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Transforming the Data Center
Hyperscale –
Power/Cooling –
Open
KarlHansen | SeniorTechnicalManager,LenovoDCG Nordic
Tallinn,October,2018
2017 Lenovo. All rights reserved.
2017 Lenovo Internal. All rights reserved. 2H Y P E R S C A L E
Lenovo: A Global Technology Leader
Worldwide facilities
36 manufacturing facilities,
7 research centers and
71 offices globally
Globally diverse leadership
team
7 different nationalities in
leadership executive council
(LEC)
Five nationalities represented on
Board of Directors.
A $43 billion,
Fortune 500 company
~52,000 employees serving
customers in 160+ countries
100% publicly traded on the
Hong Kong Stock Exchange
$1.2B
AI AND IOT INVESTMENT
#226 Fortune 500
ONE OF THE GREAT
BUSINESS STORIES IN THE
LAST 10YRS
Magazine
2017 Lenovo Internal. All rights reserved. 3H Y P E R S C A L E
Data Center Group: An Experienced, Innovative, Global Team
2,000
DEVELOPERS ACROSS 7LABS
GLOBALLY
20MSERVERS SHIPPED; SURPASSING
MILESTONE THIS YEAR
Headquarters
Lenovo Manufacturing
Other Manufacturing
25 Years
IN THE DATA CENTER
10,000SERVICE PROFESSIONALS
NUMBER OF
FASTEST SYSTEMS
ON TOP500AND
FASTEST GROWING
HPC COMPANY
#1100
OWNED /
CONTROLLED
MFG SITES
6
100 SERVERS PER HR
2017 Lenovo. All rights reserved. H Y P E R S C A L E
FAST
4
On-time
Delivery
95%
To Ship New
Products
1st
Current world
record performance
benchmarks
87
Gartner Top Supply
Chains
#24
Response
Times
2hour
2017 Lenovo. All rights reserved. H Y P E R S C A L E
FLEXIBLE
5
HIGH-
PERFORMANCE
COMPUTING /
ARTIFICIAL
INTELLIGENCE
DATA CENTER
INFRASTRUCTURE
SOFTWARE-
DEFINED
DATA CENTER
HYPERSCALE
ENGINEERED SOLUTIONS
SERVICES
62018 Lenovo Internal. All rights reserved.
Lenovo SDI Portfolio: Choose your Path to Cloud
Building Blocks Turnkey
Cloud
Model
Simplicity
Agility
HCI-ready HCI Cloud
Modular
Scaling
ThinkAgile
CP
Series
Composable
Resources
Platform
Services
ThinkAgile
SXM
On-Demand
Self-Service
End-to-End
Automation
Integrated
Infrastructure
Integrated
Software ThinkAgile
VX
Appliance
ThinkAgile
HX
ApplianceCertified
Hardware
ThinkAgile VX
Certified Node
ThinkAgile HX
Certified Node
ThinkAgile MX
Certified Node
coupled compute+storage
prescribed
resource
offerings
build your
own cloud
using
VMware
vRealize
Suite
(Operations,
Automation,
Insight)
build your own
Integration & Networking
build your
own cloud
using
VMware
vRealize
Suite
(Operations,
Automation,
Insight)
build your
own cloud
using
Nutanix
Prism
Central
&
Calm
orchestration
build your
own cloud
using
Nutanix
Prism
Central
&
Calm
build your own
cloud
using
custom
tools
&
automation
VMware
vSphere
+ vSAN
Nutanix
Acropolis
Microsoft
Windows Server
+ WSSD
100% turn-key
8
WORKING WITH 7 OF THE 10
LARGEST DATA CENTER
COMPANIES IN
THE WORLD
HYPERSCALE
2017 Lenovo Internal. All rights reserved. 9H Y P E R S C A L E
HYPERSCALE
Leadership
Paul Ju
Vice President,
WW Hyperscale
Segment GM
FASTER & more
FLEXIBLE than OEMs
Larger Commodity
SCALE than ODMs
More GLOBAL &
TECHNICAL than SIs
H Y P E R S C A L E C U S T O M E R S A R E L O O K I N G F O R
C O M PA N I E S T H AT A R E …
• Dedicated organization provides end to end services
• Industry leading engineering that can customize high
quality products with fast response
• Flexible supply chain model with leverage of entire
Lenovo scale
• The only company that can provide self-owned
manufacturing & global service capability
O U R VA L U E P R O P O S I T I O N
Mission
• Build a WW customer-
centric business model
that gives the client a
strategic partner that they
can trust to deliver value;
• Offering faster innovation,
lower cost products,
unique time-to-bid cycles,
and flexible service;
2017 Lenovo Internal. All rights reserved. 10H Y P E R S C A L E
We Own Our End To End Capabilities
TECHNICAL
ARCHITECT
MANUFACTURING
PCBA  L12
CUSTOMER
ENGAGEMENT
ENGINEERING
DESIGN
GLOBAL DEPLOYMENT
& SERVICES
2017 Lenovo Internal. All rights reserved. 11H Y P E R S C A L E
Hyperscale portfolio
Industry Trend | Evolving Technology
RackScaleStandardRack
Computing / Warm Storage Server
HIGH Volume | Commoditized
Acceleration & Storage Rich Server
Specific Application Optimized
Infrastructure Nodes / ToR
+ =
• Hyperscale data center
• Disaggregated , High-density
and Power optimize
infrastructures
• Software Defined X
 Computing
 Storage
 Networking
• Modulize design to fulfill diversify Hyperscale workloads
• Optimize Performance/Price ratio with excellent engineering
• Customize BMC/BIOS for Tier 1 customer
• Innovation design to support PCIe/ Nvlink GPU cards,
particularly suited to deep learning and resource-intensive
applications
• Optimize performance for object based storage requirements
1U 2U Multi-Node
Server
GPU Server Storage rich server
Compute
Storage
Networking
GPU Node
ARM/AMD Node
Global..
China… ODCC Scorpio
OCS
OCP ORV2
Olympus
FPGA
2017 Lenovo Internal. All rights reserved. 12H Y P E R S C A L E
ChinaChina
HungaryHungary
BrazilBrazil
MexicoMexico
USUS
Lenovo Owned Mfg
Build Locations
Lenovo Dedicated Mfg
Partner Owned
Global Manufacturing, Delivery & Service
Monterrey, MX – 2009
• Primary Support Region: Americas
• L10 Capacity 1400x/day
• Current L11/12 Capacity 21 Cells
Whitsett, US – 2015
• Primary Support Region: USA
• L10 Capacity 200x/day
• Current L11/12 Capability 2 racks/day
Shenzhen, China – 2009
• Primary Support Region: Worldwide
• L10 Capacity 4800x/day
• Current L11/L12 Capacity 25 cells
Indaiatuba, Brazil - 2014
• Primary Support Region: Brazil
• L10 Support for in-country shipments – 200x/day
• L11/L12 Capability for key engagements
Sarvar, Hungary – 2011
• Primary Support Region: EMEA
• L10 Capacity 1000x/day
• L11/L12 Capability 12 Cells
2017 Lenovo Internal. All rights reserved. 13H Y P E R S C A L E
Overall Design Capabilities
Data Center Level
Rack Scale Level
Component Level
Product Design Validation
• L11 S/V capacity
• HDD system performance optimization
Infrastructure
• Open-RMC
• 100G Networking
• NVMe over fabric
Commodity
• Lenovo NVMe SSD
Customization
FW / SW
• BMC / BIOS
• Big data predictive
failure analytics
Power / Thermal Solutions
• Liquid cooling technology
• Natural air cooling technology
• Battery and DC power
Software Defined
• Pooled resources
• SDN / SDS
From Component level to Rack Scale level to Data Center level…
The design is done by Lenovo engineers, independent of ODMs
2017 Lenovo Internal. All rights reserved. 14H Y P E R S C A L E
WE DESIGN IT | WE BUILD IT | WE DEPLOY IT
HYPERSCALE
Why Energy Is A Big And Rapidly Growing Problem For Data Centers
Data centres of the world will consume 1/5 of Earth's power by 2025 ...
Energy Hogs: Can World's Huge Data Centers Be Made More Efficient ...
Data Center Design and its Energy Consumption - Stanford University
17
0
200
400
600
800
1000
1200
1400
1600
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60
80
100
120
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200
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240
6/1/2006
11/1/2006
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2/1/2008
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12/1/2008
5/1/2009
10/1/2009
3/1/2010
8/1/2010
1/1/2011
6/1/2011
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4/1/2012
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12/1/2013
5/1/2014
10/1/2014
3/1/2015
8/1/2015
1/1/2016
6/1/2016
11/1/2016
4/1/2017
Intel Xeon Processor & Spec_fp Rate
TDP CFP2006 Rate2018 Lenovo - All rights reserved.
Performance-Power relation
500400320300 35024020585 12075
NVIDIA / AMD GPU
XEON
PHIAMD
NERVANA/CREST
NVIDIA SXM
• Maintaining Moore’s Law with increased competition
is resulting in higher component power
• Increased memory count, NVMe adoption, and I/O
requirements are driving packaging and feature
tradeoffs (superset of features doesn’t fit in 1U)
• Shared cooling fan power savings no longer exist
for dense 2S nodes architectures due to non-
spreadcore CPU layout high airflow requirements
 For highest performance systems will have to
reduce density or move to optimized cooling.
ARM SOC
Haswell
Sandy Bridge / IvyBridge
18
What Will Tomorrow’s IT Look Like?
18
Data Center
limitations
Increasing
Electricity Costs
Thermals Capping
Performance
Waste Heat
Reuse
Higher Power
Processors
<205W >205W-240W >240W
1U Half wide Air/Hybrid Water Water
1U Full wide Air/Hybrid Air/Hybrid Water
2U Half wide Air Air Water
2U Full Wide Air Air Air
CPU TDP Wattage
ServerForm
Factor
18
<205W >205W-240W >240W
1U Half wide Air/Hybrid Water Water
1U Full wide Air/Hybrid Air/Hybrid Water
2U Half wide Air Air Water
2U Full Wide Air Air Air
CPU TDP Wattage
CHOICES
Go Higher
Go Wider
Go Water
2018 Lenovo. All rights reserved.
19
Liquid Cooling Goes Mainstream
2012: A Watershed Moment
2018 Lenovo. All rights reserved.
2012
2014
2018
Leadership
Hardware
Smart Control
Software
Driving
Innovation
30+
patents
Integrated
Infrastructure
20
Lenovo ThinkSystem SD650
Direct Water Cooling Delivers Maximum Performance
 Proven
Over 30,000 Direct Water Cooled Nodes installed
 Dense
Up to 24 205W+ CPUs per 6U Enclosure
 Performance
Turbo always on + cooler CPUs run faster
 Efficient
90% heat to water
Runs at 50C reducing data center energy by 40%
PUE 1.08 capable
 Flexible
Wide variety of fabrics, DIMM, drives and software
2017 Lenovo Internal. All rights reserved. 21H Y P E R S C A L E2018 Lenovo - All rights reserved.
Power efficiency in the datacenter
• Power Usage Effectiveness (PUE)
• How much of total datacenter power is not used for IT?
• Cooling infrastructure, UPS, power , …
• Ideal value is 1.0
• Does not say anything about IT power efficiency
• IT Usage Effectiveness (ITUE)
• How much IT power is not used for computing?
• PSUs, fans, voltage regulators, …
• Ideal value is 1.0
• Does not say anything about datacenter power efficiency
• Total-Power Usage Effectiveness (TUE)
• How much datacenter power is not used for computing?
• TUE = PUE * ITUE
• Ideal value is 1.0
• Energy Reuse Effectiveness (ERE)
• How much power is lost to the universe?
• Ideal value is 0.0.
• Equal to PUE if no reuse
222018 Lenovo - All rights reserved.
Waste Energy reuse - ERE
Energy Waste Direct Reuse Indirect Reuse
Why are high water outlet temperatures important?
Pictures: Leibniz Supercomputing Centre
23
• Standard Air flow with
internal fans cooled with
the room climatization
• Broadest choice of
configurable options
supported
• Relatively inefficient cooling
• Air cooled but heat
removed with RDHX
through chilled water
• Retains high flexibility
• Enables extremely tight
rack placement
• Potentially room neutral
Air Cooled Air Cooled
w/ Rear Door Heat Exch.
2018 Lenovo - All rights reserved.
Lenovo Cooling Technologies
Choose for broadest choice
of customizable options
Choose for increased energy
efficiency with broad choice
PUE ~2.0 – 1.5
ERE ~2.0 – 1.5
PUE ~1.4 – 1.2
ERE ~1.4 – 1.2
• Most heat removed by
onboard-waterloop with
up to 50°C temperature
• Supports highest TDP CPU
at densest footprint
• Higher performance
• Free cooling
Direct Water Cooled
Choose for max performance
and high energy efficiency
PUE <=1.1
ERE <=1.1
• Waste heat reused to
generate coldness to cool
non-DWC components
• Retains highest TDP,
footprint and performance
• Potentially all system heat
covered through DWC
Direct Water Cooled
w/ Adsorption Chilling
Choose for max performance
and max energy efficiency
PUE <=1.1
ERE <1
242018 Lenovo - All rights reserved.
Why use water to move the heat away?
• Energy (Joules)
1 Joules is the energy required to
– Let the human heart work for 1 second
– Lift a chocolade bar (100g) by 1 meter (g=9.81 m/s²)
– Let electrical power of 1 W flow for 1 second
Same mass of water stores 4x energy
compared to air at a given
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Air Aluminium Copper Steel Water
Isobaric mass heat capacity• Mass heat capacity ( )
– ability of a given mass of a substance to store
internal energy while undergoing a given
temperature change
252018 Lenovo - All rights reserved.
Why use copper to transfer heat?
• Heat power transfer (W)
is dependent on surface, thickness, temperature
difference and thermal conductivity of material
sourcesink
Heat transfer
0
50
100
150
200
250
300
350
400
450
Water Steel, stainless Aluminium Copper (pure)
Thermal conductivity
Copper is a very efficient material
to transfer energy from source to sink
• Thermal conductivity ( )
is the property of a material to conduct heat
per thickness and per temperature differential
28
Open – Our Software Strategy...
and some Lenovo Contribution to the Open Community
• Rewriting our entire management stack
• Creating a new NOS – Lenovo CNOS
• Main contributor to XCAT – rewriting tools in Python
• Confluent Project
• https://github.com/openstack/pyghmi
• https://github.com/lenovo
• https://wiki.openstack.org/wiki/Neutron/ML2/LenovoML2Mechanism
• https://www.youtube.com/watch?v=1kMrY4QqzVI
Transforming the Data Center with Hyperscale Power and Cooling

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Transforming the Data Center with Hyperscale Power and Cooling

  • 1. Transforming the Data Center Hyperscale – Power/Cooling – Open KarlHansen | SeniorTechnicalManager,LenovoDCG Nordic Tallinn,October,2018 2017 Lenovo. All rights reserved.
  • 2. 2017 Lenovo Internal. All rights reserved. 2H Y P E R S C A L E Lenovo: A Global Technology Leader Worldwide facilities 36 manufacturing facilities, 7 research centers and 71 offices globally Globally diverse leadership team 7 different nationalities in leadership executive council (LEC) Five nationalities represented on Board of Directors. A $43 billion, Fortune 500 company ~52,000 employees serving customers in 160+ countries 100% publicly traded on the Hong Kong Stock Exchange $1.2B AI AND IOT INVESTMENT #226 Fortune 500 ONE OF THE GREAT BUSINESS STORIES IN THE LAST 10YRS Magazine
  • 3. 2017 Lenovo Internal. All rights reserved. 3H Y P E R S C A L E Data Center Group: An Experienced, Innovative, Global Team 2,000 DEVELOPERS ACROSS 7LABS GLOBALLY 20MSERVERS SHIPPED; SURPASSING MILESTONE THIS YEAR Headquarters Lenovo Manufacturing Other Manufacturing 25 Years IN THE DATA CENTER 10,000SERVICE PROFESSIONALS NUMBER OF FASTEST SYSTEMS ON TOP500AND FASTEST GROWING HPC COMPANY #1100 OWNED / CONTROLLED MFG SITES 6 100 SERVERS PER HR
  • 4. 2017 Lenovo. All rights reserved. H Y P E R S C A L E FAST 4 On-time Delivery 95% To Ship New Products 1st Current world record performance benchmarks 87 Gartner Top Supply Chains #24 Response Times 2hour
  • 5. 2017 Lenovo. All rights reserved. H Y P E R S C A L E FLEXIBLE 5 HIGH- PERFORMANCE COMPUTING / ARTIFICIAL INTELLIGENCE DATA CENTER INFRASTRUCTURE SOFTWARE- DEFINED DATA CENTER HYPERSCALE ENGINEERED SOLUTIONS SERVICES
  • 6. 62018 Lenovo Internal. All rights reserved. Lenovo SDI Portfolio: Choose your Path to Cloud Building Blocks Turnkey Cloud Model Simplicity Agility HCI-ready HCI Cloud Modular Scaling ThinkAgile CP Series Composable Resources Platform Services ThinkAgile SXM On-Demand Self-Service End-to-End Automation Integrated Infrastructure Integrated Software ThinkAgile VX Appliance ThinkAgile HX ApplianceCertified Hardware ThinkAgile VX Certified Node ThinkAgile HX Certified Node ThinkAgile MX Certified Node coupled compute+storage prescribed resource offerings build your own cloud using VMware vRealize Suite (Operations, Automation, Insight) build your own Integration & Networking build your own cloud using VMware vRealize Suite (Operations, Automation, Insight) build your own cloud using Nutanix Prism Central & Calm orchestration build your own cloud using Nutanix Prism Central & Calm build your own cloud using custom tools & automation VMware vSphere + vSAN Nutanix Acropolis Microsoft Windows Server + WSSD 100% turn-key
  • 7.
  • 8. 8 WORKING WITH 7 OF THE 10 LARGEST DATA CENTER COMPANIES IN THE WORLD HYPERSCALE
  • 9. 2017 Lenovo Internal. All rights reserved. 9H Y P E R S C A L E HYPERSCALE Leadership Paul Ju Vice President, WW Hyperscale Segment GM FASTER & more FLEXIBLE than OEMs Larger Commodity SCALE than ODMs More GLOBAL & TECHNICAL than SIs H Y P E R S C A L E C U S T O M E R S A R E L O O K I N G F O R C O M PA N I E S T H AT A R E … • Dedicated organization provides end to end services • Industry leading engineering that can customize high quality products with fast response • Flexible supply chain model with leverage of entire Lenovo scale • The only company that can provide self-owned manufacturing & global service capability O U R VA L U E P R O P O S I T I O N Mission • Build a WW customer- centric business model that gives the client a strategic partner that they can trust to deliver value; • Offering faster innovation, lower cost products, unique time-to-bid cycles, and flexible service;
  • 10. 2017 Lenovo Internal. All rights reserved. 10H Y P E R S C A L E We Own Our End To End Capabilities TECHNICAL ARCHITECT MANUFACTURING PCBA  L12 CUSTOMER ENGAGEMENT ENGINEERING DESIGN GLOBAL DEPLOYMENT & SERVICES
  • 11. 2017 Lenovo Internal. All rights reserved. 11H Y P E R S C A L E Hyperscale portfolio Industry Trend | Evolving Technology RackScaleStandardRack Computing / Warm Storage Server HIGH Volume | Commoditized Acceleration & Storage Rich Server Specific Application Optimized Infrastructure Nodes / ToR + = • Hyperscale data center • Disaggregated , High-density and Power optimize infrastructures • Software Defined X  Computing  Storage  Networking • Modulize design to fulfill diversify Hyperscale workloads • Optimize Performance/Price ratio with excellent engineering • Customize BMC/BIOS for Tier 1 customer • Innovation design to support PCIe/ Nvlink GPU cards, particularly suited to deep learning and resource-intensive applications • Optimize performance for object based storage requirements 1U 2U Multi-Node Server GPU Server Storage rich server Compute Storage Networking GPU Node ARM/AMD Node Global.. China… ODCC Scorpio OCS OCP ORV2 Olympus FPGA
  • 12. 2017 Lenovo Internal. All rights reserved. 12H Y P E R S C A L E ChinaChina HungaryHungary BrazilBrazil MexicoMexico USUS Lenovo Owned Mfg Build Locations Lenovo Dedicated Mfg Partner Owned Global Manufacturing, Delivery & Service Monterrey, MX – 2009 • Primary Support Region: Americas • L10 Capacity 1400x/day • Current L11/12 Capacity 21 Cells Whitsett, US – 2015 • Primary Support Region: USA • L10 Capacity 200x/day • Current L11/12 Capability 2 racks/day Shenzhen, China – 2009 • Primary Support Region: Worldwide • L10 Capacity 4800x/day • Current L11/L12 Capacity 25 cells Indaiatuba, Brazil - 2014 • Primary Support Region: Brazil • L10 Support for in-country shipments – 200x/day • L11/L12 Capability for key engagements Sarvar, Hungary – 2011 • Primary Support Region: EMEA • L10 Capacity 1000x/day • L11/L12 Capability 12 Cells
  • 13. 2017 Lenovo Internal. All rights reserved. 13H Y P E R S C A L E Overall Design Capabilities Data Center Level Rack Scale Level Component Level Product Design Validation • L11 S/V capacity • HDD system performance optimization Infrastructure • Open-RMC • 100G Networking • NVMe over fabric Commodity • Lenovo NVMe SSD Customization FW / SW • BMC / BIOS • Big data predictive failure analytics Power / Thermal Solutions • Liquid cooling technology • Natural air cooling technology • Battery and DC power Software Defined • Pooled resources • SDN / SDS From Component level to Rack Scale level to Data Center level… The design is done by Lenovo engineers, independent of ODMs
  • 14. 2017 Lenovo Internal. All rights reserved. 14H Y P E R S C A L E WE DESIGN IT | WE BUILD IT | WE DEPLOY IT HYPERSCALE
  • 15.
  • 16. Why Energy Is A Big And Rapidly Growing Problem For Data Centers Data centres of the world will consume 1/5 of Earth's power by 2025 ... Energy Hogs: Can World's Huge Data Centers Be Made More Efficient ... Data Center Design and its Energy Consumption - Stanford University
  • 17. 17 0 200 400 600 800 1000 1200 1400 1600 1800 2000 60 80 100 120 140 160 180 200 220 240 6/1/2006 11/1/2006 4/1/2007 9/1/2007 2/1/2008 7/1/2008 12/1/2008 5/1/2009 10/1/2009 3/1/2010 8/1/2010 1/1/2011 6/1/2011 11/1/2011 4/1/2012 9/1/2012 2/1/2013 7/1/2013 12/1/2013 5/1/2014 10/1/2014 3/1/2015 8/1/2015 1/1/2016 6/1/2016 11/1/2016 4/1/2017 Intel Xeon Processor & Spec_fp Rate TDP CFP2006 Rate2018 Lenovo - All rights reserved. Performance-Power relation 500400320300 35024020585 12075 NVIDIA / AMD GPU XEON PHIAMD NERVANA/CREST NVIDIA SXM • Maintaining Moore’s Law with increased competition is resulting in higher component power • Increased memory count, NVMe adoption, and I/O requirements are driving packaging and feature tradeoffs (superset of features doesn’t fit in 1U) • Shared cooling fan power savings no longer exist for dense 2S nodes architectures due to non- spreadcore CPU layout high airflow requirements  For highest performance systems will have to reduce density or move to optimized cooling. ARM SOC Haswell Sandy Bridge / IvyBridge
  • 18. 18 What Will Tomorrow’s IT Look Like? 18 Data Center limitations Increasing Electricity Costs Thermals Capping Performance Waste Heat Reuse Higher Power Processors <205W >205W-240W >240W 1U Half wide Air/Hybrid Water Water 1U Full wide Air/Hybrid Air/Hybrid Water 2U Half wide Air Air Water 2U Full Wide Air Air Air CPU TDP Wattage ServerForm Factor 18 <205W >205W-240W >240W 1U Half wide Air/Hybrid Water Water 1U Full wide Air/Hybrid Air/Hybrid Water 2U Half wide Air Air Water 2U Full Wide Air Air Air CPU TDP Wattage CHOICES Go Higher Go Wider Go Water 2018 Lenovo. All rights reserved.
  • 19. 19 Liquid Cooling Goes Mainstream 2012: A Watershed Moment 2018 Lenovo. All rights reserved. 2012 2014 2018 Leadership Hardware Smart Control Software Driving Innovation 30+ patents Integrated Infrastructure
  • 20. 20 Lenovo ThinkSystem SD650 Direct Water Cooling Delivers Maximum Performance  Proven Over 30,000 Direct Water Cooled Nodes installed  Dense Up to 24 205W+ CPUs per 6U Enclosure  Performance Turbo always on + cooler CPUs run faster  Efficient 90% heat to water Runs at 50C reducing data center energy by 40% PUE 1.08 capable  Flexible Wide variety of fabrics, DIMM, drives and software
  • 21. 2017 Lenovo Internal. All rights reserved. 21H Y P E R S C A L E2018 Lenovo - All rights reserved. Power efficiency in the datacenter • Power Usage Effectiveness (PUE) • How much of total datacenter power is not used for IT? • Cooling infrastructure, UPS, power , … • Ideal value is 1.0 • Does not say anything about IT power efficiency • IT Usage Effectiveness (ITUE) • How much IT power is not used for computing? • PSUs, fans, voltage regulators, … • Ideal value is 1.0 • Does not say anything about datacenter power efficiency • Total-Power Usage Effectiveness (TUE) • How much datacenter power is not used for computing? • TUE = PUE * ITUE • Ideal value is 1.0 • Energy Reuse Effectiveness (ERE) • How much power is lost to the universe? • Ideal value is 0.0. • Equal to PUE if no reuse
  • 22. 222018 Lenovo - All rights reserved. Waste Energy reuse - ERE Energy Waste Direct Reuse Indirect Reuse Why are high water outlet temperatures important? Pictures: Leibniz Supercomputing Centre
  • 23. 23 • Standard Air flow with internal fans cooled with the room climatization • Broadest choice of configurable options supported • Relatively inefficient cooling • Air cooled but heat removed with RDHX through chilled water • Retains high flexibility • Enables extremely tight rack placement • Potentially room neutral Air Cooled Air Cooled w/ Rear Door Heat Exch. 2018 Lenovo - All rights reserved. Lenovo Cooling Technologies Choose for broadest choice of customizable options Choose for increased energy efficiency with broad choice PUE ~2.0 – 1.5 ERE ~2.0 – 1.5 PUE ~1.4 – 1.2 ERE ~1.4 – 1.2 • Most heat removed by onboard-waterloop with up to 50°C temperature • Supports highest TDP CPU at densest footprint • Higher performance • Free cooling Direct Water Cooled Choose for max performance and high energy efficiency PUE <=1.1 ERE <=1.1 • Waste heat reused to generate coldness to cool non-DWC components • Retains highest TDP, footprint and performance • Potentially all system heat covered through DWC Direct Water Cooled w/ Adsorption Chilling Choose for max performance and max energy efficiency PUE <=1.1 ERE <1
  • 24. 242018 Lenovo - All rights reserved. Why use water to move the heat away? • Energy (Joules) 1 Joules is the energy required to – Let the human heart work for 1 second – Lift a chocolade bar (100g) by 1 meter (g=9.81 m/s²) – Let electrical power of 1 W flow for 1 second Same mass of water stores 4x energy compared to air at a given 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Air Aluminium Copper Steel Water Isobaric mass heat capacity• Mass heat capacity ( ) – ability of a given mass of a substance to store internal energy while undergoing a given temperature change
  • 25. 252018 Lenovo - All rights reserved. Why use copper to transfer heat? • Heat power transfer (W) is dependent on surface, thickness, temperature difference and thermal conductivity of material sourcesink Heat transfer 0 50 100 150 200 250 300 350 400 450 Water Steel, stainless Aluminium Copper (pure) Thermal conductivity Copper is a very efficient material to transfer energy from source to sink • Thermal conductivity ( ) is the property of a material to conduct heat per thickness and per temperature differential
  • 26.
  • 27.
  • 28. 28 Open – Our Software Strategy... and some Lenovo Contribution to the Open Community • Rewriting our entire management stack • Creating a new NOS – Lenovo CNOS • Main contributor to XCAT – rewriting tools in Python • Confluent Project • https://github.com/openstack/pyghmi • https://github.com/lenovo • https://wiki.openstack.org/wiki/Neutron/ML2/LenovoML2Mechanism • https://www.youtube.com/watch?v=1kMrY4QqzVI