Automotive PCB market is the biggest highlight. Global automotive PCB market size was USD5.28 billion in 2015 and is expected to grow by 8.3% to USD5.72 billion in 2016 and by 8.2% to USD6.19 billion in 2017, primarily because of impetus of millimeter-wave radar to RF board, of connected vehicle to multi-layer board, and of chassis electronization to metal substrate.
Technological Trends in the Field of Circuit Board Design and ManufacturingToradex
Circuit boards are extensively used across in the electronics industry. So much so that nowadays a circuit board designer is expected to be also proficient in the manufacturing technology apart from understanding electrical engineering. Read this article which will provide you with an insight on the various current and emerging technological trends prevailing in the manufacture of printed circuit boards.
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
Which applications will drive panel platforms?
For more than four decades, the semiconductor industry has rigorously followed Moore’s Law in scaling down CMOS technologies. However, a huge investment in new lithography solutions is required to achieve advanced nodes in a range of 20 nm. Although some packaging platforms processed on wafer, i.e. SI interposer, exhibit good performance, high cost is still the main obstacle that limits its adoption for high-volume manufacturing.
The demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from wafer to a larger-size panel format. Indeed, the panel infrastructure has attracted considerable interest from the semiconductor industry and is certainly a promising market due to its cost advantages and economy of scale benefits. Panel-level manufacturing has the potential to leverage the knowledge and infrastructure of wafer-level packaging (WLP) and the PCB/Flat-Panel Display/Photovoltaic industries....
Power Packaging Technology Trends and Market ExpectationsMarketResearch.com
An overview of Power Packaging Technology Trends and Market Expectations report. In this report you will find detailed descriptions of standard power module packaging designs. There are special focuses on each part: substrate, thermal interface materials, baseplate, encapsulation, die attach and interconnection. Both technological and marketing points of view are considered. Technological innovations are presented, and market metrics and forecasts are given for each part.
Technological Trends in the Field of Circuit Board Design and ManufacturingToradex
Circuit boards are extensively used across in the electronics industry. So much so that nowadays a circuit board designer is expected to be also proficient in the manufacturing technology apart from understanding electrical engineering. Read this article which will provide you with an insight on the various current and emerging technological trends prevailing in the manufacture of printed circuit boards.
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
Which applications will drive panel platforms?
For more than four decades, the semiconductor industry has rigorously followed Moore’s Law in scaling down CMOS technologies. However, a huge investment in new lithography solutions is required to achieve advanced nodes in a range of 20 nm. Although some packaging platforms processed on wafer, i.e. SI interposer, exhibit good performance, high cost is still the main obstacle that limits its adoption for high-volume manufacturing.
The demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from wafer to a larger-size panel format. Indeed, the panel infrastructure has attracted considerable interest from the semiconductor industry and is certainly a promising market due to its cost advantages and economy of scale benefits. Panel-level manufacturing has the potential to leverage the knowledge and infrastructure of wafer-level packaging (WLP) and the PCB/Flat-Panel Display/Photovoltaic industries....
Power Packaging Technology Trends and Market ExpectationsMarketResearch.com
An overview of Power Packaging Technology Trends and Market Expectations report. In this report you will find detailed descriptions of standard power module packaging designs. There are special focuses on each part: substrate, thermal interface materials, baseplate, encapsulation, die attach and interconnection. Both technological and marketing points of view are considered. Technological innovations are presented, and market metrics and forecasts are given for each part.
The world’s first single-chip radar (76 - 81 GHz) in a System-on-Chip.
Ahead of its competitors in RFCMOS applications, Texas Instruments (TI) has begun manufacturing highly integrated radar sensor chips - the latest of which is the AWR1642. But rather than integrating all transmitters, receivers, and local oscillators in a single chip, TI went further and integrated a microcontroller unit (MCU) and a digital signal processor (DSP) on the same chip.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/awr1642-77-79-ghz-rfcmos-radar-chipset-from-texas-instruments/
IP backed financing has been a viable option for companies to raise financing, and is being increasingly resorted to. This report tracks the trends of this financing route, studying the relevant patent assignment records. Prominent sectors, companies, and financial entities involved in IP backed financing transactions are tracked for a six-year period from 2009-2014. Business and financial analysts who wish to understand the impact of a company's IP (read intangible) assets on it's valuation and financing options, will find useful insights in this report.
Continental’s 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness.
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of ±75° in azimuth and a maximum range of more than 90m.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/continental-srr3-b-24ghz-blind-spot-radar/
Intel® Ethernet Series Delivering Real-World Value. As computing and networking scale in performance, interconnect technologies play a critical role in ensuring systems reach their full potential in the speed at which they move data. Intel has been at the forefront of research and development into interconnect technologies since the dawn of the PC era. Today in the data center, Intel is working to deliver greater levels of intelligence within its connectivity solutions to overcome network bottlenecks and accelerate applications. Between PC and peripherals, Intel is heavily involved with the industry as it brings the latest technologies to market for the best user experiences. At the chip level, Intel is leading the industry in advanced packaging with technologies that connect chiplets and modules in order to deliver Moore’s Law advances, while also working to reduce latency between memory and CPU. From “Microns to Miles,” Intel’s investments in interconnect technologies are among the broadest in the industry.
First consumer application in the Intel Core 8th Generation i7-8809G, the world’s first On-Package CPU and GPU with High Bandwidth Memory.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/intels-embedded-multi-die-interconnect-bridge-emib/
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
RFID in PV Solar Manufacturing Industryiaitoinfotech
Government of India had come out with the new mandate guideline under JNNSM that each of the PV modules used under this mission should be attached with the RFID tags to keep its accountability,authenticity & performance measurement.RFID allows better monitoring of the PV manufacturing processes with expedient raw material flow and more effective planning and control.
Embedded Image and Vision Processing 2017 report by Yole DeveloppementYole Developpement
From algorithms included in the image processing pipeline to neural networks running in vision processors, focus on the evolution of hardware in vision systems and how software disrupts this domain.
SOFTWARE IN VISION SYSTEMS
Vision systems are becoming increasingly important. Therefore, this report shows and explains the close links between embedded software and hardware in vision systems at the technology and market levels. What are the software technologies? How do they impact the hardware? Which hardware is impacted? What kinds of markets are affected? And how will they evolve?
We can consider software in vision systems as having two different levels. The first is very close to the hardware, inscribed inside standalone field programmable gate array (FPGA) or application specific integrated circuit (ASIC) chips, or integrated into more complicated architectures. This layer, not often considered, is the most important step in any image treatment after image acquisition by pixels. Image processing, realized in the image signal processor (ISP), has a quite simple function. It must transform a signal from the sensor to an understandable image for the human eye. It is composed as a pipeline of multiple blocks, where each block takes as input the output of the previous block. A lot of different algorithms are implemented to accomplish tasks such as removing artefacts, color correction and reproduction. This is done at a single-pixel or pixel-group level and does not need a lot of memory or power.
More information on that report at http://www.i-micronews.com/reports.html
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...Yole Developpement
How inkjet is building a success story drop by drop within 2.5D and 3D manufacturing?
More information on that report at https://www.i-micronews.com/report/product/inkjet-functional-and-additive-manufacturing-for-electronics.html
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
The world’s first single-chip radar (76 - 81 GHz) in a System-on-Chip.
Ahead of its competitors in RFCMOS applications, Texas Instruments (TI) has begun manufacturing highly integrated radar sensor chips - the latest of which is the AWR1642. But rather than integrating all transmitters, receivers, and local oscillators in a single chip, TI went further and integrated a microcontroller unit (MCU) and a digital signal processor (DSP) on the same chip.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/awr1642-77-79-ghz-rfcmos-radar-chipset-from-texas-instruments/
IP backed financing has been a viable option for companies to raise financing, and is being increasingly resorted to. This report tracks the trends of this financing route, studying the relevant patent assignment records. Prominent sectors, companies, and financial entities involved in IP backed financing transactions are tracked for a six-year period from 2009-2014. Business and financial analysts who wish to understand the impact of a company's IP (read intangible) assets on it's valuation and financing options, will find useful insights in this report.
Continental’s 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness.
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of ±75° in azimuth and a maximum range of more than 90m.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/continental-srr3-b-24ghz-blind-spot-radar/
Intel® Ethernet Series Delivering Real-World Value. As computing and networking scale in performance, interconnect technologies play a critical role in ensuring systems reach their full potential in the speed at which they move data. Intel has been at the forefront of research and development into interconnect technologies since the dawn of the PC era. Today in the data center, Intel is working to deliver greater levels of intelligence within its connectivity solutions to overcome network bottlenecks and accelerate applications. Between PC and peripherals, Intel is heavily involved with the industry as it brings the latest technologies to market for the best user experiences. At the chip level, Intel is leading the industry in advanced packaging with technologies that connect chiplets and modules in order to deliver Moore’s Law advances, while also working to reduce latency between memory and CPU. From “Microns to Miles,” Intel’s investments in interconnect technologies are among the broadest in the industry.
First consumer application in the Intel Core 8th Generation i7-8809G, the world’s first On-Package CPU and GPU with High Bandwidth Memory.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/intels-embedded-multi-die-interconnect-bridge-emib/
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Discrete Power Device Packaging: Materials Market and Technology Trends 2019 ...Yole Developpement
Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
More information on https://www.i-micronews.com/products/discrete-power-device-packaging-materials-market-and-technology-trends-2019/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
RFID in PV Solar Manufacturing Industryiaitoinfotech
Government of India had come out with the new mandate guideline under JNNSM that each of the PV modules used under this mission should be attached with the RFID tags to keep its accountability,authenticity & performance measurement.RFID allows better monitoring of the PV manufacturing processes with expedient raw material flow and more effective planning and control.
Embedded Image and Vision Processing 2017 report by Yole DeveloppementYole Developpement
From algorithms included in the image processing pipeline to neural networks running in vision processors, focus on the evolution of hardware in vision systems and how software disrupts this domain.
SOFTWARE IN VISION SYSTEMS
Vision systems are becoming increasingly important. Therefore, this report shows and explains the close links between embedded software and hardware in vision systems at the technology and market levels. What are the software technologies? How do they impact the hardware? Which hardware is impacted? What kinds of markets are affected? And how will they evolve?
We can consider software in vision systems as having two different levels. The first is very close to the hardware, inscribed inside standalone field programmable gate array (FPGA) or application specific integrated circuit (ASIC) chips, or integrated into more complicated architectures. This layer, not often considered, is the most important step in any image treatment after image acquisition by pixels. Image processing, realized in the image signal processor (ISP), has a quite simple function. It must transform a signal from the sensor to an understandable image for the human eye. It is composed as a pipeline of multiple blocks, where each block takes as input the output of the previous block. A lot of different algorithms are implemented to accomplish tasks such as removing artefacts, color correction and reproduction. This is done at a single-pixel or pixel-group level and does not need a lot of memory or power.
More information on that report at http://www.i-micronews.com/reports.html
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...Yole Developpement
How inkjet is building a success story drop by drop within 2.5D and 3D manufacturing?
More information on that report at https://www.i-micronews.com/report/product/inkjet-functional-and-additive-manufacturing-for-electronics.html
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
Many product ideas require small low power connected devices. For example, many types of activity monitors and Internet Of Things applications.
Learn how to take advantage of open source hardware and software to focus your efforts on the core value of your product that makes it unique.
In this two and a half hour long workshop, we will cover how to leverage the Open Source Firefly Project hardware and software along with other open source components, such as ARM Cortex-M GNU tools, to create a new device. This includes customizing the electronics, mechanicals, and software. You will also be shown how to produce your device at low volumes and estimate the production costs.
Bring your Mac Laptops. Devices based on the Open Source Firefly Project will be available for use by workshop participants to illustrate many of the steps in the process. Successfully program, test, and assemble a device and you can take it with you.
(Information about the Open Source Firefly Project is at http://fireflydesign.com.)
RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONSrfconnex
RFCONNEXT Has developed a family of patent pending High Speed transmission lines Technologies , PMTL, VMTL, and SMTL, that are as good as coaxial lines, but can be printed on multilayer PCB\’s and Flex, and can be building blocks of various high speed cables and connectors, PCB\’s, High Speed Packaging, Test and Measurement, RF/Microwave, and Millimeter Wave, Mobile Handsets and more. www.rfconnext.com, whatch interview by Eric Bogatin of beTheSignal. of Jamal Izadian... Signal Integrity, Power Integrity, and Thermal Integrity Problems are solved
http://realtimewith.com/pages/rtwvprofile.cgi?rtwvcatid=13&rtwvid=1276
Performance Analysis of Encoder in Different Logic Techniques for High-Speed ...Achintya Kumar
In designing a system, we can replace cell components by appropriate technique based cell so that the noise margin of overall circuit is improved. In future we can also implement some techniques for sequential circuits.
An increasing number of power electronics products are taking advantage of a growing trend in the printed circuit board industry: Heavy Copper and EXTREME Copper Printed Circuit Boards.
Most commercially available PCBs are manufactured for low-voltage or low power applications, with copper traces or planes made up of copper weights ranging from 0.5 oz/ft2 to 3 oz/ft2. Heavy copper PCBs can have more than five times that copper weight, and EXTREME copper PCBs can range up to 200 oz/ft2.
This video discusses design considerations unique to this product as well as how much current these boards can carry. The minimum conductor width and spacing and cost trade-offs for the different techniques will also be covered.
Zuken - Improve pcb quality and cost with concurrent power integrity analysis...Zuken
This presentation will look at the increasing challenges with power distribution systems on modern high-speed PCBs.
This presentation will consider:
a)The problem:
-
IC input impedance behavior
-
Resonance behavior of PDS.
- Role of decoupling capacitors
b)
EDA methodology for concurrent power integrity simulation throughout PCB design process.
Leardon Solutions is a global product development, engineering, and manufacturing services company who is passionate about helping small/medium businesses, entrepreneurs, and start-ups turn their ideas and concepts into revenue generating products. Leardon Solutions applies decades of collective knowledge and experience in medical, sports, and consumer products for companies looking to collaborate on all or a part of their product design and/or manufacturing.
Global and china rigid pcb industry report, 2015ResearchInChina
2014 was a good year for majority of PCB companies, as output value of PCB industry touched USD59.6 billion, rising 3.7% against 2013, the fastest growth rate since 2011. Looking forward to 2015, a collapse in prices of commodities, especially in that of copper, will significantly reduce raw materials costs of PCB companies, thus further driving their profit margins.
Global and china ic substrate industry report, 2015ResearchInChina
IC substrate industry may be in a predicament in 2015, rooted in two aspects: first, the maturing of FOWLP; second, the tablet sales decline and sluggish smartphone growth. In addition, the prosperity of IC substrate industry in 2013 stimulated large-scale expansion of enterprises in 2014, thus leading to an insufficient rate of capacity utilization.
It's about AAC Technologies Holdings, Inc, the global leading supplier of integrated micro-component solutions for communication and IT consumer electronics, providing clients with innovative solution technologies ranging from acoustics to haptics vibrators, radio frequency (RF) and optics.
This research study examines the Global Industrial PC Market on the basis of various segments - by component, product, application, and geography. Major drivers, restraints, and opportunities have been mentioned to provide an exhaustive picture of the market. Furthermore, the current market trends related to the demand, supply, and sales, in addition to the recent developments, have been provided in this report. The report also analyzes key players in the Global Industrial PC Market
Global and china li ion power battery industry report , 2017-2020ResearchInChina
There are three major technology roadmaps for power battery around the world:
(1) Ternary materials-based: NCA and NCM as main cathode materials. Featuring high energy density, NCM batteries have become a mainstream battery technology for electric vehicles along with a sharp cutin procurement costs of the batteries in recent years. Chinese battery enterprises, represented by Tianjin Lishen and Boston Power, have started the production of NCM batteries since 2014. NCA is chiefly used in 18650-type battery (the highest energy density so far), which supports mainly Tesla and Toyota RAV4. However, due to strong chemical activity of aluminum mixed in NCA, advanced BMS is needed to monitor the operating condition of the battery, thus resulting in a low penetration in carmakers.
(2) LFP-based. Canada and the United States were the first countries to develop power battery technology. In China, LFP, the mainstream technology for power lithium battery, is widely used in passenger cars and buses, with the typical enterprises including BYD and Guoxuan High-tech. However, due to the factors like low specific energy and poor low-temperature starting performance, LFP batteries still have not been widely used worldwide.
(3) Manganese series: with LMO as main cathode material. LMO is generally modified and is mixed with a small amount of NCM or LNO to raise battery energy density. Key representative manufacturers are LGC, AESC, LEJ, etc. And in China, they are CITIC Guoan MGL, Do-Fluoride Chemicals, etc.
China silicon carbide industry report, 2016 2020ResearchInChina
Since China's silicon carbide export quota was abolished, China’s silicon carbide export volume grew rapidly during 2013-2014, and tended to stabilize during 2015-2016. In 2016, China’s silicon carbide exports came to 321,500 tons, up 2.1% year on year; wherein, Ningxia’s export volume amounted to 111,900 tons, accounting for 34.9% of the total exports and acting as a main silicon carbide exporter in China.
As China's silicon carbide products are mainly low-end preliminarily processed products with moderate added value, the average price gap between export and import is enormous. In 2016, China's silicon carbide exports had the average price at USD0.9 / kg, less than 1/4 of the import average price (USD4.3 / kg).
Global and china hd map industry research summary, 2016 [兼容模式]ResearchInChina
Overall, autonomous driving is now dominated by automakers, and they will not completely open their underlying data on vehicles to HD map providers. Thus, many auto makers (like Audi, Mercedes-Benz, and BMW), obtain HD map data sources by acquiring digital map providers. In contrast, due to a lack of experience in fault tolerance and underlying data of vehicles, Internet companies end up cooperating with automakers.
Global and china vr and ar industry research summary, 2016 2020 [兼容模式]ResearchInChina
VR Trends:
Gradually-formed industrial standards raise access threshold, thus eliminating less competitive teams and companies;
Large companies gradually build perfect VR ecosystem;
PC VR products, primarily games and movies, will be targeted at expert players and game enthusiasts;
Mobile VR products gradually move into business fields like education and tourism;
The number of content development teams will increase, and the scope of VR contents will broaden.
Global and china natural rubber industry report, 2016 2020ResearchInChina
Due to the sluggish global economic growth and the excess supply of natural rubber, the price of natural rubber has been hovering at a low level. As of the end of 2015, China's natural rubber price had fallen to around USD1,140 / ton which was also the cost price. In 2016, the global average price of natural rubber fluctuates at USD1,200-1,500 / ton.
Global and china titanium dioxide industry report, 2016 2020ResearchInChina
In 2015, the global titanium dioxide market size hit EUR10.17 billion, up 3.7% year on year. In 2016-2020, the global market size is expected to present a CAGR of around 4.5% and reach nearly EUR13 billion in 2020.
As consumers have growing awareness of car navigation products as well as telematics develops radically, the global car navigation market witnesses steady development and a higher penetration rate. In 2015, the global embedded automotive navigation system shipment was estimated at 23.9 million sets, with the market size of USD21.6 billion; in 2016, the shipment will reach 25.3 million sets, with the market size up to USD22.6 billion.
From January to May of 2016, China preinstalled 2.074 million sets of car navigation; in 2016, the figure will exceed 5 million sets and hit 5.563 million sets.
Currently, Chinese car navigation map OEMs include NavInfo, AutoNavi (AMAP) and eMapgo Technologies (Beijing); aftermarket map companies embrace Careland, Ritu and NavInfo, among which, NavInfo and Careland occupy the majority of market share in the OEM market and the aftermarket respectively.
In the next few years, China’s preinstalled car navigation will jump year by year, with the expected amount of 9.55 million sets by 2020 and the CAGR of 15% in 2016-2020.
The increase of preinstallation is driven by the two below:
1. The navigation installation ratio of vehicle models for sale increases steadily
As of May 2016, 4,724 models of passenger cars had been on sale in the Chinese market, including 1,782 models equipped with navigation systems, with the installation ratio of 37.7%; among them, Haval’s 130 models had been equipped with navigation systems with the installation ratio of 85%, ranking first. Independent brands, such as Haval, Chang'an, Geely and BYD, played main roles in promoting navigation systems.
2. Automotive navigation has spread gradually from medium and high-end vehicle models to low-end models.
In terms of the navigation installation ratio of vehicle models on sale, 1,245 models tagged with the unit price of RMB200,000 or less were equipped with navigation in May 2016, compared with 1,004 models in? January; correspondingly, the navigation installation ratio ascended from 31.1% to 32.7%. This shows that Chinese car navigation has spread gradually from medium and high-end vehicle models to low-end models.
Global and china supercapacitor industry report, 2016 2020ResearchInChina
Globally, supercapacitor is primarily applied to consumer electronics and transportation, which made up 47% and 29% of total supercapacitor consumption respectively in 2015. The demand for supercapacitor from transportation, particularly electric vehicles, has risen rapidly and is expected to account for roughly 41% in 2020, becoming the largest application field of supercapacitor.
Global and china carbon fiber and cfrp industry report, 2016 2020ResearchInChina
The global carbon fiber demand amounted to 59,000 tons in 2015. 22%, 62% and 16% of carbon fiber were applied to aerospace, industries, and sports & leisure respectively. Specifically, the demand from industries grew fastest, especially from automobiles, wind power, pressure vessels and other market segments. By 2020, 72% of the global carbon fiber will be used in industries, of which 23% will be adopted by automobiles and 21% by wind power.
China etc (electronic toll collection) industry report, 2015 2019ResearchInChina
The Chinese ETC equipment (OBU, RSU) market size has expanded rapidly in recent years, growing at a CAGR of 33.5% during 2012-2014. With advances in networked ETC nationwide, the Chinese ETC equipment market size is estimated to be up to RMB1.35 billion in 2015, presenting a year-on-year jump of 40.5%.
Global and china low e glass industry report, 2015-2018ResearchInChina
Although China’s Low-E glass capacity grows rapidly, the constraint of production technologies (especially online coating technology) leads to a low capacity utilization rate. In 2014, China’s Low-E glass output ascended 11.9% year on year to 150 million m2, while the capacity utilization rate was only 25.1%. In 2015, the capacity utilization rate is expected to hit 25.8% amid the stable glass market. In addition, China's Low-E glass penetration rate is less than 15%, still lagging far behind 80% in Europe, Japan, South Korea, the United States and other developed countries.
Global and china li ion power battery industry report, 2016-2020ResearchInChina
In 2014, the global demand for Li-ion power battery for electric vehicles came to 9.8GWh, up 87% from a year earlier, of which the demand from passenger vehicles totaled 7.3GWh and commercial vehicles 2.5GWh. In H1 2015, the global demand for EV Li-ion power battery hit 7GWh, maintaining high growth
Global and china graphene industry report, 2015 2018ResearchInChina
Global graphene market size is only USD24.4 million in 2015, and most of demand comes from semiconductor electronics, lithium battery and composite materials industries, which seize a combined 60.1% share. As progress is made in the industrialized application of graphene, global graphene market size is expected to hit USD65 million in 2018.
China tire curing press industry report,2015 2018 ResearchInChina
By the end of 2014, there are about 40 tire curing press manufacturers in China with the annual capacity of 4,500 units or so, mainly distributed in major tire-producing provinces such as Shandong province (Qingdao city), Jiangsu province, Guangdong province. Among them, only Guilin Rubber Machinery and Sino-Rubber Machinery have annual capacity of more than 500 units of curing press, others produce 200-400 units a year. In 2014, Guilin Rubber Machinery, Yiyang Rubber & Plastics Machinery Group, Greatoo Inc., Sino-Rubber Machinery, Guangzhou SCUT Bestry Technology occupied the top five spots of curing press production ranking.
Global and china tyre pressure monitoring system (tpms) industry report, 2015...ResearchInChina
South Korea, European Union, and Taiwan joined the camp that forces the installation of TPMS in 2014, as the former in Jul 2014 and the latter two in Nov 2014 asked that related auto models must be installed with TPMS, directly boosting global demand for the product. Global installation rate of TPMS reached 36% in 2014, up 6 percentage points from 2013, and is expected to exceed 45% in 2015, creating a demand of more than 40 million sets.
The development of automobiles, machinery manufacturing, electrical, and other industries in China has triggered a rapid expansion of lubricant market size. So far, China has become one of the world’s major lubricant producers and consumers. However, amid the low-speed growth of the global economy, China’s lubricant market continued to decline for the past two years, with 2014’s lubricant output falling by 3.6% year-on-year to 5.6866 million tons.
Global and china 3 d printing industry report, 2015 2018ResearchInChina
Since 2010, the global 3D printing market has been in a period of rapid development, with an AAGR of 30% or so. In 2014, the market size totaled USD4.1 billion. 3D printing mainly involves software, equipment, materials and service, of which 3D printing equipment accounted for about 46.5% in the industry in 2014.
China financial leasing industry report, 2015ResearchInChina
Although China’s economic growth posted continuous downturn, China financial leasing industry maintained fast increase since 2014, with total turnover reaching around RMB 3,420 billion as of the end of March 2015, up about RMB 220 billion compared to the end of 2014. The number of enterprises totaled 2,661, an increase of 459 compared to the end of 2014. The number of foreign leasing enterprises enjoyed the fastest growth, being 2,440, an increase of 420.
Global and china automotive seating industry report, 2014 2015ResearchInChina
The seemingly simple automotive seating actually reflects a country's machining ability. In the world, at most 20 companies are capable of producing automotive seating whose frames are made of precision metals via stamping, while nearly a thousand companies have the capability to produce automotive engines.
Global and china obd telematics industry report, 2014 2015ResearchInChina
Along with the development of intelligent automobile hardware and mobile internet, the car becomes the next fast-growing mobile terminal and telematics market also ushers in rapid development. At present, the enterprises are aggressively engaged in telematics market layout and seizing the entrance to telematics, then OBD-based telematic solutions become an important entrance.
Opendatabay - Open Data Marketplace.pptxOpendatabay
Opendatabay.com unlocks the power of data for everyone. Open Data Marketplace fosters a collaborative hub for data enthusiasts to explore, share, and contribute to a vast collection of datasets.
First ever open hub for data enthusiasts to collaborate and innovate. A platform to explore, share, and contribute to a vast collection of datasets. Through robust quality control and innovative technologies like blockchain verification, opendatabay ensures the authenticity and reliability of datasets, empowering users to make data-driven decisions with confidence. Leverage cutting-edge AI technologies to enhance the data exploration, analysis, and discovery experience.
From intelligent search and recommendations to automated data productisation and quotation, Opendatabay AI-driven features streamline the data workflow. Finding the data you need shouldn't be a complex. Opendatabay simplifies the data acquisition process with an intuitive interface and robust search tools. Effortlessly explore, discover, and access the data you need, allowing you to focus on extracting valuable insights. Opendatabay breaks new ground with a dedicated, AI-generated, synthetic datasets.
Leverage these privacy-preserving datasets for training and testing AI models without compromising sensitive information. Opendatabay prioritizes transparency by providing detailed metadata, provenance information, and usage guidelines for each dataset, ensuring users have a comprehensive understanding of the data they're working with. By leveraging a powerful combination of distributed ledger technology and rigorous third-party audits Opendatabay ensures the authenticity and reliability of every dataset. Security is at the core of Opendatabay. Marketplace implements stringent security measures, including encryption, access controls, and regular vulnerability assessments, to safeguard your data and protect your privacy.
Data Centers - Striving Within A Narrow Range - Research Report - MCG - May 2...pchutichetpong
M Capital Group (“MCG”) expects to see demand and the changing evolution of supply, facilitated through institutional investment rotation out of offices and into work from home (“WFH”), while the ever-expanding need for data storage as global internet usage expands, with experts predicting 5.3 billion users by 2023. These market factors will be underpinned by technological changes, such as progressing cloud services and edge sites, allowing the industry to see strong expected annual growth of 13% over the next 4 years.
Whilst competitive headwinds remain, represented through the recent second bankruptcy filing of Sungard, which blames “COVID-19 and other macroeconomic trends including delayed customer spending decisions, insourcing and reductions in IT spending, energy inflation and reduction in demand for certain services”, the industry has seen key adjustments, where MCG believes that engineering cost management and technological innovation will be paramount to success.
MCG reports that the more favorable market conditions expected over the next few years, helped by the winding down of pandemic restrictions and a hybrid working environment will be driving market momentum forward. The continuous injection of capital by alternative investment firms, as well as the growing infrastructural investment from cloud service providers and social media companies, whose revenues are expected to grow over 3.6x larger by value in 2026, will likely help propel center provision and innovation. These factors paint a promising picture for the industry players that offset rising input costs and adapt to new technologies.
According to M Capital Group: “Specifically, the long-term cost-saving opportunities available from the rise of remote managing will likely aid value growth for the industry. Through margin optimization and further availability of capital for reinvestment, strong players will maintain their competitive foothold, while weaker players exit the market to balance supply and demand.”
Techniques to optimize the pagerank algorithm usually fall in two categories. One is to try reducing the work per iteration, and the other is to try reducing the number of iterations. These goals are often at odds with one another. Skipping computation on vertices which have already converged has the potential to save iteration time. Skipping in-identical vertices, with the same in-links, helps reduce duplicate computations and thus could help reduce iteration time. Road networks often have chains which can be short-circuited before pagerank computation to improve performance. Final ranks of chain nodes can be easily calculated. This could reduce both the iteration time, and the number of iterations. If a graph has no dangling nodes, pagerank of each strongly connected component can be computed in topological order. This could help reduce the iteration time, no. of iterations, and also enable multi-iteration concurrency in pagerank computation. The combination of all of the above methods is the STICD algorithm. [sticd] For dynamic graphs, unchanged components whose ranks are unaffected can be skipped altogether.
Explore our comprehensive data analysis project presentation on predicting product ad campaign performance. Learn how data-driven insights can optimize your marketing strategies and enhance campaign effectiveness. Perfect for professionals and students looking to understand the power of data analysis in advertising. for more details visit: https://bostoninstituteofanalytics.org/data-science-and-artificial-intelligence/
Levelwise PageRank with Loop-Based Dead End Handling Strategy : SHORT REPORT ...Subhajit Sahu
Abstract — Levelwise PageRank is an alternative method of PageRank computation which decomposes the input graph into a directed acyclic block-graph of strongly connected components, and processes them in topological order, one level at a time. This enables calculation for ranks in a distributed fashion without per-iteration communication, unlike the standard method where all vertices are processed in each iteration. It however comes with a precondition of the absence of dead ends in the input graph. Here, the native non-distributed performance of Levelwise PageRank was compared against Monolithic PageRank on a CPU as well as a GPU. To ensure a fair comparison, Monolithic PageRank was also performed on a graph where vertices were split by components. Results indicate that Levelwise PageRank is about as fast as Monolithic PageRank on the CPU, but quite a bit slower on the GPU. Slowdown on the GPU is likely caused by a large submission of small workloads, and expected to be non-issue when the computation is performed on massive graphs.
Chatty Kathy - UNC Bootcamp Final Project Presentation - Final Version - 5.23...John Andrews
SlideShare Description for "Chatty Kathy - UNC Bootcamp Final Project Presentation"
Title: Chatty Kathy: Enhancing Physical Activity Among Older Adults
Description:
Discover how Chatty Kathy, an innovative project developed at the UNC Bootcamp, aims to tackle the challenge of low physical activity among older adults. Our AI-driven solution uses peer interaction to boost and sustain exercise levels, significantly improving health outcomes. This presentation covers our problem statement, the rationale behind Chatty Kathy, synthetic data and persona creation, model performance metrics, a visual demonstration of the project, and potential future developments. Join us for an insightful Q&A session to explore the potential of this groundbreaking project.
Project Team: Jay Requarth, Jana Avery, John Andrews, Dr. Dick Davis II, Nee Buntoum, Nam Yeongjin & Mat Nicholas
2. METHODOLOGY
Both primary and secondary research methodologies were used
in preparing this study. Initially, a comprehensive and exhaustive
search of the literature on this industry was conducted. These
sources included related books and journals, trade literature,
marketing literature, other product/promotional literature, annual
reports, security analyst reports, and other publications.
Subsequently, telephone interviews or email correspondence
was conducted with marketing executives etc. Other sources
included related magazines, academics, and consulting
companies.
INFORMATION SOURCES
The primary information sources include Company Reports,
and National Bureau of Statistics of China etc.
STUDY GOAL AND OBJECTIVES
This report provides the industry executives with strategically significant
competitor information, analysis, insight and projection on the
competitive pattern and key companies in the industry, crucial to the
development and implementation of effective business, marketing and
R&D programs.
REPORT OBJECTIVES
To establish a comprehensive, factual, annually updated and cost-
effective information base on market size, competition patterns,
market segments, goals and strategies of the leading players in the
market, reviews and forecasts.
To assist potential market entrants in evaluating prospective
acquisition and joint venture candidates.
To complement the organizations’ internal competitor information
gathering efforts with strategic analysis, data interpretation and
insight.
To suggest for concerned investors in line with the current
development of this industry as well as the development tendency.
To help company to succeed in a competitive market, and
understand the size and growth rate of any opportunity.Room 509, Building 1+1, No.10, Caihefang Road, Haidian District, Beijing, 100080
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Copyright 2012 ResearchInChina
3. Abstract
Global PCB Industry Report, 2015-2020 highlights the followings:
1. Global PCB Market and Status Quo of the Industry
2. Global Downstream Markets of PCB
3. Mobile Phone PCB Trends
4. Tablet PC/Laptop Computer/Automotive PCB Trends
5. Ranking of Global and Chinese PCB Vendors
6. Study of Major Global and Chinese PCB Vendors
Global PCB market was valued at USD57 billion in 2015, a 4.4% decline from 2014, largely due to: 1) depreciation of Japanese yen, euro,
and NTD against the dollar; 2) stagnation in saturated mobile phone market, continuous decline in PC market, and a plunge in tablet PC
market. The sluggish demand from downstream markets has extended to 2016 and it is expected there will be no substitute for
smartphone to drive PCB market until the year 2020. Global PCB industry is projected to keep shrinking in 2016 with a market size of
USD55.3 billion (a 3.0% contraction).
Automotive PCB market is the biggest highlight. Global automotive PCB market size was USD5.28 billion in 2015 and is expected to grow
by 8.3% to USD5.72 billion in 2016 and by 8.2% to USD6.19 billion in 2017, primarily because of impetus of millimeter-wave radar to RF
board, of connected vehicle to multi-layer board, and of chassis electronization to metal substrate.
The biggest change in PCB industry in 2017 will be wider application of substrate like. According to Apple’s suppliers, iPhone 7S/8 to be
launched in 2017 will see some substantial upgradings in specification with substrate-like HDI replacing commonly-used HDI so as to
massively import System in Package (SiP) technology with the aim of modularizing sub-system.
Compared with traditional HDI, the biggest change in the specification of substrate-like HDI is the line space/width on circuit board which
moves toward fine pitch in order to work properly with SiP technology. Particularly, the line space/width must be miniaturized below 35
micrometers. In such case, traditional PCB HDI process cannot meet technical requirements on fine pitch, and large sums of money are
needed to upgrade manufacturing equipment and re-explore production processes. By contrast, IC substrate vendors can easily
produce such PCB, showing overwhelming superiority.
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Copyright 2012ResearchInChina
4. According to Apple’s suppliers, for iPhone 7S/8 to be launched in 2017, the original one large traditional HDI board will be disassembled
into four small substrate-like HDI boards, thus not only speeding up import of SiP technology but also freeing up more space for larger
battery capacity. Apple has asked suppliers to send samples in the third quarter, attracting IC substrate vendors including Ibiden,
Kinsus, and Unimicron to scramble for orders. However, it now seems that Kinsus, a key SiP board supplier for Apple, has the best
chance of winning substrate-like HDI order, and ASE Group is likely to grab SiP packaging & testing order.
Global Top10 HDI Vendors in 2015 by Revenue
Source: Global PCB Industry Report, 2015-2020 by ResearchInChina
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Copyright 2012ResearchInChina
5. 1 Global PCB Market and Industry
1.1 Global PCB Output Value, 1980-2001
1.2 Global PCB Output Value and Growth Rate, 2001-2016
1.3 PaCB Industry Chain
1.4 Global PCB Output Value by Technology, 2000-2020E
1.5 Global PCB Output Value by Place of Production, 2013-2016
1.6 Global PCB Output Value by Corporate Headquarters, 2012-2016
1.7 PCB Industry Revenue and Growth Rate in Taiwan, 2011-2016
1.8 PCB Output Value in Taiwan by Technology, 2013-2016
1.9 PCB Output and Output Value in Japan by Technology, 2015 & 2016
1.10 PCB Output Value in Japan by Type
2 Global Downstream Markets of PCB
2.1 Recent Development of Global Mobile Phone Market
2.2 Chinese Mobile Phone Market, 2016Q2
2.3 Chinese Mobile Phone Market Analysis
2.4 Mobile Phone PCB Trends
2.5 Substrate-like HDI
2.6 Global Top10 HDI Vendors by Revenue, 2015
2.7 PCB Suppliers for Apple, 2015 (%)
2.8 PCB Suppliers for Huawei, 2015 (%)
2.9 PCB Suppliers for BBK (OPPO &Vivio), 2015 (%)
Table of contents
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2.10 Global Tablet PC Shipments, 2011-2017E
2.11 Global Laptop Computer Shipments, 2008-2017E
2.12 Introduction to Photovoltaic Panel
2.13 Market Share of Major Photovoltaic Panel Companies, 2006-2015
2.14 Introduction to Automotive PCB
2.15 Top20 Automotive PCB Suppliers, 2013-2015
3 Global PCB Vendors
3.1 Global Top100 PCB Vendors (1-56)
3.2 Global Top100 PCB Vendors (57-103)
3.3 Gross Margin and Operating Margin of Major Global PCB Vendors,
2014-2016
3.4 Top15 FPCB Vendors by Revenue, 2014-2015
3.5 Top10 IC Carrier Vendors by Revenue, 2014-2015
3.6 Ranking in China’s PCB Industry (Domestic-funded) (1-25), 2015
3.7 Ranking in China’s PCB Industry (Domestic-funded) (26-50), 2015
3.8 Ranking in China’s PCB Industry (Domestic-funded) (51-75), 2015
3.9 Ranking in China’s PCB Industry (1-23), 2015
3.10 Ranking in China’s PCB Industry (24-47), 2015
3.11 Ranking in China’s PCB Industry (48-72), 2015
3.12 Ranking in China’s PCB Industry (73-100), 2015
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