Lessons for MEMS Test Engineers - Ira Feldman 111020

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Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers presentation at MEMS Testing and Reliability 3rd Annual Conference (October 20, 2011) by Ira Feldman (www.hightechbizdev.com)

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Lessons for MEMS Test Engineers - Ira Feldman 111020

  1. 1. Feldman Engineering Semiconductor Wafer Test Technology and Trends:Lessons for MEMS Test Engineers Ira Feldman October 20, 2011 MEMS Testing & Reliability Conference 2011 © 2011 Feldman Engineering Corp.
  2. 2. MEMS Testing & Reliability Conference 2011Outline}  Market Dynamics}  Testing Semiconductors vs. MEMS}  Cost of Test }  Semiconductor Solutions}  MEMS Challenges}  MEMS @ Semiconductor Wafer Test Workshop}  Conclusion 2
  3. 3. MEMS Testing & Reliability Conference 2011 ~ 5.5 B Units“MEMS Roadmap: From Device to Function” Jean-Christophe Eloy, Semicon West 2011 3
  4. 4. DRAM MEMS Testing & Reliability Conference 2011 ~ 17.4 B Units in 2011http://www.dramexchange.com/Market/market_activity.aspx 4
  5. 5. Cost of Test – Constant Pressure MEMS Testing & Reliability Conference 2011“Wafer Level Testing – Challenges and Opportunities” Vikas Sharma, Intel Corporation 5
  6. 6. Package Proliferation MEMS Testing & Reliability Conference 2011“Backend to the Front Line” William Chen, ASE Group, SWTW 2011 6
  7. 7. MEMS Testing & Reliability Conference 2011Outline}  Market Dynamics}  Testing Semiconductors vs. MEMS}  Cost of Test }  Semiconductor Solutions}  MEMS Challenges}  MEMS @ Semiconductor Wafer Test Workshop}  Conclusion 7
  8. 8. Device Testing MEMS Testing & Reliability Conference 2011 DeviceStimulus Under Test Response Correct? (DUT) 8
  9. 9. Traditional Wafer Probe Test Cell MEMS Testing & Reliability Conference 2011 Stimulus Electrical DUT Response Thermal Verigy / Advantest 9
  10. 10. Stimulus & Response - Traditional MEMS Testing & Reliability Conference 2011 Electrical Device Under Test Electrical (DUT) Thermal •  Semiconductors •  Oscillators •  MEMS switches •  MEMS filters •  MEMS oscillators 10
  11. 11. Stimulus & Response - Optical MEMS Testing & Reliability Conference 2011 Electrical Device Electrical Thermal Under Test (DUT) Optical •  Image Sensors Optical •  LEDs •  Micro- / Pico - projectors (DLP, etc.) •  Micro bolometers 11
  12. 12. Stimulus & Response – MEMS Sensors MEMS Testing & Reliability Conference 2011 Electrical Thermal Electrical Device Under Test Motion (DUT) Pressure •  Accelerometers Magnetic •  Gyroscopes •  Magnetic Compass •  Microphones •  Speakers •  Pressure sensors Pressure … 12
  13. 13. Stimulus & Response – Life Science + ? MEMS Testing & Reliability Conference 2011 Electrical Electrical Thermal Device Under Test Mass Mass (DUT) • Valves •  Pumps Optical •  Mixers Optical •  Micro reactors •  Sensors •  Micro explosives …Mass include movement of material in / out of DUT such as fluids & gas. 13
  14. 14. Device Testing MEMS Testing & Reliability Conference 2011 DeviceStimulus Under Test Response Correct? (DUT) 14
  15. 15. MEMS Testing & Reliability Conference 2011Outline}  Market Dynamics}  Testing Semiconductors vs. MEMS}  Cost of Test }  Semiconductor Solutions}  MEMS Challenges}  MEMS @ Semiconductor Wafer Test Workshop}  Conclusion 15
  16. 16. Cost of Test Drivers MEMS Testing & Reliability Conference 2011 Increasing Tighter test pad frequency pitchesIncreasing Increasingtransistor probe count Increased count Cost 16
  17. 17. Semiconductor Cost - Test Solutions MEMS Testing & Reliability Conference 2011 Test Increased Test LowerReduction Parallelism Partitioning Cost Silicon Velocity 17
  18. 18. www.bobsspaceracers.com Confl Intuit icting ive S olutio & Cou ns nter18 MEMS Testing & Reliability Conference 2011
  19. 19. Semiconductor Cost - Test Solutions MEMS Testing & Reliability Conference 2011 Test Increased Test LowerReduction Parallelism Partitioning Cost Silicon Velocity 19
  20. 20. MEMS Testing & Reliability Conference 2011 TestReduction -  Test Escapes -  Run time complexity +  Statistical based sampling +  Test elimination 20
  21. 21. MEMS Testing & Reliability Conference 2011IncreasedParallelism -  Increased probe card cost -  Increased tester resources + Decreased handling time + Greater prober amortization + Reduced floor space + Increased Silicon Velocity 21
  22. 22. MEMS Testing & Reliability Conference 2011 TestPartitioning -  Increased process steps -  Increased process complexity +  Optimized high-cost ATE 22
  23. 23. MEMS Testing & Reliability Conference 2011 23“Bemo – Nemo – Remo, The Trifurcation of the ATE Industry”, Jim Healy, Sony LSI Design, ATE Vision July 2011
  24. 24. MEMS Testing & Reliability Conference 2011Outline}  Market Dynamics}  Testing Semiconductors vs. MEMS}  Cost of Test }  Semiconductor Solutions}  MEMS Challenges}  MEMS @ Semiconductor Wafer Test Workshop}  Conclusion 24
  25. 25. Manual Alignment MEMS Testing & Reliability Conference 2011 www.vortexcontrolsystems.com 25Electroglas 2001 ca. 1982-5
  26. 26. Technoprobe Cantilever & Blade SV Probe26 MEMS Testing & Reliability Conference 2011
  27. 27. MEMS Testing & Reliability Conference 2011 ole eH cop ic ros ulus? l M rical stim igia n-elect est r no V fo pathVerigy V5400 Testhead 27
  28. 28. MEMS Testing & Reliability Conference 2011Vertical - Buckling Beam FormFactor: “MEMS for ProbeCard Applications” Chong Chan Pin – Semicon Singapore 2010 Mann: SWTW Tutorial 2004 SV Probe “Trio” JEM “VC” 28
  29. 29. MEMS Testing & Reliability Conference 2011Vertical - Buckling BeamMicroProbe: Apollo Vertical JEM:VC SV Probe: Trio 29
  30. 30. MEMS Testing & Reliability Conference 2011 MEMS - VerticalMicrofabrica MicroProbe FormFactor (T1) MicroProbe (Vx-MP) 30
  31. 31. MEMS Testing & Reliability Conference 2011MEMS - Micro CantileverMicrofabrica FormFactor (T3) MJC (U Probe) http://www.mjc.co.jp/eng/ir/pdf/MJC070226-s.pdf JEM 31
  32. 32. Vertical Probe Head MEMS Testing & Reliability Conference 2011 Printed Circuit Board BGA (Solder Attach) Space TransformerUpper Guide Plate SpacerLower Guide PlateMicroProbe Apollo Probes 32
  33. 33. FormFactor CMOS Imaging Solution MEMS Testing & Reliability Conference 2011 Stiffener PCB Probe Head 33
  34. 34. MEMS Testing & Reliability Conference 2011Outline}  Market Dynamics}  Testing Semiconductors vs. MEMS}  Cost of Test }  Semiconductor Solutions}  MEMS Challenges}  MEMS @ Semiconductor Wafer Test Workshop}  Conclusion 34
  35. 35. SWTW 2011 MEMS Testing & Reliability Conference 2011"MSO - Multi-Site Optimizer" Kevin Fredriken (SPA GmbH - Germany)•  MEMS device alternating rotation across wafer à required two probe passes.•  No probe of cap or wafer exclusion zone•  Developed four site probe card and stepping algorithm using MSO. Inclusive probing with multi-probes on some die. 35
  36. 36. SWTW 2011 MEMS Testing & Reliability Conference 2011 "Probe to Pad Placement Error Correction for Wafer Level S- Parameter Measurements" Steven Ortiz (Avago Technologies - USA)•  FBAR structure – resonator plus cap wafer.Vias through cap wafer to resonator.•  Due to very high frequency and tight specification tolerance, very sensitive to location of probes on pad. à Implemented “calibration” structures to de- embed the measurements. 36
  37. 37. SWTW 2011 MEMS Testing & Reliability Conference 2011 "Ghosting - Touchdown Reduction Using Alternate Site Sharing" Doron Avidar and Yossi Dadi (Micron - Israel)When using large multisite arrays that need > 3 touchdowns / wafer, “ghosting” may save several touchdowns. Examples showed12 to 20% savings. 37
  38. 38. MEMS Testing & Reliability Conference 2011Summary}  Proven semiconductor cost reduction techniques }  Not always intuitive }  Require test engineering }  Can be applied to MEMS}  MEMS wafer test challenge }  Multi-site stimulus and response }  Proper probe card architectures required }  Solution integration support 38
  39. 39. MEMS Testing & Reliability Conference 2011Resources}  IEEE Semiconductor Wafer Test Workshop (SWTW) }  http://www.swtest.org}  International SEMATECH Manufacturing Initiative (ISMI) Probe Card Cost Model }  http://ismi.sematech.org/modeling/probeCOO.htm}  SEMI E35-0307 }  Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment 39
  40. 40. MEMS Testing & Reliability Conference 2011 Thank You! Ira Feldmanira@feldmanengineering.com Visit my blog www.hightechbizdev.comfor additional test resources. 40

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