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EXASCALE
UPDATE
Exascale Race/Technologies
Projected Exascale Dates and Suppliers
U.S.
Sustained ES*: 2022-2023
Peak ES: 2021
Vendors: U.S.
Processors: U.S. (some ARM?)
Initiatives: NSCI/ECP
Cost: $600M per system, plus
heavy R&D investments
China
Sustained ES*: 2021-2022
Peak ES: 2020
Vendors: Chinese (multiple sites)
Processors: Chinese (plus U.S.?)
13th 5-Year Plan
Cost: $350-$500M per system, plus
heavy R&D
EU
PEAK ES: 2023-2024
Pre-ES: 2021-2022
Vendors: Likely European
Processors: Likely ARM or RISC-V
Initiatives: EuroHPC
Cost: Over $350M per system, plus
heavy R&D investments
Japan
Sustained ES*: ~2022
Peak ES: Likely as a AI/ML/DL system
Vendors: Japanese
Processors: Japanese
Cost: $800M-$1B, this includes both 1
system and the R&D costs
They will also do many smaller size
systems
* 1 exaflops on a 64-bit real application
Exascale Race/Technologies
Projected Exascale Investment Levels
(In Addition to System Purchases)
U.S.
$1 to $2 billion a year in R&D
Investments by both
governments & vendors
Plans are to purchases
multiple exascale systems
each year
China
Over $1billion a year in R&D
Investments by both
governments & vendors
Plans are to purchases multiple
exascale systems each year
Already investing in 3 pre-
exascale systems starting in
late 2018
EU
About 5-6 billion euros in total –
and growing
Investments in multiple exascale
and pre-exascale systems
Investments by country
governments and from the EU
Large EU CPU funding
Japan
Planned investment of over
$1billion* (over 5 years) for
both the R&D and purchase of
1 exascale system
To be followed by a number of
smaller systems ~$100M to
$150M each
Creating a new processor and a
new software environment
* Note that this includes both the system and R&D
Announced China Pre-Exascale Plans
Note: some of these could slip into 2019
Computer Name Sunway Exascale
Prototype TianHe-2A Sugon Prototype Tianhe-3
Overview Sunway Exascale
Prototype TianHe2 upgrade Sugon Exascale
Prototype
NUDT Exascale
Prototype
Prime Developer /
Industry Partner NRCPC NUDT/Inspur Sugon /AMD NUDT
Location
National
Supercomputing
Center in Jinan
National
Supercomputing
Center in Tianjin
TBD
National Super
Computer Tianjin
Center
Planned/Estimated
Delivery Date 2019 1H 2018, 1H 2019, 1H 3Q 2019
Planned/Estimated
Performance Pflops 2 100 5.12 100-300
Linpack/Peak
Performance Ratio 75% (est.) 60% 60-70% (est.) 60-70% (est.)
Linpack Performance 1.5 61.4 3.072-3.58 60-210
GF/Watt TBD 5.55 10.24 TBD
Linpack GF/Watt TBD 3.4 6.14-7.16 TBD
Source: Hyperion Research, 2018
Expected Chinese Exascale Plans
Computer Name Sugon Exascale Sunway 2020 NUDT 2020
Overview Sugon Exascale (if
selected)
Sunway Exascale (if
selected)
TianHe-3 Prototype
Follow-on
Prime Developer /
Industry Partner Sugon/AMD NRCPC NUDT
Location City of Qingdao, the largest port in
Shandong (?) TBD
Organization Sugon Sunway NUDT
Planned Delivery Date/
Estimated 2020, 4Q 2020-2021
Planned/Estimated
Performance Pflops 1046 1000 1000
Linpack/Peak
Performance Ratio 60-70% (est.) 60-70% (est.) 70-80% (est.)
Linpack Performance 627-732 600-700 700-800
GF/Watt 34.13 30 (est.) 20-30
Linpack GF/Watt 20.90 20-23 (est.) 23.3-32.0
Source: Hyperion Research, 2018
Summary of Chinese Exascale Efforts
Broad-scale development from a number of
suppliers:
§  NUDT
§  Sunway
§  Sugon
Noticeable – and continued absence of major
Chinese HPC suppliers:
§  Lenovo, and Inspur
Indigenous HW dependence deepens
A EU-wide Exascale Development Plan
In January 2018, the European Commission (EC)
announced a financial framework for investing €1
billion in European supercomputers over the next
two years
§  Under this framework, known as the EuroHPC Joint
Undertaking, the European Union (EU) would
contribute around €486 million
§  The remainder would be supplied by EU member
states and associated countries (and others)
This is a schedule adjustment: one to two years
later, from earlier plans, in order to develop the new
EU processor (and the system for it)
A EU-wide Exascale Development Plan
20 EU member states have already committed to
contributing to the EUR €1B funding, virtually assuring
the goal will be met
Sources of indigenous technology include the ETP4HPC
initiative and CEA-RIKEN collaboration around ARMv8
The EU has divided vendors into three classes for
purposes of awarding EU-funded projects:
§  European HPC vendors (based in Europe, doing R&D in Europe)
§  International European vendors (based outside of Europe, doing
R&D in Europe)
§  Non-European vendors (based outside of Europe, not doing R&D in
Europe)
Key Motivators For the EU Project
Provide European industry and in particular SME with a
better access to supercomputers to develop innovative
products
Indigenously produce world-class HPCs
Allow European scientists and industry to process their
data in the EU, reducing problems related to privacy,
data protection, commercial trade secrets, and
ownership of data in particular for sensitive
applications.
The Goalà Secure the EU's independent access to top HPC
technology
HPC is still expected to be a growth market
§ Growing recognition of HPC’s strategic value
§ HPDA, including ML/DL, cognitive and AI
§ HPC in the Cloud will lift the sector writ large
Vendor share positions shifted greatly in 2015,
2016 & 2017 and may continue to shift
§ E.g., HPE acquisition of SGI & Lenovo buying
IBM's x86 server business
The HPDA, AI, ML & DL markets will expand
opportunities for vendors
In Summary
Please email:
ejoseph@hyperionres.com
Or check out:
www.HyperionResearch.com
www.hpcuserforum.com
Questions?
Agenda: Wednesday Morning
78:15am Meeting Welcome and Announcements: Paul Muzio, Rupak
Biswas, Earl Joseph and Steve Conway
8:30am HPC Market Update and Exascale Programs Around the
World, Earl Joseph
8:45am Session: Leadership Computing Initiatives
• EuroHPC and the European HPC Strategy, Leonardo
Flores, European Commission
• Exascale Computing Project Update, Doug Kothe, Oak
Ridge National Laboratory
• NSF Activities Related to Leadership-Class
Computing, Irene Qualters
10:15am Break
10:45am Session: Leadership Computing Initiatives (continued)
• ExaAM: Transforming Additive Manufacturing through
Exascale Simulation, John Turner, Oak Ridge National
Laboratory
• The European Processor Initiative, Jean-Marc Denis
11:45am Dell EMC Vendor Update
12:00pm Networking Lunch
Please Return
By 1:00PM
Agenda: Wednesday Afternoon
1:00pm Session: Leadership Computing Initiatives (continued)
• NASA's Spaceborne Computer Program, Mark
Fernandez, HPE
• Suitability of Commercial Clouds for NASA's HPC
Applications, Bob Hood
2:00pm HPE Vendor Update
2:15pm Gaining a Competitive Edge with HPC Cloud Computing,
William Edsall, Dow Chemical Company
2:45pm Networking Break
3:15pm HPC Innovations: Short Presentations, Moderated by Earl
Joseph
• Altair, AMD, IBM, Penguin, Panasas, Rescale,
Tachyum, and Univa
4:30pm Object Detection in Mobile Urban Complex Environments,
Ruth Cheng, ERDC
5:00pm Networking Time
6:30pm Special Dinner Event at the Henry Ford Museum
Welcome To The
Second Day Of The
HPC User Forum
Meeting
Thank You To Our Sponsors!
•  Tuesday Dinner - Dell EMC & Intel
•  Wednesday Breakfast - HPE & NVIDIA
•  Wednesday Lunch – AMD
•  Wednesday PM Refreshments - Altair
•  Wednesday Dinner - HPE & Intel
•  Thursday Breakfast - Panasas
•  Thursday AM Refreshments - Rescale
•  Thursday Lunch - IBM
•  Thursday PM Refreshments - HPE & NVIDIA
Agenda: Thursday Morning
8:30am Session: Automated Driving Systems, Automotive Engineering,
Sensor Networks
• Bridging the Automated Vehicle Gap: Consumer Trust,
Technology and Liability, Kristin Kolodge, J.D. Power and
Associates and Tina Georgieva, Miller Canfield
• Computer Vision for Autonomous Vehicles, Xiaoming Liu
and Garrick Brazil, Michigan State University (45 minutes)
• Navigation/Localization Performance of Autonomous
Vehicles," Dorota Grejner-Brzezinska, Ohio State College of
Engineering
10:15am Scalable AI Solutions and HPC Systems: Examples from the
Wild, Bob Zak, Intel
10:30am Networking Break
11:00am Session: Automated Driving Systems, Automotive Engineering,
Sensor Networks (continued)
• AI for Autonomous Driving Will Revolutionize the
Transportation Industry, Bill Veenhuis and Norm Marks, NVIDIA
• Nek5000 Engine Simulation with Exascale Scaling, Muhsin
Ameen, Argonne National Laboratory
12:00pm Networking Lunch
Please Return
By 1:00PM
Agenda: Thursday Afternoon
1:00pm Session: Automated Driving Systems, Automotive Engineering,
Sensor Networks (continued)
• Use of HPC for AI Applications at Ford Motor Company,
Bryan Goodman
• Data Science meets CFD: FieldView Analytics in
Engineering, Steve Legensky, Intelligent Light
2:00pm Vendor Technology Update
2:15pm Market Trends in the HPC Arena, Dave Kepczynski, General
Electric
2:45pm Networking Break
3:15pm Manufacturing Science and Engineering at Argonne, Santanu
Chaudhuri
3:45pm Leadership Computing at Argonne National Laboratory, the
Future Home of A21, the First US Exascale System, David Martin
4:15pm Use of HPC to Drive Development of Advanced, More Fuel-
Efficient Engines, Ron Grover, General Motors
4:45pm Meeting Wrap-Up, Paul Muzio, Rupak Biswas, Earl Joseph and
Steve Conway
Important Dates For Your Calendar
HPC USER FORUM MEETINGS:
§  October 1 to 2, Stuttgart, Germany
§  April 22 to 24, 2019, Santa Fe, New
Mexico
§  September 9 to 11, 2019, Chicago
Illinois, Argonne National Laboratory
And Join us for the Hyperion SC18 Briefing:
•  Tuesday, November 13, The Adolphus Hotel
Thank You To Our Sponsors!
•  Tuesday Dinner - Dell EMC & Intel
•  Wednesday Breakfast - HPE & NVIDIA
•  Wednesday Lunch – AMD
•  Wednesday PM Refreshments - Altair
•  Wednesday Dinner - HPE & Intel
•  Thursday Breakfast - Panasas
•  Thursday AM Refreshments - Rescale
•  Thursday Lunch - IBM
•  Thursday PM Refreshments - HPE & NVIDIA
Thank You
For Attending The
HPC User Forum
Meeting!
Please email:
ejoseph@hyperionres.com
Or check out:
www.HyperionResearch.com
www.hpcuserforum.com
Questions?

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Exascale Update from Hyperion Research

  • 2. Exascale Race/Technologies Projected Exascale Dates and Suppliers U.S. Sustained ES*: 2022-2023 Peak ES: 2021 Vendors: U.S. Processors: U.S. (some ARM?) Initiatives: NSCI/ECP Cost: $600M per system, plus heavy R&D investments China Sustained ES*: 2021-2022 Peak ES: 2020 Vendors: Chinese (multiple sites) Processors: Chinese (plus U.S.?) 13th 5-Year Plan Cost: $350-$500M per system, plus heavy R&D EU PEAK ES: 2023-2024 Pre-ES: 2021-2022 Vendors: Likely European Processors: Likely ARM or RISC-V Initiatives: EuroHPC Cost: Over $350M per system, plus heavy R&D investments Japan Sustained ES*: ~2022 Peak ES: Likely as a AI/ML/DL system Vendors: Japanese Processors: Japanese Cost: $800M-$1B, this includes both 1 system and the R&D costs They will also do many smaller size systems * 1 exaflops on a 64-bit real application
  • 3. Exascale Race/Technologies Projected Exascale Investment Levels (In Addition to System Purchases) U.S. $1 to $2 billion a year in R&D Investments by both governments & vendors Plans are to purchases multiple exascale systems each year China Over $1billion a year in R&D Investments by both governments & vendors Plans are to purchases multiple exascale systems each year Already investing in 3 pre- exascale systems starting in late 2018 EU About 5-6 billion euros in total – and growing Investments in multiple exascale and pre-exascale systems Investments by country governments and from the EU Large EU CPU funding Japan Planned investment of over $1billion* (over 5 years) for both the R&D and purchase of 1 exascale system To be followed by a number of smaller systems ~$100M to $150M each Creating a new processor and a new software environment * Note that this includes both the system and R&D
  • 4. Announced China Pre-Exascale Plans Note: some of these could slip into 2019 Computer Name Sunway Exascale Prototype TianHe-2A Sugon Prototype Tianhe-3 Overview Sunway Exascale Prototype TianHe2 upgrade Sugon Exascale Prototype NUDT Exascale Prototype Prime Developer / Industry Partner NRCPC NUDT/Inspur Sugon /AMD NUDT Location National Supercomputing Center in Jinan National Supercomputing Center in Tianjin TBD National Super Computer Tianjin Center Planned/Estimated Delivery Date 2019 1H 2018, 1H 2019, 1H 3Q 2019 Planned/Estimated Performance Pflops 2 100 5.12 100-300 Linpack/Peak Performance Ratio 75% (est.) 60% 60-70% (est.) 60-70% (est.) Linpack Performance 1.5 61.4 3.072-3.58 60-210 GF/Watt TBD 5.55 10.24 TBD Linpack GF/Watt TBD 3.4 6.14-7.16 TBD Source: Hyperion Research, 2018
  • 5. Expected Chinese Exascale Plans Computer Name Sugon Exascale Sunway 2020 NUDT 2020 Overview Sugon Exascale (if selected) Sunway Exascale (if selected) TianHe-3 Prototype Follow-on Prime Developer / Industry Partner Sugon/AMD NRCPC NUDT Location City of Qingdao, the largest port in Shandong (?) TBD Organization Sugon Sunway NUDT Planned Delivery Date/ Estimated 2020, 4Q 2020-2021 Planned/Estimated Performance Pflops 1046 1000 1000 Linpack/Peak Performance Ratio 60-70% (est.) 60-70% (est.) 70-80% (est.) Linpack Performance 627-732 600-700 700-800 GF/Watt 34.13 30 (est.) 20-30 Linpack GF/Watt 20.90 20-23 (est.) 23.3-32.0 Source: Hyperion Research, 2018
  • 6. Summary of Chinese Exascale Efforts Broad-scale development from a number of suppliers: §  NUDT §  Sunway §  Sugon Noticeable – and continued absence of major Chinese HPC suppliers: §  Lenovo, and Inspur Indigenous HW dependence deepens
  • 7. A EU-wide Exascale Development Plan In January 2018, the European Commission (EC) announced a financial framework for investing €1 billion in European supercomputers over the next two years §  Under this framework, known as the EuroHPC Joint Undertaking, the European Union (EU) would contribute around €486 million §  The remainder would be supplied by EU member states and associated countries (and others) This is a schedule adjustment: one to two years later, from earlier plans, in order to develop the new EU processor (and the system for it)
  • 8. A EU-wide Exascale Development Plan 20 EU member states have already committed to contributing to the EUR €1B funding, virtually assuring the goal will be met Sources of indigenous technology include the ETP4HPC initiative and CEA-RIKEN collaboration around ARMv8 The EU has divided vendors into three classes for purposes of awarding EU-funded projects: §  European HPC vendors (based in Europe, doing R&D in Europe) §  International European vendors (based outside of Europe, doing R&D in Europe) §  Non-European vendors (based outside of Europe, not doing R&D in Europe)
  • 9. Key Motivators For the EU Project Provide European industry and in particular SME with a better access to supercomputers to develop innovative products Indigenously produce world-class HPCs Allow European scientists and industry to process their data in the EU, reducing problems related to privacy, data protection, commercial trade secrets, and ownership of data in particular for sensitive applications. The Goalà Secure the EU's independent access to top HPC technology
  • 10. HPC is still expected to be a growth market § Growing recognition of HPC’s strategic value § HPDA, including ML/DL, cognitive and AI § HPC in the Cloud will lift the sector writ large Vendor share positions shifted greatly in 2015, 2016 & 2017 and may continue to shift § E.g., HPE acquisition of SGI & Lenovo buying IBM's x86 server business The HPDA, AI, ML & DL markets will expand opportunities for vendors In Summary
  • 11. Please email: ejoseph@hyperionres.com Or check out: www.HyperionResearch.com www.hpcuserforum.com Questions?
  • 12. Agenda: Wednesday Morning 78:15am Meeting Welcome and Announcements: Paul Muzio, Rupak Biswas, Earl Joseph and Steve Conway 8:30am HPC Market Update and Exascale Programs Around the World, Earl Joseph 8:45am Session: Leadership Computing Initiatives • EuroHPC and the European HPC Strategy, Leonardo Flores, European Commission • Exascale Computing Project Update, Doug Kothe, Oak Ridge National Laboratory • NSF Activities Related to Leadership-Class Computing, Irene Qualters 10:15am Break 10:45am Session: Leadership Computing Initiatives (continued) • ExaAM: Transforming Additive Manufacturing through Exascale Simulation, John Turner, Oak Ridge National Laboratory • The European Processor Initiative, Jean-Marc Denis 11:45am Dell EMC Vendor Update 12:00pm Networking Lunch
  • 14. Agenda: Wednesday Afternoon 1:00pm Session: Leadership Computing Initiatives (continued) • NASA's Spaceborne Computer Program, Mark Fernandez, HPE • Suitability of Commercial Clouds for NASA's HPC Applications, Bob Hood 2:00pm HPE Vendor Update 2:15pm Gaining a Competitive Edge with HPC Cloud Computing, William Edsall, Dow Chemical Company 2:45pm Networking Break 3:15pm HPC Innovations: Short Presentations, Moderated by Earl Joseph • Altair, AMD, IBM, Penguin, Panasas, Rescale, Tachyum, and Univa 4:30pm Object Detection in Mobile Urban Complex Environments, Ruth Cheng, ERDC 5:00pm Networking Time 6:30pm Special Dinner Event at the Henry Ford Museum
  • 15. Welcome To The Second Day Of The HPC User Forum Meeting
  • 16. Thank You To Our Sponsors! •  Tuesday Dinner - Dell EMC & Intel •  Wednesday Breakfast - HPE & NVIDIA •  Wednesday Lunch – AMD •  Wednesday PM Refreshments - Altair •  Wednesday Dinner - HPE & Intel •  Thursday Breakfast - Panasas •  Thursday AM Refreshments - Rescale •  Thursday Lunch - IBM •  Thursday PM Refreshments - HPE & NVIDIA
  • 17. Agenda: Thursday Morning 8:30am Session: Automated Driving Systems, Automotive Engineering, Sensor Networks • Bridging the Automated Vehicle Gap: Consumer Trust, Technology and Liability, Kristin Kolodge, J.D. Power and Associates and Tina Georgieva, Miller Canfield • Computer Vision for Autonomous Vehicles, Xiaoming Liu and Garrick Brazil, Michigan State University (45 minutes) • Navigation/Localization Performance of Autonomous Vehicles," Dorota Grejner-Brzezinska, Ohio State College of Engineering 10:15am Scalable AI Solutions and HPC Systems: Examples from the Wild, Bob Zak, Intel 10:30am Networking Break 11:00am Session: Automated Driving Systems, Automotive Engineering, Sensor Networks (continued) • AI for Autonomous Driving Will Revolutionize the Transportation Industry, Bill Veenhuis and Norm Marks, NVIDIA • Nek5000 Engine Simulation with Exascale Scaling, Muhsin Ameen, Argonne National Laboratory 12:00pm Networking Lunch
  • 19. Agenda: Thursday Afternoon 1:00pm Session: Automated Driving Systems, Automotive Engineering, Sensor Networks (continued) • Use of HPC for AI Applications at Ford Motor Company, Bryan Goodman • Data Science meets CFD: FieldView Analytics in Engineering, Steve Legensky, Intelligent Light 2:00pm Vendor Technology Update 2:15pm Market Trends in the HPC Arena, Dave Kepczynski, General Electric 2:45pm Networking Break 3:15pm Manufacturing Science and Engineering at Argonne, Santanu Chaudhuri 3:45pm Leadership Computing at Argonne National Laboratory, the Future Home of A21, the First US Exascale System, David Martin 4:15pm Use of HPC to Drive Development of Advanced, More Fuel- Efficient Engines, Ron Grover, General Motors 4:45pm Meeting Wrap-Up, Paul Muzio, Rupak Biswas, Earl Joseph and Steve Conway
  • 20. Important Dates For Your Calendar HPC USER FORUM MEETINGS: §  October 1 to 2, Stuttgart, Germany §  April 22 to 24, 2019, Santa Fe, New Mexico §  September 9 to 11, 2019, Chicago Illinois, Argonne National Laboratory And Join us for the Hyperion SC18 Briefing: •  Tuesday, November 13, The Adolphus Hotel
  • 21. Thank You To Our Sponsors! •  Tuesday Dinner - Dell EMC & Intel •  Wednesday Breakfast - HPE & NVIDIA •  Wednesday Lunch – AMD •  Wednesday PM Refreshments - Altair •  Wednesday Dinner - HPE & Intel •  Thursday Breakfast - Panasas •  Thursday AM Refreshments - Rescale •  Thursday Lunch - IBM •  Thursday PM Refreshments - HPE & NVIDIA
  • 22. Thank You For Attending The HPC User Forum Meeting!
  • 23. Please email: ejoseph@hyperionres.com Or check out: www.HyperionResearch.com www.hpcuserforum.com Questions?