Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) Referneces :- * Aqueous electrophoretic deposition (epd) Part - 1 : http://goo.gl/aH06fC * Aqueous electrophoretic deposition (epd) Part - 2 : http://goo.gl/tu9F4Y * Aqueous electrophoretic deposition (epd) Part - 3 : http://goo.gl/hreKCr*

1. APPLICATION OFAPPLICATION OF PULSED DCPULSED DC TO SUPPRESSTO SUPPRESS
BUBBLE INCORPORATION & CONTROL DEPOSITBUBBLE INCORPORATION & CONTROL DEPOSIT
MORPHOLOGY DURING AQUEOUSMORPHOLOGY DURING AQUEOUS
ELECTROPHORETIC DEPOSITION (EPD)ELECTROPHORETIC DEPOSITION (EPD)
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Part - 4Part - 4

2. Mechanism
1.How the particles maintain
electrophoretic mobility during pulse
OFF time.
2.Why the bubble incorporation decreases
at lower pulse widths.
??

3. Mechanisms

4. Mechanism

5. Mechanisms

6. Pulsed EPD in High Magnetic Field

7. Pulsed EPD in High Magnetic Field

8. Pulsed EPD in High Magnetic Field

9. Anodic pulse EPD

10. Summary
 Application of Pulse voltage/current of suitable width and duty cycle enabled smooth, bubble-free deposit by EPD
from aqueous suspension.
 Yield from pulsed –EPD is generally less than continuous DC EPD. Yield decreases with decrease in pulse width.
 A narrow window exists in the Voltage/current vs. pulse width plot within which bubble-free deposit is obtained.
 There is no deposition at pulse widths below the window.
 Deposit with incorporated bubbles form at pulse widths above the window.
 The window is wider and lies at higher pulse widths for low applied potential/currents compared to higher
potential/currents.
 Decrease in bubble incorporation at lower pulse widths is due to low discrete amount of H2 generation per pulse and
its uniform dissipation as micro and nano-bubbles which dont coalesce to form macro-bubbles.
 Pulsed EPD will enable reduction in cost of EPD as it promises to use aqueous suspension and replace the
conventionally used organic solvents which are expensive and not environmental friendly.

11. Acknowledgements
Prof. Y. Sakka for giving me an opportunity to work in
this Group.
Dr. T. Uchikoshi for being my host researcher.
All the researchers in the group for their invaluable help
and discussion.
Ms. Miki, Ms. Kon and Ms.Nakaizumi for help in
experiments.
Ms. Tamiya & Ms. Yamaguchi for the administrative help.
NIMS for the Post-doctoral fellowship.
All the friends for making my time in Japan a memorable
one.

12. APPLICATION OFAPPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLETO SUPPRESS BUBBLE
INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURINGINCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING
AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)
THANK YOU
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