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HFSS 3D Layout Phi vs HFSS CAD Classic
The document discusses the meshing techniques in HFSS (High Frequency Structure Simulator) focusing on classic and phi mesher approaches, highlighting the benefits of phi meshing for faster and more efficient simulations of complex geometries. HFSS 3D layout is shown to significantly reduce initial mesh times and improve adaptability for multi-layer designs compared to traditional HFSS 3D. Overall, phi meshing offers a breakthrough in generating finite element meshes, enhancing simulation speed and accuracy, particularly for IC components and PCBs.
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HFSS 3D Layout Phi vs HFSS CAD Classic
- 1. HFSS 3D Layoutand the Phi Mesher
- 2. 2 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential HFSS Meshing Techniques Classic • Approach: Starts with a 3D surface triangular mesh on all objects and generate a 3D volume mesh throughout simulation domain • Availability: HFSS (traditional 3D interface) and HFSS 3D Layout • Pro: Works for any arbitrary 3D geometry • Con: For complex, many layered geometries can require a long time to generate PhiNew • Approach: From a layout, generate layer by layer 2D triangular mesh. Sweep mesh in stackup (+z) direction to generate tetrahedral mesh elements • Advantage: Skips heavyweight ACIS and 3D surface mesh generation • Availability: HFSS 3D Layout only • Pro: Extremely fast relative to classic 3D mesh approach • Con: Only works for stack-up or ‘swept in Z’ geometries. IC components and packages, PCBs. etc.
- 3. 3 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Why Phi? Phi vs Classic • Always wins initial mesh generation – Including Lambda + Port Adapt – Initial mesh size is comparable • Can mesh bigger designs – When combined with distributed memory solver and hardware can solve very large and complex designs Initial Mesh is orders of magnitudes faster! HFSS 15: 5hrs - Initial Mesh HFSS 2014: 11min - Initial Mesh
- 4. 4 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential • Accurate Solution – Industry leading meshing capacity – Causal/Passive s-parameters – True DC solution – Embedded RLC or s-parameter components • Fast Simulations – Reduces multi-day long simulations to a few hours or less • Ease of use – 3D Layout – Easy translation, import and setup – Maintains trace characteristics and nets from layout – Hierarchical design – Chip/Package/Board – Embedded dielectric layers – Parameterized model for Design Optimization • Trace width, layer thickness, via dimensions etc. • Manufacturing tolerances (etching factor) • Materials Benefits of HFSS for 3D Layout
- 5. 5 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential HFSS 3D Classic – 5hrs 15min HFSS 3D Layout w Classic v15 – 3hrs 41 min •HFSS 3D Layout meshing advantages – Mesh and solve non-manifold geometry – Mesh geometries with large aspect ratios – Layer-based geometry is easier to edit, modify, clean up etc. Enhanced Meshing in HFSS 3D Layout ¼ of multilayer flip-chip package 20 nets (40 ports) HFSS 3D Layout w Phi – 11 min
- 6. 6 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Is there a difference between HFSS 3D and HFSS 3D Layout ? Solve a model in both HFSS 3D and HFSS 3D Layout and compare Note easy export from HFSS 3D layout to HFSS 3D
- 7. 7 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Multilayer complex package layout • HFSS 3D compared to HFSS 3D Layout HFSS 3D CAD HFSS 3D Layout
- 8. 8 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Initial Meshing Comparison • Extremely fast initial Phi meshing. Phi is 20X faster! • 4min vs. 1hr 20min HFSS 3D CAD - Classic HFSS 3D Layout - PHI
- 9. 9 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential HFSS 3D – Run Time • Total: 6hrs 33min • Adaptive Part: 4hr 1min • Interpolating Sweep: 2hrs 32 min
- 10. 10 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential HFSS 3D Layout – Run Time • Total: 3hrs 3min • Adaptive Part: 1hr 05min • Interpolating Sweep: 1hr 58 min
- 11. 11 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential HFSS CAD vs. HFSS 3D Layout Solid HFSS 3D CAD Dashed - - - - - - - HFSS 3D Layout Virtually identical results from adaptive meshing
- 12. 12 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Summary HFSS 3D CAD HFSS 3D Layout Initial Mesher Classic Phi Initial Mesh Size (tets) 763, 953 712, 536 Initial Mesh Time 1hr 20min 4min Number of Adaptive Passes 6 7 Number of Tets - Final 1, 617, 954 1, 620, 969 Adaptive Passes Run Time 4hrs 1min 1hr 5min (3.7X faster) RAM 47.6 GB 49.6 GB
- 13. 13 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Is there a difference between HFSS 3D and HFSS 3D Layout ? Example #2: Multi-layer PCB with end to end SMA connectors 3D components drawn as stacked up geometry can be modeled in HFSS 3D Layout
- 14. 14 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential HFSS 3D Geometry • Include SMA connector body with stands (serve as ground pins) • Account for true 3D SMA transition to PCB HFSS 3D Solid Model Design Creation Lumped Port dimensions equal to connector pin dimensions
- 15. 15 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Added SMA body geometry to a layout stackup Port properties created automatically HFSS 3D Layout Design Creation Layout View EM Design 3D View Stackup Editor Port/pin settings
- 16. 16 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Results Comparison • HFSS 3D compared to HFSS 3D Layout Solid HFSS 3D CAD Dashed - - - - - - - HFSS 3D Layout
- 17. 17 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Results Comparison – Return Loss • HFSS 3D compared to HFSS 3D Layout Solid HFSS 3D CAD Dashed - - - - - - - - HFSS 3D Layout
- 18. 18 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Results Comparison – Insertion Loss Solid HFSS 3D CAD Dashed - - - - - - - - HFSS 3D Layout • HFSS 3D compared to HFSS 3D Layout
- 19. 19 © 2014ANSYS, Inc. March 28, 2014 ANSYS Confidential Phi meshing is a breakthrough technology for finite element mesh generation Provides designers of IC components, IC packages and printed circuit boards a faster initial mesh and faster simulation Enables even larger and more complex layered geometries to be solved When combined with ANSYS HPC can leverage scalable and fast HPC technologies Distributed direct matrix solver to solve the largest design on distributed memory Spectral decomposition method (SDM) to solve frequency points in parallel for faster simulations Conclusions
Editor's Notes
- #2 This presentation discusses the new Phi meshing technology available with HFSS 2014. It describes this new meshing technology’s advantages in reducing meshing and simulation time for complex layouts found in IC package and high speed printed circuit board designs. It demonstrates examples comparing simulation times and results between solving in the traditional 3D HFSS interface utilizing the classic 3D HFSS meshing technology to the Phi mesher running in the HFSS 3D Layout interface.Matt Commens is the Lead Product Manager for HFSS at ANSYS, Inc. He first joined ANSYS in 2001 working for Ansoft as an application engineer specializing in high frequency electromagnetic simulation. Prior to Joining ANSYS he worked as an antenna designer and simulation manager at Rangestar Wireless in Aptos, CA and as a NMR probe designer at Varian Inc. in Palo Alto, CA. He holds five patents in the areas of NMR coil and antenna design and received a B.S. in Physics from University of Missouri-Rolla and a Ph.D. in physics from Washington University in St. Louis, MO.