
 3 Axis Motion Unit (z axis Focusing Unit)
 Package Jig + Expression Jig
18
ETC Machine System
Laser Driller For the CMP Pad Dejunk System
Laser Deflasher
<60㎛>
Laser Marker
Fiber Laser Marker CO2 Laser Marker
19
High Power Green Laser
High Power DPSS Green 100w Laser
20
100W at 532nm
2% rms 240hours
Long term stability measurement
Specification GREEN 100 Watts
Wavelength 532 nm
Average Power 100 Watt
Repetition Rate 10 kHz
Polarization Linear
Beam Mode Multi-Mode
Beam Size 4.0 mm
Beam Divergence 4 mr
Pulse-to-Pulse
Stability
5 %
Power Stability < 3 % @ 24 hrs
Controller Electrical
Power
220/8A AC, Single Phase, 60
Hz
Chiller Electrical
Power
220/11.4A AC, Single Phase,
60 Hz
Cooling Method Closed-Loop Water Cooling
Thank You !
21

LTS company profile

  • 1.
    Introduction to Laser TotalSolution www.ltsolution.com
  • 2.
    Company Profile Company Profile COMPANY PRESIDENT FOUNDATION ADDRESS EMPLOYEE SCALE QUALITYMANAGEMENT SYSTEM CERTIFICATION LTS Co., Ltd. (Laser Total Solution) Ph. D. Hongjin Park 2003. Feb. 14th 38-13, Ojeon-dong, Uiwang-si, Gyeonggi-do, Korea 214 (standard 2013. January. 7th) Total 4,500㎡ (Factory 2,500㎡/ Office 2,000㎡ ISO 9001: 2008/ISO 14001:2004 Ventures, INNI-Biz, Main-Biz, CE Certified  Revenue : 63.3 billion (74.2% growth) - AMOLED Cell Sealing System - LGP Laser Engraving System - Solar-Cell Selective Emitter  Technology Available : Patent Application 52 cases  Has Laser Source Manufacturing Technology  R&D Center : 61 people 2 World Class 300 (Ministry of Knowledge Economy)
  • 3.
    Organization CEO DISPLAY STRATE G Y LED/BLU SEMICO NDUCTO R N EW TECHNO L O G Y MANAG EMENT On the Fly T/F COO Software Hardware Mechanical Design Optics Design 17% 12% 21% 15% CustomerService Management Sales 20% 8% 7% Doctor Master B.A. College TOTAL 10 14 142 48 214 3 ‘13. 01. 07 R & D CENTER Cutting T / F Planning Marketin g L a s e r Q .A. T E A M S / W H / W SA LE S
  • 4.
    Company History Establishment Steps (‘03∼’05) Customerand Market Application Discovery - 2003. 02. LTS established - 2003. 05. BLU Laser Engraver developed - 2004. 07. UV Laser Dry Etcher developed : Touch Screen用 - 2005. 01. High Speed CMP Pad用 Laser Driller Market Entry Steps (‘06∼’07) Reference Ensure Specialty Products - 2006. 02. PDP Glass用 Laser Driller - 2006. 05. Laser Sealing System Developed : AMOLED用 - 2007. 06. Solar cell Edge Isolation - 2007. 08. Relocated Office to Gyeonggi-do, Uiwang-si Growth Steps (‘08∼’09) Business Capacity and Growth Engine - 2008. 03. Laser ITO Section Etching Machine - 2008. 03. DSSC Scribing & Sealing System - 2008. 06. Laser Ablation Layer System - 2008. 07. Laser BLU Mold Pattering System - 2008. 10. Laser Area Dry Etching System - 2009. 02. Laser Polarizing Film Cutter - 2009. 03. AMOLED In-Glass Marker(Galaxy S) Stabilization Steps (‘10∼’Present) M/S and Expanding New Business Areas Prepared Based on Global Business - 2010. 02. Pico Second Laser Drilling - 2010. 04. High Speed Laser Engraver (LGP用) - 2010. 10. Ochang Ofiice produce LGP - 2011. 03. Solar cell Laser Selective Emitter Doping System - 2011. 06. Registered on KOSDAQ - 2011. 09. 2ND Battery Foil Cutting & Welding System - 2011. 10. OLED Lighting Laser Sealing System - 2011. 12. Ceramic Laser Drilling / Full Cutting System - 2012. 02. Jang Youngsil Prize 4
  • 5.
    Flagship Product Configuration LaserCell Sealing M/C Laser Repair M/C Laser Cutting M/C LGP Engraving M/C LGP Cutting M/C LGP Laser Serration M/C Selective Emitter Laser Doping M/C Solar Cell Scribing M/C Solar Cell Drilling M/C AMOLED LED TV Film Laser Cutter Display Energy Battery Foil Cutting Lift-Off M/C Flexible (Marking) Battery Welding Flexible M/C Solar Cell Battery 5
  • 6.
    Laser Frit CellSealing System for AM-OLED  AMOLED Sealing Process Equipment - SMD Exclusive Supply - SMART Phone, Tablet PC for AMOLED Equipment Supply in Priority - Exclusive Supply for S company AMOLED Sealing Equipment (in 2011)  S Company AMOLED M/S – More than 98%. - Completed the Development of Large AMOLED (8.5G) - Features  High Throughput  High Accuracy Stage  High Resolution  Fine Align Function Frit GLASS 접착제 Laser sealing 합착 및 Sealing Cutting 6
  • 7.
    Laser OLED ThinFilm Layer Isolation & In-Glass Marking Laser Cutting System For Glass (LCD, AMOLED) Laser CuttingEdge Grinding - Mass Production & Engineering Work : 3G ~ 8G AMOLED & TFT LCD. Solar Cell - Pssible to the Tempered Glass (Max DOL 20um) - Clean/Fine Images of the Cutting Edges (No Particle) Laser OLED Thin Film Layer Isolation & In-Glass Marking Laser Cutting System For Glass (LCD, AMOLED) 7
  • 8.
    Laser Cutting Systemfor Glass (Tempered Glass) [Gorilla Tempered Galss Cutting (DOL 40um)] [Straight Line] [Round Line] [Circle Line] ① ② ③ General Specification - Laser : Picosecond Laser - Cutting speed : min 200mm/sec (外形 ) - Chipping : ±50μm - Burr : ±50μm Feature - Mass Production & Engineering Work : AMOLED. TFT LCD. Tempered Glass DOL 40um - Easy & Low Maintenance Cost - Eco_Friendly : Dry Process (no Particle) 8
  • 9.
    Laser Lift-Off Systemfor Flexible Display Excimer Laser Application Flexible Display Laser Lift-Off (OLED,LCD, E-Paper) Excimer Laser Application Lift-Off by Laser Absorption DPSS SHG Green Laser LED Laser Lift-Off Laser Cutting of Wafer  Fine Control : Ultra Narrow Width  Lowest Thermal Damage  Dry Process / Edge Sintering 9
  • 10.
    Laser Engraver ofthe LGP for LED TV The World First Laser LGP Engraver for LED TV Max 100” Inch · LGP Laser Patterning for LED TV M/S 90% (in 2011) - Supply of New Production Equipment in Companies Affiliate S Company (150 Units) - Production for the TV LGP To SONY and GA (in 2011 - 350K) : Has Production Capacity - Complete the LGP Development for Monitor (0.8T) and Lighting - New Equipment Supply Related Display Company : LGP Cutting System, Serration System Developing Supply - Feature  Engraving speed : 4,000 mm/sec  High Brightness (Best Light Efficiency)  High Throughput & Performance  Flexibility : Variable Size  User Friendly & Editing Software  Easy & Low Maintenance Cost  Eco-Friendly : Dry Process (no Chemicals)  Multi Line The World First Laser LGP Cutter for LED TV Max 63” Inch 10
  • 11.
    POL Film LaserCutting System for LCD TV / Monitor Narrow Bezel· L Company Bezel-Less Process Equipment - Cutting POL Film accurately by Laser - Released in LGD CES1212 (Bezel 1mm) - Work size : Min7”~ Max 23” - Work Process : LD→ POL Pick Up → POL Stage Loading → Vision Align → Laser Cutting → Pickup /ULD - Feature  High throughput  High Accuracy Stage  High Cutting Quality (minimize the yellow band & burr)  Easy operation & maintenance 11
  • 12.
    Laser ITO Patterning,Film Cutting and Ag paste Direct Patterning for Touch Screen Panel Capacitive Touch Screen Resistive Touch Screen Laser Bonding System Laser Film Cutting System The World First Area Laser Patterning for Touch Panel 12
  • 13.
    Laser Repair Systemfor AM-OLED Laser System for Dye Sensitized Solar Cells Working Table Coaxial Type Light Laser SourceMotorized Slit Linear Motor Lens Granite Base Vision illumination Attenuator Main X, Y Table Isolator System - Cutting - Firing - Welding / Bonding - Deposition Glass Cutting TCO Isolation Hole Drilling Catalyst Deposition Interconnect & 1st Seal Attachment Hole Sealing Residual Dye Removal Dye ApplicationCohesion Tio2 Deposition 2nd Sealing Wire Connection Electrolyte Injection Sinterin g TCO Isolation Hole Drilling Laser Sintering Laser Frit Sealing Laser Repair System for AM-OLED Laser System for Dye Sensitized Solar Cells 13
  • 14.
    Laser System forCIGS Solar Cells  Inner Glass Marker  P1,P2,P3 Laser Scriber  Laser Edge Deletion 14 P2 (left) P3(right) Pico-second laser scribing (Reference from Industrial Laser Solutions) Pico-second laser (F = 0.72 J/cm2, v = 20 mm/s). P1 Pico-second laser scribing
  • 15.
    Laser Selective Emitterfor Bulk Type Si Solar Cells Damage Free UPH World Record : Max 3,600!! · Entry Japanese Solar Cell Market - Exclusive supply to Japan K company, Selective Emitter one of the Laser Doping process equipment.  Evaluation : Increase Solar cell efficiency / Saving investment costs LTS Laser Doping M/C Available apply in Existing line Solar Cell Efficiency 1% Synergy 3~4% overall equipment investment cost savings 15
  • 16.
    Laser Tabbing Machinefor Si Wafer Solar Cells Laser Edge Isolation System for Bulk Type Si Solar Cells 전극 Laser Head Laser Head Up/Down Jig 고정용 Pin Work (Wafer) Heater Main X Axis Table Working Table & Clamping Jig Laser #1 Laser #2 Focusing Head #2 Fiber Fiber Focusing Head #1 Mono or Polycrystalline Silicon Isolation Cut (Reduction of Recombination Losses) Front Contact n Si (p) Rear Side Contact Laser Tabbing Machine Laser Edge Isolation System 16
  • 17.
    Rechargeable Battery CuttingSystem Roll to Roll Type Roll to Cell Type  Roll to Roll System : Max speed 30m/min  Scanner speed : 1,000mm/s  Max Capability : 30매/min (300×300)  Roll to Cell System : Max speed 20m/min  Scanner speed : 1,000mm/s  Max Capability : 20매/min (350×350) - Cell unit Loading of Electrode  Inspection 기능 추가 가능(Option)  2 Moving Stage 적용 시 Max 35매 생산가능 17
  • 18.
    Rechargeable Battery WeldingSystem Multi-Cell Foil Welding Pack (Between dissimilar metals Welding) Features : Welding between electrode parts and Tab - Improve the internal resistance - Improve the upper and lower bonding strength  Use Scanners : High Speed Welding Implementation  Spatter Protection : sealed Chamber + Suction  Inert Gas Blowing  Available 60 sheets electrode Tab welding  Important Component - Laser : According to customer spec. - Expression Jig Unit - Isolated 2 Chamber - 3 Axis Motion Unit  Related Patent Applications : 2 cases  Features : Between dissimilar metals Welding (Anode-Cathode/ Cell- Busbar) - Reduce contact electrical resistance  Improved heat issues - Minimize Intermetallic Compound  Spatter Suction  Inert Gas Blowing  Use welding parts vision checker(Option)  3 Axis Motion Unit (z axis Focusing Unit)  Package Jig + Expression Jig 18
  • 19.
    ETC Machine System LaserDriller For the CMP Pad Dejunk System Laser Deflasher <60㎛> Laser Marker Fiber Laser Marker CO2 Laser Marker 19
  • 20.
    High Power GreenLaser High Power DPSS Green 100w Laser 20 100W at 532nm 2% rms 240hours Long term stability measurement Specification GREEN 100 Watts Wavelength 532 nm Average Power 100 Watt Repetition Rate 10 kHz Polarization Linear Beam Mode Multi-Mode Beam Size 4.0 mm Beam Divergence 4 mr Pulse-to-Pulse Stability 5 % Power Stability < 3 % @ 24 hrs Controller Electrical Power 220/8A AC, Single Phase, 60 Hz Chiller Electrical Power 220/11.4A AC, Single Phase, 60 Hz Cooling Method Closed-Loop Water Cooling
  • 21.