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Global PCB Industry Report, 2015-2020
Aug. 2016
METHODOLOGY
Both primary and secondary research methodologies were used
in preparing this study. Initially, a comprehensive and exhaustive
search of the literature on this industry was conducted. These
sources included related books and journals, trade literature,
marketing literature, other product/promotional literature, annual
reports, security analyst reports, and other publications.
Subsequently, telephone interviews or email correspondence
was conducted with marketing executives etc. Other sources
included related magazines, academics, and consulting
companies.
INFORMATION SOURCES
The primary information sources include Company Reports,
and National Bureau of Statistics of China etc.
STUDY GOAL AND OBJECTIVES
This report provides the industry executives with strategically significant
competitor information, analysis, insight and projection on the
competitive pattern and key companies in the industry, crucial to the
development and implementation of effective business, marketing and
R&D programs.
REPORT OBJECTIVES
 To establish a comprehensive, factual, annually updated and cost-
effective information base on market size, competition patterns,
market segments, goals and strategies of the leading players in the
market, reviews and forecasts.
 To assist potential market entrants in evaluating prospective
acquisition and joint venture candidates.
 To complement the organizations’ internal competitor information
gathering efforts with strategic analysis, data interpretation and
insight.
 To suggest for concerned investors in line with the current
development of this industry as well as the development tendency.
 To help company to succeed in a competitive market, and
understand the size and growth rate of any opportunity.Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080
Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com
Copyright 2012 ResearchInChina
Abstract
Global PCB Industry Report, 2015-2020 highlights the followings:
1. Global PCB Market and Status Quo of the Industry
2. Global Downstream Markets of PCB
3. Mobile Phone PCB Trends
4. Tablet PC/Laptop Computer/Automotive PCB Trends
5. Ranking of Global and Chinese PCB Vendors
6. Study of Major Global and Chinese PCB Vendors
Global PCB market was valued at USD57 billion in 2015, a 4.4% decline from 2014, largely due to: 1) depreciation of Japanese yen, euro,
and NTD against the dollar; 2) stagnation in saturated mobile phone market, continuous decline in PC market, and a plunge in tablet PC
market. The sluggish demand from downstream markets has extended to 2016 and it is expected there will be no substitute for
smartphone to drive PCB market until the year 2020. Global PCB industry is projected to keep shrinking in 2016 with a market size of
USD55.3 billion (a 3.0% contraction).
Automotive PCB market is the biggest highlight. Global automotive PCB market size was USD5.28 billion in 2015 and is expected to grow
by 8.3% to USD5.72 billion in 2016 and by 8.2% to USD6.19 billion in 2017, primarily because of impetus of millimeter-wave radar to RF
board, of connected vehicle to multi-layer board, and of chassis electronization to metal substrate.
The biggest change in PCB industry in 2017 will be wider application of substrate like. According to Apple’s suppliers, iPhone 7S/8 to be
launched in 2017 will see some substantial upgradings in specification with substrate-like HDI replacing commonly-used HDI so as to
massively import System in Package (SiP) technology with the aim of modularizing sub-system.
Compared with traditional HDI, the biggest change in the specification of substrate-like HDI is the line space/width on circuit board which
moves toward fine pitch in order to work properly with SiP technology. Particularly, the line space/width must be miniaturized below 35
micrometers. In such case, traditional PCB HDI process cannot meet technical requirements on fine pitch, and large sums of money are
needed to upgrade manufacturing equipment and re-explore production processes. By contrast, IC substrate vendors can easily
produce such PCB, showing overwhelming superiority.
Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080
Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com
Copyright 2012ResearchInChina
According to Apple’s suppliers, for iPhone 7S/8 to be launched in 2017, the original one large traditional HDI board will be disassembled
into four small substrate-like HDI boards, thus not only speeding up import of SiP technology but also freeing up more space for larger
battery capacity. Apple has asked suppliers to send samples in the third quarter, attracting IC substrate vendors including Ibiden,
Kinsus, and Unimicron to scramble for orders. However, it now seems that Kinsus, a key SiP board supplier for Apple, has the best
chance of winning substrate-like HDI order, and ASE Group is likely to grab SiP packaging & testing order.
Global Top10 HDI Vendors in 2015 by Revenue
Source: Global PCB Industry Report, 2015-2020 by ResearchInChina
Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080
Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com
Copyright 2012ResearchInChina
1 Global PCB Market and Industry
1.1 Global PCB Output Value, 1980-2001
1.2 Global PCB Output Value and Growth Rate, 2001-2016
1.3 PaCB Industry Chain
1.4 Global PCB Output Value by Technology, 2000-2020E
1.5 Global PCB Output Value by Place of Production, 2013-2016
1.6 Global PCB Output Value by Corporate Headquarters, 2012-2016
1.7 PCB Industry Revenue and Growth Rate in Taiwan, 2011-2016
1.8 PCB Output Value in Taiwan by Technology, 2013-2016
1.9 PCB Output and Output Value in Japan by Technology, 2015 & 2016
1.10 PCB Output Value in Japan by Type
2 Global Downstream Markets of PCB
2.1 Recent Development of Global Mobile Phone Market
2.2 Chinese Mobile Phone Market, 2016Q2
2.3 Chinese Mobile Phone Market Analysis
2.4 Mobile Phone PCB Trends
2.5 Substrate-like HDI
2.6 Global Top10 HDI Vendors by Revenue, 2015
2.7 PCB Suppliers for Apple, 2015 (%)
2.8 PCB Suppliers for Huawei, 2015 (%)
2.9 PCB Suppliers for BBK (OPPO &Vivio), 2015 (%)
Table of contents
Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080
Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com
2.10 Global Tablet PC Shipments, 2011-2017E
2.11 Global Laptop Computer Shipments, 2008-2017E
2.12 Introduction to Photovoltaic Panel
2.13 Market Share of Major Photovoltaic Panel Companies, 2006-2015
2.14 Introduction to Automotive PCB
2.15 Top20 Automotive PCB Suppliers, 2013-2015
3 Global PCB Vendors
3.1 Global Top100 PCB Vendors (1-56)
3.2 Global Top100 PCB Vendors (57-103)
3.3 Gross Margin and Operating Margin of Major Global PCB Vendors,
2014-2016
3.4 Top15 FPCB Vendors by Revenue, 2014-2015
3.5 Top10 IC Carrier Vendors by Revenue, 2014-2015
3.6 Ranking in China’s PCB Industry (Domestic-funded) (1-25), 2015
3.7 Ranking in China’s PCB Industry (Domestic-funded) (26-50), 2015
3.8 Ranking in China’s PCB Industry (Domestic-funded) (51-75), 2015
3.9 Ranking in China’s PCB Industry (1-23), 2015
3.10 Ranking in China’s PCB Industry (24-47), 2015
3.11 Ranking in China’s PCB Industry (48-72), 2015
3.12 Ranking in China’s PCB Industry (73-100), 2015
Table of contents
Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080
Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com
4 PCB Vendors
4.1 ZDT
4.2 TTM
4.3 Unimicron
4.4 COMPEQ
4.5 Tripod Technology
4.6 HannStar Board
4.7 Nan Ya PCB
4.8 Chin-Poon Industrial
4.9 Gold Circuit Electronics
4.10 MEIKO
4.11 AT&S
4.12 CMK
4.13 IBIDEN
4.14 T.P.T
4.15 DAEDUCK
4.16 SIMMTECH
4.17 LG INNOTEK
4.18 SEMCO
4.19 Unitech
4.20 Dynamic
4.21 Ellington
4.22 WUS Printed Circuit
4.23 Shennan Circuit
4.24 Kinwong
4.25 Fastprint
4.26 Founder PCB
4.27 Wuzhu Technology
4.28 ISU PETASYS
4.29 KBC
You can place your order in the following alternative ways:
1.Order online at www.researchinchina.com
2.Fax order sheet to us at fax number:+86 10 82601570
3. Email your order to: report@researchinchina.com
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Party A:
Name:
Address:
Contact Person: Tel
E-mail: Fax
Party B:
Name: Beijing Waterwood Technologies Co., Ltd (ResearchInChina)
Address: Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beiji
ng, 100080
Contact
Person:
Liao Yan Phone
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E-mail: report@researchinchina.com Fax: 86-10-82601570
Bank
details:
Beneficial Name: Beijing Waterwood Technologies Co., Ltd
Bank Name: Bank of Communications, Beijing Branch
Bank Address: NO.1 jinxiyuan shijicheng,Landianchang,Haidian
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About ResearchInChina
ResearchInChina (www.researchinchina.com) is a leading independent provider of China business
intelligence. Our research is designed to meet the diverse planning and information needs of businesses,
institutions, and professional investors worldwide. Our services are used in a variety of ways, including
strategic planning, product and sales forecasting, risk and sensitivity management, and as investment
research.
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Global pcb industry report, 2015 2020

  • 1. Global PCB Industry Report, 2015-2020 Aug. 2016
  • 2. METHODOLOGY Both primary and secondary research methodologies were used in preparing this study. Initially, a comprehensive and exhaustive search of the literature on this industry was conducted. These sources included related books and journals, trade literature, marketing literature, other product/promotional literature, annual reports, security analyst reports, and other publications. Subsequently, telephone interviews or email correspondence was conducted with marketing executives etc. Other sources included related magazines, academics, and consulting companies. INFORMATION SOURCES The primary information sources include Company Reports, and National Bureau of Statistics of China etc. STUDY GOAL AND OBJECTIVES This report provides the industry executives with strategically significant competitor information, analysis, insight and projection on the competitive pattern and key companies in the industry, crucial to the development and implementation of effective business, marketing and R&D programs. REPORT OBJECTIVES  To establish a comprehensive, factual, annually updated and cost- effective information base on market size, competition patterns, market segments, goals and strategies of the leading players in the market, reviews and forecasts.  To assist potential market entrants in evaluating prospective acquisition and joint venture candidates.  To complement the organizations’ internal competitor information gathering efforts with strategic analysis, data interpretation and insight.  To suggest for concerned investors in line with the current development of this industry as well as the development tendency.  To help company to succeed in a competitive market, and understand the size and growth rate of any opportunity.Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080 Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com Copyright 2012 ResearchInChina
  • 3. Abstract Global PCB Industry Report, 2015-2020 highlights the followings: 1. Global PCB Market and Status Quo of the Industry 2. Global Downstream Markets of PCB 3. Mobile Phone PCB Trends 4. Tablet PC/Laptop Computer/Automotive PCB Trends 5. Ranking of Global and Chinese PCB Vendors 6. Study of Major Global and Chinese PCB Vendors Global PCB market was valued at USD57 billion in 2015, a 4.4% decline from 2014, largely due to: 1) depreciation of Japanese yen, euro, and NTD against the dollar; 2) stagnation in saturated mobile phone market, continuous decline in PC market, and a plunge in tablet PC market. The sluggish demand from downstream markets has extended to 2016 and it is expected there will be no substitute for smartphone to drive PCB market until the year 2020. Global PCB industry is projected to keep shrinking in 2016 with a market size of USD55.3 billion (a 3.0% contraction). Automotive PCB market is the biggest highlight. Global automotive PCB market size was USD5.28 billion in 2015 and is expected to grow by 8.3% to USD5.72 billion in 2016 and by 8.2% to USD6.19 billion in 2017, primarily because of impetus of millimeter-wave radar to RF board, of connected vehicle to multi-layer board, and of chassis electronization to metal substrate. The biggest change in PCB industry in 2017 will be wider application of substrate like. According to Apple’s suppliers, iPhone 7S/8 to be launched in 2017 will see some substantial upgradings in specification with substrate-like HDI replacing commonly-used HDI so as to massively import System in Package (SiP) technology with the aim of modularizing sub-system. Compared with traditional HDI, the biggest change in the specification of substrate-like HDI is the line space/width on circuit board which moves toward fine pitch in order to work properly with SiP technology. Particularly, the line space/width must be miniaturized below 35 micrometers. In such case, traditional PCB HDI process cannot meet technical requirements on fine pitch, and large sums of money are needed to upgrade manufacturing equipment and re-explore production processes. By contrast, IC substrate vendors can easily produce such PCB, showing overwhelming superiority. Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080 Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com Copyright 2012ResearchInChina
  • 4. According to Apple’s suppliers, for iPhone 7S/8 to be launched in 2017, the original one large traditional HDI board will be disassembled into four small substrate-like HDI boards, thus not only speeding up import of SiP technology but also freeing up more space for larger battery capacity. Apple has asked suppliers to send samples in the third quarter, attracting IC substrate vendors including Ibiden, Kinsus, and Unimicron to scramble for orders. However, it now seems that Kinsus, a key SiP board supplier for Apple, has the best chance of winning substrate-like HDI order, and ASE Group is likely to grab SiP packaging & testing order. Global Top10 HDI Vendors in 2015 by Revenue Source: Global PCB Industry Report, 2015-2020 by ResearchInChina Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080 Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com Copyright 2012ResearchInChina
  • 5. 1 Global PCB Market and Industry 1.1 Global PCB Output Value, 1980-2001 1.2 Global PCB Output Value and Growth Rate, 2001-2016 1.3 PaCB Industry Chain 1.4 Global PCB Output Value by Technology, 2000-2020E 1.5 Global PCB Output Value by Place of Production, 2013-2016 1.6 Global PCB Output Value by Corporate Headquarters, 2012-2016 1.7 PCB Industry Revenue and Growth Rate in Taiwan, 2011-2016 1.8 PCB Output Value in Taiwan by Technology, 2013-2016 1.9 PCB Output and Output Value in Japan by Technology, 2015 & 2016 1.10 PCB Output Value in Japan by Type 2 Global Downstream Markets of PCB 2.1 Recent Development of Global Mobile Phone Market 2.2 Chinese Mobile Phone Market, 2016Q2 2.3 Chinese Mobile Phone Market Analysis 2.4 Mobile Phone PCB Trends 2.5 Substrate-like HDI 2.6 Global Top10 HDI Vendors by Revenue, 2015 2.7 PCB Suppliers for Apple, 2015 (%) 2.8 PCB Suppliers for Huawei, 2015 (%) 2.9 PCB Suppliers for BBK (OPPO &Vivio), 2015 (%) Table of contents Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080 Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com 2.10 Global Tablet PC Shipments, 2011-2017E 2.11 Global Laptop Computer Shipments, 2008-2017E 2.12 Introduction to Photovoltaic Panel 2.13 Market Share of Major Photovoltaic Panel Companies, 2006-2015 2.14 Introduction to Automotive PCB 2.15 Top20 Automotive PCB Suppliers, 2013-2015 3 Global PCB Vendors 3.1 Global Top100 PCB Vendors (1-56) 3.2 Global Top100 PCB Vendors (57-103) 3.3 Gross Margin and Operating Margin of Major Global PCB Vendors, 2014-2016 3.4 Top15 FPCB Vendors by Revenue, 2014-2015 3.5 Top10 IC Carrier Vendors by Revenue, 2014-2015 3.6 Ranking in China’s PCB Industry (Domestic-funded) (1-25), 2015 3.7 Ranking in China’s PCB Industry (Domestic-funded) (26-50), 2015 3.8 Ranking in China’s PCB Industry (Domestic-funded) (51-75), 2015 3.9 Ranking in China’s PCB Industry (1-23), 2015 3.10 Ranking in China’s PCB Industry (24-47), 2015 3.11 Ranking in China’s PCB Industry (48-72), 2015 3.12 Ranking in China’s PCB Industry (73-100), 2015
  • 6. Table of contents Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080 Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com 4 PCB Vendors 4.1 ZDT 4.2 TTM 4.3 Unimicron 4.4 COMPEQ 4.5 Tripod Technology 4.6 HannStar Board 4.7 Nan Ya PCB 4.8 Chin-Poon Industrial 4.9 Gold Circuit Electronics 4.10 MEIKO 4.11 AT&S 4.12 CMK 4.13 IBIDEN 4.14 T.P.T 4.15 DAEDUCK 4.16 SIMMTECH 4.17 LG INNOTEK 4.18 SEMCO 4.19 Unitech 4.20 Dynamic 4.21 Ellington 4.22 WUS Printed Circuit 4.23 Shennan Circuit 4.24 Kinwong 4.25 Fastprint 4.26 Founder PCB 4.27 Wuzhu Technology 4.28 ISU PETASYS 4.29 KBC
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  • 8. About ResearchInChina ResearchInChina (www.researchinchina.com) is a leading independent provider of China business intelligence. Our research is designed to meet the diverse planning and information needs of businesses, institutions, and professional investors worldwide. Our services are used in a variety of ways, including strategic planning, product and sales forecasting, risk and sensitivity management, and as investment research. Our Major Activities Multi-users market reports Database-RICDB Custom Research Company Search For any problems, please contact our service team at: Room 502, Block 3, Tower C, Changyuan Tiandi Building, No. 18, Suzhou Street, Haidian District, Beijing, China 100080 Phone: +86 10 82600828 ● Fax: +86 10 82601570 ● www.researchinchina.com ● report@researchinchina.com RICDB service