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Manufacturing That Eliminates Risk & Improves Reliability
 PCB Capabilities
High-Tech Printed Circuit Board Manufacturer
...
Manufacturing That Eliminates Risk & Improves Reliability
2
America's Oldest, A History of Innovation
 Privately held com...
Manufacturing That Eliminates Risk & Improves Reliability
3
Our Products
Custom Battery Packs Flex & Rigid-Flex PCB’s High...
Manufacturing That Eliminates Risk & Improves Reliability
4
Our Customers - The Top Global
OEMs In Growth Industries
Manufacturing That Eliminates Risk & Improves Reliability
5
PCB Capabilities Summary
 Printed circuit boards have been in...
Manufacturing That Eliminates Risk & Improves Reliability
6
Standard PCB Capabilities
 Up to 34 Layers
 Laminate – FR-4 ...
Manufacturing That Eliminates Risk & Improves Reliability
7
Advanced Capabilities Full Etch Back
 Z Axis Milling
 Edge ...
Manufacturing That Eliminates Risk & Improves Reliability
8
High Technology Capabilities
 High tech PCB’s require careful...
Manufacturing That Eliminates Risk & Improves Reliability
9
RF, Hybrid & Advanced Technologies
 Hybrid construction
typic...
Manufacturing That Eliminates Risk & Improves Reliability
10
Heavy/EXTREME Copper PCB’s
Epec is the industry leader in bui...
Manufacturing That Eliminates Risk & Improves Reliability
11
HDI – High Density Interconnect PCB
 HDI is a PCB with a hig...
Manufacturing That Eliminates Risk & Improves Reliability
12
Equipment Investment
 Laser Direct Imaging
– Tighter Impedan...
Manufacturing That Eliminates Risk & Improves Reliability
13
Certifications & Materials
CERTIFICATIONS
IPC-6012 Class II
I...
Manufacturing That Eliminates Risk & Improves Reliability
14
Design Centers & Technical Support
 Battery Pack & Power Man...
Manufacturing That Eliminates Risk & Improves Reliability
15
Inventory Management
 Customer requirements are always uniqu...
Manufacturing That Eliminates Risk & Improves Reliability
16
The Difference is Measureable
01
WORLD CLASS DESIGNS
With ind...
Manufacturing That Eliminates Risk & Improves Reliability
17
Thank You
Check out our website at www.epectec.com.
For more ...
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PCB Capabilities

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From a complex multi-layer board to a double sided surface mount design, our goal is to provide you a quality product that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper, and production tolerances allow us to provide our customers exactly what they need for their end product.

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PCB Capabilities

  1. 1. Manufacturing That Eliminates Risk & Improves Reliability  PCB Capabilities High-Tech Printed Circuit Board Manufacturer April 2017
  2. 2. Manufacturing That Eliminates Risk & Improves Reliability 2 America's Oldest, A History of Innovation  Privately held company, established in 1952.  Estimated 2017: Sales: US$50 Million  117 Employees Worldwide (84 – North America, 30 – Asia, 3 – Europe)  Design and manufacture customized, build-to-print, performance-critical products for all sectors of the electronics industry.  Leading provider of custom battery packs, flex & rigid-flex PCBs, high reliability SMART user interfaces, energy efficient fans & motors, cable assemblies, and printed circuit boards.  Integrated supply chain management solutions to handle the complexity of today’s global marketplace while making sure that every order is being manufactured at the “right” factory.
  3. 3. Manufacturing That Eliminates Risk & Improves Reliability 3 Our Products Custom Battery Packs Flex & Rigid-Flex PCB’s High Reliability SMART HMIs Energy Efficient Fans & Motors Cable Assemblies Printed Circuit Boards
  4. 4. Manufacturing That Eliminates Risk & Improves Reliability 4 Our Customers - The Top Global OEMs In Growth Industries
  5. 5. Manufacturing That Eliminates Risk & Improves Reliability 5 PCB Capabilities Summary  Printed circuit boards have been in our blood since 1952.  Our PCB offering focuses on high mix – medium/low volume customers who require the highest level of technology and service.  Our experience and dedicated technical resources ensure that our customers get quality product on time. Full Range of Products Standard Technology Typical parameters that we manufacture every day using our well established and documented processes and procedures. 01 Advanced Technology Requires significant investment in engineering time in order to provide the significant technical advantage of these attributes. 02 RF & Hybrid PCB’s Experience in the design and manufacture of PCB’s for analog, digital and mixed signal applications. 03 Heavy/EXTREME Copper PCB’s up to 20 oz and EXTREME Copper to 200 oz. 04 HDI PCBS Containing blind and buried via’s often with microvia’s of .006” or less. 05
  6. 6. Manufacturing That Eliminates Risk & Improves Reliability 6 Standard PCB Capabilities  Up to 34 Layers  Laminate – FR-4 (All Tg & Td Ranges), Teflon, Ceramic, Polyimide  Finished Thickness Up to .478”  Minimum Dielectric Spacing = .003”  Via in Pad and Extreme Copper  Immersion Gold, Gold Fingers, Full Body Gold, Bondable Gold  Immersion Silver, Immersion Tin, Lead Free HAL, OSP, ENEPIG  Minimum Lines & Spaces =.003”  Blind & Buried Vias  Maximum Panel Size = 24” x 36”  Minimum Finished Hole Size = .005” +/- .003”  HDI (Types I, II, III, IV)  Maximum Hole Aspect Ratio = 25:1  Maximum Copper Weight = 6 oz. (UL Approved)  Laser Direct Imaging and Laser Drilling  Controlled Impedance +/- 10%  Conductive Filled Via’s and Back Drilled Vias
  7. 7. Manufacturing That Eliminates Risk & Improves Reliability 7 Advanced Capabilities Full Etch Back  Z Axis Milling  Edge Plating  Micro BGA  Heat Sinks and Thermal Planes  LPI, Dry Film and Epoxy Soldermask  Selective Tin/Lead & Nickel Gold Plating  Up to 6 lamination cycles  Rogers Material in Stock  Mixed and Un-Balanced Copper Constructions  Cu & Aluminum Cores  Exposed Cavities and Air Gaps  Castellated Edges  Counter Sinks/Counter Bores  Standoff’s, Spacers & Pem Nuts Installed  Aluminum Clad Boards
  8. 8. Manufacturing That Eliminates Risk & Improves Reliability 8 High Technology Capabilities  High tech PCB’s require careful attention to design parameters to successfully yield reliable and robust boards and assemblies. Micro Via’s using Laser Drilling Buried Via w/Via Fill
  9. 9. Manufacturing That Eliminates Risk & Improves Reliability 9 RF, Hybrid & Advanced Technologies  Hybrid construction typically involve a low loss material such as Nelco or Rogers combined with another core material like FR-4 Advanced Technologies like filled and plugged via’s require investment in specialized equipment such as: • Vacuum and controlled pressure plugging equipment • Alkaline Permanganate Desmear • Advance Planarization Equipment • Laser/X-Ray Guided Registration for Secondary Drilling FR-4 & Rogers Mixed Copper Hybrid
  10. 10. Manufacturing That Eliminates Risk & Improves Reliability 10 Heavy/EXTREME Copper PCB’s Epec is the industry leader in building Heavy Copper PCB’s up to 20 oz and EXTREME Copper to 200 oz.  Maximum Number of Layers = 50  Laminate – FR-4 (All Tg Ranges), Teflon, Ceramic, Polyimide  Finished Thickness = .020" - 1.500"  Hot Air Solder Leveling (HASL)  Immersion Gold (ENIG) & Immersion Silver  ITAR, Military and AS9100  Blind & Buried Vias  Minimum Holes Size - .008" +.005"/-.008"  Maximum Hole Aspect Ratio = 10:1  Maximum Copper Weight = 200 oz.  Controlled Impedance +/- 10%  Copper forms up to 1” thick can be embedded into the PCB laminate Heavy Copper Production Capabilities Check out our web site for heavy copper production minimums
  11. 11. Manufacturing That Eliminates Risk & Improves Reliability 11 HDI – High Density Interconnect PCB  HDI is a PCB with a higher wiring density per area, finer lines and space, smaller vias and pads than conventional PCB’s.  HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.  To produce HDI boards, investment in laser direct imaging, laser drilling equipment, vacuum controlled pressure plugging equipment, alkaline permanganate desmear, and advance Planarization equipment is a must. HDI Production Capabilities  Microvias & Plated Over Via’s  Blind and Buried Via’s  Sequential Lamination  Via-In-Pad Technology  3/3 lines and spacing  Copper filled stacked microvia’s  Up to 18 Layers  Down to 2 mil dielectrics  Tight Impedance Control
  12. 12. Manufacturing That Eliminates Risk & Improves Reliability 12 Equipment Investment  Laser Direct Imaging – Tighter Impedance Control and No Film Growth due to heat expansion – Layer to Layer Registration within .0004”  Precision DES (Develop-Etch-Strip) – 2 micron variation over the panel – 1 mil core capacity for HDI and rigid flex  Laser Drills – 3:1 Aspect Ratio; .0014” hole with .004” Pad  In Process X-Ray and Automated AOI (Optical Inspection)  This equipment investments helps us get 97% yields on the most demanding technology PCB’s.
  13. 13. Manufacturing That Eliminates Risk & Improves Reliability 13 Certifications & Materials CERTIFICATIONS IPC-6012 Class II IPC-6012 Class 3 (Military) IPC-6012 Class 3 (Hi-Rel) MIL-PRF-55110 MIL-PRF-31032/1 MIL-PRF-50884 MIL-PRF-31032/2 IPC-6013 (Flex, R-Flex) IPC-6016 (HDI/Micro-Via) IPC-6018 (RF) NADCAP Certified AS9100 IPC-1752 Materials Declaration Capable MATERIALS Isola 370HR Sheng Yi ITEQ Polyimide Getek Rogers Taconic Nelco Arlon Panasonic Matsushita DuPont TaiFlex
  14. 14. Manufacturing That Eliminates Risk & Improves Reliability 14 Design Centers & Technical Support  Battery Pack & Power Management – Denver, CO  SMART User Interfaces – Largo, FL  Fans & Motors – Wales, UK  Printed Circuit Boards – New Bedford, MA & Shenzhen, China  Flex & Rigid Flex – Toronto, Canada  Cable Assemblies – Largo, FL  Our Engineering and Design teams are ready to help our customers create world class and cost effective product solutions.
  15. 15. Manufacturing That Eliminates Risk & Improves Reliability 15 Inventory Management  Customer requirements are always unique and customized, therefore our inventory management system must accommodate for this type of environment.  Our Solutions Include: – Kanban – Consignment – JIT Programs – Blanket Orders – Customer Fulfillment – Bonded Warehousing – Kitting – Safety Stock – Other Flexible Solutions
  16. 16. Manufacturing That Eliminates Risk & Improves Reliability 16 The Difference is Measureable 01 WORLD CLASS DESIGNS With industry leading technical resources for all of our product groups, our design and engineering group works with customers to help minimize unit production costs of finished products, reduce project risks, and speed time to market. 02 QUICKER DELIVERY Epec's technology infrastructure and people, including the Asian and US based operations, manufacturing, quality and engineering teams, enable jobs to get started the same day the order is received with no delays due to 24/7 coverage. 03 BETTER QUALITY Epec ensures higher levels of quality through actual investment in all of our processes. Whether it is our 10+ people strong quality organization in Asia, equipping our tech centers with the latest tech gear, or our A3 improvement auditing process, real investment is made to ensure quality. 04 FLEXIBILITY Each of our manufacturing facilities have been selected for their best-in-class niche product, delivery and technology solutions, ensuring our optimal facility is building every order.
  17. 17. Manufacturing That Eliminates Risk & Improves Reliability 17 Thank You Check out our website at www.epectec.com. For more information email sales@epectec.com. Stay Connected with Epec Engineered Technologies Follow us on our social media sites for continuous technical updates and information:

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