This document provides an overview of AT&S, a leading high-tech printed circuit board company. It discusses AT&S' strategy of focusing on high-end technologies for growth markets like mobile devices and advanced packaging. The company has a global footprint with production facilities in Europe and Asia. It aims to enter new high-end business segments and expand its share of high-end technology markets, which currently make up over 70% of its revenue. A key part of AT&S' strategy is a new plant in Chongqing, China that will produce IC substrates and substrate-like PCBs, addressing growing demand in applications like wearables and the Internet of Things.
The document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. Some key points:
- AT&S focuses on high-end technologies for applications in mobile devices, automotive, industrial, and medical sectors.
- They have production facilities in Europe and Asia, with the majority of revenue now coming from Asian production.
- Their strategic focus is on innovative interconnect solutions to support trends like miniaturization and the Internet of Things.
- A new plant in Chongqing, China will allow them to expand into new technologies like IC substrates and substrate-like PCBs.
AT&S is a leading high-tech printed circuit board and IC substrate company. It has a global footprint with production facilities in Europe and Asia. AT&S is expanding into new technologies like substrate-like PCBs and IC substrates to position itself for future growth opportunities in advanced applications and markets driven by trends like the Internet of Things. A major investment project underway is a new plant in Chongqing, China dedicated to IC substrates and substrate-like PCBs, which is expected to begin production in 2016. This will expand AT&S' technology portfolio and capabilities in high-end applications.
AT&S Investor and Analyst Presentation March 2017 AT&S_IR
AT&S presented an investor and analyst presentation covering the company's strategy and financials. The presentation included:
1) An overview of AT&S' position as a leading manufacturer of high-end printed circuit boards and IC substrates for applications in mobile devices, automotive, industrial, medical, and semiconductors.
2) Details on AT&S' strategic focus on high-end technologies and applications with above average growth potential and long-term profitability.
3) Financial highlights showing AT&S' track record of revenue growth and margins above industry levels, as well as investments in new production capacity, particularly in Chongqing, China.
The document is a company presentation for AT&S, a leading manufacturer of printed circuit boards and IC substrates. It provides an overview of AT&S, including its strategy, competitive advantages, global footprint, key financials, and positioning in high-end interconnection technologies. AT&S focuses on advanced applications in mobile devices, automotive, industrial, and medical sectors. It aims to strengthen its technology leadership and achieve long-term profitable growth through operational excellence.
AT&S Investor and Analyst Presentation January 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants in Europe and Asia. In the first half of 2016/17, AT&S achieved revenue of €737 million, stable compared to the previous year. EBITDA was impacted by ramping up new plants in China but was 24% when adjusted for these effects. AT&S is investing €480 million in its new Chongqing site in China to expand production capacity for IC substrates and substrate-like PCBs, with the goal of strengthening its technology leadership and achieving long-term profitable growth.
- AT&S is a leading provider of printed circuit boards and IC substrates for applications such as mobile devices, automotive, industrial, medical, and more.
- In fiscal year 2019/20, AT&S achieved over €1 billion in revenue but saw declines in EBITDA and earnings per share due to lower sales volume, unfavorable product mix, and impacts of COVID-19.
- However, AT&S remained profitable with an EBITDA margin within its guided range of 18-20% and continues investing in expanding IC substrate capacities for future growth opportunities in high-performance computing.
This document provides an overview of AT&S, a leading manufacturer of high-end printed circuit boards and IC substrates. It discusses AT&S' strategy, market position, technologies, and financials. Key points:
- AT&S focuses on high-end technologies for mobile devices, automotive, industrial, and medical applications.
- It has a global footprint with plants in Europe and Asia and is #1 in Europe and #3 worldwide for high-end PCB technology.
- The company is investing €480 million in a new plant in Chongqing, China to expand its IC substrate and substrate-like PCB production capabilities.
AT&S Investor and Analyst Presentation October 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has six production plants in Europe and Asia. In the past fiscal year, AT&S achieved revenue of €762.9 million with continuous above-market growth and an EBITDA margin of 22%. The company is focusing on high-end technologies and applications with a strategic investment of €480 million in its new Chongqing, China plant to expand production of IC substrates and substrate-like PCBs. While revenue declined in the most recent quarter due to seasonal factors and price pressure, AT&S remains profitable with a adjusted EBITDA margin of over 20% excluding ramp-up costs in Chongqing.
The document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. Some key points:
- AT&S focuses on high-end technologies for applications in mobile devices, automotive, industrial, and medical sectors.
- They have production facilities in Europe and Asia, with the majority of revenue now coming from Asian production.
- Their strategic focus is on innovative interconnect solutions to support trends like miniaturization and the Internet of Things.
- A new plant in Chongqing, China will allow them to expand into new technologies like IC substrates and substrate-like PCBs.
AT&S is a leading high-tech printed circuit board and IC substrate company. It has a global footprint with production facilities in Europe and Asia. AT&S is expanding into new technologies like substrate-like PCBs and IC substrates to position itself for future growth opportunities in advanced applications and markets driven by trends like the Internet of Things. A major investment project underway is a new plant in Chongqing, China dedicated to IC substrates and substrate-like PCBs, which is expected to begin production in 2016. This will expand AT&S' technology portfolio and capabilities in high-end applications.
AT&S Investor and Analyst Presentation March 2017 AT&S_IR
AT&S presented an investor and analyst presentation covering the company's strategy and financials. The presentation included:
1) An overview of AT&S' position as a leading manufacturer of high-end printed circuit boards and IC substrates for applications in mobile devices, automotive, industrial, medical, and semiconductors.
2) Details on AT&S' strategic focus on high-end technologies and applications with above average growth potential and long-term profitability.
3) Financial highlights showing AT&S' track record of revenue growth and margins above industry levels, as well as investments in new production capacity, particularly in Chongqing, China.
The document is a company presentation for AT&S, a leading manufacturer of printed circuit boards and IC substrates. It provides an overview of AT&S, including its strategy, competitive advantages, global footprint, key financials, and positioning in high-end interconnection technologies. AT&S focuses on advanced applications in mobile devices, automotive, industrial, and medical sectors. It aims to strengthen its technology leadership and achieve long-term profitable growth through operational excellence.
AT&S Investor and Analyst Presentation January 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants in Europe and Asia. In the first half of 2016/17, AT&S achieved revenue of €737 million, stable compared to the previous year. EBITDA was impacted by ramping up new plants in China but was 24% when adjusted for these effects. AT&S is investing €480 million in its new Chongqing site in China to expand production capacity for IC substrates and substrate-like PCBs, with the goal of strengthening its technology leadership and achieving long-term profitable growth.
- AT&S is a leading provider of printed circuit boards and IC substrates for applications such as mobile devices, automotive, industrial, medical, and more.
- In fiscal year 2019/20, AT&S achieved over €1 billion in revenue but saw declines in EBITDA and earnings per share due to lower sales volume, unfavorable product mix, and impacts of COVID-19.
- However, AT&S remained profitable with an EBITDA margin within its guided range of 18-20% and continues investing in expanding IC substrate capacities for future growth opportunities in high-performance computing.
This document provides an overview of AT&S, a leading manufacturer of high-end printed circuit boards and IC substrates. It discusses AT&S' strategy, market position, technologies, and financials. Key points:
- AT&S focuses on high-end technologies for mobile devices, automotive, industrial, and medical applications.
- It has a global footprint with plants in Europe and Asia and is #1 in Europe and #3 worldwide for high-end PCB technology.
- The company is investing €480 million in a new plant in Chongqing, China to expand its IC substrate and substrate-like PCB production capabilities.
AT&S Investor and Analyst Presentation October 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has six production plants in Europe and Asia. In the past fiscal year, AT&S achieved revenue of €762.9 million with continuous above-market growth and an EBITDA margin of 22%. The company is focusing on high-end technologies and applications with a strategic investment of €480 million in its new Chongqing, China plant to expand production of IC substrates and substrate-like PCBs. While revenue declined in the most recent quarter due to seasonal factors and price pressure, AT&S remains profitable with a adjusted EBITDA margin of over 20% excluding ramp-up costs in Chongqing.
The annual report summarizes the company's financial performance in 2014/15. Some key points:
- Revenue grew 13.1% to €667 million, with strong growth in mobile devices and automotive electronics.
- Earnings also increased substantially, with EBITDA up 31.8% and profit for the period rising 81.5% to €69.3 million.
- The balance sheet remains solid, with an equity ratio of 49.5% and reduced net gearing of 21.6%, allowing continued investment in expanding production capacity.
AT&S Investor and Analyst Presentation August 2017AT&S_IR
This document provides an overview of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading manufacturer of printed circuit boards and IC substrates. It discusses the company's strategy, market position, financial performance, and expansion plans. Key points include:
- AT&S focuses on high-end technologies and applications with above average growth potential.
- It has the #1 market position in Europe and #3 globally for high-end PCB technology.
- In Q1 2017/18, revenue grew 9% to €814.9 million driven by contributions from new plants in China.
- Margin was impacted by start-up costs for new plants but improvements are expected as
AT&S Investor and Analyst Presentation October 2017AT&S_IR
AT&S is a leading manufacturer of printed circuit boards and IC substrates, focusing on high-end technologies. The company has 6 production plants across Europe and Asia. In Q1 2017/18, AT&S reported revenue growth of 14% year-over-year driven by contributions from its new Chongqing plant in China. EBITDA margins declined due to start-up costs associated with new plants but showed improvements over the previous quarter. AT&S remains focused on expanding its technology leadership position and driving long-term profitable growth through its strategic focus on innovative, high-end applications.
- AT&S is a leading high-tech printed circuit board (PCB) company based in Austria with production facilities in Europe and Asia.
- The company is strategically focusing on high-end technologies like HDI PCBs and IC substrates for applications in mobile devices, automotive, industrial, and medical markets.
- AT&S is currently investing €480 million to build a new plant in Chongqing, China that will produce IC substrates and substrate-like PCBs starting in 2016, allowing the company to enter new high-growth market segments.
AT&S Investor and Analyst Presentation April 2017AT&S_IR
The document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. It discusses AT&S' strategy, market positioning, technologies, growth projects, and key financial figures. Specifically:
- AT&S focuses on high-end technologies for applications in mobile devices, automotive, industrial, medical, and semiconductors.
- It aims to strengthen its technology leadership, achieve long-term profitable growth, and generate shareholder value.
- Major growth projects include new IC substrate and substrate-like PCB production lines in Chongqing, China.
- Financially, AT&S has achieved sound revenue growth and margins above industry averages,
AT&S Investor and Analyst Presentation November 2017AT&S_IR
This document is an investor and analyst presentation by AT&S, a leading manufacturer of printed circuit boards and IC substrates.
The presentation provides an overview of AT&S, their strategic focus on high-end technologies, key financial figures, and an update on their new plant in Chongqing, China. In the first half of 2017/18, AT&S achieved revenue growth of 26% and EBITDA growth of 227.7% compared to the same period last year, driven by the ramp-up of their new mSAP technology and IC substrate plant in Chongqing. Their continued focus is on expanding their technology leadership position and driving long-term profitable growth.
Global and china rigid pcb industry report, 2015ResearchInChina
The document provides an overview and analysis of the global rigid printed circuit board (PCB) industry. It discusses the industry's output value and trends from 2001-2015. It also examines the PCB industries and major companies in regions like Taiwan, China, Europe, North America, and Japan. The document aims to establish an updated, factual information base and strategic analysis of the leading global PCB companies and competitive landscape to assist with business and investment decisions. It includes sections on PCB technology trends, downstream markets, industry analysis, and in-depth profiles of 35 major PCB companies.
AT&S is an Austrian technology group specialized in manufacturing high-end printed circuit boards and IC substrates. It has 6 manufacturing sites globally and supplies "blue chip" customers. AT&S is entering the growing IC substrate market with a new plant in Chongqing, China starting production in 2016. Key trends in electronics like miniaturization, connectivity, and the internet of things are driving demand for AT&S' complex, high-quality printed circuit board and substrate solutions. AT&S aims to strengthen its technology leadership position and enter attractive new markets.
AT&S Investor Relations Presentation September 2015AT&S_IR
This document provides an overview of AT&S, a leading high-tech printed circuit board (PCB) company. Some key points:
- AT&S has a global footprint with production facilities in Europe and Asia to ensure cost efficiency. Their focus is on high-end technologies like HDI PCBs and upcoming IC substrates.
- They have a balanced portfolio of customers in industries like mobile devices, automotive, industrial, and medical.
- AT&S is investing €480 million to expand into IC substrates with a new plant in Chongqing, China starting production in 2016.
- Financially, AT&S has shown consistent revenue growth, above industry EBITDA margins of
AT&S Investor and Analyst Presentation September 2017AT&S_IR
AT&S is a leading provider of high-end printed circuit boards and IC substrates. It has 6 production plants across Europe and Asia. The company focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, medical, and semiconductor industries. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth through operational excellence and a focus on high-end technologies and cash flow generation. Recent investments in new plants in China will help expand the company's product portfolio and customer base.
AT&S Investor and Analyst Presentation September 2019 AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates. The summary is:
1) AT&S provides an overview of the company, its global footprint, investment highlights including its technology leadership position and financial results for Q1 2019/20.
2) Revenue was flat for Q1 2019/20 at €222.7 million due to diversified products compensating for market fluctuations, though EBITDA declined due to seasonal effects and a challenging market environment.
3) The presentation discusses the company's strategic focus on high-end technologies and driving future trends through innovation and expansion to achieve medium-term targets.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards. It begins with a disclaimer and agenda setting out the topics to be covered. It then discusses AT&S's product portfolio and technology capabilities. Subsequent sections cover the company's history, management team, business segments, growth strategy, locations, mid-term strategy including plans to enter the IC substrate market, an overview of the Chongqing project, financial results and debt profile. The document aims to present AT&S as a quality leader in its industry with a profitable growth path.
The document provides an overview of AT&S, a leading high-tech printed circuit board company. Some key points:
- AT&S has a global footprint with production facilities in Europe focusing on high mix/low volume and Asia focusing on high volume/low mix.
- Their strategy is focused on high-end technologies like HDI PCBs and IC substrates for applications in growing markets like mobile devices, automotive, medical and more.
- They are making a major investment in a new plant in Chongqing, China to expand their production of IC substrates and a new segment of substrate-like PCBs.
- Financial highlights show continued revenue growth, above industry average EBITDA
1) The document is an annual report from AT&S, a leading manufacturer of printed circuit boards and IC substrates, reporting on the 2019/20 fiscal year.
2) It highlights key figures such as revenue declining 2.7% year-over-year to €1 billion, EBITDA falling 22.2% to €195 million, and profit for the period declining 75.9% to €21.5 million.
3) AT&S discusses major trends in the industry like 5G mobile networks, increasing data volumes, and growing markets for IC substrates that the company is positioned to capture through expansion.
AT&S Investor and Analyst Presentation May 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The document provides an overview of AT&S, including its strategy, technologies, market positioning, and financial performance. It focuses on AT&S strengthening its leadership in high-end interconnect solutions through innovation, a strategic focus on technologies with above-average growth, and operational excellence.
AT&S is a leading high-tech printed circuit board company with a global footprint. It has production facilities in Europe and Asia focused on high mix/low volume and high volume/low mix respectively. In the first half of 2014/15, AT&S continued its sound top-line growth and above industry margins. It is entering a new high-end business segment of IC substrates with a new plant in Chongqing, China starting production in 2016. AT&S aims to leverage its technological leadership to capitalize on growing trends in areas like the Internet of Things.
This document provides an overview of AT&S, a leading high-tech printed circuit board and IC substrate manufacturer. Some key points:
- AT&S has a global footprint with production facilities in Europe and Asia, and a focus on high-end applications.
- They serve growing end markets like mobile devices, automotive, industrial, and
AT&S Investor and Analyst Presentation August 2019 von AT&S_IRAT&S_IR
AT&S presented its investor and analyst presentation for August 2019. Some key points:
- AT&S is a leading provider of high-end printed circuit boards and IC substrates.
- In Q1 2019/20, revenue was flat at €222.7 million but EBITDA declined due to challenging market conditions and higher R&D costs.
- Growth opportunities exist across all segments due to trends like 5G, AI, and electric vehicles. However, some segments like automotive currently face temporary slowdowns.
- AT&S is initiating its next growth step with a planned €1 billion investment over 5 years in a new IC substrate plant in China and expansion in Austria to capture demand for high
AT&S Investor and Analyst Presentation July 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The company has 6 production plants across Europe and Asia. AT&S focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, medical, and semiconductor industries. In the financial year 2016/17, AT&S generated €814.9 million in revenue and employed 9,526 people worldwide. The company aims to strengthen its technology leadership position and achieve long-term profitable growth through a focus on high-end technologies and applications with above average growth potential.
This document provides an investor and analyst presentation for AT&S, a leading producer of printed circuit boards and IC substrates. It summarizes that AT&S has a unique market position as a provider of high-end PCBs and substrates for growth applications in mobile devices, automotive, industrial, and medical industries. It also outlines AT&S' global production footprint and technology leadership through continuous R&D efforts. The presentation discusses the company's growth strategy through incremental investments to capture opportunities in megatrend markets and its goal of sustainable profitability above industry averages.
AT&S Investor and Analyst Presentation August 2018AT&S_IR
AT&S presented its strategy and financial results for investors and analysts. Key points include:
- AT&S aims to become the leading provider of high-end interconnect solutions through innovation, profitable growth, and shareholder value creation.
- The company is expanding into new technologies like IC substrates to diversify beyond PCBs.
- In Q1 2018/19, AT&S grew revenue 11% to €222 million and improved its EBITDA margin to 23%, driven by contributions from its new Chongqing plant.
- AT&S has a global footprint across 6 plants and aims to reach €1.5 billion in revenue through focus on fast-growing applications like medical devices and autom
AT&S Investor and Analyst Presentation September 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has a strong focus on advanced interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth and high profitability. Key strategies include focusing on high-end technologies and applications with above average growth potential.
The annual report summarizes the company's financial performance in 2014/15. Some key points:
- Revenue grew 13.1% to €667 million, with strong growth in mobile devices and automotive electronics.
- Earnings also increased substantially, with EBITDA up 31.8% and profit for the period rising 81.5% to €69.3 million.
- The balance sheet remains solid, with an equity ratio of 49.5% and reduced net gearing of 21.6%, allowing continued investment in expanding production capacity.
AT&S Investor and Analyst Presentation August 2017AT&S_IR
This document provides an overview of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading manufacturer of printed circuit boards and IC substrates. It discusses the company's strategy, market position, financial performance, and expansion plans. Key points include:
- AT&S focuses on high-end technologies and applications with above average growth potential.
- It has the #1 market position in Europe and #3 globally for high-end PCB technology.
- In Q1 2017/18, revenue grew 9% to €814.9 million driven by contributions from new plants in China.
- Margin was impacted by start-up costs for new plants but improvements are expected as
AT&S Investor and Analyst Presentation October 2017AT&S_IR
AT&S is a leading manufacturer of printed circuit boards and IC substrates, focusing on high-end technologies. The company has 6 production plants across Europe and Asia. In Q1 2017/18, AT&S reported revenue growth of 14% year-over-year driven by contributions from its new Chongqing plant in China. EBITDA margins declined due to start-up costs associated with new plants but showed improvements over the previous quarter. AT&S remains focused on expanding its technology leadership position and driving long-term profitable growth through its strategic focus on innovative, high-end applications.
- AT&S is a leading high-tech printed circuit board (PCB) company based in Austria with production facilities in Europe and Asia.
- The company is strategically focusing on high-end technologies like HDI PCBs and IC substrates for applications in mobile devices, automotive, industrial, and medical markets.
- AT&S is currently investing €480 million to build a new plant in Chongqing, China that will produce IC substrates and substrate-like PCBs starting in 2016, allowing the company to enter new high-growth market segments.
AT&S Investor and Analyst Presentation April 2017AT&S_IR
The document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. It discusses AT&S' strategy, market positioning, technologies, growth projects, and key financial figures. Specifically:
- AT&S focuses on high-end technologies for applications in mobile devices, automotive, industrial, medical, and semiconductors.
- It aims to strengthen its technology leadership, achieve long-term profitable growth, and generate shareholder value.
- Major growth projects include new IC substrate and substrate-like PCB production lines in Chongqing, China.
- Financially, AT&S has achieved sound revenue growth and margins above industry averages,
AT&S Investor and Analyst Presentation November 2017AT&S_IR
This document is an investor and analyst presentation by AT&S, a leading manufacturer of printed circuit boards and IC substrates.
The presentation provides an overview of AT&S, their strategic focus on high-end technologies, key financial figures, and an update on their new plant in Chongqing, China. In the first half of 2017/18, AT&S achieved revenue growth of 26% and EBITDA growth of 227.7% compared to the same period last year, driven by the ramp-up of their new mSAP technology and IC substrate plant in Chongqing. Their continued focus is on expanding their technology leadership position and driving long-term profitable growth.
Global and china rigid pcb industry report, 2015ResearchInChina
The document provides an overview and analysis of the global rigid printed circuit board (PCB) industry. It discusses the industry's output value and trends from 2001-2015. It also examines the PCB industries and major companies in regions like Taiwan, China, Europe, North America, and Japan. The document aims to establish an updated, factual information base and strategic analysis of the leading global PCB companies and competitive landscape to assist with business and investment decisions. It includes sections on PCB technology trends, downstream markets, industry analysis, and in-depth profiles of 35 major PCB companies.
AT&S is an Austrian technology group specialized in manufacturing high-end printed circuit boards and IC substrates. It has 6 manufacturing sites globally and supplies "blue chip" customers. AT&S is entering the growing IC substrate market with a new plant in Chongqing, China starting production in 2016. Key trends in electronics like miniaturization, connectivity, and the internet of things are driving demand for AT&S' complex, high-quality printed circuit board and substrate solutions. AT&S aims to strengthen its technology leadership position and enter attractive new markets.
AT&S Investor Relations Presentation September 2015AT&S_IR
This document provides an overview of AT&S, a leading high-tech printed circuit board (PCB) company. Some key points:
- AT&S has a global footprint with production facilities in Europe and Asia to ensure cost efficiency. Their focus is on high-end technologies like HDI PCBs and upcoming IC substrates.
- They have a balanced portfolio of customers in industries like mobile devices, automotive, industrial, and medical.
- AT&S is investing €480 million to expand into IC substrates with a new plant in Chongqing, China starting production in 2016.
- Financially, AT&S has shown consistent revenue growth, above industry EBITDA margins of
AT&S Investor and Analyst Presentation September 2017AT&S_IR
AT&S is a leading provider of high-end printed circuit boards and IC substrates. It has 6 production plants across Europe and Asia. The company focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, medical, and semiconductor industries. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth through operational excellence and a focus on high-end technologies and cash flow generation. Recent investments in new plants in China will help expand the company's product portfolio and customer base.
AT&S Investor and Analyst Presentation September 2019 AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates. The summary is:
1) AT&S provides an overview of the company, its global footprint, investment highlights including its technology leadership position and financial results for Q1 2019/20.
2) Revenue was flat for Q1 2019/20 at €222.7 million due to diversified products compensating for market fluctuations, though EBITDA declined due to seasonal effects and a challenging market environment.
3) The presentation discusses the company's strategic focus on high-end technologies and driving future trends through innovation and expansion to achieve medium-term targets.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards. It begins with a disclaimer and agenda setting out the topics to be covered. It then discusses AT&S's product portfolio and technology capabilities. Subsequent sections cover the company's history, management team, business segments, growth strategy, locations, mid-term strategy including plans to enter the IC substrate market, an overview of the Chongqing project, financial results and debt profile. The document aims to present AT&S as a quality leader in its industry with a profitable growth path.
The document provides an overview of AT&S, a leading high-tech printed circuit board company. Some key points:
- AT&S has a global footprint with production facilities in Europe focusing on high mix/low volume and Asia focusing on high volume/low mix.
- Their strategy is focused on high-end technologies like HDI PCBs and IC substrates for applications in growing markets like mobile devices, automotive, medical and more.
- They are making a major investment in a new plant in Chongqing, China to expand their production of IC substrates and a new segment of substrate-like PCBs.
- Financial highlights show continued revenue growth, above industry average EBITDA
1) The document is an annual report from AT&S, a leading manufacturer of printed circuit boards and IC substrates, reporting on the 2019/20 fiscal year.
2) It highlights key figures such as revenue declining 2.7% year-over-year to €1 billion, EBITDA falling 22.2% to €195 million, and profit for the period declining 75.9% to €21.5 million.
3) AT&S discusses major trends in the industry like 5G mobile networks, increasing data volumes, and growing markets for IC substrates that the company is positioned to capture through expansion.
AT&S Investor and Analyst Presentation May 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The document provides an overview of AT&S, including its strategy, technologies, market positioning, and financial performance. It focuses on AT&S strengthening its leadership in high-end interconnect solutions through innovation, a strategic focus on technologies with above-average growth, and operational excellence.
AT&S is a leading high-tech printed circuit board company with a global footprint. It has production facilities in Europe and Asia focused on high mix/low volume and high volume/low mix respectively. In the first half of 2014/15, AT&S continued its sound top-line growth and above industry margins. It is entering a new high-end business segment of IC substrates with a new plant in Chongqing, China starting production in 2016. AT&S aims to leverage its technological leadership to capitalize on growing trends in areas like the Internet of Things.
This document provides an overview of AT&S, a leading high-tech printed circuit board and IC substrate manufacturer. Some key points:
- AT&S has a global footprint with production facilities in Europe and Asia, and a focus on high-end applications.
- They serve growing end markets like mobile devices, automotive, industrial, and
AT&S Investor and Analyst Presentation August 2019 von AT&S_IRAT&S_IR
AT&S presented its investor and analyst presentation for August 2019. Some key points:
- AT&S is a leading provider of high-end printed circuit boards and IC substrates.
- In Q1 2019/20, revenue was flat at €222.7 million but EBITDA declined due to challenging market conditions and higher R&D costs.
- Growth opportunities exist across all segments due to trends like 5G, AI, and electric vehicles. However, some segments like automotive currently face temporary slowdowns.
- AT&S is initiating its next growth step with a planned €1 billion investment over 5 years in a new IC substrate plant in China and expansion in Austria to capture demand for high
AT&S Investor and Analyst Presentation July 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The company has 6 production plants across Europe and Asia. AT&S focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, medical, and semiconductor industries. In the financial year 2016/17, AT&S generated €814.9 million in revenue and employed 9,526 people worldwide. The company aims to strengthen its technology leadership position and achieve long-term profitable growth through a focus on high-end technologies and applications with above average growth potential.
This document provides an investor and analyst presentation for AT&S, a leading producer of printed circuit boards and IC substrates. It summarizes that AT&S has a unique market position as a provider of high-end PCBs and substrates for growth applications in mobile devices, automotive, industrial, and medical industries. It also outlines AT&S' global production footprint and technology leadership through continuous R&D efforts. The presentation discusses the company's growth strategy through incremental investments to capture opportunities in megatrend markets and its goal of sustainable profitability above industry averages.
AT&S Investor and Analyst Presentation August 2018AT&S_IR
AT&S presented its strategy and financial results for investors and analysts. Key points include:
- AT&S aims to become the leading provider of high-end interconnect solutions through innovation, profitable growth, and shareholder value creation.
- The company is expanding into new technologies like IC substrates to diversify beyond PCBs.
- In Q1 2018/19, AT&S grew revenue 11% to €222 million and improved its EBITDA margin to 23%, driven by contributions from its new Chongqing plant.
- AT&S has a global footprint across 6 plants and aims to reach €1.5 billion in revenue through focus on fast-growing applications like medical devices and autom
AT&S Investor and Analyst Presentation September 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has a strong focus on advanced interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth and high profitability. Key strategies include focusing on high-end technologies and applications with above average growth potential.
AT&S Investor and Analyst Presentation February 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The company has 6 production plants in Europe and Asia. In the past fiscal year, AT&S generated €762.9 million in revenue with 5.2% organic growth. The company is strategically focused on high-end technologies and applications with above average growth potential. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth and shareholder value.
AT&S Investor and Analyst Presentation September 2018AT&S_IR
- AT&S is a leading global provider of high-end printed circuit boards and IC substrates, serving growing end markets including mobile devices, automotive, industrial, and medical.
- In the first quarter of FY2018/19, AT&S achieved revenue growth of 11.2% to €222 million driven by additional contributions from its new Chongqing plant in China and higher demand for IC substrates.
- EBITDA margin improved significantly to 23.4% in Q1 FY2018/19 compared to 14.9% in the prior year period, benefiting from higher margins in Chongqing and one-time valuation effects.
AT&S Investor and Analyst Presentation November 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants in Europe and Asia. In the first half of 2016/17, AT&S achieved stable revenue but lower profitability due to ramping up new production lines in China. While revenue was balanced by the first contributions from China, earnings before interest, taxes, depreciation, and amortization (EBITDA) was impacted by start-up costs. Excluding these costs, the adjusted EBITDA margin remained nearly as high as the previous year. The company continues to focus on high-end technologies and applications to strengthen its technology leadership.
AT&S Investor and Analyst Presentation August 2018AT&S_IR
- AT&S is a leading provider of printed circuit boards and IC substrates headquartered in Austria.
- In Q1 2018/19, AT&S saw revenue increase 11.2% to €222.1 million due to additional contributions from its new plant in Chongqing, China and higher demand for IC substrates.
- EBITDA margin increased significantly to 23.4% in Q1 2018/19 from 14.9% in the prior year period, driven by the higher contribution from Chongqing as well as one-time valuation effects.
AT&S Investor and Analyst Presentation December 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants across Europe and Asia. The company focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth. Its strategy is focused on high-end technologies, highest customer service, operational excellence, and cash flow generation. The company has outperformed the broader PCB market in recent years and intends to continue doing so in the future.
AT&S Investor and Analyst Presentation February 2018AT&S_IR
- AT&S is a leading global manufacturer of printed circuit boards and IC substrates headquartered in Austria.
- They provide high-end interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors.
- In their investor presentation, they outline their strategy to expand their technology leadership position and achieve long-term profitable growth through focusing on fast-growing applications and maintaining highest service levels for customers.
AT&S Investor and Analyst Presentation March 2018AT&S_IR
- AT&S is a leading global manufacturer of printed circuit boards and IC substrates headquartered in Austria.
- The presentation provides an overview of AT&S's strategy, markets, and financial results for investors and analysts.
- Key points include outlining AT&S's focus on high-end technologies, strategic goals of long-term growth and profitability, and financial results showing increased revenue and strong earnings in the first three quarters of FY 2016/17.
AT&S is an Austrian technology group specialized in manufacturing high-end printed circuit boards and IC substrates. It has production facilities in Europe and Asia. The presentation provides an overview of AT&S, including its business segments, product portfolio, global footprint, and key financial information. It also discusses trends in the electronics industry such as miniaturization and connectivity that drive demand for AT&S's complex, high-quality solutions. The company has a strategy to strengthen its technology portfolio and enter the growing IC substrate market to further push revenue growth. Financial highlights include steady revenue growth, solid EBITDA margins around 20%, and increasing operating cash flow.
AT&S Investor and Analyst Presentation February 2019AT&S_IR
The document is an investor and analyst presentation from AT&S, a leading provider of printed circuit boards and IC substrates.
In the first 3 sentences:
AT&S reported revenue growth of 3.2% to €790.1 million for the first nine months of the fiscal year, with strong demand for IC substrates and in medical applications. EBITDA increased 15.9% to €220.5 million due to efficiency improvements and the absence of start-up costs in Chongqing. The presentation discusses AT&S' financial results, markets, strategy to become a leading high-end interconnect solutions provider, and outlook.
AT&S Investor and Analyst Presentation January 2019AT&S_IR
This document provides an investor and analyst presentation for AT&S Austria Technologie & Systemtechnik Aktiengesellschaft. Some key points:
- AT&S is a leading global provider of printed circuit boards and IC substrates, serving growing end markets like mobile devices, automotive, industrial, and medical.
- In the first nine months of FY 2018/19, AT&S achieved revenue growth to €790.1 million and an increase in EBITDA to €220.5 million, demonstrating strong financial performance.
- The company is well positioned in high-end technologies through its focus on miniaturization and modularization. Its technology leadership and quality are keys to outperforming the broader
AT&S Investor and Analyst Presentation August 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 9 production facilities across Europe and Asia. In the first quarter of 2016/17, AT&S' revenue declined due to normal seasonal effects and price pressures while EBITDA was impacted by ramping up new production lines in China. However, excluding start-up costs, margins were near previous levels. The company continues to focus on high-end technologies and applications to drive above-market growth long-term.
AT&S Investor and Analyst Presentation January 2019AT&S_IR
This document provides an investor and analyst presentation from AT&S, a leading provider of high-end printed circuit boards and IC substrates. The summary is:
1) AT&S has a global footprint with 6 plants in Europe and Asia and provides high-end interconnect solutions for mobile devices, automotive, industrial, and medical applications.
2) The presentation outlines AT&S' strategy to position itself as a leading provider of advanced interconnect solutions through a focus on high-end technologies and applications with growth targets of €1.5 billion in revenue and an EBITDA margin of 20-25%.
3) In the first half of the 2018/19 fiscal year, AT&S strengthened its technology
This document provides an overview of AT&S, a leading printed circuit board company. It discusses AT&S' strategy of focusing on high-end market segments with attractive growth potential. The company has a global production footprint and aims to enter the high-end IC substrate segment. Financial information is presented showing revenue growth, above industry EBITDA margins, and increasing cash flow generation.
AT&S Investor and Analyst Presentation December 2018AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates.
The presentation summarizes that AT&S has outperformed the flat PCB market in recent years through scaling high-end technologies. It outlines AT&S' strategy to position itself as a leading provider of high-end interconnect solutions beyond PCBs. Key targets include medium-term revenue of €1.5 billion and an EBITDA margin of 20-25%.
The presentation reviews AT&S' financial results for the first half of the 2018/2019 fiscal year, noting a 6.4% increase in revenue and 32.5% increase in EBITDA compared to the
AT&S Investor and Analyst Presentation December 2018AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates.
The presentation summarizes that AT&S has outperformed the flat PCB market in recent years through scaling high-end technologies. It outlines AT&S' strategy to position itself as a leading provider of high-end interconnect solutions beyond PCBs. Key targets include reaching €1.5 billion in revenue and maintaining an EBITDA margin of 20-25% in the medium term.
Financial highlights of the first half of the 2018/19 fiscal year show revenue growth of 6.4% and a significant 32.5% increase in EBITDA, driven by additional output from
Similar to AT&S Company Presentation April 2016 (17)
- AT&S reported lower revenue and earnings for the first nine months of the 2019/20 financial year compared to the same period last year, due to market upheavals and the economic climate. Revenue was down 4.7% and EBITDA declined 29.1%.
- While some segments like IC substrates and medical saw increases, declines were seen in the mobile devices and industrial segments due to changes in product mix and price pressure.
- AT&S adjusted its outlook for the full financial year due to the effects of the coronavirus, and now expects revenue of €960 million and an EBITDA margin of 18-20%. Medium-term growth targets were maintained.
AT&S presented financial results for Q1-3 2019/20. Revenue declined slightly to €753.2 million from challenging market conditions, though remained within target margins. EBITDA fell to €156.4 million due to higher R&D and preparation costs for future applications. The automotive segment performed steadily despite difficulties, while industrial was weaker. Ongoing investments in IC substrate capacity will support long-term growth opportunities in high-performance computing.
- Revenue for AT&S was stable at €222.7 million for the quarter, though earnings declined as expected due to market factors and investments in strategic expansion. EBITDA was €34.9 million, down 32.9%.
- Demand was weaker in the Mobile Devices, Automotive and Industrial segments, leading to underutilization of production capacity. The IC Substrates and Medical & Healthcare segments saw sales increases.
- AT&S initiated an investment project of up to €1 billion to significantly increase IC substrate capacity, with production starting in 2021. This is expected to double revenue to €2 billion in the next 5 years and improve margins long-term.
This document contains the consolidated financial statements of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) for the fiscal year ending March 31, 2019. It includes the consolidated statement of profit or loss, consolidated statement of financial position, notes to the consolidated financial statements, and independent auditor's reports on the consolidated and standalone financial statements. AT&S manufactures printed circuit boards and provides related services for industries including mobile devices, automotive, industrial, medical, and others.
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. In the past fiscal year, AT&S achieved over €1 billion in revenue with approximately 9,800 employees worldwide. The company focuses on providing solutions for mobile devices, automotive, industrial, medical and other applications. Looking ahead, AT&S expects growth to continue driven by digital megatrends and increasing demand for its solutions to support areas like mobility, autonomous driving, industrial automation and more.
- Revenue for AT&S grew slightly to €790.1 million in the first three quarters of 2018/19, while EBITDA increased significantly by 15.9% to €220.5 million.
- Improved profitability was driven by efficiency gains, the absence of startup costs, and a better product mix, despite weaker demand in mobile devices and automotive.
- Earnings per share jumped 83.2% to €2.21, reflecting higher profits and stable number of shares outstanding.
AT&S Investor and Analyst Präsentation September 2018AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates.
The presentation summarizes that AT&S has outperformed the flat PCB market in recent years through scaling high-end technologies. It outlines AT&S' strategy to position itself as a leading provider of high-end interconnect solutions beyond PCBs. Key targets include medium-term revenue of €1.5 billion and an EBITDA margin of 20-25%.
The presentation reviews AT&S' financial results for the first half of the 2018/2019 fiscal year, noting a 6.4% increase in revenue and 32.5% increase in EBITDA compared to the
- AT&S, a manufacturer of high-end printed circuit boards and IC substrates, increased revenue and profits in the first half of the 2018/19 fiscal year compared to the same period last year. Revenue grew 6.4% to €516.9 million driven by additional capacity from new Chinese plants and strong demand for IC substrates.
- EBITDA improved 32.5% to €138.3 million due to the positive contributions from the Chinese plants, and the EBITDA margin increased to 26.8%. Net profit more than tripled to €55.4 million.
- The company upgraded its full-year guidance, now expecting 6-8% revenue growth and an EBITDA margin of
The document is the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft as of March 31, 2018. It includes the consolidated statement of profit or loss, consolidated statement of financial position, notes on accounting policies, and other financial details. The consolidated financial statements were prepared in accordance with International Financial Reporting Standards and interpretations as adopted by the European Union.
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1. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben
Tel +43 (0) 3842 200-0 | E-Mail info@ats.net
www.ats.net
AT&S
first choice for advanced applications
Company Presentation
April 2016
3. 2
AT&S – a world leading high-tech PCB company
Megatrend-driven
markets with attractive
growth potential
Entering a new high-end
business segment by
2016
Pure high-end segment play
Technology & quality leader
Largest European PCB
producer
Partner of choice for blue
chip customer base
Balanced industry portfolio
Strong Asian production
footprint with focus on
high volume/low mix
European footprint: high
mix/low volume
Operational excellence:
Outstanding process
know-how, productivity
and efficiency
One of the most profitable
players in the industry:
above industry EBITDA
margins
Strong cash flow generation
Proven long term successful
financial track record
4. AT&S – Key Facts
Strong track record1 Balanced portfolio / Global customer base2
7%
€ in millions
3
Split revenue: Business Unit, Q1-Q3 2015/16
Split revenue: Customer Region, Q1-Q3 2015/16
based on sold to party
23%
6%
14%
57%
Germany/Austria
Other European
countries
Asia
Americas
488
514
542
590
667
489
584
96 103 102
127
168
127 140
47 42 31
54
90 71 76
2010/11 2011/12 2012/13 2013/14 2014/15 Q1-Q3
2014/15
Q1-Q3
2015/16
Revenue EBITDA EBIT
+5%+5% +9% +13%
+19%
Revenue growth
60%
40%
Mobile Devices &
Substrates
Automotive,
Industrial, Medical
5. 4
Global footprint ensures proximity to supply chain
& cost efficiency
European production facilities: high mix/low volume
Asian production facilities: high volume/low mix
Sales network spanning three continents
8,688 employees*
Plant Shanghai, China
Staff: 4,636*
Plant Ansan, Korea
Staff: 276*
Plant Nanjangud, India
Staff: 1,167*
Plant Chongqing, China
under construction
Staff: 1,289*
Plant Leoben, Austria
Headquarters
Staff: 911*
Plant Fehring, Austria
Staff: 373*
AT&S sales officesAT&S plants
*Average, FTE, Q1-Q3 2015/16; 36 employees in other locations
6. ► volatility due to seasonal effects
5
Balanced high-end product portfolio
to level seasonality
Characteristic Selected ApplicationsSegment
1) Based on external revenue € in millions in Q1 2015/16
Mobile Devices &
Substrates
Advanced
Packaging
Selected Market
Leaders
GoPro
Sony
LG
Canon
Qualcomm
Blackberry
Lenovo
Huawei
Samsung
Xiaomi
ZTE
Intel
Apple
► stable business due to longer product life
time
Includes the segment Advanced Packaging (in the
process of being established) as well as group
management and financial activities
Others
(Revenue € in millions)
(Revenue € in millions)
Automotive,
Industrial,
Medical
Revenue
Share1)
Communication
Computing
Automotive:
Lighting, thermal, sensors,
safety, infotainment,
powertrain
Medical:
Patient monitoring,
therapy, diagnostic
Industrial:
Instrumentation &
control, power
solutions, lighting
Consumer
Electronics
Osram
Hella
Siemens
General Electric
Continental
Harmann
EADS
Texas Instruments
ST Microelectronics
Freescale
Semiconductor
RFMD
TDK-Epcos
Qualcomm
60%
40%
68.0
88.7
120.9
104.5 115.9 112.2 123.4
Q1 14/15Q2 14/15Q3 14/15Q4 14/15Q1 15/16Q2 15/16Q3 15/16
72.6 71.7 65.9 72.6 77.8 79.5 72.7
Q1 14/15Q2 14/15Q3 14/15Q4 14/15Q1 15/16Q2 15/16Q3 15/16
8. AT&S Positioning Strategy
Strategic focus on high-end technologies
High-end
HDI PCBs and
IC-Substrates
~30%
High-end technology share > 70%
HDI and Anylayer PCBs, Embedding
Complementary
technology share: <30%
SS, DS, ML,
Flex, RF
Structure of general PCB market – based on technologies
Single-sided (SS), double-sided (DS), multilayer- (ML),
flex and rigid-flex (RF) PCBs
~70%
AT&S Revenue structure in 2014/15 - based on technologies
7
9. Strategy: Selecting segments and applications
Market segments – selected by AT&S:
Mobile Devices & Substrates Automotive Industrial Medical
Attractive, specific
application growth:
> 10 %
Potential for sustainable
high EBITDA margins :
> 20 %
Technological fit:
dense structures:
35 - 60 micrometer
Criteria for selection
Smartphones, Tablets,
Ultrabooks, Wearables ..
Navigation, Advanced
Driver Assistance
Systems, Infotainment..
Machine-2-Machine
Communication,
Industrial Computer…
Hearing Aids, Patient
Monitoring ..
1 2 3
Specific applications that show attractive, overall growth within our addressed market segments :
8
10. 9
Market Player/Position HDI Technology
Source: Prismark, August 2014; NTI CY2013; AT&S Strategy
Market position HDI Technology
Revenue (US$ in millions)
Rank Country Supplier HDI
Non HDI
PCBs
IC-
Substrates
Total
revenue
1 TWN Unimicron 682 671 795 2,148
2 TWN Compeq 538 509 - 1,047
3 AUT AT&S 530 248 - 778
4 KOR SEMCO 480 173 1,212 1,865
5 JPN Ibiden 426 - 1,080 1,506
6 USA TTM 406 962 - 1,368
7 TWN Zhen Ding 343 1,774 - 2,117
8 TWN Tripod 305 1,077 - 1,382
9 KOR DAP 279 21 - 300
10 TWN Unitech 236 304 - 540
11. Source: AT&S; Prismark (2015), JMS (2014), YOLE (2015)
Advanced Packaging represents the “Embedded die – package” forecast.
FC-Substrates represents “FC-BGA” and “FC-CSP” package substrates.
Market per Segments 2014 – 2019 [US$ in millions]
The Total PCB & Substrate Market will reach around
70 bn US $ in 2019
Overall Market development
Market per Technology 2014 – 2019 [US$ in millions]
10
CAGR 4% CAGR 4%
12. The world is changing – miniaturisation &
modularisation as main drivers
11
2003/04 2013 2016 2024
?
Type Mobile Phone Smartphone System in Package All in One
PCB 125x55mm 85x20mm 30x30mm 20x20 ?
Form Factor 1 0.25 0.13 0.06 ?
Line/Space 100/100µm 40/40µm 30/30µm 20/20µm ?
Technology 1-n-1 Anylayer Anylayer&Embedding ?
13. 12
AT&S’ advanced technology solutions
General Description & Technology Application Areas Customer Base Market Size
High-End
(HDI) PCBs
PCBs are the interconnection platform for electric, electronic
& mechanical components (such as resistors , capacitors, IC’s,
connectors; etc.)
Density: Line/ Space > 35 micron
Computer, Consumer,
Communication, Automotive
Industrial, Medical
OEM´s
Tier 1
Tier 2
AT&S addresses a
market of
USD 5.8bn *
Substrate-like
PCBs
Substrate-like PCBs are the next evolution of high-end HDI
PCBs with higher density: Line/Space 20-30micron
Wearables and applications of
the “Internet of Things”
OEM’s
Tier 1
Tier 2
Technology in
introduction, part
of High –end HDI
and Low-end
Substrate market
* AT&S addresses part of a total market of USD 47.5bn/ source: Global Production Value 2014, Prismark, March 2015
14. 13
* AT&S addresses part of a total market of USD 7.6bn/ source: Global Production Value 2014, Prismark, March 2015;)
** Source: AT&S; Prismark (2015), JMS (2014), YOLE (2015); Advanced Packaging represents the “Embedded die – package” forecast.
IC (FC)-Substrates represents “FC-BGA” and “FC-CSP” package substrates.
General Description & Technology Application Areas Customer Base Market Size
IC Substrates
IC-Substrates serve as interconnection platform with
higher density (Line/Space < 15 micron) between
semiconductors (Chips) & PCBs
High-end processors for
Computer, Communication,
Automotive, Industrial
OEM’s
Semiconductor
Industry
AT&S addresses a
market of
USD 5.1bn *
Embedded
Component
Packaging
(ECP®) Embedded Component Packaging allows to embed
active/passive components (e.g. wafer level dies) within the
layers of a PCB – contributes to miniaturisation
Power Electronics, e.g. for
Automotive, Industrial
OEM’s
Semiconductor
Industry
AT&S addresses a
market of
USD 210m **
AT&S’ advanced technology solutions
15. Growth Project Chongqing – IC-S & Substrate-like
PCBs
Building 1: IC Substrate plant
Specifications:
Clean Room Class < 100
Building 2: Substrate-like PCB plant
Specifications:
Clean Room Class < 10,000 to
< 1,000 in special areas
14
16. Growth Project Chongqing – Overview
15
Location: Chongqing, Central China
Total investment: € 480m in first phase
(until mid 2017)
Expected CAPEX-revenue ratio: mean of 0.9 (at full
expansion – incl. second phase)
Start of High Volume Mass Production
> IC Substrates: February 2016
> Substrate-like PCBs: expected second half 2016
* at full expansion (incl. a second phase not yet scheduled)
** Capex for tangible fixed assets
Plant I Plant II
Products: IC Substrates Substrate-like PCBs
Capacity: 150,000 sqm/p.a.* 200,000 sqm/p.a.*
Investment** Phase 1: ~ € 280m ~ € 200m
Investment** as of 31/12/2015: € 195.6m € 45.3m
17. 16
Driving Future Trends in Customer Segments:
Internet of Things (IoT) and Application Structures
Healthcare
Glasses
Wearable Electronics
Smart Mobility Autonomous Driving
Car2Car Communication
Smart City Smart Lighting
Smart Buildings Home/Building Automatisation
Energy Management
Smart Production/Industry 4.0 Automatisation/Robotics
Production Control Systems
Smart Healthcare Connectivity (e.g. online patient
monitoring)
Smart Energy Smart Metering
30-50 billion of „Things“ will be connected in 2020
Wearables market forecast: USD 10 – 60 billion by 2018
Source: IHS, 2013
19. 18
Sound top-line growth, above industry margins
and increasing cash conversion
488
514
542
590
667
489
584
96
103 102
127
168
127
140
19.7%20.1%
18.9%
21.6%
25.1% 26.0%
24.0%
€ in millions
71
87
72
105
144
95
130
Revenue
Y-O-Y growth
Operating Cash Flow
Y-O-Y development
EBITDA and
EBITDA-margin
Continuous growth path up to full
capacity utilisation
Revenue with products out of
Asian production increased from
69% in 2010/11 to 81% in Q1-Q3
2015/16
EBITDA increase due to good product
mix and high capacity utilisation
EBITDA margin guidance FY 2015/16:
>19% due to impact from ramp-up
Chongqing plant
Operating cash flow generation
driven by strong EBITDA
performance
€ in millions € in millions
20. 19
Capex & Staff
CAPEX
CAPEX reflects investments in Chongqing
project (whereof € 122.1m) and technology
investments in existing locations .
113
40
90
165
130
177
2011/12 2012/13 2013/14 2014/15 Q1-Q3
2014/15
Q1-Q3
2015/16
STAFF*
The increased headcount is primarily based on
the Chongqing project.
7,417 7,321
7,027
7,638
8,688
2011/12 2012/13 2013/14 2014/15 Q1-Q3 2015/16
123
60954 1,289
* incl. leased personnel, FTE, average for the period(€ in millions)
Core business Employees project Chongqing
21. Financials Q1-Q3 2015/16
20
€ in thousands (unless otherwise
indicated)
01.04.2015 – 31.12.2015 01.04.2014 – 31.12.2014
STATEMENT OF PROFIT OR LOSS
Revenue 584,333 489,416
produced in Asia 81% 79%
produced in Europe 19% 21%
EBITDA 140,233 127,284
EBITDA margin 24.0% 26.0%
EBIT 76,074 70,811
EBIT margin 13.0% 14.5%
Finance costs - net (2,664) (4,376)
Income Taxes (13,182) (16,097)
Profit for the period 60,228 50,338
Cash Earnings 124,292 106,751
EPS in € 1.55 1.29
EBITDA increase of 10.2% based on high
capacity utilisation and good product mix;
Positive FX effects of € 10.9m included.
Revenue increase of 19.4%:
7.6% from organic growth and 11.8%
from FX effects.
Higher interest expenses
overcompensated by higher interest
income and capitalised interests for
qualified assets
EBITDA margin decline in comparison to
very high benchmark of 26.0% in Q1-Q3
2014/15
22. 21
Profit for the period and earnings per share
Earnings per share increased by 19.6%
23.3 23.3 23.3
30.8
38.9 38.9 38.9
1.51 1.14 0.62 1.24 1.78 1.29 1.55
-20
-15
-10
-5
0
0
10
20
30
40
50
2010/11 2011/12 2012/13 2013/14 2014/15 Q1-Q3
2014/15
Q1-Q3
2015/16
Number of shares, average number; in million pcs. Earnings per share; in €
23. Financials Q1-Q3 2015/16
22
€ in thousands (unless otherwise
indicated) 31.12.2015 31.03.2015
STATEMENT OF FINANCIAL POSITION
Non-current assets 836,746 712,757
Current assets 639,343 508,055
Equity 599,649 604,358
Non-current liabilities 548,189 413,070
Current liabilities 328,251 203,384
Total assets 1,476,089 1,220,812
Net debt 192,420 130,510
Net gearing 32.1% 21.6%
Net working capital 81,271 95,319
Net working capital per revenue 10.4% 14.3%
Equity ratio 40.6% 49.5%
Improvement of net income was
overcompensated by negative FX effects
26. 25
Overview Debt Portfolio Duration
Maturity
€ in millions < 1 Year 1-5 Years > 5 Years Total
Corporate Bond 82.3 - - 82.3
Export Loans
32.0
- - 32.0
Public funds and other - 2.7 1.4 4.1
Bank Borrowings 16.8 381.9 102.3 501.0
Total 31/12/2015 131.1 384.6 103.7 619.4
Total 31/03/2015 46.0 321.6 37.7 405.3
Average debt portfolio duration: 4.0 years (2014/15: 3.8 years)
Average financing costs of 2.7%
153m € of credit lines not utilised
Refinancing 2015/16
27. Financials Q1-Q3 2015/16
26
€ in thousands 01.04.2015 – 31.12.2015 01.04.2014 – 31.12.2014)
STATEMENT OF CASH FLOWS
Profit for the period 60,228 50,338
Non cash bearing of profit or loss 63,195 65,442
Changes in Working Capital 6,475 (20,406)
Cash flow from operating activities 129,898 95,374
Cash flow from investing activities (175,667) (130,433)
Cash flow from financing activities 204,117 16,838
Change in cash and cash equivalents 158,348 (18,221)
Decrease in Net Working Capital due to
improved customer payment term.
Continuous planned high CAPEX
based on investments in
Chongqing and continuous upgrades
of existing production facilities.
28. 27
Net Working Capital Management
Net Working Capital Development - € in millions and in % of revenue
92
103
92 95
81
18.0%
19.0%
15.6%
14.3%
10.4%
2011/12 2012/13 2013/14 2014/15 Q3 2015/16
Net Working Capital development Net Working Capital % of revenue
29. AT&S - Stock Profile
Listing: Vienna Stock Exchange,
Prime Standard
Indices: ATX, WBI
ThomsonReuters (A): ATSV.VI
Bloomberg (A): ATS AV
Annual Results 2015/16 10 May 2016
Record Date Annual General Meeting 27 June 2016
22nd Annual General Meeting 07 July 2016
Ex-Dividend Day 26 July 2016
Record Date Dividend 27 July 2016
Dividend Payment Day 28 July 2016
Results for the first quarter 2016/17 28 July 2016
Results for the first half-year 2016/17 03 November 2016
28
Financial Calendar 1 year development / Daily volume
ATX
AT&S
# of shares outstanding 38.85m
Avg. daily volume: 65.400 shares
Performance ytd: -11.40%
Performance 1 year: -11.76%
Dividend 2014/15: EUR 0.36/per share
Dividend yield: 2.5%
30. 29
14.9% of Free Float not identified
AT&S – Shareholder structure
31. 30
Outlook FY 2015/16
Management expects the satisfactory capacity utilisation to continue for the financial year
2015/16 provided that the macroeconomic environment remains stable and customer demand
continues at a good level.
On the basis of the organic growth in the first nine months, an expected seasonality in the next
three months, management confirms its revenue guidance of EUR 740 million.
Influenced by the expected costs of the start-up of the new plants in Chongqing, the EBITDA
margin should exceed 19% (guidance at the beginning of the financial year: 18-20%). This
includes an EBITDA margin in the core business at a similar level of the previous year.
33. 32
AT&S Product Portfolio
HDI
any-layer printed circuit
boards
HDI microvia printed
circuit boards – high
density interconnect
Multilayer printed
circuit boards
Double-sided printed
circuit boards
IMS printed circuit
boards – insulated
metal substrate
Further technological
enhancement to HDI
microvia: All electrical
connections in HDI any-layer
boards consist of laser-drilled
microvias. Advantage:
further miniaturisation, and
higher performance and
reliability. AT&S produces HDI
any-layer in 4 to 12 layers.
HDI: high
density interconnect,
meaning laser-drilled
connections (microvias).
HDI is first step
towards miniaturisation.
AT&S can produce 4-layer
laser PCBs up to 6-n-6
HDI multi layer PCBs.
Found in almost every area of
industrial electronics. AT&S
produces printed circuit
boards with 4 to 28 layers, in
quantities from individual
prototypes to small batches
and mass production.
Used in all areas of
electronics.
AT&S focuses on double-
sided printed circuit boards
with thicknesses in the range
of 0.1-3.2 mm.
IMS: insulated metal
substrate. Primary function:
heat dissipation for use
mainly with LEDs and power
components.
Production site
Shanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring
Applications
Smartphones, Tablets,
Notebooks
Mobile phones and nearly all
electronic applications
including automotive
(navigation, infotainment and
driver assistance systems)
Used in all electronic
applications including touch
panels, and in products
ranging from aircraft to
motorcycles, from storage
power plants to solar arrays
Primarily industrial and
automotive applications
Lighting industry
34. 33
AT&S Product Portfolio
Flexible printed
circuit boards
Semi-flexible printed
circuit boards
Rigid-flex printed
circuit boards
Flexible printed circuit
boards on aluminium
AT&S patented
technologies
Used to replace
wiring and connectors,
allowing for connections
and geometries that are
not possible with rigid
printed circuit boards.
More limited bend radius
than flexible printed circuit
boards. The use of a
standard thin laminate
makes them a cost-effective
alternative.
Combine the
advantages of flexible
and rigid printed circuit
boards, yielding benefits
for signal transmission,
size and stability.
Used when installing LEDs
in car headlights, for
example, where the
printed circuit board is
bonded to an aluminium
heat sink to which the
LEDs are then attached.
Production site
Ansan, Fehring Fehring Leoben, Ansan Ansan
Applications
Nearly all areas of
electronics, including
measuring devices and
medical applications
Automotive applications Industrial electronics,
such as production
machines and industrial
robots
Lighting, automotive,
building lighting
ECP: Embedded
Component Packaging
ECP® is a patented AT&S packaging
technology used to embed
active and passive electronic
components in the inner layers
of a printed circuit board. ECP®
technology is used in
ever smaller, more efficient and
more powerful devices, such
as smartphones, tablets, digital
cameras and hearing aids.
Production site: Leoben
2.5D® Technology
Platform
Combines mechanical and
electronic miniaturisation, and
enables partial reduction of the
thickness of a circuit board.
Advantage: populated assemblies
have a thinner profile.
Can be also used to
make cavities in the printed circuit
board, e.g. for acoustic
channels. Major application
for this technology is the 2.5D®
rigid-flex printed circuit board,
a lower cost alternative for flex-to
install applications.
Production sites:
Leoben, Shanghai
35. Management
34
Andreas Gerstenmayer, CEO
Joined AT&S as CEO in 2010
Previous positions include:
18 years of work experience at Siemens, including Managing Director with Siemens Transportation Systems
GmbH Austria and CEO of the Drive Technology business unit in Graz from 2003 to 2008
Partner at FOCUSON Business Consulting GmbH after leaving Siemens
Education and other positions:
Member of the Research Council of Styria
Degree in Production Engineering from Rosenheim University of Applied Sciences
Heinz Moitzi, COO
COO since 2005; with AT&S since 19811)
Previous positions include:
Various management positions within AT&S
Measurement engineer with Leoben University of Mining and Metallurgy
Education:
Degree from Higher Technical College of Electrical Engineering
Karl M. Asamer, CFO
Joined AT&S as CFO in 2014
Previous positions include:
Managing Director of GEKA Group in Germany
Managing Director of Sell GmbH in Germany
Education:
Degree: doctorate in business administration in Linz, Austria
1)He was already with the founding company of AT&S
37. Five core dimensions of sustainability within AT&S
Energy and
carbon footprint
Water
AT&S – a learning
organisationResources
Thinking ahead –
shaping the future
CSR gains importance in long term success
Improving efficiency
Motivated and qualified staff
CSR as a key to sustainable business success
36
The importance of sustainability is rising within:
Authorities
(basis for securing operation licences)
Customers
(relevant for placing orders)
38. AT&S saves CO2 and Water…
37
Sustainability – Figures and Fields of Action
AT&S aims to minimise its
environmental footprint by
reducing the CO2 emissions
per m2 PCB attributable to
production processes by 5%
a year.
AT&S aims to reduce
the Group‘s annual
fresh water
consumption per m2
PCB by 3%.
765.2
834.7
783.9
734.0
2011/12 2012/13 2013/14 2014/15
Freshwater consumption
In liters per sqm weighted PCB
1)
47.4
51.0
50.7
49.0
2011/12 2012/13 2013/14 2014/15
CO2-Footprint
1)
In kg per sqm weighted PCB
1) Since 2012/13 calculation according to EICC standards
before that AT&S internal calculation
40. Disclaimer
39
This presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria
(“AT&S”), and the contents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein,
and no reliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are
expressly cautioned not to place undue reliance on this information.
This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s
expectations and assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual
developments, results, performance or events may vary significantly from the statements contained explicitly or implicitly herein.
Neither AT&S, nor any affiliated company, or any of their directors, officers, employees, advisors or agents accept any responsibility or liability (for negligence or
otherwise) for any loss whatsoever out of the use of or otherwise in connection with this presentation. AT&S undertakes no obligation to update or revise any forward-
looking statements, whether as a result of changed assumptions or expectations, new information or future events.
This presentation does not constitute a recommendation, an offer or invitation, or solicitation of an offer, to subscribe for or purchase any securities, and neither this
presentation nor anything contained herein shall form the basis of any contract or commitment whatsoever. This presentation does not constitute any financial analysis
or financial research and may not be construed to be or form part of a prospectus. This presentation is not directed at, or intended for distribution to or use by, any
person or entity that is a citizen or resident or located in any locality, state, country or other jurisdiction where such distribution, publication, availability or use would be
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