The document provides a teardown analysis of the Texas Instruments AWR1642 79 GHz radar chipset. It includes:
- An overview of the chipset's features and TI's portfolio.
- A physical analysis of the package and die, identifying key blocks and the RF CMOS process.
- A cost analysis estimating wafer costs, die costs, and the packaged component cost.
- A comparison to other TI mmWave devices and a Delphi radar solution.
- An estimated selling price for the AWR1642 chipset based on its manufacturing costs and TI's financial parameters.
amsās Color Sensor in the Apple iPhone 8 2018 teardown reverse costing report...Yole Developpement
Ā
A next-generation sensor with organic color filters, more photodiodes, and infrared detection.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/amss-color-sensor-in-the-apple-iphone-8/
GaN-on-Silicon Transistor Comparison 2018 Structural, Process & Costing Repor...Yole Developpement
Ā
Dive deep into the technology and cost of GaN-on-silicon HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments.
More information on that report at https://www.i-micronews.com/report/product/gan-on-silicon-transistor-comparison-2018.html
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Continentalās 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness.
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of Ā±75Ā° in azimuth and a maximum range of more than 90m.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/continental-srr3-b-24ghz-blind-spot-radar/
Continental, Veoneer, ZF, Valeo, Bosch, Aptiv, Denso, Ainstein: Discover the technologies used in the main Radar Systems and Chipsets.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/automotive-radar-comparison-2018/
Ainstein T-79: Automotive 79GHz Short Range Radarsystem_plus
Ā
A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Ā
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technologyās low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providersā investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 ā 2020. This will increase to 40% from 2020 ā 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
amsās Color Sensor in the Apple iPhone 8 2018 teardown reverse costing report...Yole Developpement
Ā
A next-generation sensor with organic color filters, more photodiodes, and infrared detection.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/amss-color-sensor-in-the-apple-iphone-8/
GaN-on-Silicon Transistor Comparison 2018 Structural, Process & Costing Repor...Yole Developpement
Ā
Dive deep into the technology and cost of GaN-on-silicon HEMTs from EPC, Transphorm, GaN Systems, Panasonic and Texas Instruments.
More information on that report at https://www.i-micronews.com/report/product/gan-on-silicon-transistor-comparison-2018.html
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Continentalās 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness.
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of Ā±75Ā° in azimuth and a maximum range of more than 90m.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/continental-srr3-b-24ghz-blind-spot-radar/
Continental, Veoneer, ZF, Valeo, Bosch, Aptiv, Denso, Ainstein: Discover the technologies used in the main Radar Systems and Chipsets.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/automotive-radar-comparison-2018/
Ainstein T-79: Automotive 79GHz Short Range Radarsystem_plus
Ā
A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Ā
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technologyās low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providersā investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 ā 2020. This will increase to 40% from 2020 ā 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Ā
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 Āµm or even 50 Āµm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
FLIR Boson ā a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
Ā
An infrared camera with a powerful vision processor in a small package, using a new 12Ī¼m microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera coreās economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Ā
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
The MRR20 is a 77GHz radar sensor offering mid-range detection for Advanced Driver Assistance Systems (ADAS).
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/mando-mrr20-77ghz-mid-range-radar/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
Ā
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the marketās dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
Ā
In the era of a slowing Mooreās Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...Yole Developpement
Ā
Continental consolidates its successful role in ADAS-related equipment with this cost-effective solution for emergency brake assist.
Light detection and ranging (LiDAR) sensing has a wide spectrum of applications, one of which is in autonomous or āself-drivingā cars. LiDAR is therefore attracting attention from the automotive industry, as well as other fields. However, until now, systems havenāt matched challenging automotive specifications for reliability, compact-ness, and cost-efficiency.
Based on rugged design and components, the SRL-1 from Continental provides a reliable and efficient solid-state LiDAR for frontal impact detection without any mechanical movement. Detecting collisions in an urban environment at speeds up to 50km/h, including an emergency braking assist (EBA) function, makes this product a great asset for todayās autonomous and assisted driving needs.
More information on that report at http://www.i-micronews.com/reports.html
An ultrasonic sensor in a compact housing, with 20-450cm detection range.
Ultrasonic transducers are used in vehicles as parking assistance. The ultrasonic transducer sends out short ultrasonic impulses which are reflected by barriers. The echo signals are registered by the sensor and are evaluated by a central control unit.
This ultrasonic parking sensor from Bosch is very compact with its very few components meaning it is manufactured at low cost. The sensor is made with one electronic board, including a Bosch transceiver integrated circuit (IC) that drives the output of the Epcos/TDK transformer and evaluates the reflected signal. The transducer itself is made of a lead zirconate titanate (PZT) membrane and silver electrodes.
More information on that report at http://www.i-micronews.com/reports.html
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Samsung Galaxy S9+ Teardown and Identification of Key Components report publ...Yole Developpement
Ā
Discover Samsungās key devices, advanced packaging technical choices and main suppliers.
More information on that report at https://www.i-micronews.com/report/product/samsung-galaxy-s9-teardown-and-identification-of-key-components.html
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Ā
Driven by megatrend markets, More than Moore devicesā overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
LG LA080WV3 ā8-inch Display with Touch Panel for Car Navigation 2017 teardown...Yole Developpement
Ā
An inside look at the reasons why LG Display is one of the top players in the automotive display market
Automotive displays are increasingly replacing mechanical meters and buttons, and the display market is therefore forecasted to grow rapidly over the next few years.
However, it is still unclear which suppliers will emerge as long-term winners. To fulfill the requirements of the market and its users, it is important to consider various conditions and specifications.
Display characteristics like luminance, contrast ratio, greyscale, and color, and their maintenance under automotive conditions of varying temperature and ambient light must continually improve.
LG Display provides smart infotainment to drivers and passengers. Its advanced high performance in-plane switching (AH-IPS) enables high resolution, high luminance and wide viewing angle, which is the display standard in smart cars.
LG Display stays competitive by combining low-cost manufacturing at its Nanjing site and the experience it has acquired in the automotive market.
This report presents a complete teardown analysis of LGās LA080WV3 8-inch display and the associated touchscreen extracted from the Hyundai Tucson.
Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the display module. The report also offers a complete physical analysis and manufacturing cost estimate for every part, including the backlight module and the different mechanical frames.
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
Ā
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Fan-In Packaging: Business update 2016 Report by Yole DeveloppementYole Developpement
Ā
Fan-In: A steady growth platform awaiting disruption
The Fan-In Packaging platform has been a successful and steadily growing platform for over a decade. It remains appealing as an inherently unmatched combination of smallest package form factor and low cost. Due to these features, historically it found penetration in form driven handsets and tablets and has maintained growth within these devices. It is estimated that more than 90% of Fan-In packages today are found in the mobile segment. With respect to Fan-In adoption, in todayās high end smartphones already more than 30% of all packages are Fan-In packages. Therefore, Fan-In packaging spread in the sweet spot mobile segment continues.
While the Fan-In packaging growth pace until now could be described as steady and stable, the global semiconductor market shifts and rising uncertainty over future applications will inevitably impact the outlook of Fan-In packaging as well. The smartphone market leading Fan-In adoption is maturing, with smartphone unit growth dropping from 35% in 2013 to 8% in 2016 and forecasted at 6% by 2020. While the trend is not favourable in terms of high growth expectations, smartphones are still expected to be the leading semiconductor driver with more than 2 billion units in 2020.
Primary Fan-In devices are WiFi/BT combos, transceivers, PMIC and DC/DC converters (~50% of total production) followed by a variety of analog/digital/mixed signal devices including MEMS and image sensors. The biggest challenge the Fan-In platform will be facing in the future is functional integration of devices into SiP form. Figure below indicates the impact of SiP growth on Fan-In unit production, decreasing the overall CAGR from 9% to 6%. A detailed analysis of SiP growth is performed in the report.
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
Ā
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
The first Aptiv short range radar with Infineon SiGe CMOS technology for Advanced Driver Assistance Systems (ADAS).
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/aptiv-r3tr-76ghz-short-range-radar/
Worldās first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Ā
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 Āµm or even 50 Āµm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
FLIR Boson ā a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
Ā
An infrared camera with a powerful vision processor in a small package, using a new 12Ī¼m microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera coreās economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Ā
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
The MRR20 is a 77GHz radar sensor offering mid-range detection for Advanced Driver Assistance Systems (ADAS).
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/mando-mrr20-77ghz-mid-range-radar/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
Ā
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the marketās dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
Ā
In the era of a slowing Mooreās Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...Yole Developpement
Ā
Continental consolidates its successful role in ADAS-related equipment with this cost-effective solution for emergency brake assist.
Light detection and ranging (LiDAR) sensing has a wide spectrum of applications, one of which is in autonomous or āself-drivingā cars. LiDAR is therefore attracting attention from the automotive industry, as well as other fields. However, until now, systems havenāt matched challenging automotive specifications for reliability, compact-ness, and cost-efficiency.
Based on rugged design and components, the SRL-1 from Continental provides a reliable and efficient solid-state LiDAR for frontal impact detection without any mechanical movement. Detecting collisions in an urban environment at speeds up to 50km/h, including an emergency braking assist (EBA) function, makes this product a great asset for todayās autonomous and assisted driving needs.
More information on that report at http://www.i-micronews.com/reports.html
An ultrasonic sensor in a compact housing, with 20-450cm detection range.
Ultrasonic transducers are used in vehicles as parking assistance. The ultrasonic transducer sends out short ultrasonic impulses which are reflected by barriers. The echo signals are registered by the sensor and are evaluated by a central control unit.
This ultrasonic parking sensor from Bosch is very compact with its very few components meaning it is manufactured at low cost. The sensor is made with one electronic board, including a Bosch transceiver integrated circuit (IC) that drives the output of the Epcos/TDK transformer and evaluates the reflected signal. The transducer itself is made of a lead zirconate titanate (PZT) membrane and silver electrodes.
More information on that report at http://www.i-micronews.com/reports.html
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Samsung Galaxy S9+ Teardown and Identification of Key Components report publ...Yole Developpement
Ā
Discover Samsungās key devices, advanced packaging technical choices and main suppliers.
More information on that report at https://www.i-micronews.com/report/product/samsung-galaxy-s9-teardown-and-identification-of-key-components.html
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Ā
Driven by megatrend markets, More than Moore devicesā overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
LG LA080WV3 ā8-inch Display with Touch Panel for Car Navigation 2017 teardown...Yole Developpement
Ā
An inside look at the reasons why LG Display is one of the top players in the automotive display market
Automotive displays are increasingly replacing mechanical meters and buttons, and the display market is therefore forecasted to grow rapidly over the next few years.
However, it is still unclear which suppliers will emerge as long-term winners. To fulfill the requirements of the market and its users, it is important to consider various conditions and specifications.
Display characteristics like luminance, contrast ratio, greyscale, and color, and their maintenance under automotive conditions of varying temperature and ambient light must continually improve.
LG Display provides smart infotainment to drivers and passengers. Its advanced high performance in-plane switching (AH-IPS) enables high resolution, high luminance and wide viewing angle, which is the display standard in smart cars.
LG Display stays competitive by combining low-cost manufacturing at its Nanjing site and the experience it has acquired in the automotive market.
This report presents a complete teardown analysis of LGās LA080WV3 8-inch display and the associated touchscreen extracted from the Hyundai Tucson.
Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the display module. The report also offers a complete physical analysis and manufacturing cost estimate for every part, including the backlight module and the different mechanical frames.
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
Ā
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Fan-In Packaging: Business update 2016 Report by Yole DeveloppementYole Developpement
Ā
Fan-In: A steady growth platform awaiting disruption
The Fan-In Packaging platform has been a successful and steadily growing platform for over a decade. It remains appealing as an inherently unmatched combination of smallest package form factor and low cost. Due to these features, historically it found penetration in form driven handsets and tablets and has maintained growth within these devices. It is estimated that more than 90% of Fan-In packages today are found in the mobile segment. With respect to Fan-In adoption, in todayās high end smartphones already more than 30% of all packages are Fan-In packages. Therefore, Fan-In packaging spread in the sweet spot mobile segment continues.
While the Fan-In packaging growth pace until now could be described as steady and stable, the global semiconductor market shifts and rising uncertainty over future applications will inevitably impact the outlook of Fan-In packaging as well. The smartphone market leading Fan-In adoption is maturing, with smartphone unit growth dropping from 35% in 2013 to 8% in 2016 and forecasted at 6% by 2020. While the trend is not favourable in terms of high growth expectations, smartphones are still expected to be the leading semiconductor driver with more than 2 billion units in 2020.
Primary Fan-In devices are WiFi/BT combos, transceivers, PMIC and DC/DC converters (~50% of total production) followed by a variety of analog/digital/mixed signal devices including MEMS and image sensors. The biggest challenge the Fan-In platform will be facing in the future is functional integration of devices into SiP form. Figure below indicates the impact of SiP growth on Fan-In unit production, decreasing the overall CAGR from 9% to 6%. A detailed analysis of SiP growth is performed in the report.
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Ā
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
The first Aptiv short range radar with Infineon SiGe CMOS technology for Advanced Driver Assistance Systems (ADAS).
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/aptiv-r3tr-76ghz-short-range-radar/
Worldās first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
Aptivās Third Generation of 77 GHz-Based Short-Range Radar (SRR3)system_plus
Ā
The first highly integrated 77 GHz short range radar sensor for advanced driver assistance systems with a single receive-transmit MMIC bare die from Infineon found on the market.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/aptivs-third-generation-of-77-ghz-based-short-range-radar-srr3/
A PTFE-free radar, with single receive-transmit MMIC based on TowerJazzās SiGe CMOS technology, for the first time associated with a phased array antenna.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/denso-dnsrr004-short-range-radar/
SiGe based millimeter-wave chipset commercially available for
backhaul applications with beamforming capability.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/peraso-x710-chipset-60ghz-outdoor-wireless-broadband-solution/
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
Denso DNMWR009 Cruise Control Radar Distance Sensorsystem_plus
Ā
A cruise control radar distance sensor with Infineon SiGe CMOS Technology for Advanced Driver Assistance Systems (ADAS).
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/denso-dnmwr009-cruise-control-radar-distance-sensor/
Qualcomm QCA9500 60 GHz Chipset - reverse costing report published by System ...system_plus
Ā
Disruptive double side molded system-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae.
2018 will be a key milestone in the journey towards 5G communication. Several areas, from semiconductor to packaging, will improve their technologies to be suitable for 5G deployment. We now know that the 5G frequency will be in the millimeter wave (mmWave) range.
More information on that report at http://www.i-micronews.com/reports.html
Analog Devices ADIS16460 6-axis MEMS Inertial Sensorsystem_plus
Ā
High precision 6-Axis Inertial Measurement Unit for industrial and harsh environments.
More information on that report at: http://www.systemplus.fr/fr/reverse-costing-reports/analog-devices-adis16460-6-axis-mems-inertial-sensor/
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset Worldās First Smartphone Editionsystem_plus
Ā
Early glimpse of very compact form millimeter-wave chipset commercially available for handset applications.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/qualcomm-60ghz-wigigwifi-802-11ad-chipset-worlds-first-smartphone-edition/
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
Ā
The first MMIC FEM targeting 5G base stations and terminals using a 0.15Āµm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...system_plus
Ā
The 3D camera is using infrared active stereo depth and red/green/blue sensors, and a VCSEL projector.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/intel-realsense-d435-3d-active-ir-stereo-depth-camera/
Broadcom AFEM-8072 ā Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
Ā
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
Fingerprint Cardsā FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
Ā
The worldās first capacitive fingerprint successfully integrated under glass, in collaboration with TPK
Fingerprint Cards AB (FPC), a leader in capacitive fingerprint technology, has over the last year equipped a large number of smartphones worldwide. One of its biggest clients, Huawei, traditionally integrates the latest technology in its flagship model every year. With the integration of the FPC1268 in the Huawei Mate 9 Pro and the Huawei P10 series, FPC has introduced a new kind of capacitive fingerprint integration: one that can be successfully integrated under glass. This technology, developed in collaboration with TPK, aims to be the new low-cost solution for fingerprint scanner integration.
Following the Mate 9 Pro, the Huawei P10 is the latest smartphone to feature the capacitive fingerprint completely hidden behind the cover glass. The sensor is located under the home button in the deviceās front, under a unique TPK-developed glass cover that allows for new, highly attractive designs like the ultrasonic fingerprint.
Using the same process as FPCās previous flagship product, the 1025, the integration no longer requires wire bonding but instead a specific TSV designed by an identified OSAT and based on Tesseraās WLCSP solution. While previously used for CIS integration, this is the first time it has been used for fingerprint. Along with the ASIC, the fingerprint is integrated into an LGA package which is soldered on a flex PCB and covered by TPKās specially-designed glass.
Thanks to conductive layers, TPKās solution allows for the precise detection and identification of the fingerprint under glass. Everything is packaged in a metal ring that forms part of the home button.
This report provides a complete analysis of chip fabrication and package processes, along with a cost estimate. Also included is a comparison with FPCās previous capacitive fingerprint generation, the FPC1025, and Qualcommās new ultrasonic fingerprint, the Sense ID.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics Proximity & Flood Illuminator in the Apple iPhone X - reve...system_plus
Ā
A unique combination of STMicroelectronicsā latest proximity sensor, based on single-photon avalanche diode (SPAD) technology and a VCSEL illuminator, all in Appleās most advanced handset.
More information on that report at http://www.i-micronews.com/reports.html
Xaar partners with Ricoh to develop its first MEMS inkjet die with thin film PZT technology.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/xaar-1201-gs2p5-pzt-printhead/
amsā Spectral Sensor Portfolio: the AS726X Series report 2018 published by Sy...system_plus
Ā
Apple iPhone X capacities, with a standard offer from ams.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/ams-spectral-sensor-portfolio-the-as726x-series/
The Audi A8 zFAS ADAS Platform by Aptivsystem_plus
Ā
The first level 3 autonomous driving system, designed by Audi and manufactured by Aptiv (Delphi), integrates high-performance processors from Nvidia (Tegra K1), Altera (Cyclon V), Infineon (Aurix), and Mobileye (EyeQ3 image processor)
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/the-audi-a8-zfas-adas-platform-by-aptiv/
Texas Instrumentsā Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
Ā
A look into Texas Instrumentsā system-on-chip, including Sony/Softkineticās time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companiesā design choices.
More information on that report at http://www.i-micronews.com/reports.html
Similar to AWR1642 77 & 79 GHz RFCMOS Radar Chipset from Texas Instruments 2018 teardown reverse costing report published by System Plus (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
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Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Ā
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive ā heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging ā How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
5Gās Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
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An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
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Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
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Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
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Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
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COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
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Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
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The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
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Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
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91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Ā
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
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Ā
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Ā
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overviewā
-------------------------------------------
During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
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After immersing yourself in the blue book and its red counterpart, attending DDD-focused conferences, and applying tactical patterns, you're left with a crucial question: How do I ensure my design is effective? Tactical patterns within Domain-Driven Design (DDD) serve as guiding principles for creating clear and manageable domain models. However, achieving success with these patterns requires additional guidance. Interestingly, we've observed that a set of constraints initially designed for training purposes remarkably aligns with effective pattern implementation, offering a more āmechanicalā approach. Let's explore together how Object Calisthenics can elevate the design of your tactical DDD patterns, offering concrete help for those venturing into DDD for the first time!
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
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In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
Learn about:
ā¢ The Future of Testing: How AI is shifting testing towards verification, analysis, and higher-level skills, while reducing repetitive tasks.
ā¢ Test Automation: How AI-powered test case generation, optimization, and self-healing tests are making testing more efficient and effective.
ā¢ Visual Testing: Explore the emerging capabilities of AI in visual testing and how it's set to revolutionize UI verification.
ā¢ Inflectra's AI Solutions: See demonstrations of Inflectra's cutting-edge AI tools like the ChatGPT plugin and Azure Open AI platform, designed to streamline your testing process.
Whether you're a developer, tester, or QA professional, this webinar will give you valuable insights into how AI is shaping the future of software delivery.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
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In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
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My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
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We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
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Ā
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
Ā
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. Whatās changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Ā
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
17. COMPLETE TEARDOWN
WITH:
ā¢ Detailedphotos
ā¢ Precise measurements
ā¢ Materialsanalysis
ā¢ Manufacturing process
flow
ā¢ Supply chain
evaluation
ā¢ Manufacturing cost
analysis
ā¢ Estimatedsales price
ā¢ Comparison with other
Texas Instrumentsā
mmWave devices
AWR1642 77 & 79 GHz RFCMOS
Radar Chipset from Texas Instruments
Title: AWR1642 from
Texas Instruments
Pages: 85
Date: April 2018
Format: PDF & Excel file
Price: Full report:
EUR 2,990
The worldās first single-chip radar(76 - 81 GHz) in a System-on-Chip
available on the market. It features six channels (four receivers and two
transmitters) along with an MCU and a DSP, all on the same chip. Not
surprisingly, this new chipset is extremely compact compared to its competitors.
With a portfolio that now contains three different chip solutions, TI targets
multiple automotive and industrial applications, from ultra-short-range radar
detection (USRR) to radar imaging (RI). Also, TIās portfolio ranges from low-
power, highly-integrated devices, to high-performance radar working in the 79
GHz band. TI seeks to replace the 24 GHz market for short-range applications,
which is expected to decrease in 2020 with the coming European restriction law.
Also, having the control unit and the signal processing chip on the same die
allows TI to drastically reduce the PCB footprint, with an almost 60% space
reduction compared to other solutions.
This report reviews the AWR1642, including a complete die analysis, cost
analysis, and price estimate for the chips. Also included is a physical and technical
comparison with Delphiās SRR chipset solution and TIās own AWR1243 (featuring
four receivers and three transmitters without the MCU and the DSP) targeting
long-range radar detection and radar imaging.
Ahead of its competitors in RFCMOS
applications, Texas Instruments (TI) has
begun manufacturing highly integrated
radar sensor chips - the latest of which is
t h e AW R 1642. B u t rat h er t h an
integrating all transmitters, receivers,
and local oscillators in a single chip, TI
wen t fu rt h er an d in t eg rat ed a
microcontroller unit (MCU) and a digital
signal processor (DSP) on the same chip.
This makes the AWR1642 the most
int egrated radar chipset current ly
Structure, Process & Cost Analysis
Reverse CostingĀ®
19. Infineon RASIC:
RRN7740 & RTN7750
76GHz Radar Dies
Delphi Rear and
Side Detection System
Continental SRR3-B 24GHz
Blind-Spot Radar
New receiver and transmitter
components with a SiGe:C HBT
technology from Infineon.
76GHz short-range radar specially
designed for blind-spot detection.
Continentalās 3rd-generation short-
range radar sensor: a simplified
design improves cost-effectiveness.
Pages: 87
Date: January2016
Full report: EUR 1,990*
Pages: 83
Date: September 2016
Full report: EUR 2,990*
Pages: 80
Date: March2018
Full report: EUR 2,990*
ANNUAL SUBSCRIPTION OFFER
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ā¢ MEMS & Sensors:
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Microphone - Optics - Oscillator - Pressure
ā¢ Power:
GaN - IGBT - MOSFET - Si Diode - SiC
ā¢ Imaging: Camera - Spectrometer
ā¢ LED & Laser:
UV LED - VCSEL - White/blue LED
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analysesinvarious domains.
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