CMC Laboratories was founded in 2003 and provides technical services focused on advanced materials for the electronics industry. It has over 200 clients ranging from startups to Fortune 100 companies. The document discusses CMC's technical expertise, business focus in materials analysis, electrical/thermal testing, and technology development. It provides examples of recent projects supporting medical device, optoelectronics, telecommunications, and advanced materials manufacturers.

1. 1
CMC
Laboratories,
Inc.
Client
Presenta4on
March
2009
Friday, September 11, 2009

2. 2
•
CMC
Laboratories
was
founded
in
2003
by
a
group
of
packaging
industry
veterans.
•
Today,
CMC
has
over
200
clients
ranging
from
start-­‐ups
to
Fortune
100
companies.
•
CMC
supports
clients
across
North
America,
Europe,
and
throughout
Asia
including
China,
Taiwan,
Singapore,
and
Malaysia.
Friday, September 11, 2009

3. 3
CMC
Laboratories
provides
a
high
level
of
technical
service
focussed
on
advanced
materials
within
the
electronic
industry.
Innova&ve
Materials
Solu&ons
for
Electronics
Friday, September 11, 2009

4. 4
Technical
Exper4se
Friday, September 11, 2009

5. 4
Technical
Exper4se
• Advanced
electronic
packaging
materials
• Micro-­‐structural
Characteriza:on
• Failure
Analysis
and
Destruc:ve
Physical
Analysis
• Electrical,
Thermal
and
Mechanical
Test
and
Proper:es
of
Packaging
Materials
• Custom
Reliability
Tes:ng:
Test
Development
and
Implementa:on
• Thin
and
Thick
FIlm
Metalliza:on
• Electro
and
Electro-­‐less
pla:ng
for
electronic
applica:ons
Friday, September 11, 2009

6. 5
CMC
Business
Focus
• Materials
Analysis
• Electrical
and
Thermal
Tes:ng
•
Technology
Development
and
Prototype/
Low
Volume
Fabrica:on
Friday, September 11, 2009

7. Business Sectors
6
CMC
Client
Industries
Friday, September 11, 2009

8. Business Sectors
6
CMC
Client
Industries
Medical Device Photovoltaic
Military and Aerospace Advanced Materials
Telecommunications Semiconductor
Friday, September 11, 2009

9. 7
Technical
Support
to
Medical
Device
Manufacturers
Friday, September 11, 2009

10. 7
Technical
Support
to
Medical
Device
Manufacturers
• Reliability
evalua:on
and
failure
mode
analysis.
• Device
and
component
construc:on
analysis
for
supplier
qualifica:on.
• Microstructural
analysis
in
support
of
process
op:miza:on
and
verifica:on.
• Design,
development
and
FA
support
to
assist
clients
with
FDA
submissions.
Friday, September 11, 2009

11. 8
Medical
Device
Manufacturers:
Recent
Projects
Friday, September 11, 2009

12. 8
Medical
Device
Manufacturers:
Recent
Projects
1. Electronic
reliability
and
failure
mode
evalua:on
of
a
PCB
assembly
used
in
a
hand
held
medical
device.
2. Evalua:on
of
Pb
and
Pb-­‐free
solder
processing
parameters
and
rework
limita:ons
for
high
reliability
implantable
devices.
3. Assisted
in
the
development
of
an
improved
herme:c
feed-­‐thru
for
an
implantable
device.
Friday, September 11, 2009

13. 9
Experience
Base
in
Op4cal
Applica4ons
for
Semiconductors
Friday, September 11, 2009

14. 9
Experience
Base
in
Op4cal
Applica4ons
for
Semiconductors
•Solar
cells,
high
brightness
LEDs,
Laser
Diodes
•Thin
film,
thick
film
and
direct
bond
copper
metalliza:on
•Material
structure,
composi:on
and
defect
characteriza:on
in
Opto-­‐electronic
assemblies
•
Ceramic
packages
including
alumina
and
AlN
•
Cu
pla:ng
Friday, September 11, 2009

15. 10
Optoelectronics
and
Photovoltaics:
Recent
Projects
Friday, September 11, 2009

16. 10
Optoelectronics
and
Photovoltaics:
Recent
Projects
1.
Characteriza:on
and
op:miza:on
of
high
thermal
demand
packaging
for
cuUng
edge
solar
concentrator
technology.
2.
Thick
Cu
pla:ng
process
development
for
an
HBLED
package
3.
New
material
selec:on
and
assembly
process
development
for
a
high
frequency
MEMs
op:cal
transmiWer.
Friday, September 11, 2009

17. 11
Experience
in
RF
and
Microwave
Device
Packaging
Friday, September 11, 2009

18. 11
Experience
in
RF
and
Microwave
Device
Packaging
•
Cellular
base-­‐sta:on
power
amplifier
packages
including
GaAs
and
Silicon
LDMOS
•
Microwave
communica:on
devices
•
Packaging
materials
and
processing
for
high
frequency
applica:ons
•
Alumina,
LTCC
and
LCP
TELECOMUNICATIONS
Friday, September 11, 2009

19. 12
RF
and
Microwave
Device
Packaging:
Recent
Projects
Friday, September 11, 2009

20. 12
RF
and
Microwave
Device
Packaging:
Recent
Projects
1.
Working
with
a
leading
edge
advanced
packaging
material
supplier
to
introduce
a
new
genera:on
of
RF
packages
for
cellular
base-­‐sta:on
applica:ons.
2.
Supported
the
introduc:on
to
market
of
a
new
high
frequency
passive
component
technology
with
enhanced
performance
from
20-­‐100
GHz.
3.
Assisted
in
the
development
of
a
novel,
low
stress
die
aWach
technology
for
RF
devices
which
enhances
thermal
managment.
Supported
client
patent
submissions.
TELECOMUNICATIONS
Friday, September 11, 2009

21. 13
CMC
Supports
The
Worlds
Most
Innova4ve
Advanced
Materials
Suppliers
Worldwide
Friday, September 11, 2009

22. 13
CMC
Supports
The
Worlds
Most
Innova4ve
Advanced
Materials
Suppliers
Worldwide
•
CMC
provides
clients
cri4cal
exper4se
for
advanced
materials
development
•
CMC
assists
in
market
introduc4on
for
advanced
materials
in
electronic
applica4ons
•
High
thermal
performance
materials
• Expansion
matched
systems
• Advanced
solder
systems
• Specialized
thick
film
and
thin
film
metalliza4on
• Polymer
composites
• High
frequency
materials
• LTCC,
HTCC,
and
AlN
• Pla4ng
layers
Friday, September 11, 2009

23. 14
Advanced
Materials:
Recent
Projects
Friday, September 11, 2009

24. 14
Advanced
Materials:
Recent
Projects
1.
Process
development
to
reclaim/rework
high-­‐end
specialty
components
preven:ng
mul:-­‐million
dollar
yield
loss.
2.Valida:on
of
material
proper:es
and
market
opportuni:es
for
advanced
polymer
composites
used
in
high
thermal
demand
packaging
applica:ons.
3.Licensing
of
CMC
developed
AlN
mul:layer
ceramic
technology
for
military,
space,
medical,
wafer
tes:ng,
and
telecommunica:ons.
Friday, September 11, 2009

25. 15
Core
Exper4se
in
Specialized
Technology
for
Military
and
Aerospace
Applica4ons
Friday, September 11, 2009

26. 15
Core
Exper4se
in
Specialized
Technology
for
Military
and
Aerospace
Applica4ons
•
Ceramic
packaging
technologies
including
LTCC,
AlN
and
HTCC
• Thin
film
metalliza4on
• High
performance
organic
packaging
solu4ons
• High
thermal
demand
packaging
materials
including
AlSiC
and
other
composite
metal
solu4ons
• Herme4c
package
sealing
technologies
•
Custom,
aerospace
focussed
reliability
test
development
Friday, September 11, 2009

27. 16
Military
and
Aerospace
Applica4ons:
Recent
Projects
Friday, September 11, 2009

28. 16
Military
and
Aerospace
Applica4ons:
Recent
Projects
1.
Developed
and
implemented
custom
electrical
test
program
for
power
components
for
space
under
environmental
stress
condi:ons.
2.
LTCC
component
op:miza:on
and
failure
analysis
for
next
genera:on
short
wave
military
communica:ons.
3.
Root
cause
analysis
of
wirebond
failures
in
guidance
system
control
module.
Friday, September 11, 2009

29. 17
Technology
Services
Friday, September 11, 2009

30. 17
Technology
Services
Failure Analysis Reliability and Test
Materials Characterization Process Development
AlN Licensing Market Analysis
Friday, September 11, 2009

31. 18
Failure
Analysis
and
Material
Characteriza4on
Capabili4es
Friday, September 11, 2009

32. 18
Failure
Analysis
and
Material
Characteriza4on
Capabili4es
• Package
deconstruc4on • Electrical
resis4vity
• Interfacial
structure • Dielectric
constant
and
loss
• Elemental
analysis
and
• Surface
roughness
mapping • Adhesion
Tes4ng
• Microstructure
and
phase
• Mechanical
Tes4ng
analysis • Thermal
conduc4vity
• Grain
structure
and
size
• Interfacial
thermal
distribu4on resistance
• Failure
interface
• Micro-­‐hardness
iden4fica4on
Friday, September 11, 2009

33. 19
Failure
Analysis
and
Material
Characteriza4on
Capabili4es-­‐
Con4nued
Friday, September 11, 2009

34. 19
Failure
Analysis
and
Material
Characteriza4on
Capabili4es-­‐
Con4nued
• SEM
with
SE
and
BSE
imaging • IC
Level
Analysis
• Energy
Dispersive
• Metal
Fractography
Spectrometry • Acous4c
Microscopy
• Metallographic
Evalua4on (CSAM)
• X-­‐Ray
Radiography • Secondary
Ion
Mass
• XRF
Thickness
Measurement Spectroscopy
(SIMS)
Friday, September 11, 2009

35. 20
Failure
Analysis
and
Material
Characteriza4on:
Recent
Projects
Friday, September 11, 2009

36. 20
Failure
Analysis
and
Material
Characteriza4on:
Recent
Projects
1. Failure
determina:on
of
a
herme:c
feed-­‐thru
in
an
implantable
medical
device.
2. Construc:on
evalua:on
of
a
discrete
device
for
patent
infringement
li:ga:on.
3. Compe::ve
analysis
of
advanced
graphics
processor
including
the
device,
package/substrate
and
graphics
board.
4. Advanced
solder
process
evalua:on
and
op:miza:on
for
major
medical
device
manufacturer.
Friday, September 11, 2009

37. 21
Metal
Fractography
Friday, September 11, 2009

38. 22
IC
Level
Cross
Sec4on
Analysis
Friday, September 11, 2009

39. 23
X-­‐ray
Radiography
and
Acous4c
Microscopy
Friday, September 11, 2009

40. 24
Custom
Design
for
Specialized
Tes4ng
Requirements
Friday, September 11, 2009

41. 24
Custom
Design
for
Specialized
Tes4ng
Requirements
• Micro-­‐Controllers • Air
to
air
thermal
• High-­‐Speed
Data
stress
Acquisi:on • HAST
Chamber
• Lab
View
Programming • Wide
range
of
• Environmental
Test
electrical
test
Chambers equipment
from
DC
to
• Mechanical
Tes:ng GHz
Friday, September 11, 2009

42. 25
Custom
Design
for
Specialized
Tes4ng
Requirements:
Recent
Projects
Friday, September 11, 2009

43. 25
Custom
Design
for
Specialized
Tes4ng
Requirements:
Recent
Projects
1.
System
design
and
development
to
test
and
capture
extremely
short
:me
scale
events
in
an
advanced
satellite
component
while
undergoing
environmental
stress.
2. Burn-­‐in
and
precision
electrical
monitoring
of
military
components
under
rigid
temperature
condi:ons.
3. Design
and
development
of
a
custom
op:cal
reflectometer
to
set
laser
weld
condi:ons
for
high
reliability.
Friday, September 11, 2009

44. 26
Technology
Development
and
Fabrica4on
•
Pla:ng
metalliza:on
development
• Low
volume
electro-­‐pla:ng,
electro-­‐less
pla:ng
and
barrel
pla:ng
•
Fabrica:on
and
assembly
process
development
–
Solder
profiles
–
Braze
profiles
–
Die
aWach
processes
•
Low
volume
fabrica:on
and
assembly
capability
•
Thick
film
metalliza:on
produc:on
facility
•
Module
re-­‐work
for
military
and
medical
applica:ons
Friday, September 11, 2009

45. 27
Pla4ng
Process
Development
Friday, September 11, 2009

46. 27
Pla4ng
Process
Development
• Development
of
custom
pla4ng
processes
–
Evaluate
pla4ng
chemistry
op4ons
–
Create
prototypes
for
func4onal
and
reliability
tes4ng
–
Detailed
documenta4on
of
pla4ng
procedures
–
Transfer
to
high
volume
processors
•
Small
volume,
fully
func4onal
pla4ng
facility
–
Rack
and
barrel
pla4ng
–
DC
and
pulsed
rec4fica4on
Friday, September 11, 2009

47. 28
Pla4ng
Process
Development
Friday, September 11, 2009

48. 28
Pla4ng
Process
Development
• CMC’s
Pla4ng
Development
Customers:
–
Semiconductor
manufacturers
–
Electronic
Package
fabricators
–
Specialty
materials
manufacturers
• Cu,
Ni,
Au,
Sn
and
co-­‐deposited
alloys
• Cleaning
and
etching
chemistry
Friday, September 11, 2009

49. 29
Technology
Development
and
Fabrica4on-­‐
Recent
Projects
•
Fabricate
specialized
direct
bond
copper
substrates
•
Plate
Al-­‐SiC
flanges
over
wide
composi:on
range
•
Re-­‐work
and
re-­‐assemble
module
used
for
medical
imaging
•
Produce
range
of
high
temperature
thick
film
metalliza:on
pastes
for
AlN
ceramics
•
Assemble
MEMs
diode
laser
switching
module
for
telecommunica:ons
applica:ons
Friday, September 11, 2009

50. 30
CMC
Wireless
Packaging
Experience
Friday, September 11, 2009

51. 31
Mul4layer,
Co-­‐Fire
AlN
Technology
Licenses
Friday, September 11, 2009

52. 31
Mul4layer,
Co-­‐Fire
AlN
Technology
Licenses
• Non-­‐exclusive
Licensing
of
CMC’s
proprietary
co-­‐fired,
mul4layer
AlN
process
–
Thermal
conduc:vity
as
high
as
190
W/m-­‐K
–
Up
to
20
metalliza:on
layers
–
Required
materials,
processes
and
equipment
details
transferred
to
licensees
• Process
has
been
u4lized
for
high
volume
produc4on
• Applica4ons
in
telecommunica4ons
infrastructure,
power
electronics,
op4cal
communica4ons,
HBLED
and
industrial
equipment.
ALUMINUM NITRIDE
TECHNOLOGY LICENSING
Friday, September 11, 2009

53. 32
Technology
Market
Analysis
Friday, September 11, 2009

54. 32
Technology
Market
Analysis
• Technical
Market
Studies
focused
on
Electronic
Interconnect,
Packaging,
New
Materials,
Assembly
Technology,
or
Passive
Components
• Compe44ve
Analysis
including
Compe4tor’s
Technical
Performance,
Target
Markets,
Key
Strengths/Weaknesses
and
Product
Roadmaps
• Iden4fica4on
of
Acquisi4on
Candidates
to
fit
Client’s
Growth
Objec4ves.
• Industry
Wide
Surveys
and
Survey
Data
Analysis
Friday, September 11, 2009

55. 33
Technology
Market
Analysis-­‐
Recent
Projects
Friday, September 11, 2009

56. 33
Technology
Market
Analysis-­‐
Recent
Projects
1. Developed
a
customized
market
analysis
for
a
large
advanced
materials
company,
evalua:ng
the
market
poten:al
of
a
new
polymer-­‐based
product
line
used
in
high
thermal
demand
electronic
applica:ons.
Developed
a
market
strategy
and
iden:fied
poten:al
customers
throughout
the
US
and
Asia
(2008).
2. Introduced
a
small
advanced
materials
company
specializing
in
new
polymer
formula:ons
for
packaging
applica:ons
to
poten:al
strategic
partners
to
assist
in
scale-­‐up
and
marke:ng
of
this
technology
(2008).
3. Performed
a
detailed
market
analysis
for
an
advanced
electronic
materials
company
in
China,
delinea:ng
commercial
market
opportuni:es
for
ceramic
products.
Created
a
technology
roadmap
for
this
client
based
on
the
study.
Provided
technical
support
to
implement
the
roadmap
(2007,
2008).
Friday, September 11, 2009

57. 34
Friday, September 11, 2009

58. 34
CMC
Laboratories,
Inc.
7755
South
Research
Drive
Tempe,
AZ
85284
(480)
496-­‐5000
Contact
Us:
info@CMCLaboratories.com
Friday, September 11, 2009