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NI enters semi test market. Beginning of the 
end for big-iron ATE? 
Larry Desjardin - August 07, 2014 
NI Week in early August marks the annual migration of National Instrument (NI) users to Austin, 
Texas to learn about the latest products and applications. Joining them are a myriad of NI partners 
and developers, and me – your humble correspondent. Last year I wrote about NI’s strategy being 
the quintessential platform play. By rigorous alignment to a few key platforms, NI is able to address 
an impressively wide set of applications. For automated testing, those key platforms are essentially 
PXI and LabView. Those insights on NI’s strategy are just as relevant today, so if you need a primer, 
you can find it here. 
While the weather for this NI Week was cooler than years before, the product introductions 
remained hot. Top of the list was NI’s entry into semiconductor ATE. 
Whoa! You read that right. NI is joining the ranks of Advantest and Teradyne in offering solutions 
for semiconductor testing, both for design validation and manufacturing. As a side note, your 
humble correspondent is feeling a little less humble today, as I suggested modular-based testers 
would do exactly this in 2012, and most recently in 2013. 
Well, let’s take a look at the tester… 
The first thing to note is that the offering is actually three testers, all based on PXI internally. The 
T1, T2, and T4 systems support one, two, or four PXI chassis, located under the load board. The 
systems are focused on mixed-signal and RF testing, in both development and manufacturing 
applications. An embedded controller running a semiconductor-specific variant of NI TestStand is 
the brains of the system.
Being based on PXI, one could imagine any arbitrary set of PXI modules to be used. Indeed, that is 
the case. However, NI is clearly aiming the system at mixed-signal and RF test, where big-iron ATE 
has the most challenges. To wit, NI introduced four new PXI instruments simultaneously. They are: 
14-bit, 250 MS/s, 300 MHz, 8-channel oscilloscope 
26.5 GHz high-performance RF vector signal analyzer 
12-bit, 2 GS/s, 2 GHz intermediate frequency digitizer 
12.5 Gb/s, 8 TX/8 RX lane high-speed serial instrument 
They are all described by NI as “software-designed instruments”. That is, each has a user-definable 
FPGA that can be customized by the developer using LabView FPGA, a technique I described in 
more detail last year. While these modules are intentionally designed to be dual purpose, that is, 
used in a standard PXI system or embedded in the semiconductor ATE, this is clearly a key 
competitive advantage NI believes they have to address the semiconductor market. 
Let me give an example. On the exhibit floor I spoke to Mauro Arigossi, CEO of Alfamation, a test 
platform provider and system integrator. Alfamation focuses on the testing of automotive and 
consumer electronics. Each is characterized by a wide set of serial protocols that must be tested, or 
at least operated, to test the rest of the DUT (Device Under Test). Mauro told me that Alfamation 
uses the NI FlexRIO modules (those with a customizable FPGA) to create a portfolio of real time 
serial instruments to interface with these unique serial ports. This is essentially the same challenge 
as in the semiconductor testing where protocol-aware DUTs need similar capabilities. NI’s 
introduction of a 8-lane serial instrument brings this capability to higher speeds, as evidenced by 
CPRI emulation being shown at one NI exhibit. 
I spoke with Luke Schreier, Senior Manager at NI, about the product. He stated that NI has been 
successful in design validation of mixed signal ICs with their standard PXI platform, and this was an 
opportunity to explicitly address manufacturing, both of wafers and packaged parts. NI won’t be 
doing final system integration, that will still be left to partners or sophisticated end users. That said, 
Luke pointed out that by standardizing on much of the mechanics, such as the load boards and 
handler interfaces, they can now create an ecosystem around these that make their integrators and 
users more productive. When asked about their competitive advantage, Luke replied that it was 
essentially the same as for PXI: a robust ecosystem of modules, open system, and flexibility. Of 
course, LabView and flexible FPGAs on the modules are an additional competitive advantage they 
maintain above the PXI standard by itself. Finally, Luke disclosed that NI has had an active beta 
program, including at least one single user who was testing upwards of ½ million parts per day. 
Remarkably enough, I had an unplanned meeting with one of the users on the show floor, Dale 
Hensley, Business Unit Manager of RF and Semiconductor at Ball Systems. He described the system 
as “perfect for RF”, as it supported multi-site test, while integrating RF and semiconductor test 
techniques. He has developed both design validation and manufacturing test applications using the 
NI STS system. He gave as an example a 144-pin mixed signal device that included a 
microprocessor, several serial links, three A/D converters, a multiplexer, and a DC power regulator. 
This system has already been delivered to the final end user. 
A chance to speak with "Dr. T" 
While discussing the STS with Dale on the show floor, James Truchard, President, CEO, and 
cofounder of National Instruments wandered by and joined our conversation. Hey- I may not have a 
journalism background, but if I have a name badge that says “PRESS” on it, and a CEO comes up to 
me, I’m going to conduct an interview right there. “Dr. T”, as he is called by employees, was happy
to answer my questions. So, EDN readers, here is an exclusive interview with Dr. T: 
What does this entrance into semiconductor test mean for your company? 
Dr. T described technical “convergence” giving NI this opportunity. He pointed out that traditional 
semiconductor ATE has a “big envelope, even for a few pins”. This was driven by big parallel digital 
DUTs needing big–iron solutions. But “Systems on a Chip with integrated A/Ds have changed the 
rules how ATE systems should be built”. This change, which Dr. T described as a “convergence” 
matches the platform architecture NI has. 
Semiconductor test is notoriously volatile, how will Wall Street accept your entrance into this 
market? 
Dr. T says that the investors “have known us for years” and are appreciative that NI has a “broader 
base” than traditional semiconductor ATE. Due to NI’s broad base of applications, NI is “more 
resilient” and supports a “better cost structure” than dedicated ATE vendors. In fact, all the internal 
PXI modules are also sold on the wider test and measurement market, further reducing volatility. 
What do you see as your key competitive advantages? 
Continuing with the theme of the leverage of PXI modules, Dr. T pointed out that this now gives NI 
“the ability to go from the lab to manufacturing” using the same products and software. This has 
been the “holy grail for the past decade” in semiconductor test, and NI is now going to deliver on it. 
Dr. T also noted the individual advantages of certain modules. The 26.5GHz VSA (vector signal 
analyzer) sports 765MHz of bandwidth. Though not the center of semiconductor testing, “we can 
now do work in real time spectrum analysis” by deploying one or multiple VSAs, all customizable 
with a user-configurable FPGAs. 
Summary. 
So, there you have it. The PXI ecosystem, which has been a disruptor to the traditional automated 
test market, is now a challenger to semiconductor ATE. Personally, I think mixed-signal and RF 
semi testing will definitely go to this new model. In fact, I gave the keynote talk at Silicon Valley 
Test Workshop in August 2012, where I made this exact prediction. I noted there that if you look at 
three axis: DUT integration, lifecycle, and amount of digital and analog testing, you will see that big-iron 
is optimized for one combination- manufacturing test of digital ICs. Once you deviate from that 
combination on any axis, the value proposition of big-iron testers becomes much weaker, and is at 
risk. 
And that presents on opportunity for a disruptive change. NI has seized it. The question now is who 
else may seize it too. If you are an incumbent big-iron vendor, your natural response may be to try 
to invalidate the architecture in the customer's mind through marketing presentations. That would 
be a grave mistake. If you are tempted to do this, do your company a favor, and read this first. 
Don't become a case study along with Swiss watch makers. 
See also: 
National Instruments adds to its platforms
Semiconductor test: an application for modular instruments? 
The innovator’s dilemma

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Beginning of the end for big iron ATE?

  • 1. NI enters semi test market. Beginning of the end for big-iron ATE? Larry Desjardin - August 07, 2014 NI Week in early August marks the annual migration of National Instrument (NI) users to Austin, Texas to learn about the latest products and applications. Joining them are a myriad of NI partners and developers, and me – your humble correspondent. Last year I wrote about NI’s strategy being the quintessential platform play. By rigorous alignment to a few key platforms, NI is able to address an impressively wide set of applications. For automated testing, those key platforms are essentially PXI and LabView. Those insights on NI’s strategy are just as relevant today, so if you need a primer, you can find it here. While the weather for this NI Week was cooler than years before, the product introductions remained hot. Top of the list was NI’s entry into semiconductor ATE. Whoa! You read that right. NI is joining the ranks of Advantest and Teradyne in offering solutions for semiconductor testing, both for design validation and manufacturing. As a side note, your humble correspondent is feeling a little less humble today, as I suggested modular-based testers would do exactly this in 2012, and most recently in 2013. Well, let’s take a look at the tester… The first thing to note is that the offering is actually three testers, all based on PXI internally. The T1, T2, and T4 systems support one, two, or four PXI chassis, located under the load board. The systems are focused on mixed-signal and RF testing, in both development and manufacturing applications. An embedded controller running a semiconductor-specific variant of NI TestStand is the brains of the system.
  • 2. Being based on PXI, one could imagine any arbitrary set of PXI modules to be used. Indeed, that is the case. However, NI is clearly aiming the system at mixed-signal and RF test, where big-iron ATE has the most challenges. To wit, NI introduced four new PXI instruments simultaneously. They are: 14-bit, 250 MS/s, 300 MHz, 8-channel oscilloscope 26.5 GHz high-performance RF vector signal analyzer 12-bit, 2 GS/s, 2 GHz intermediate frequency digitizer 12.5 Gb/s, 8 TX/8 RX lane high-speed serial instrument They are all described by NI as “software-designed instruments”. That is, each has a user-definable FPGA that can be customized by the developer using LabView FPGA, a technique I described in more detail last year. While these modules are intentionally designed to be dual purpose, that is, used in a standard PXI system or embedded in the semiconductor ATE, this is clearly a key competitive advantage NI believes they have to address the semiconductor market. Let me give an example. On the exhibit floor I spoke to Mauro Arigossi, CEO of Alfamation, a test platform provider and system integrator. Alfamation focuses on the testing of automotive and consumer electronics. Each is characterized by a wide set of serial protocols that must be tested, or at least operated, to test the rest of the DUT (Device Under Test). Mauro told me that Alfamation uses the NI FlexRIO modules (those with a customizable FPGA) to create a portfolio of real time serial instruments to interface with these unique serial ports. This is essentially the same challenge as in the semiconductor testing where protocol-aware DUTs need similar capabilities. NI’s introduction of a 8-lane serial instrument brings this capability to higher speeds, as evidenced by CPRI emulation being shown at one NI exhibit. I spoke with Luke Schreier, Senior Manager at NI, about the product. He stated that NI has been successful in design validation of mixed signal ICs with their standard PXI platform, and this was an opportunity to explicitly address manufacturing, both of wafers and packaged parts. NI won’t be doing final system integration, that will still be left to partners or sophisticated end users. That said, Luke pointed out that by standardizing on much of the mechanics, such as the load boards and handler interfaces, they can now create an ecosystem around these that make their integrators and users more productive. When asked about their competitive advantage, Luke replied that it was essentially the same as for PXI: a robust ecosystem of modules, open system, and flexibility. Of course, LabView and flexible FPGAs on the modules are an additional competitive advantage they maintain above the PXI standard by itself. Finally, Luke disclosed that NI has had an active beta program, including at least one single user who was testing upwards of ½ million parts per day. Remarkably enough, I had an unplanned meeting with one of the users on the show floor, Dale Hensley, Business Unit Manager of RF and Semiconductor at Ball Systems. He described the system as “perfect for RF”, as it supported multi-site test, while integrating RF and semiconductor test techniques. He has developed both design validation and manufacturing test applications using the NI STS system. He gave as an example a 144-pin mixed signal device that included a microprocessor, several serial links, three A/D converters, a multiplexer, and a DC power regulator. This system has already been delivered to the final end user. A chance to speak with "Dr. T" While discussing the STS with Dale on the show floor, James Truchard, President, CEO, and cofounder of National Instruments wandered by and joined our conversation. Hey- I may not have a journalism background, but if I have a name badge that says “PRESS” on it, and a CEO comes up to me, I’m going to conduct an interview right there. “Dr. T”, as he is called by employees, was happy
  • 3. to answer my questions. So, EDN readers, here is an exclusive interview with Dr. T: What does this entrance into semiconductor test mean for your company? Dr. T described technical “convergence” giving NI this opportunity. He pointed out that traditional semiconductor ATE has a “big envelope, even for a few pins”. This was driven by big parallel digital DUTs needing big–iron solutions. But “Systems on a Chip with integrated A/Ds have changed the rules how ATE systems should be built”. This change, which Dr. T described as a “convergence” matches the platform architecture NI has. Semiconductor test is notoriously volatile, how will Wall Street accept your entrance into this market? Dr. T says that the investors “have known us for years” and are appreciative that NI has a “broader base” than traditional semiconductor ATE. Due to NI’s broad base of applications, NI is “more resilient” and supports a “better cost structure” than dedicated ATE vendors. In fact, all the internal PXI modules are also sold on the wider test and measurement market, further reducing volatility. What do you see as your key competitive advantages? Continuing with the theme of the leverage of PXI modules, Dr. T pointed out that this now gives NI “the ability to go from the lab to manufacturing” using the same products and software. This has been the “holy grail for the past decade” in semiconductor test, and NI is now going to deliver on it. Dr. T also noted the individual advantages of certain modules. The 26.5GHz VSA (vector signal analyzer) sports 765MHz of bandwidth. Though not the center of semiconductor testing, “we can now do work in real time spectrum analysis” by deploying one or multiple VSAs, all customizable with a user-configurable FPGAs. Summary. So, there you have it. The PXI ecosystem, which has been a disruptor to the traditional automated test market, is now a challenger to semiconductor ATE. Personally, I think mixed-signal and RF semi testing will definitely go to this new model. In fact, I gave the keynote talk at Silicon Valley Test Workshop in August 2012, where I made this exact prediction. I noted there that if you look at three axis: DUT integration, lifecycle, and amount of digital and analog testing, you will see that big-iron is optimized for one combination- manufacturing test of digital ICs. Once you deviate from that combination on any axis, the value proposition of big-iron testers becomes much weaker, and is at risk. And that presents on opportunity for a disruptive change. NI has seized it. The question now is who else may seize it too. If you are an incumbent big-iron vendor, your natural response may be to try to invalidate the architecture in the customer's mind through marketing presentations. That would be a grave mistake. If you are tempted to do this, do your company a favor, and read this first. Don't become a case study along with Swiss watch makers. See also: National Instruments adds to its platforms
  • 4. Semiconductor test: an application for modular instruments? The innovator’s dilemma