AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants across Europe and Asia. The company focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth. Its strategy is focused on high-end technologies, highest customer service, operational excellence, and cash flow generation. The company has outperformed the broader PCB market in recent years and intends to continue doing so in the future.
AT&S Investor and Analyst Presentation September 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has a strong focus on advanced interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth and high profitability. Key strategies include focusing on high-end technologies and applications with above average growth potential.
AT&S Investor and Analyst Presentation February 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The company has 6 production plants in Europe and Asia. In the past fiscal year, AT&S generated €762.9 million in revenue with 5.2% organic growth. The company is strategically focused on high-end technologies and applications with above average growth potential. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth and shareholder value.
- Revenue remained stable at €386.5 million, matching the previous year's strong level. However, profitability declined due to start-up costs associated with the new Chongqing plant.
- EBITDA decreased 44% to €52.1 million due to €37.3 million in start-up costs for Chongqing. Excluding this, EBITDA declined 5% and the margin was nearly unchanged at 23.8%.
- Net loss was €14.8 million compared to €42.1 million profit in the previous year, due to the Chongqing start-up costs and higher financing expenses. Outlook for the year remains cautious due to ongoing ramp-up
AT&S Investor and Analyst Presentation August 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 9 production facilities across Europe and Asia. In the first quarter of 2016/17, AT&S' revenue declined due to normal seasonal effects and price pressures while EBITDA was impacted by ramping up new production lines in China. However, excluding start-up costs, margins were near previous levels. The company continues to focus on high-end technologies and applications to drive above-market growth long-term.
This document provides key financial figures and performance highlights for AT&S, a leading manufacturer of printed circuit boards, for the years 2012/13 through 2015/16. Some key points:
- Revenue increased 14.4% in 2015/16 to €762.9 million, with growth primarily from the Mobile Devices & Substrates segment.
- EBITDA remained flat at €167.5 million while EBIT declined 14.6% due to higher depreciation from a new production line in China.
- ROCE declined from 12.0% to 8.2% due to investments in a new plant in Chongqing, China.
- Headcount increased 12.3% to 9
AT&S Investor and Analyst Presentation April 2017AT&S_IR
The document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. It discusses AT&S' strategy, market positioning, technologies, growth projects, and key financial figures. Specifically:
- AT&S focuses on high-end technologies for applications in mobile devices, automotive, industrial, medical, and semiconductors.
- It aims to strengthen its technology leadership, achieve long-term profitable growth, and generate shareholder value.
- Major growth projects include new IC substrate and substrate-like PCB production lines in Chongqing, China.
- Financially, AT&S has achieved sound revenue growth and margins above industry averages,
AT&S Investor and Analyst Presentation November 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants in Europe and Asia. In the first half of 2016/17, AT&S achieved stable revenue but lower profitability due to ramping up new production lines in China. While revenue was balanced by the first contributions from China, earnings before interest, taxes, depreciation, and amortization (EBITDA) was impacted by start-up costs. Excluding these costs, the adjusted EBITDA margin remained nearly as high as the previous year. The company continues to focus on high-end technologies and applications to strengthen its technology leadership.
- Revenue increased 5.3% to €615.1 million due to first revenues from new IC substrate and circuit board plants in China, though profitability declined.
- EBITDA fell 27.2% to €102.1 million due to €51.6 million in start-up costs for the new China plants, while adjusted EBITDA rose 8.5% as cost cuts offset price pressure.
- Net loss of €19.7 million compared to €60.2 million profit last year primarily from start-up effects and higher financing costs, though core business profitability improved.
AT&S Investor and Analyst Presentation September 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has a strong focus on advanced interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth and high profitability. Key strategies include focusing on high-end technologies and applications with above average growth potential.
AT&S Investor and Analyst Presentation February 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The company has 6 production plants in Europe and Asia. In the past fiscal year, AT&S generated €762.9 million in revenue with 5.2% organic growth. The company is strategically focused on high-end technologies and applications with above average growth potential. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth and shareholder value.
- Revenue remained stable at €386.5 million, matching the previous year's strong level. However, profitability declined due to start-up costs associated with the new Chongqing plant.
- EBITDA decreased 44% to €52.1 million due to €37.3 million in start-up costs for Chongqing. Excluding this, EBITDA declined 5% and the margin was nearly unchanged at 23.8%.
- Net loss was €14.8 million compared to €42.1 million profit in the previous year, due to the Chongqing start-up costs and higher financing expenses. Outlook for the year remains cautious due to ongoing ramp-up
AT&S Investor and Analyst Presentation August 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 9 production facilities across Europe and Asia. In the first quarter of 2016/17, AT&S' revenue declined due to normal seasonal effects and price pressures while EBITDA was impacted by ramping up new production lines in China. However, excluding start-up costs, margins were near previous levels. The company continues to focus on high-end technologies and applications to drive above-market growth long-term.
This document provides key financial figures and performance highlights for AT&S, a leading manufacturer of printed circuit boards, for the years 2012/13 through 2015/16. Some key points:
- Revenue increased 14.4% in 2015/16 to €762.9 million, with growth primarily from the Mobile Devices & Substrates segment.
- EBITDA remained flat at €167.5 million while EBIT declined 14.6% due to higher depreciation from a new production line in China.
- ROCE declined from 12.0% to 8.2% due to investments in a new plant in Chongqing, China.
- Headcount increased 12.3% to 9
AT&S Investor and Analyst Presentation April 2017AT&S_IR
The document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. It discusses AT&S' strategy, market positioning, technologies, growth projects, and key financial figures. Specifically:
- AT&S focuses on high-end technologies for applications in mobile devices, automotive, industrial, medical, and semiconductors.
- It aims to strengthen its technology leadership, achieve long-term profitable growth, and generate shareholder value.
- Major growth projects include new IC substrate and substrate-like PCB production lines in Chongqing, China.
- Financially, AT&S has achieved sound revenue growth and margins above industry averages,
AT&S Investor and Analyst Presentation November 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants in Europe and Asia. In the first half of 2016/17, AT&S achieved stable revenue but lower profitability due to ramping up new production lines in China. While revenue was balanced by the first contributions from China, earnings before interest, taxes, depreciation, and amortization (EBITDA) was impacted by start-up costs. Excluding these costs, the adjusted EBITDA margin remained nearly as high as the previous year. The company continues to focus on high-end technologies and applications to strengthen its technology leadership.
- Revenue increased 5.3% to €615.1 million due to first revenues from new IC substrate and circuit board plants in China, though profitability declined.
- EBITDA fell 27.2% to €102.1 million due to €51.6 million in start-up costs for the new China plants, while adjusted EBITDA rose 8.5% as cost cuts offset price pressure.
- Net loss of €19.7 million compared to €60.2 million profit last year primarily from start-up effects and higher financing costs, though core business profitability improved.
AT&S Investor and Analyst Presentation January 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants in Europe and Asia. In the first half of 2016/17, AT&S achieved revenue of €737 million, stable compared to the previous year. EBITDA was impacted by ramping up new plants in China but was 24% when adjusted for these effects. AT&S is investing €480 million in its new Chongqing site in China to expand production capacity for IC substrates and substrate-like PCBs, with the goal of strengthening its technology leadership and achieving long-term profitable growth.
AT&S Investor and Analyst Presentation May 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The document provides an overview of AT&S, including its strategy, technologies, market positioning, and financial performance. It focuses on AT&S strengthening its leadership in high-end interconnect solutions through innovation, a strategic focus on technologies with above-average growth, and operational excellence.
AT&S Investor and Analyst Presentation October 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has six production plants in Europe and Asia. In the past fiscal year, AT&S achieved revenue of €762.9 million with continuous above-market growth and an EBITDA margin of 22%. The company is focusing on high-end technologies and applications with a strategic investment of €480 million in its new Chongqing, China plant to expand production of IC substrates and substrate-like PCBs. While revenue declined in the most recent quarter due to seasonal factors and price pressure, AT&S remains profitable with a adjusted EBITDA margin of over 20% excluding ramp-up costs in Chongqing.
This document provides an overview of AT&S, a leading manufacturer of high-end printed circuit boards and IC substrates. It discusses AT&S' strategy, market position, technologies, and financials. Key points:
- AT&S focuses on high-end technologies for mobile devices, automotive, industrial, and medical applications.
- It has a global footprint with plants in Europe and Asia and is #1 in Europe and #3 worldwide for high-end PCB technology.
- The company is investing €480 million in a new plant in Chongqing, China to expand its IC substrate and substrate-like PCB production capabilities.
- Revenue declined 8% to €178.9 million in Q1 2017 compared to Q1 2016, due to the expected seasonal downturn in demand for mobile device PCBs.
- EBITDA was €18.8 million versus €45.5 million in the previous year, influenced by start-up effects of the new Chongqing plant. Excluding these effects, EBITDA was €38.1 million.
- Net loss was €13.6 million compared to a €19.6 million profit in the previous year, due to start-up costs and higher financing costs.
The document is a company presentation for AT&S, a leading manufacturer of printed circuit boards and IC substrates. It provides an overview of AT&S, including its strategy, competitive advantages, global footprint, key financials, and positioning in high-end interconnection technologies. AT&S focuses on advanced applications in mobile devices, automotive, industrial, and medical sectors. It aims to strengthen its technology leadership and achieve long-term profitable growth through operational excellence.
- Revenue increased 6.8% to a record €814.9 million, outperforming the general market, but earnings were negatively impacted by start-up costs associated with the Chongqing plant expansion.
- The core printed circuit board business remained profitable with EBITDA margins above 25%, but earnings were lower due to price pressure and lost production capacity during plant upgrades.
- The expansion in Chongqing faced technical challenges, resulting in longer ramp-up times and lower profits from IC substrates. A second production line started in September.
- The losses for the period and negative earnings per share were due to the lower EBITDA and higher depreciation/financing costs.
-
AT&S Investor and Analyst Presentation July 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The company has 6 production plants across Europe and Asia. AT&S focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, medical, and semiconductor industries. In the financial year 2016/17, AT&S generated €814.9 million in revenue and employed 9,526 people worldwide. The company aims to strengthen its technology leadership position and achieve long-term profitable growth through a focus on high-end technologies and applications with above average growth potential.
- Revenue increased 25.7% to €485.7 million due to strong customer demand and better than expected ramp-up of new technology.
- EBITDA doubled to €104.4 million, with the margin increasing 8% to 21.5% due to efficiency measures overcoming challenges faster.
- Net profit turned positive to €15.4 million compared to a loss of €14.8 million previously, with earnings per share of €0.40.
This document contains the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft as of March 31, 2016. It includes the consolidated statement of profit or loss, consolidated statement of comprehensive income, consolidated statement of financial position, consolidated statement of cash flows, and consolidated statement of changes in equity. The notes to the consolidated financial statements provide details on the company's accounting policies, consolidation principles, segments, and other financial details. The company manufactures printed circuit boards for industries such as mobile devices, automotive, industrial, medical and others.
The annual report summarizes the company's financial performance in 2014/15. Some key points:
- Revenue grew 13.1% to €667 million, with strong growth in mobile devices and automotive electronics.
- Earnings also increased substantially, with EBITDA up 31.8% and profit for the period rising 81.5% to €69.3 million.
- The balance sheet remains solid, with an equity ratio of 49.5% and reduced net gearing of 21.6%, allowing continued investment in expanding production capacity.
The document provides an overview of AT&S, a leading high-tech printed circuit board company. Some key points:
- AT&S has a global footprint with production facilities in Europe focusing on high mix/low volume and Asia focusing on high volume/low mix.
- Their strategy is focused on high-end technologies like HDI PCBs and IC substrates for applications in growing markets like mobile devices, automotive, medical and more.
- They are making a major investment in a new plant in Chongqing, China to expand their production of IC substrates and a new segment of substrate-like PCBs.
- Financial highlights show continued revenue growth, above industry average EBITDA
AT&S Investor and Analyst Presentation November 2017AT&S_IR
This document is an investor and analyst presentation by AT&S, a leading manufacturer of printed circuit boards and IC substrates.
The presentation provides an overview of AT&S, their strategic focus on high-end technologies, key financial figures, and an update on their new plant in Chongqing, China. In the first half of 2017/18, AT&S achieved revenue growth of 26% and EBITDA growth of 227.7% compared to the same period last year, driven by the ramp-up of their new mSAP technology and IC substrate plant in Chongqing. Their continued focus is on expanding their technology leadership position and driving long-term profitable growth.
This document contains the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) as of March 31, 2015, including notes to the consolidated financial statements. It provides details on AT&S' consolidated statement of profit or loss, statement of financial position, statement of cash flows, statement of changes in equity, accounting policies, and group of consolidated entities. The consolidated financial statements were prepared in accordance with International Financial Reporting Standards and applicable Austrian law.
AT&S Investor and Analyst Presentation August 2017AT&S_IR
This document provides an overview of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading manufacturer of printed circuit boards and IC substrates. It discusses the company's strategy, market position, financial performance, and expansion plans. Key points include:
- AT&S focuses on high-end technologies and applications with above average growth potential.
- It has the #1 market position in Europe and #3 globally for high-end PCB technology.
- In Q1 2017/18, revenue grew 9% to €814.9 million driven by contributions from new plants in China.
- Margin was impacted by start-up costs for new plants but improvements are expected as
- AT&S finished the 2011/12 financial year with record sales of around EUR 514m, about 5% higher than the previous year. EBITDA increased to over EUR 103m, however EBIT and net income declined slightly.
- External factors such as the earthquake in Japan and European financial crisis impacted demand in the first half of the year but the business stabilized in the second half.
- Innovation and technological leadership remain strategic focuses as AT&S anticipates future market needs. Several new partnerships and technologies were developed over the year.
- The outlook for the printed circuit board industry is positive and AT&S sees opportunities to expand in mobile devices, automotive, and recovering industrial segments. Maint
AT&S Investor and Analyst Presentation June 2017AT&S_IR
AT&S is a leading manufacturer of printed circuit boards and IC substrates headquartered in Austria. The company focuses on high-end technologies and applications with above average growth potential. It has production facilities across Europe and Asia to be close to customers and ensure cost efficiency. AT&S aims to strengthen its technology leadership position and generate long-term profitable growth and shareholder value through operational excellence and a strategic focus on innovative interconnect solutions.
- AT&S reported lower revenue and earnings for the first nine months of the 2019/20 financial year compared to the same period last year, due to market upheavals and the economic climate. Revenue was down 4.7% and EBITDA declined 29.1%.
- While some segments like IC substrates and medical saw increases, declines were seen in the mobile devices and industrial segments due to changes in product mix and price pressure.
- AT&S adjusted its outlook for the full financial year due to the effects of the coronavirus, and now expects revenue of €960 million and an EBITDA margin of 18-20%. Medium-term growth targets were maintained.
AT&S Investor and Analyst Presentation August 2019 von AT&S_IRAT&S_IR
AT&S presented its investor and analyst presentation for August 2019. Some key points:
- AT&S is a leading provider of high-end printed circuit boards and IC substrates.
- In Q1 2019/20, revenue was flat at €222.7 million but EBITDA declined due to challenging market conditions and higher R&D costs.
- Growth opportunities exist across all segments due to trends like 5G, AI, and electric vehicles. However, some segments like automotive currently face temporary slowdowns.
- AT&S is initiating its next growth step with a planned €1 billion investment over 5 years in a new IC substrate plant in China and expansion in Austria to capture demand for high
AT&S is a leading global producer of printed circuit boards and IC substrates. It has a balanced portfolio serving the mobile devices, industrial/automotive, and medical markets. The company has a global footprint with production facilities in Europe and Asia. It aims to enter the high-end IC substrate business by 2016 with a new facility in China. AT&S has demonstrated a track record of revenue and profitability growth, above industry margins, and strong cash flow generation.
AT&S Investor and Analyst Presentation March 2017 AT&S_IR
AT&S presented an investor and analyst presentation covering the company's strategy and financials. The presentation included:
1) An overview of AT&S' position as a leading manufacturer of high-end printed circuit boards and IC substrates for applications in mobile devices, automotive, industrial, medical, and semiconductors.
2) Details on AT&S' strategic focus on high-end technologies and applications with above average growth potential and long-term profitability.
3) Financial highlights showing AT&S' track record of revenue growth and margins above industry levels, as well as investments in new production capacity, particularly in Chongqing, China.
The document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. Some key points:
- AT&S focuses on high-end technologies for applications in mobile devices, automotive, industrial, and medical sectors.
- They have production facilities in Europe and Asia, with the majority of revenue now coming from Asian production.
- Their strategic focus is on innovative interconnect solutions to support trends like miniaturization and the Internet of Things.
- A new plant in Chongqing, China will allow them to expand into new technologies like IC substrates and substrate-like PCBs.
AT&S Investor and Analyst Presentation January 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has 6 production plants in Europe and Asia. In the first half of 2016/17, AT&S achieved revenue of €737 million, stable compared to the previous year. EBITDA was impacted by ramping up new plants in China but was 24% when adjusted for these effects. AT&S is investing €480 million in its new Chongqing site in China to expand production capacity for IC substrates and substrate-like PCBs, with the goal of strengthening its technology leadership and achieving long-term profitable growth.
AT&S Investor and Analyst Presentation May 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The document provides an overview of AT&S, including its strategy, technologies, market positioning, and financial performance. It focuses on AT&S strengthening its leadership in high-end interconnect solutions through innovation, a strategic focus on technologies with above-average growth, and operational excellence.
AT&S Investor and Analyst Presentation October 2016AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. It has six production plants in Europe and Asia. In the past fiscal year, AT&S achieved revenue of €762.9 million with continuous above-market growth and an EBITDA margin of 22%. The company is focusing on high-end technologies and applications with a strategic investment of €480 million in its new Chongqing, China plant to expand production of IC substrates and substrate-like PCBs. While revenue declined in the most recent quarter due to seasonal factors and price pressure, AT&S remains profitable with a adjusted EBITDA margin of over 20% excluding ramp-up costs in Chongqing.
This document provides an overview of AT&S, a leading manufacturer of high-end printed circuit boards and IC substrates. It discusses AT&S' strategy, market position, technologies, and financials. Key points:
- AT&S focuses on high-end technologies for mobile devices, automotive, industrial, and medical applications.
- It has a global footprint with plants in Europe and Asia and is #1 in Europe and #3 worldwide for high-end PCB technology.
- The company is investing €480 million in a new plant in Chongqing, China to expand its IC substrate and substrate-like PCB production capabilities.
- Revenue declined 8% to €178.9 million in Q1 2017 compared to Q1 2016, due to the expected seasonal downturn in demand for mobile device PCBs.
- EBITDA was €18.8 million versus €45.5 million in the previous year, influenced by start-up effects of the new Chongqing plant. Excluding these effects, EBITDA was €38.1 million.
- Net loss was €13.6 million compared to a €19.6 million profit in the previous year, due to start-up costs and higher financing costs.
The document is a company presentation for AT&S, a leading manufacturer of printed circuit boards and IC substrates. It provides an overview of AT&S, including its strategy, competitive advantages, global footprint, key financials, and positioning in high-end interconnection technologies. AT&S focuses on advanced applications in mobile devices, automotive, industrial, and medical sectors. It aims to strengthen its technology leadership and achieve long-term profitable growth through operational excellence.
- Revenue increased 6.8% to a record €814.9 million, outperforming the general market, but earnings were negatively impacted by start-up costs associated with the Chongqing plant expansion.
- The core printed circuit board business remained profitable with EBITDA margins above 25%, but earnings were lower due to price pressure and lost production capacity during plant upgrades.
- The expansion in Chongqing faced technical challenges, resulting in longer ramp-up times and lower profits from IC substrates. A second production line started in September.
- The losses for the period and negative earnings per share were due to the lower EBITDA and higher depreciation/financing costs.
-
AT&S Investor and Analyst Presentation July 2017AT&S_IR
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. The company has 6 production plants across Europe and Asia. AT&S focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, medical, and semiconductor industries. In the financial year 2016/17, AT&S generated €814.9 million in revenue and employed 9,526 people worldwide. The company aims to strengthen its technology leadership position and achieve long-term profitable growth through a focus on high-end technologies and applications with above average growth potential.
- Revenue increased 25.7% to €485.7 million due to strong customer demand and better than expected ramp-up of new technology.
- EBITDA doubled to €104.4 million, with the margin increasing 8% to 21.5% due to efficiency measures overcoming challenges faster.
- Net profit turned positive to €15.4 million compared to a loss of €14.8 million previously, with earnings per share of €0.40.
This document contains the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft as of March 31, 2016. It includes the consolidated statement of profit or loss, consolidated statement of comprehensive income, consolidated statement of financial position, consolidated statement of cash flows, and consolidated statement of changes in equity. The notes to the consolidated financial statements provide details on the company's accounting policies, consolidation principles, segments, and other financial details. The company manufactures printed circuit boards for industries such as mobile devices, automotive, industrial, medical and others.
The annual report summarizes the company's financial performance in 2014/15. Some key points:
- Revenue grew 13.1% to €667 million, with strong growth in mobile devices and automotive electronics.
- Earnings also increased substantially, with EBITDA up 31.8% and profit for the period rising 81.5% to €69.3 million.
- The balance sheet remains solid, with an equity ratio of 49.5% and reduced net gearing of 21.6%, allowing continued investment in expanding production capacity.
The document provides an overview of AT&S, a leading high-tech printed circuit board company. Some key points:
- AT&S has a global footprint with production facilities in Europe focusing on high mix/low volume and Asia focusing on high volume/low mix.
- Their strategy is focused on high-end technologies like HDI PCBs and IC substrates for applications in growing markets like mobile devices, automotive, medical and more.
- They are making a major investment in a new plant in Chongqing, China to expand their production of IC substrates and a new segment of substrate-like PCBs.
- Financial highlights show continued revenue growth, above industry average EBITDA
AT&S Investor and Analyst Presentation November 2017AT&S_IR
This document is an investor and analyst presentation by AT&S, a leading manufacturer of printed circuit boards and IC substrates.
The presentation provides an overview of AT&S, their strategic focus on high-end technologies, key financial figures, and an update on their new plant in Chongqing, China. In the first half of 2017/18, AT&S achieved revenue growth of 26% and EBITDA growth of 227.7% compared to the same period last year, driven by the ramp-up of their new mSAP technology and IC substrate plant in Chongqing. Their continued focus is on expanding their technology leadership position and driving long-term profitable growth.
This document contains the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) as of March 31, 2015, including notes to the consolidated financial statements. It provides details on AT&S' consolidated statement of profit or loss, statement of financial position, statement of cash flows, statement of changes in equity, accounting policies, and group of consolidated entities. The consolidated financial statements were prepared in accordance with International Financial Reporting Standards and applicable Austrian law.
AT&S Investor and Analyst Presentation August 2017AT&S_IR
This document provides an overview of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading manufacturer of printed circuit boards and IC substrates. It discusses the company's strategy, market position, financial performance, and expansion plans. Key points include:
- AT&S focuses on high-end technologies and applications with above average growth potential.
- It has the #1 market position in Europe and #3 globally for high-end PCB technology.
- In Q1 2017/18, revenue grew 9% to €814.9 million driven by contributions from new plants in China.
- Margin was impacted by start-up costs for new plants but improvements are expected as
- AT&S finished the 2011/12 financial year with record sales of around EUR 514m, about 5% higher than the previous year. EBITDA increased to over EUR 103m, however EBIT and net income declined slightly.
- External factors such as the earthquake in Japan and European financial crisis impacted demand in the first half of the year but the business stabilized in the second half.
- Innovation and technological leadership remain strategic focuses as AT&S anticipates future market needs. Several new partnerships and technologies were developed over the year.
- The outlook for the printed circuit board industry is positive and AT&S sees opportunities to expand in mobile devices, automotive, and recovering industrial segments. Maint
AT&S Investor and Analyst Presentation June 2017AT&S_IR
AT&S is a leading manufacturer of printed circuit boards and IC substrates headquartered in Austria. The company focuses on high-end technologies and applications with above average growth potential. It has production facilities across Europe and Asia to be close to customers and ensure cost efficiency. AT&S aims to strengthen its technology leadership position and generate long-term profitable growth and shareholder value through operational excellence and a strategic focus on innovative interconnect solutions.
- AT&S reported lower revenue and earnings for the first nine months of the 2019/20 financial year compared to the same period last year, due to market upheavals and the economic climate. Revenue was down 4.7% and EBITDA declined 29.1%.
- While some segments like IC substrates and medical saw increases, declines were seen in the mobile devices and industrial segments due to changes in product mix and price pressure.
- AT&S adjusted its outlook for the full financial year due to the effects of the coronavirus, and now expects revenue of €960 million and an EBITDA margin of 18-20%. Medium-term growth targets were maintained.
AT&S Investor and Analyst Presentation August 2019 von AT&S_IRAT&S_IR
AT&S presented its investor and analyst presentation for August 2019. Some key points:
- AT&S is a leading provider of high-end printed circuit boards and IC substrates.
- In Q1 2019/20, revenue was flat at €222.7 million but EBITDA declined due to challenging market conditions and higher R&D costs.
- Growth opportunities exist across all segments due to trends like 5G, AI, and electric vehicles. However, some segments like automotive currently face temporary slowdowns.
- AT&S is initiating its next growth step with a planned €1 billion investment over 5 years in a new IC substrate plant in China and expansion in Austria to capture demand for high
AT&S is a leading global producer of printed circuit boards and IC substrates. It has a balanced portfolio serving the mobile devices, industrial/automotive, and medical markets. The company has a global footprint with production facilities in Europe and Asia. It aims to enter the high-end IC substrate business by 2016 with a new facility in China. AT&S has demonstrated a track record of revenue and profitability growth, above industry margins, and strong cash flow generation.
AT&S Investor and Analyst Presentation March 2017 AT&S_IR
AT&S presented an investor and analyst presentation covering the company's strategy and financials. The presentation included:
1) An overview of AT&S' position as a leading manufacturer of high-end printed circuit boards and IC substrates for applications in mobile devices, automotive, industrial, medical, and semiconductors.
2) Details on AT&S' strategic focus on high-end technologies and applications with above average growth potential and long-term profitability.
3) Financial highlights showing AT&S' track record of revenue growth and margins above industry levels, as well as investments in new production capacity, particularly in Chongqing, China.
The document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. Some key points:
- AT&S focuses on high-end technologies for applications in mobile devices, automotive, industrial, and medical sectors.
- They have production facilities in Europe and Asia, with the majority of revenue now coming from Asian production.
- Their strategic focus is on innovative interconnect solutions to support trends like miniaturization and the Internet of Things.
- A new plant in Chongqing, China will allow them to expand into new technologies like IC substrates and substrate-like PCBs.
AT&S Investor and Analyst Presentation September 2017AT&S_IR
AT&S is a leading provider of high-end printed circuit boards and IC substrates. It has 6 production plants across Europe and Asia. The company focuses on advanced interconnect solutions for applications in mobile devices, automotive, industrial, medical, and semiconductor industries. AT&S aims to strengthen its technology leadership position and achieve long-term profitable growth through operational excellence and a focus on high-end technologies and cash flow generation. Recent investments in new plants in China will help expand the company's product portfolio and customer base.
AT&S Investor and Analyst Presentation October 2017AT&S_IR
AT&S is a leading manufacturer of printed circuit boards and IC substrates, focusing on high-end technologies. The company has 6 production plants across Europe and Asia. In Q1 2017/18, AT&S reported revenue growth of 14% year-over-year driven by contributions from its new Chongqing plant in China. EBITDA margins declined due to start-up costs associated with new plants but showed improvements over the previous quarter. AT&S remains focused on expanding its technology leadership position and driving long-term profitable growth through its strategic focus on innovative, high-end applications.
AT&S Investor and Analyst Presentation March 2018AT&S_IR
- AT&S is a leading global manufacturer of printed circuit boards and IC substrates headquartered in Austria.
- The presentation provides an overview of AT&S's strategy, markets, and financial results for investors and analysts.
- Key points include outlining AT&S's focus on high-end technologies, strategic goals of long-term growth and profitability, and financial results showing increased revenue and strong earnings in the first three quarters of FY 2016/17.
AT&S Investor and Analyst Presentation February 2018AT&S_IR
- AT&S is a leading global manufacturer of printed circuit boards and IC substrates headquartered in Austria.
- They provide high-end interconnect solutions for applications in mobile devices, automotive, industrial, and medical sectors.
- In their investor presentation, they outline their strategy to expand their technology leadership position and achieve long-term profitable growth through focusing on fast-growing applications and maintaining highest service levels for customers.
AT&S Investor and Analyst Presentation August 2018AT&S_IR
- AT&S is a leading provider of printed circuit boards and IC substrates headquartered in Austria.
- In Q1 2018/19, AT&S saw revenue increase 11.2% to €222.1 million due to additional contributions from its new plant in Chongqing, China and higher demand for IC substrates.
- EBITDA margin increased significantly to 23.4% in Q1 2018/19 from 14.9% in the prior year period, driven by the higher contribution from Chongqing as well as one-time valuation effects.
This document provides an overview of AT&S, a leading printed circuit board company. It discusses AT&S' strategy of focusing on high-end market segments with attractive growth potential. The company has a global production footprint and aims to enter the high-end IC substrate segment. Financial information is presented showing revenue growth, above industry EBITDA margins, and increasing cash flow generation.
AT&S Investor and Analyst Presentation August 2018AT&S_IR
AT&S presented its strategy and financial results for investors and analysts. Key points include:
- AT&S aims to become the leading provider of high-end interconnect solutions through innovation, profitable growth, and shareholder value creation.
- The company is expanding into new technologies like IC substrates to diversify beyond PCBs.
- In Q1 2018/19, AT&S grew revenue 11% to €222 million and improved its EBITDA margin to 23%, driven by contributions from its new Chongqing plant.
- AT&S has a global footprint across 6 plants and aims to reach €1.5 billion in revenue through focus on fast-growing applications like medical devices and autom
AT&S presented financial results for Q1-3 2019/20. Revenue declined slightly to €753.2 million from challenging market conditions, though remained within target margins. EBITDA fell to €156.4 million due to higher R&D and preparation costs for future applications. The automotive segment performed steadily despite difficulties, while industrial was weaker. Ongoing investments in IC substrate capacity will support long-term growth opportunities in high-performance computing.
This document provides an overview of AT&S, a leading manufacturer of printed circuit boards and IC substrates. It discusses AT&S' strategy of focusing on high-end technology applications, its balanced portfolio and global production footprint. Financial information shows steady revenue growth, above industry EBITDA margins of 18-20%, and strong cash flow generation. The outlook anticipates continued satisfactory business development in the current fiscal year provided macroeconomic stability.
AT&S Investor and Analyst Presentation February 2019AT&S_IR
The document is an investor and analyst presentation from AT&S, a leading provider of printed circuit boards and IC substrates.
In the first 3 sentences:
AT&S reported revenue growth of 3.2% to €790.1 million for the first nine months of the fiscal year, with strong demand for IC substrates and in medical applications. EBITDA increased 15.9% to €220.5 million due to efficiency improvements and the absence of start-up costs in Chongqing. The presentation discusses AT&S' financial results, markets, strategy to become a leading high-end interconnect solutions provider, and outlook.
AT&S Investor and Analyst Presentation January 2019AT&S_IR
This document provides an investor and analyst presentation for AT&S Austria Technologie & Systemtechnik Aktiengesellschaft. Some key points:
- AT&S is a leading global provider of printed circuit boards and IC substrates, serving growing end markets like mobile devices, automotive, industrial, and medical.
- In the first nine months of FY 2018/19, AT&S achieved revenue growth to €790.1 million and an increase in EBITDA to €220.5 million, demonstrating strong financial performance.
- The company is well positioned in high-end technologies through its focus on miniaturization and modularization. Its technology leadership and quality are keys to outperforming the broader
This document provides an investor and analyst presentation for AT&S, a leading producer of printed circuit boards and IC substrates. It summarizes that AT&S has a unique market position as a provider of high-end PCBs and substrates for growth applications in mobile devices, automotive, industrial, and medical industries. It also outlines AT&S' global production footprint and technology leadership through continuous R&D efforts. The presentation discusses the company's growth strategy through incremental investments to capture opportunities in megatrend markets and its goal of sustainable profitability above industry averages.
AT&S Investor and Analyst Presentation January 2019AT&S_IR
This document provides an investor and analyst presentation from AT&S, a leading provider of high-end printed circuit boards and IC substrates. The summary is:
1) AT&S has a global footprint with 6 plants in Europe and Asia and provides high-end interconnect solutions for mobile devices, automotive, industrial, and medical applications.
2) The presentation outlines AT&S' strategy to position itself as a leading provider of advanced interconnect solutions through a focus on high-end technologies and applications with growth targets of €1.5 billion in revenue and an EBITDA margin of 20-25%.
3) In the first half of the 2018/19 fiscal year, AT&S strengthened its technology
AT&S is a leading high-tech printed circuit board and IC substrate company. It has a global footprint with production facilities in Europe and Asia. AT&S is expanding into new technologies like substrate-like PCBs and IC substrates to position itself for future growth opportunities in advanced applications and markets driven by trends like the Internet of Things. A major investment project underway is a new plant in Chongqing, China dedicated to IC substrates and substrate-like PCBs, which is expected to begin production in 2016. This will expand AT&S' technology portfolio and capabilities in high-end applications.
AT&S Investor and Analyst Presentation December 2018AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates.
The presentation summarizes that AT&S has outperformed the flat PCB market in recent years through scaling high-end technologies. It outlines AT&S' strategy to position itself as a leading provider of high-end interconnect solutions beyond PCBs. Key targets include medium-term revenue of €1.5 billion and an EBITDA margin of 20-25%.
The presentation reviews AT&S' financial results for the first half of the 2018/2019 fiscal year, noting a 6.4% increase in revenue and 32.5% increase in EBITDA compared to the
AT&S Investor and Analyst Presentation December 2018AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates.
The presentation summarizes that AT&S has outperformed the flat PCB market in recent years through scaling high-end technologies. It outlines AT&S' strategy to position itself as a leading provider of high-end interconnect solutions beyond PCBs. Key targets include reaching €1.5 billion in revenue and maintaining an EBITDA margin of 20-25% in the medium term.
Financial highlights of the first half of the 2018/19 fiscal year show revenue growth of 6.4% and a significant 32.5% increase in EBITDA, driven by additional output from
AT&S Investor and Analyst Präsentation September 2018AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates.
The presentation summarizes that AT&S has outperformed the flat PCB market in recent years through scaling high-end technologies. It outlines AT&S' strategy to position itself as a leading provider of high-end interconnect solutions beyond PCBs. Key targets include medium-term revenue of €1.5 billion and an EBITDA margin of 20-25%.
The presentation reviews AT&S' financial results for the first half of the 2018/2019 fiscal year, noting a 6.4% increase in revenue and 32.5% increase in EBITDA compared to the
AT&S Investor and Analyst Presentation September 2018AT&S_IR
- AT&S is a leading global provider of high-end printed circuit boards and IC substrates, serving growing end markets including mobile devices, automotive, industrial, and medical.
- In the first quarter of FY2018/19, AT&S achieved revenue growth of 11.2% to €222 million driven by additional contributions from its new Chongqing plant in China and higher demand for IC substrates.
- EBITDA margin improved significantly to 23.4% in Q1 FY2018/19 compared to 14.9% in the prior year period, benefiting from higher margins in Chongqing and one-time valuation effects.
Similar to AT&S Investor and Analyst Presentation December 2016 (20)
1) The document is an annual report from AT&S, a leading manufacturer of printed circuit boards and IC substrates, reporting on the 2019/20 fiscal year.
2) It highlights key figures such as revenue declining 2.7% year-over-year to €1 billion, EBITDA falling 22.2% to €195 million, and profit for the period declining 75.9% to €21.5 million.
3) AT&S discusses major trends in the industry like 5G mobile networks, increasing data volumes, and growing markets for IC substrates that the company is positioned to capture through expansion.
- AT&S is a leading provider of printed circuit boards and IC substrates for applications such as mobile devices, automotive, industrial, medical, and more.
- In fiscal year 2019/20, AT&S achieved over €1 billion in revenue but saw declines in EBITDA and earnings per share due to lower sales volume, unfavorable product mix, and impacts of COVID-19.
- However, AT&S remained profitable with an EBITDA margin within its guided range of 18-20% and continues investing in expanding IC substrate capacities for future growth opportunities in high-performance computing.
AT&S Investor and Analyst Presentation September 2019 AT&S_IR
This document provides an investor and analyst presentation for AT&S, a leading provider of printed circuit boards and IC substrates. The summary is:
1) AT&S provides an overview of the company, its global footprint, investment highlights including its technology leadership position and financial results for Q1 2019/20.
2) Revenue was flat for Q1 2019/20 at €222.7 million due to diversified products compensating for market fluctuations, though EBITDA declined due to seasonal effects and a challenging market environment.
3) The presentation discusses the company's strategic focus on high-end technologies and driving future trends through innovation and expansion to achieve medium-term targets.
- Revenue for AT&S was stable at €222.7 million for the quarter, though earnings declined as expected due to market factors and investments in strategic expansion. EBITDA was €34.9 million, down 32.9%.
- Demand was weaker in the Mobile Devices, Automotive and Industrial segments, leading to underutilization of production capacity. The IC Substrates and Medical & Healthcare segments saw sales increases.
- AT&S initiated an investment project of up to €1 billion to significantly increase IC substrate capacity, with production starting in 2021. This is expected to double revenue to €2 billion in the next 5 years and improve margins long-term.
This document contains the consolidated financial statements of AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) for the fiscal year ending March 31, 2019. It includes the consolidated statement of profit or loss, consolidated statement of financial position, notes to the consolidated financial statements, and independent auditor's reports on the consolidated and standalone financial statements. AT&S manufactures printed circuit boards and provides related services for industries including mobile devices, automotive, industrial, medical, and others.
AT&S is a leading manufacturer of high-end printed circuit boards and IC substrates. In the past fiscal year, AT&S achieved over €1 billion in revenue with approximately 9,800 employees worldwide. The company focuses on providing solutions for mobile devices, automotive, industrial, medical and other applications. Looking ahead, AT&S expects growth to continue driven by digital megatrends and increasing demand for its solutions to support areas like mobility, autonomous driving, industrial automation and more.
- Revenue for AT&S grew slightly to €790.1 million in the first three quarters of 2018/19, while EBITDA increased significantly by 15.9% to €220.5 million.
- Improved profitability was driven by efficiency gains, the absence of startup costs, and a better product mix, despite weaker demand in mobile devices and automotive.
- Earnings per share jumped 83.2% to €2.21, reflecting higher profits and stable number of shares outstanding.
- AT&S, a manufacturer of high-end printed circuit boards and IC substrates, increased revenue and profits in the first half of the 2018/19 fiscal year compared to the same period last year. Revenue grew 6.4% to €516.9 million driven by additional capacity from new Chinese plants and strong demand for IC substrates.
- EBITDA improved 32.5% to €138.3 million due to the positive contributions from the Chinese plants, and the EBITDA margin increased to 26.8%. Net profit more than tripled to €55.4 million.
- The company upgraded its full-year guidance, now expecting 6-8% revenue growth and an EBITDA margin of
The document is the consolidated financial statements of AT & S Austria Technologie & Systemtechnik Aktiengesellschaft as of March 31, 2018. It includes the consolidated statement of profit or loss, consolidated statement of financial position, notes on accounting policies, and other financial details. The consolidated financial statements were prepared in accordance with International Financial Reporting Standards and interpretations as adopted by the European Union.
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AT&S Investor and Analyst Presentation December 2016
1. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben
Tel +43 (0) 3842 200-0 | E-Mail info@ats.net
www.ats.net
AT&S
First choice for advanced applications
Investor and Analyst Presentation
December 2016
3. High-end interconnection
solutions
for
Mobile Devices, Automotive,
Industrial, Medical Applications
One of the
most profitable players
in the industry
Continuously
outperforming
market growth
€ 762.9m
revenue in FY 2015/16;
5.2% organic growth
# 1
manufacturer in Europe
# 3
in high-end technology
worldwide
9,315
employees
Cost-competitive production
footprint with
6
plants in Europe and Asia
AT&S – a world leading high-tech PCB company
2
4. Outstanding
process know-how
and process
efficiency
Our competitive advantages
Cost advantage as
first high-end IC
substrates
manufacturer in
China
Strategic focus on
high-end
technologies and
applications
Technology
leverage between
customer segments
Quality
3
5. What guides us
Vision First choice for advanced applications
Targets
Strengthening the technology leadership
Long-term profitable growth with the target to be one of the most profitable
players in the industry
Generation of shareholder value
Strategy
Focus on high-end technologies and applications with above average
growth potential and long-term profitability
Focus on highest service-level and customer orientation
Focus on operational excellence
Focus on cash flow generation
4
6. High-end PCBs for high-end applications
Revenue Share*Segment
Selected Market
Leaders**
GoPro
Sony
LG
Canon
Qualcomm
Blackberry
Lenovo
Huawei
Samsung
Xiaomi
ZTE
Intel
Apple
Selected Applications
Osram
Hella
Siemens
General Electric
Continental
Harman
EADS
Mobile Devices &
Substrates
Automotive,
Industrial,
Medical
Consumer
Electronic
Smartphones
Wearables
Tablets,
Ultrabooks,
2 in 1
Automotive:
Navigation,
Advanced Driver
Assistance Systems,
Infotainment...
Industrial:
Machine-2-Machine
communication,
industry computer...
Medical:
MRT, hearing aids,
pacemaker, patient
monitoring...
* Based on external revenue
** Does not reflect actual customer base
58%
42%
5
7. 514
542
590
667
763
387 387
103 102 127
168 168
93
5242 31 54
90 77 51
(6)
2011/12 2012/13 2013/14 2014/15 2015/16 H1
2015/16
H1
2016/17
Revenue EBITDA EBIT
AT&S – Key Facts
Strong track record1 Balanced portfolio/Global customer base2
7%
Split revenue: Business Unit, H1 2016/17
Split revenue: Customer Region, H1 2016/17
based on sold to party
+5% +9% +13% +14%
* Based on ramp-up effects for new plants in China
Revenue growth
€ in millions
*
6
25%
6%
15%
54%
Germany/Austria
Other European
countries
Asia
Americas
58%42%
Mobile Devices &
Substrates
Automotive,
Industrial, Medical
8. Global footprint ensures proximity to supply chain
& cost efficiency
European production facilities: high mix/low volume
Asian production facilities: high volume/low mix
Sales network spanning three continents
9,315 employees*
Plant Shanghai, China
Staff: 4,539*
Plant Ansan, Korea
Staff: 291*
Plant Nanjangud, India
Staff: 1,122*
Plant Chongqing, China
In ramp phase
Staff: 1,929*
Plant Leoben, Austria
Headquarters
Staff: 983*
Plant Fehring, Austria
Staff: 373*
AT&S sales officesAT&S plants
* Average, FTE, H1 2016/17; 78 employees in other locations
7
9. PCB market – Overview
15.654 17.146
16.203
17.543
7.676
8.084
3.638
4.3323.645
4.417
2.288
2.520
2016 2020
Computing Communication
Consumer Automotive
Industrial/Medical Military/Aerospace
4.9%
4.5%
1.3%
2.3%
2.0%
Source: Prismark, Feb. 2016
Moderate growth of 2.4% forecast for the
total PCB market until 2020.
49.104
54.042CAAGR 2016-
2020: 2.4%
2.4%
USD in billions
8
AT&S outperformed a flat market in the past 5 years and is set to
continue to do so also in the future.
100.5 101.3 103.7 99.8
105.4
114.8
129.8
148.4
2011* 2012 2013 2014 2015
Index (2011 = 100)*
PCB & substrates market AT&S revenue
* Basis 2011:
PCB & substrates market: USD 55.4bn
AT&S revenue: € 514m
AT&S outperformed the market by scaling high-end any-layer technology and
by leveraging HDI technology to the Computer-, Consumer-, Automotive-,
Industrial and Medical market.
13. 12
Driving Future Trends: Internet of Things (IoT) Applications
Everything is going to be smart and/or connected
Healthcare & Fitness
Smart Watches and Glasses
Wearable Electronics
Smart Mobility Autonomous Driving
Car2X Communication
Smart City Smart Lighting
Smart Buildings Home/Building Automatization
Smart Home Devices
Smart Production/Industry 4.0 Automatization/Robotics
Machine-to-Machine Communication
Smart Healthcare Connected Patient Monitoring Systems
Connected Consumer Healthcare Devices
Smart Energy Smart Metering
Building Blocks of IoT Modules: Sensing, Connectivity, Energy Storage/Harvesting, Power Management
30-50 billion of „Things“ will be connected in 2020
Wearable electronic devices offer revenue opportunities of USD 61.7bn beyond the smartphone market
in 2020
Source: Gartner Inc. 2016
14. The world is changing – miniaturization &
modularization as main drivers
2003/04 2013 2017 202x
?
Type Mobile Phone Smartphone Smartphone All in One
PCB 125x55mm 85x20mm 80x20mm 25x25mm ?
FF 1 0.25 0.23 0.06 ?
L/S 100/100µm 40/40µm 30/30µm 10/10µm
Techn. 1-n-1 Any-layer mSAP – Any-layer FO/SAP/mSAP
13
15. From vision to strategy
14
Targets/Key performance
Indicators
Strategy
Strengthening technology leadership
• Leading player in the high-end core
business
• Medium-term: leading player in new
business areas
• Innovation Revenue Rate: > 20%
Continuous innovation and focus on high-end
technologies and applications
Focus on innovative solutions
Long term profitable growth/to be
one of the most profitable players in
the industry
• Medium-term EBITDA margin target of
18-20%
• Medium-term revenue target of ~ € 1bn
Focus on technologies and applications with above-
average growth potential and long-term profitability
Focus on highest service-level and customer orientation
Focus on operational excellence
Focus on cash flow generation
Generation of shareholder value
• Medium term ROCE of 12%
Sustainable development focusing on ROCE
Stable dividend policy
Vision:
“First choice
for advanced
applications”
The best employees and
executives
• Talent Programs
• Trainings
• Leadership Excellence Program
Sustainable management
To be the benchmark of the industry
by reduction of:
• 5% CO2 emissions p.a.
• 3% freshwater consumption p.a.
Capital Excellence
• Equity ratio: > 40%
• Financing costs of < 2% (in a
corresponding interest
environment)
• Payback period of < 3 years
16. 19.6% of AT&S‘ total revenue in 2015/16 is generated by products with new, innovative
technologies introduced to the market within the last three years (Innovation Revenue
Rate). IRR decreased due to a generation of mature products.
162 patent families, resulting in 212 patents.
R&D expenses: € 95.5m in the financial year 2015/16.
R&D quota (i.e. relation to revenue): 12.5% (vs. 8.7% in the previous year). Adjusted for
project IC substrates: 4.5%.
32.9
24.7
31.8
57.9
95.5
2011/12 2012/13 2013/14 2014/15 2015/16
15.0
19.2
26.5
29.2
19.6
2011/12 2012/13 2013/14 2014/15 2015/16
101
124
153
174
212
2011/12 2012/13 2013/14 2014/15 2015/16
IRR (Innovation Revenue Rate)
€ in millions in % Quantity
PatentsR&D expenses
Research and development as the key for
technological leadership
15
17. „New interconnection solutions“
> supporting miniaturization and
modularization
„High-end Toolbox“
New and existing
Application Areas
New and existing
customers
Semiconductors
Packaging
companies (OSATs)
Original Electronic
Manufacturers
(OEMs)
Tier 1 suppliers
Future positioning as leading high-end
interconnection solutions provider
Mobile
Devices
Automotive
Industrial
Medical
INTERNET of
THINGS
NEW
TECHNOLOGIES
IC substrates
Advanced Packaging
Substrate-like PCBs
EXISTING
TECHNOLOGIES
Multilayer PCBs
HDI any-layer PCBs
Embedding
Flexible PCBs
CORE BUSINESS
Multilayer PCBs,
HDI any-layer PCBS,
Embedding,
Flexible PCBs
e-IC substrate
Advanced
Packaging/SLP
(SiB)
Advanced
Packaging/(SiP)
e-Interposer
16
„More comprehensive
positioning in the value chain“
18. 17
AT&S’ advanced technology solutions
General Description & Technology Application Areas Customer Base
High-end
(HDI) PCBs
PCBs are the interconnection platform for electric, electronic &
mechanical components (such as resistors, capacitors, ICs,
connectors, etc.)
Density: Line/Space > 35 micron
Computer, Consumer,
Communication, Automotive
Industrial, Medical
OEMs
Tier 1
Tier 2
Substrate-like
PCBs
Substrate-like PCBs are the next evolution of high-end HDI PCBs
with higher density: Line/Space < 30 micron
Mobile Applications like
Wearables
OEMs
Tier 1
Tier 2
19. 18
General Description & Technology Application Areas Customer Base
IC substrates
IC substrates serve as interconnection platform with
higher density (Line/Space < 15 micron) between
semiconductors (Chips) & PCBs
High-end processors for
Computer, Communication,
Automotive, Industrial
OEMs
Semiconductor
Industry
Embedded
Component
Packaging
(ECP®) Embedded Component Packaging allows to embed
active/passive components (e.g. wafer level dies) within the
layers of a PCB – contributes to miniaturization
Power Electronics, e.g. for
Automotive, Industrial
OEMs
Semiconductor
Industry
AT&S’ advanced technology solutions
20. Growth Project Chongqing
IC substrate project
Investment* Phase 1: ~ € 280m
Investment* as of 30/09/2016: € 238m
Substrate-like PCB project
Investment* Phase 1: ~ € 200m
Investment* as of 30/09/2016: € 155m
19
Total investment: € 480m* in first phase (until mid 2017)
Depreciation & Amortization: average of 10 years; roughly additional € 40m in FY 2016/17
* CAPEX for tangible fixed assets
21. Q4 2015/16
(January – March 2016)
Challenge: Ramp of three production lines
within 12 months
Ramp: PRODUCTION LINE 1 – IC SUBSTRATES
Q1 2016/17
(April – June 2016)
Q2 2016/17
(July – September 2016)
Q3 2016/17
(October – December 2016)
Q4 2016/17
(January – March 2017)
Ramp: PRODUCTION LINE 1 – SUBSTRATE-LIKE PCBs
Ramp: PRODUCTION LINE 2 – IC SUBSTRATES
FY 2015/16 FY 2016/17
20
23. Sound top-line growth, above industry margins
and increasing cash conversion
87
72
105
144
137
56
(13)
Revenue
YoY growth
Operating Cash Flow
YoY development
EBITDA and
EBITDA-margin
Stable revenue in H1 2016/17;
first revenue from Chongqing
plants balanced expected Q1
seasonality effects.
EBITDA impacted by negative effects
from ramp-up of new plants in Chongqing.
EBITDA margin adjusted for Chongqing
effects almost on high level of H1 2015/16.
Decrease is based on lower EBIT
and higher depreciation.
€ in millions
514
542
590
667
763
387 387
€ in millions
103 102
127
168 168
93
52
89*
€ in millions; %
* Adjusted for Chongqing effects
(0.2%)
20.1% 18.9% 21.6% 25.1% 22.0% 24.1% 13.5%
25.8%* 23.7%* 24.3%* 23.8%*
22
24. Good demand in Q2
Chongqing revenue contribution almost compensated stronger seasonality in Q1 and negative FX effect
Effects from Chongqing and price/product mix impacted profitability
Business Development – Mobile Devices &
Substrates
68.0
88.7
120.9
104.5
115.9 112.2
123.4
101.0 97.7
126.6
Q1 14/15 Q2 14/15 Q3 14/15 Q4 14/15 Q1 15/16 Q2 15/16 Q3 15/16 Q4 15/16 Q1 16/17 Q2 16/17
€ in millions (unless
otherwise indicated)
H1 2015/16 H1 2016/17 Change in %
Revenue 272.8 269.7 (1.1%)
Revenue with external
customers 228.1 224.3 (1.7%)
EBITDA 67.6 24.5 (63.8%)
EBITDA margin 24.8% 9.1% -
EBITDA adjusted* 68.8 58.5 (14.9%)
EBITDA margin adjusted* 25.3% 22.7% -
€ in millions; * Adjusted for Chongqing effects; ** Revenue with external customers
Revenue per quarter**
23
25. 72.6 71.7 65.9 72.6 77.8 79.5 72.7 76.6 80.4 79.9
Q1 14/15 Q2 14/15 Q3 14/15 Q4 14/15 Q1 15/16 Q2 15/16 Q3 15/16 Q4 15/16 Q1 16/17 Q2 16/17
Automotive: continuous high demand for HDI PCBs (e.g. driver assistance systems and safety features)
Medical: strong growth based on new technologies and functionalities
Industrial: on same high level as last year
On EBITDA level, positive impact from release of a provision for unused production space
Business Development – Automotive, Industrial,
Medical
€ in millions (unless
otherwise indicated)
H1 2015/16 H1 2016/17 Change in %
Revenue 169.5 174.4 2.9%
Revenue with external
customers 157.3 160.3 1.9%
EBITDA 19.2 23.0 19.9%
EBITDA margin 11.3% 13.2% -
24
Revenue per quarter*
€ in millions; * Revenue with external customers
26. Net CAPEX & Staff
Net CAPEX
CAPEX spending of € 142.5m in H1 2016/17
includes investments in Chongqing project
(whereof € 105.2m in H1) and technology
investments in existing locations.
STAFF*
The increased headcount is primarily based on
Chongqing.
40.3
57.9
78.7 77.4
66.3
76.2
Q1 2015/16 Q2 2015/16 Q3 2015/16 Q4 2015/16 Q1 2016/17 Q2 2016/17
7,341 7,403 7,399 7,379 7,339 7,386
1,049 1,152 1,289 1,380 1,826 1,929
8,390 8,555 8,688 8,759
9,165 9,315
Q1 2015/16 Q2 2015/16 Q3 2015/16 Q4 2015/16 Q1 2016/17 Q2 2016/17
Core business Employees Chongqing
25
€ in millions * Incl. leased personnel, FTE, average for the period
27. € in thousands (unless otherwise
stated)
H1 2015/16 H1 2016/17
Change
YoY
STATEMENT OF PROFIT OR LOSS
Revenue 387,129 386,510 (0.2%)
produced in Asia 80% 81% 1pp
produced in Europe 20% 19% (1pp)
EBITDA 93,230 52,115 (44.1%)
EBITDA margin 24.1% 13.5% (10.6pp)
EBITDA adjusted 93,681 89,380 (4.6%)
EBITDA adjusted margin 24.3% 23.8% (0.5pp)
EBIT 50,742 (5,818) (>100%)
EBIT margin 13.1% (1.5%) (14.6pp)
EBIT adjusted 55,403 51,688 (6.7%)
EBIT adjusted margin 14.4% 13.8% (0.6pp)
Finance costs – net 25 (10,046) (>100%)
Income taxes (8,630) 1,025 >100%
Profit/loss for the period 42,137 (14,839) (>100%)
Earnings per share € 1.08 (€ 0.38) (>100%)
Financials H1 2016/17
26
Negative impact of € 37.3m
from Project Chongqing.
Slight reduction vs. prior
year due to price/product
mix – could not be
compensated by cost
savings.
Includes negative FX effects of
€ 3.7m. Last year includes
positive FX impact of € 3.4m.
28. Financials H1 2016/17
Reduction due to net loss of
€ 14.8m, dividend payment of
€ 14.0m and FX.
27
Increase due to high CAPEX
spending.
€ in thousands (unless otherwise stated)
31 Mar 2016 30 Sep 2016 Change
STATEMENT OF FINANCIAL POSITION
Non-current assets 866,338 953,948 10.1%
Current assets 478,312 507,842 6.2%
Equity 568,936 531,928 (6.5%)
Non-current liabilities 421,407 562,883 33.6%
Current liabilities 354,307 366,979 3.6%
Total assets 1,344,650 1,461,790 8.7%
Net debt 263,192 439,157 66.9%
Net gearing 46.3% 82.6% 36.3pp
Net working capital 88,427 124,306 40.6%
Net working capital per revenue 11.6% 16.1% 4.5pp
Equity ratio 42.3% 36.4% (5.9pp)
29. 273
299
372
405
523
681
31
82
261 274
260 242243 217
111
131
263
439
2011/12 2012/13 2013/14 2014/15 2015/16 H1 2016/17
Gross debt Financial assets and cash Net debt
2.3
2.1
0.9
0.8
1.6
2011/12 2012/13 2013/14 2014/15 2015/16
Expected multiple in temporary peak of
Chongqing investments: ~ 3.5x
Net debt/EBITDA
Financial debt, financial assets and cash, net debt
Based on € 242m financial assets and cash:
repayment of the bond in November 2016,
financing the start-up phase and
outstanding payments for investments of
the first phase of Chongqing are secured.
€ in millions
28
30. Overview Debt Portfolio Duration
Average debt portfolio duration: 3.4 years (2015/16: 3.9 years)
Average financing costs: 2.6% (as of 30/09/2016)
€ 152m of credit lines not utilized (as of 30/09/2016)
Currency mix of EUR and USD to support natural hedging strategy
29
Maturity
€ in millions* < 1 Year 1-5 Years > 5 Years Total
Bond 2011-2016 78.8 - - 78.8
Promissory note loans 2014 1.4 61.1 5.0 67.5
Promissory note loans 2015 2.4 154.2 66.3 222.9
Promissory note loans 2016 0.8 49.9 100.0 150.7
Subsidized loans 43.9 35.4 - 79.3
Bank Borrowings and others 50.5 31.6 - 82.1
Total 30/09/2016 177.8 332.2 171.3 681.3
Total 31/03/2016 161.4 285.3 76.3 523.0
* Including accrued interest and placement costs
81.6%
15.3%
3.1%
Currency mix of debt portfolio
EUR USD RMB
31. € in thousands
H1 2015/16 H1 2016/17
Change
YoY
STATEMENT OF CASH FLOWS
Operating result (EBIT) 50,742 (5,818) (>100%)
Paid/received interests (2,379) (3,066) (28.8%)
Paid taxes (4,346) (9,219) (>100%)
Non cash bearing of profit or loss 41,375 55,021 33.0%
Cash flow from operating activities before
changes in working capital
85,392 36,918 (56.8%)
Changes in working capital (29,757) (49,955) (67.9%)
Cash flow from operating activities 55,635 (13,037) (>100%)
Cash flow from investing activities (97,485) (155,072) (59.1%)
Cash flow from financing activities (9,879) 138,838 >100%
Change in cash and cash equivalents (51,729) (29,271) 43.4%
Financials H1 2016/17
30
Increase includes payout of
promissory note loans of
€ 150m.
Net working capital increase
due to seasonality.
32. Net Working Capital Management
92
103
92 95
88
124
18.0%
19.0%
15.6%
14.3%
11.6%
16.1%
2011/12 2012/13 2013/14 2014/15 2015/16 H1 2016/17
Net Working Capital development Net Working Capital as a percentage of revenues
€ in millions; % of revenue
Net Working Capital development
31
33. AT&S – Stock Profile
Listing: Vienna Stock Exchange,
Prime Standard
Indices: ATX Prime, WBI
Thomson Reuters (A): ATSV.VI
Bloomberg (A): ATS:AV
Results for the first three quarters 2016/17 31 January 2017
Annual results 2016/17 09 May 2017
Record Date Annual General Meeting 26 June 2017
23rd Annual General Meeting 06 July 2017
Ex-Dividend Day 25 July 2017
Record Date Dividend 26 July 2017
Dividend Payment Day 27 July 2017
32
Financial Calendar Shareholder structure
# of shares outstanding 38.85m
Average daily volume: ~ 78,100 shares*
Performance YTD: -31.43%*
Dividend 2015/16: EUR 0.36/per share
Dividend yield: 2.8%
* 01/01/2016 – 30/11/2016
34. 33
Outlook FY 2016/17
Focus on:
- Chongqing plant 1 (IC substrates): capacity utilization of first production line of IC substrates and
ramp of the second production line
- Chongqing plant 2 (Substrate-like PCBs): ramp of the first production line
- Partial adjustment of capacities for the new technology in the Shanghai plant for 2017
- Cost and price management
AT&S expects stronger seasonality in Q4 and continuous low visibility
Based on a macroeconomic stable environment, FX relation of USD-EUR on a similar level than FY
2015/16 and a stable demand in the core business, management expects revenue growth of 4-6%.
EBITDA margin should be on a level of 15-16%, based primary on costs related to the ramp of
Chongqing. EBITDA margin in core business should be on a similar level than in FY 2015/16.
Higher depreciation for the project Chongqing of additional ~ € 40m in FY 2016/17 will have a
clear impact on EBIT level.
36. AT&S Product Portfolio – I
ECP:
Embedded Component Packaging
IC substrates Substrate-like printed circuit boards
Embedded Component Packaging allows to embed
active/passive components (e.g. wafer level dies)
within the layers of a PCB – contributes to
miniaturization.
IC substrates serve as interconnection platform with
higher density (Line/Space < 15 micron) between
semiconductors (Chips) & PCBs .
Substrate-like PCBs are the next evolution of high-
end HDI PCBs with higher density: Line/Space < 30
micron.
Production site
Leoben Chongqing Chongqing, Shanghai
Applications
Devices such as smartphones, tablets, digital
cameras and hearing aids
High-end processors for
Computer, Communication, Automotive, Industrial
Mobile applications like wearables
35
37. AT&S Product Portfolio – II
HDI
any-layer printed circuit
boards
HDI microvia printed
circuit boards – high
density interconnect
Multilayer printed
circuit boards
Double-sided printed
circuit boards
IMS printed circuit
boards – insulated
metal substrate
Further technological
enhancement to HDI
microvia: All electrical
connections in HDI any-layer
boards consist of laser-drilled
microvias. Advantage: further
miniaturization, and higher
performance and reliability.
AT&S produces HDI any-layer
in 4 to 12 layers.
HDI: high density
interconnect, meaning
laser-drilled connections
(microvias). HDI is first step
towards miniaturization.
AT&S can produce 4-layer
laser PCBs up to 6-n-6
HDI multi layer PCBs.
Found in almost every area of
industrial electronics. AT&S
produces printed circuit
boards with 4 to 28 layers, in
quantities from individual
prototypes to small batches
and mass production.
Used in all areas of
electronics. AT&S focuses on
double-sided printed circuit
boards with thicknesses in
the range of 0.1-3.2mm.
IMS: insulated metal
substrate. Primary function:
heat dissipation for use
mainly with LEDs and power
components.
Production site
Shanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring
Applications
Smartphones, Tablets,
Notebooks
Mobile phones and nearly all
electronic applications
including automotive
(navigation, infotainment and
driver assistance systems)
Used in all electronic
applications including touch
panels, and in products
ranging from aircraft to
motorcycles, from storage
power plants to solar arrays
Primarily industrial and
automotive applications
Lighting industry
36
38. AT&S Product Portfolio – III
Flexible printed
circuit boards
Semi-flexible printed
circuit boards
Rigid-flex printed
circuit boards
Flexible printed circuit
boards on aluminum
AT&S patented
technologies
Used to replace wiring and
connectors, allowing for
connections and geometries
that are not possible with
rigid printed circuit boards.
More limited bend radius
than flexible printed circuit
boards. The use of a
standard thin laminate
makes them a cost-effective
alternative.
Combine the
advantages of flexible
and rigid printed circuit
boards, yielding benefits
for signal transmission,
size and stability.
Used when installing LEDs
in car headlights, for
example, where the
printed circuit board is
bonded to an aluminum
heat sink to which the
LEDs are then attached.
Production site
Ansan, Fehring Fehring Leoben, Ansan Ansan
Applications
Nearly all areas of
electronics, including
measuring devices and
medical applications
Automotive applications Industrial electronics,
such as production
machines and industrial
robots
Lighting, automotive,
building lighting
ECP: Embedded
Component Packaging
ECP® is a patented AT&S packaging
technology used to embed
active and passive electronic
components in the inner layers
of a printed circuit board. ECP®
technology is used in
ever smaller, more efficient and
more powerful devices, such
as smartphones, tablets, digital
cameras and hearing aids.
Production site: Leoben
2.5D® Technology
Platform
Combines mechanical and
electronic miniaturization, and
enables partial reduction of the
thickness of a circuit board.
Advantage: populated assemblies
have a thinner profile.
Can be also used to
make cavities in the printed circuit
board, e.g. for acoustic
channels. Major application
for this technology is the 2.5D®
rigid-flex printed circuit board,
a lower cost alternative for flex-to
install applications.
Production sites:
Leoben, Shanghai
37
39. Management
Andreas Gerstenmayer, CEO
Born 1965; joined AT&S as CEO in 2010
Previous positions include:
18 years of work experience at Siemens, including Managing Director
with Siemens Transportation Systems GmbH Austria and CEO of the
Drive Technology business unit in Graz from 2003 to 2008
Partner at FOCUSON Business Consulting GmbH after leaving Siemens
Education and other positions:
Member of the Research Council of Styria
Degree in Production Engineering from Rosenheim University of
Applied Sciences
Heinz Moitzi, COO
Born 1956; COO since 2005; with AT&S since 1981*
Previous positions include:
Various management positions within AT&S
Measurement engineer with Leoben University of Mining and
Metallurgy
Education:
Degree from Higher Technical College of Electrical Engineering
Karl M. Asamer, CFO Born 1970; joined AT&S as CFO in 2014
Previous positions include:
Managing Director of GEKA Group in Germany
Managing Director of Sell GmbH in Germany
Education:
Degree: Doctorate in business administration in Linz, Austria
* He was already with the founding company of AT&S
Responsibilities:
Sales and Marketing
Human Resources
Investor Relations, Public Relations and
Internal Communications
Business Development & Strategy
Compliance
CSR & Sustainability
Responsibilities:
Finance and Accounting, Treasury
Controlling
Legal Affairs, Risk Management and
Internal Audit
IT and Organization
Procurement
Responsibilities:
Research & Development (R&D)
Operations
Quality Management
Business Process Excellence
Environment
Safety
38
40. Milestones in the Group’s history
1987
Founding of the Group, emerging
from several companies owned by
the Austrian State Owned
Industries.
1994
Privatization and acquisition
by Messrs. Androsch,
Dörflinger, Zoidl.
1999
Initial public offering on Frankfurt Stock Exchange
(„Neuer Markt“). Acquisition of Indal Electronics
Ltd., largest Indian printed circuit board plant
(Nanjangud) – today, AT&S India Private Limited.
2002
Start of production at new Shanghai
facility – one of the leading HDI
production sites in the world.
2010
Start of production
at plant II in India.
2009
New production direction: Austrian
plants produce for high-value niches
in the automotive and industrial
segment; Shanghai focuses on the
high-end mobile devices segment.
2008
AT&S changes
to Vienna Stock
Exchange.
2006
Acquisition of Korean
flexible printed circuit
board manufacturer,
Tofic Co. Ltd. – today,
AT&S Korea Co., Ltd.
2015
AT&S again achieves record high sales and earnings for
financial year 2014/15 and decides to increase the investment
program in Chongqing from € 350m to € 480m.
2011
Construction starts on new
plant in Chongqing, China.
Capacity increase in
Shanghai by 30%.
2013
AT&S enters the IC substrates
market in cooperation with a
leading manufacturer of
semiconductors.
2016
AT&S starts the serial production
of IC substrates at the plant in
Chongqing.
39
41. Five core dimensions of sustainability within AT&S
Energy and
carbon footprint
Water
AT&S – a learning
organizationResources
Thinking ahead –
shaping the future
CSR gains importance in long term success
Improving efficiency
Motivated and qualified staff
CSR as a key to sustainable business success
The importance of sustainability is rising within:
Authorities
(basis for securing operation licenses)
Customers
(relevant for placing orders)
40
42. AT&S saves CO2 and Water…
Sustainability – Figures and Fields of Action
AT&S aims to minimize its
environmental footprint by
reducing the CO2 emissions
per m2 PCB attributable to
production processes by 5%
a year.
AT&S aims to reduce
the Group‘s annual
fresh water
consumption per m2
PCB by 3%.
765.2
834.7
783.9
734.0
718.6
2011/12 2012/13 2013/14 2014/15 2015/16
Freshwater consumption**
** in liters per sqm weighted PCB
1)
47.4
51.0
50.7
49.0
50.7
2011/12 2012/13 2013/14 2014/15 2015/16
CO2-Footprint*
1)
* in kg per sqm weighted PCB
1) Since 2012/13 calculation according to EICC standards;
before that AT&S internal calculation
41
44. Disclaimer
This presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria
(“AT&S”), and the contents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein,
and no reliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are
expressly cautioned not to place undue reliance on this information.
This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s
expectations and assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual
developments, results, performance or events may vary significantly from the statements contained explicitly or implicitly herein.
Neither AT&S, nor any affiliated company, or any of their directors, officers, employees, advisors or agents accept any responsibility or liability (for negligence or
otherwise) for any loss whatsoever out of the use of or otherwise in connection with this presentation. AT&S undertakes no obligation to update or revise any forward-
looking statements, whether as a result of changed assumptions or expectations, new information or future events.
This presentation does not constitute a recommendation, an offer or invitation, or solicitation of an offer, to subscribe for or purchase any securities, and neither this
presentation nor anything contained herein shall form the basis of any contract or commitment whatsoever. This presentation does not constitute any financial analysis
or financial research and may not be construed to be or form part of a prospectus. This presentation is not directed at, or intended for distribution to or use by, any
person or entity that is a citizen or resident or located in any locality, state, country or other jurisdiction where such distribution, publication, availability or use would be
contrary to law or regulation or which would require any registration or licensing within such jurisdiction.
43