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High-Tech Printed Circuit Boards Overview

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For more than 50 years, Epec has continued its tradition of perfection in engineering and manufacturing printed circuit boards for the most discerning customers. Our years of manufacturing experience provide us with a competitive edge when it comes to PCB layout and design. From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture.

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High-Tech Printed Circuit Boards Overview

  1. 1.  High-Tech Printed Circuit Boards Overview  DELIVERING QUALITY SINCE 1952.
  2. 2. America's Oldest, A History of Innovation  Privately held company, established in 1952.  Estimated 2013: Sales: US$40 Million  100+ Employees Worldwide (70 – North America, 30 – Asia, 3 – Europe)  Design and manufacture customized, built-to-print, performance-critical products for all sectors of the electronics industry.  Leading provider of printed circuit boards, membrane switches, graphic overlays, silicone rubber products, electronic heaters, fans, motors and custom battery packs.  Integrated supply chain management solutions to handle the complexity of today’s global marketplace while making sure that every order is being manufactured at the “right” factory. 2
  3. 3. Global Operations Significant Investment in People and Facilities across the globe. 3
  4. 4. Our Customers - The Top Global OEM’s In Growth Industries 4
  5. 5. Industry Breakdown 5
  6. 6. Technology Road Map 6
  7. 7. Focus on the Right Market  Key Markets to go after: – Industrial • Avionics • Aerospace • Automation – Telecommunications – Information Technologies – Military • Communications • Antenna • Satellite • Ordinance • Aerospace – Medical – Transportation 7
  8. 8. Quickturn PCB Capabilities                 Up to 18 Layers Laminate – FR-4 (All Tg & Td Ranges), CEM-1, Teflon, Ceramic, Polyimide Finished Thickness Up to .300” Minimum Dielectric Spacing = .003” Green, Blue, Red, Black, Clear and White Solder Masks and Legend Inks Immersion Gold, Gold Fingers, Full Body Gold, Bondable Gold Immersion Silver, Immersion Tin, Lead Free HAL, OSP, ENEPIG Minimum Lines & Spaces =.003” Blind & Buried Vias Maximum Panel Size = 24” x 36” Minimum Finished Hole Size = .005” +/- .003” Maximum Hole Aspect Ratio = 15:1 Maximum Copper Weight = 6 oz. (UL Approved) Laser Direct Imaging and Laser Drilling Controlled Impedance +/- 10% Carbon Ink 8
  9. 9. Clear Focus in Manufacturing  Focusing on Technology: – – – – 2.7 Mil Signals 26:1 Via Aspect Ratio Impedance down to 5% Micro via Laser & Stacked Drill and rout – Thermal Solutions & Cavities – Oversize Boards and Backplanes  Backplanes & Back panels – – – – – Up to 24 x 34 panels Up to .400” thickness Hi Performance dielectrics 24 Hour Quickturn are available All surface finishes are available 9
  10. 10. To Be Successful You Need the Right Tools  Laser Direct Imaging: – Orbotech LDI System – 60 Scans per hour w/ 1 Mil signal resolution – 5 Colight Exposure Units – 3 Collimated Exposure Units  Develop Etch & Strip: – – – – – HMS Hollmuller DES Steady State processing Accelerated Cycles Increased thru-put Enhanced yields 10
  11. 11. Continued Investment  Autoclave Vacuum Lamination: – Vacuum Press International – Allows for oversized panels/backplanes – Improves adhesion – Improves tolerance – Reduces Cycle Time 11
  12. 12. Capital Investment  Excellon Dual Laser – – – – – Microvias 3k holes/minute Stacked Vias Laser Trim Laser Route 12
  13. 13. Capital Investment  Drill Optimize & Register: – – – – – Multiline System Real Time x-Ray Sub lam registration Optimize scale factors Enhanced yields 13
  14. 14. PCB Services  Delivery STANDARD LEAD TIME - 20 Working Days Technology 1 Day 2 Day 3 Day 5 Day 7 Day 10 Day 1 - 4 Layers x x x x x x x x x x x x x x x 6 - 10 Layers > 10 Layers Both Prototype and Production Quantities 14
  15. 15. HDI – High Density Interconnect PCB  HDI is a PCB with a higher wiring density per area, finer lines and space, smaller vias and pads than conventional PCB’s.  HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.  To produce HDI boards, laser direct imaging and laser drilling equipment is a must along with investment in other high tech equipment to ensure high quality production. HDI Production Capabilities          Laser Microvias Blind and Buried Via’s Sequential Lamination Via-In-Pad Technology 2/2 lines and spacing Copper filled stacked microvia’s Up to 18 Layers Down to 2 mil dielectrics Tight Impedance Control 15
  16. 16. Value Added Capabilities       Castellated Edges Counter Sinks/Counter Bores – Plated/Non-Plated Standoff’s, Spacers & Pem Nuts Installed Connectors (Soldered/Press Fit) Aluminum Clad Boards Silver Thru Hole Volume Production        FR-4 Custom Board Spacers Ultra Clean Ionic Cleanliness Eyelets Peelable Solder Mask Edge Plating MIL-55110 & 31032 Back Planes  Hole Tolerance +/- .002” 16
  17. 17. Material Used in Fabrication ISOLA ITEQ ROGERS TACNOIC NANYA NELCO AD 370HR IT-140 3003 TMM6 RF-35 NP140 N4000-13 527 CLTE FR406 IT-156 4003 TLT N400013EP 870 CUCLAD FR408 4350 TLX N400013SI 933 DICLAD FR408H R 5870 TLY N4000-6 25FR GX GETEK 5880 TSM30 25N GY IS410 6002 35N LX IS415 6010 Arlon 522 85N ULTRALAM IT-180A TMM10 17
  18. 18. Industry’s Leading Online Tools  Sign up today and try InstantPCBQuote™, the most flexible and user friendly internet quoting and ordering tool in the PCB industry. Try it Now! www.epectec.com/instantpcbquote/ 18
  19. 19. PCB Design and Layout Our Capabilities Encompass The Full Design Flow From Start To Finish Including:           Micro BGA / Micro Via / Blind and Buried Vias Rules Driven Designs Schematic Capture Library Development Database Construction and Verification Signal Integrity/Design Verification EMI Checking Full Document Package Creation Electrical Engineering Expertise We are fully licensed and utilize industry leading tools, including Cadence Allegro, Mentor Expedition, Mentor's PADS, Altium, Valor for DFM Analysis. 19
  20. 20. World Class Quality Assurance & Engineering  US Based QA Capabilities Include: – Full Cross Section/Microsection Reporting and Ionic – – – – Testing Equipment X-Ray Fisherscope for all Metal Thickness & Purity Measurement on every lot. Scienscope DMP-1000 stereo zoom microscope with digital picture capability up to 100x Vision Engineering Mantis Elite for 10X full range visual inspection. World Class Electronics Test Lab  Epec’s superior on-time delivery rates are the result of our significant, dedicated engineering resources and processes. – Perform all DRC, DFM, Graphic Art and Engineering reviews at our Engineering Center outside of Boston, MA – Documentation of all manufacturing and detailed planning processes, for all special requirements, – Consistent documentation and tooling at all manufacturing locations to ensure seamless prototype through production manufacturing. 20
  21. 21. The Epec Value Added Operation The Broker Customer Delivery in 5-8 weeks Send order to the factory broker works with Receive Customer Order 80% On-Time 80% Quality The Epec Operation Receive Customer Order Production Planning matches order with our optimal domestic or Asian facility Complete Epec Eng Analysis, work with customer to resolve all technical and build issues. Continual Epec US & process and Asian on-site Operations technical groups improvement Manufacturing manages program, to order status, Begins optimize on-site; daily delivery and WIP analysis quality through ERP performance System On-site QA Inspection at factory by Epec employees. Product arrives at Epec, is reinspected, final QA is completed before shipping to customer. Customer Delivery in as little as 1 day. 98% On-Time 99.5% Quality 21
  22. 22. Our Products Battery Packs Flex & Rigid-Flex PCB’s User Interfaces Fans & Motors Cable Assemblies Printed Circuit Boards 22
  23. 23. Inventory Management  Customer requirements are always unique and customized, therefore our inventory management system must accommodate for this type of environment.  We Offer: – Kanban – Consignment – JIT Programs – Blanket Orders – Customer Fulfillment – Bonded Warehousing – Kitting – Safety Stock – Other flexible solutions 23
  24. 24. The Difference is Quality and Delivery 1. Quicker Delivery - Epec's technology infrastructure and people, including the Asian and US based operations and engineering teams, enable jobs to get started the same day the order data is electronically received by our factory. 2. Accurate Information - Epec's on-site personnel provide accurate daily Work In Process reports so customers can receive immediate order status information, along with in person verification of all daily reports by Epec staff. 3. Better Quality - Epec ensures higher levels of quality through three key additional processes. On-site QA inspectors at each facility provide an additional audit before it leaves Asia, Epec maintains dual UL approval at each facility with quarterly audits, and perform QA audits at our headquarters in Boston, MA. 4. Flexibility - Each of our manufacturing facilities have been selected for their best-in-class niche product and delivery solutions, ensuring our optimal facility is building every order. 24
  25. 25.  If you require additional information please contact us with any questions or requests. North American Headquarters 174 Duchaine Blvd. New Bedford, MA 02745 Tel: (508) 995-5171 Fax: (508) 998-8694 Contact Us By Email: Sales Quotes Engineering sales@epectec.com quoting@epectec.com engineering@epectec.com Visit Our Website For More Information www.epectec.com Stay Connected with Epec Engineered Technologies Join our Social Community and keep in touch with all our latest technology investments, current news, upcoming events, and promotions. Visit our Social Media Websites for more information. 25

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