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Benchmark of Metal Strip
Current Sensing Resistors
   I.     Specification Comparison
   II.    Appearance Observations
   III.   Manufacturing Processes
   IV.    Characteristic Analysis
   V.     Summary
I. Specification Comparison

 Company


  Model         WMCS series      WSL series            LR series         RL series     RLM series

  Power       2W (1mW≦R≦100mW)   2W (R≦10mΩ)       2W (0.5mΩ≦R≦75mΩ) 2W (R≦2mΩ) 2W (R≦10mW)

  Rating      1W (1mW≦R≦200mW)   1W (R>10mΩ)       1W (0.5mΩ≦R≦100mΩ) 1W (R>2mΩ)       1W (R>10mW)
                                    275ppm/°C             50ppm/°C         200ppm/°C     275ppm/°C
                                   (R≦2.9mΩ)          (0.5mΩ≦R≦3mΩ)       (R≦2.9mΩ)       (R≦2mΩ)
                                     150ppm/°C            -25ppm/°C        100ppm/°C      100ppm/°C
                   ±50ppm/°C     (2.9mΩ<R≦4.9mΩ)      (3.1mΩ<R≦6.9mΩ)   (3mΩ<R≦10mΩ)   (2mΩ<R≦10mΩ)
   TCR          (1mW≦R≦200mΩ)        110ppm/°C           -15ppm/°C        50ppm/°C       75ppm/°C
                                 (4.9mΩ<R≦6.9mΩ)      (7mΩ≦R>10mΩ)        (R>10mΩ)       (R>10mΩ)
                                     75ppm/°C
                                    (R>6.9mΩ)
 Resistance
                 1mΩ~200mΩ        1mΩ~500mΩ           0.5mΩ~100mΩ       1mΩ~50mΩ       1mΩ~100mΩ
   Range
 Operating
                 -55°C~+170°C    -65°C~+170°C         -65°C~+275°C      -55°C~+170°C   -55°C~+170°C
Temp. Range
II. Appearance Observations


 Company




 Top View



Bottom View



 Side View
III. Manufacturing Processes
                Wellcomp WMCS series




      Metal foil/substrate   Cu electrode     Resistance
         lamination           formation       trimming




        Over-coating           Marking      Cu/Ni/Sn Plating
III. Manufacturing Processes
                   Vishay WSL series




    NiCr foil   Cu electrode welding   Trimming   Over-coating




    Marking        Terminal plating
III. Manufacturing Processes
                        GTC LR series


                                                         010
     Resistance
                                 Molding                 Marking
     formation




                    010                        010
                  Cu electrode
                                           Terminal Plating
                  combination
III. Manufacturing Processes
                    Cyntec RL series




        Substrate      Metal foil/substrate      Trimming
                          lamination




        Over-coating         Marking          Terminal plating
III. Manufacturing Processes
                    TA-I RLM series




    Resistance
                    Molding    Marking   Cu plating
    formation




   Cutting and Sn
                     Sorting
       plating
IV. Characteristic Analysis

        TCR (Temperature Coefficient of Resistance)

    Company


                    WMCS2512   WSL2512   LR2512   RL3264   RLM2512
      Item            R010      R010      R010     R010     R010


 R1 at 25°C (mW)      9.98       9.96     9.97     10.02    10.02



 R2 at 125°C (mW)     9.97       9.98     9.96     10.03     9.99



  TCR (ppm/°C)        -10.02    20.08    -10.03    9.98     -29.94
IV. Characteristic Analysis
        STOL (short time over load) test
        Test condition:
         Power:5W           Current:22.4A           Loading Time:5 seconds

     Power                                  5W


 Company


             MAX   0.02%       0.04%        0.03%        0.08%     0.03%
Resistance
Variation




             MIN   0.01%       0.01%        0.01%        0.02%     0.01%

             AVG   0.011%     0.023%        0.02%        0.05%     0.013%
IV. Characteristic Analysis
        STOL (short time over load) test
        Test condition:
         Power:10W          Current:31.6A         Loading Time:5 seconds

     Power                                  10W


 Company


             MAX   0.06%      0.32%     0.28%         0.26%      0.15%
Resistance
Variation




             MIN   0.01%      0.11%     0.13%         0.02%      0.02%

             AVG   0.038%     0.243%    0.178%        0.133%    0.092%
IV. Characteristic Analysis
    Device Surface Temperature
    Test Condition: Current:10A    Loading Time:10min




          Wellcomp             Vishay              GTC




                     TA-I                Cyntec
V. Summary
 Company         Wellcomp                Vishay               GTC                Cyntec                  TA-I
                   WMCS
   Model                             WSL series LR Seroes RL series RLM Series
                   series
                                     Combination of the Combination of the                    Metal foil body with
               Metal foil on ceramic                                          Metal foil on
                                      metal foil and the metal foil and the                     copper plating
                     substrate                                              ceramic substrate
Construction                         electrode material electrode material                        electrodes



               1.High chip size      1. Lower terminal 1. Lead-free         1. Low device           1. Well mass
                  ability                resistance        product             working                 production ability
                  (From 0805~2512) 2. Lead-free         2. Lower terminal      temperature          2. Lead-free product
               2. Low device              product          resistance       2. Lead-free product
 Advantage       working temperature                                        3. High device
               3. Lead-free product                                             thermal stability
               4. High thermal
                  stability
               1. Not well known     1. High material   1. High material    1. High process         1. High device
                   yet                   cost              cost                 control cost        working temperature
                                     2. High human      2. High human       2. Longer lead time     2. Poor soldering
                                        source request     source request                            especially at small
Disadvantage
                                      for the assembling for the assembling                          size device.
                                                        3. Weak overcoating

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Benchmark of metal strip current sensing resistors 20101203

  • 1. Benchmark of Metal Strip Current Sensing Resistors I. Specification Comparison II. Appearance Observations III. Manufacturing Processes IV. Characteristic Analysis V. Summary
  • 2. I. Specification Comparison Company Model WMCS series WSL series LR series RL series RLM series Power 2W (1mW≦R≦100mW) 2W (R≦10mΩ) 2W (0.5mΩ≦R≦75mΩ) 2W (R≦2mΩ) 2W (R≦10mW) Rating 1W (1mW≦R≦200mW) 1W (R>10mΩ) 1W (0.5mΩ≦R≦100mΩ) 1W (R>2mΩ) 1W (R>10mW) 275ppm/°C 50ppm/°C 200ppm/°C 275ppm/°C (R≦2.9mΩ) (0.5mΩ≦R≦3mΩ) (R≦2.9mΩ) (R≦2mΩ) 150ppm/°C -25ppm/°C 100ppm/°C 100ppm/°C ±50ppm/°C (2.9mΩ<R≦4.9mΩ) (3.1mΩ<R≦6.9mΩ) (3mΩ<R≦10mΩ) (2mΩ<R≦10mΩ) TCR (1mW≦R≦200mΩ) 110ppm/°C -15ppm/°C 50ppm/°C 75ppm/°C (4.9mΩ<R≦6.9mΩ) (7mΩ≦R>10mΩ) (R>10mΩ) (R>10mΩ) 75ppm/°C (R>6.9mΩ) Resistance 1mΩ~200mΩ 1mΩ~500mΩ 0.5mΩ~100mΩ 1mΩ~50mΩ 1mΩ~100mΩ Range Operating -55°C~+170°C -65°C~+170°C -65°C~+275°C -55°C~+170°C -55°C~+170°C Temp. Range
  • 3. II. Appearance Observations Company Top View Bottom View Side View
  • 4. III. Manufacturing Processes Wellcomp WMCS series Metal foil/substrate Cu electrode Resistance lamination formation trimming Over-coating Marking Cu/Ni/Sn Plating
  • 5. III. Manufacturing Processes Vishay WSL series NiCr foil Cu electrode welding Trimming Over-coating Marking Terminal plating
  • 6. III. Manufacturing Processes GTC LR series 010 Resistance Molding Marking formation 010 010 Cu electrode Terminal Plating combination
  • 7. III. Manufacturing Processes Cyntec RL series Substrate Metal foil/substrate Trimming lamination Over-coating Marking Terminal plating
  • 8. III. Manufacturing Processes TA-I RLM series Resistance Molding Marking Cu plating formation Cutting and Sn Sorting plating
  • 9. IV. Characteristic Analysis TCR (Temperature Coefficient of Resistance) Company WMCS2512 WSL2512 LR2512 RL3264 RLM2512 Item R010 R010 R010 R010 R010 R1 at 25°C (mW) 9.98 9.96 9.97 10.02 10.02 R2 at 125°C (mW) 9.97 9.98 9.96 10.03 9.99 TCR (ppm/°C) -10.02 20.08 -10.03 9.98 -29.94
  • 10. IV. Characteristic Analysis  STOL (short time over load) test  Test condition: Power:5W Current:22.4A Loading Time:5 seconds Power 5W Company MAX 0.02% 0.04% 0.03% 0.08% 0.03% Resistance Variation MIN 0.01% 0.01% 0.01% 0.02% 0.01% AVG 0.011% 0.023% 0.02% 0.05% 0.013%
  • 11. IV. Characteristic Analysis  STOL (short time over load) test  Test condition: Power:10W Current:31.6A Loading Time:5 seconds Power 10W Company MAX 0.06% 0.32% 0.28% 0.26% 0.15% Resistance Variation MIN 0.01% 0.11% 0.13% 0.02% 0.02% AVG 0.038% 0.243% 0.178% 0.133% 0.092%
  • 12. IV. Characteristic Analysis  Device Surface Temperature  Test Condition: Current:10A Loading Time:10min Wellcomp Vishay GTC TA-I Cyntec
  • 13. V. Summary Company Wellcomp Vishay GTC Cyntec TA-I WMCS Model WSL series LR Seroes RL series RLM Series series Combination of the Combination of the Metal foil body with Metal foil on ceramic Metal foil on metal foil and the metal foil and the copper plating substrate ceramic substrate Construction electrode material electrode material electrodes 1.High chip size 1. Lower terminal 1. Lead-free 1. Low device 1. Well mass ability resistance product working production ability (From 0805~2512) 2. Lead-free 2. Lower terminal temperature 2. Lead-free product 2. Low device product resistance 2. Lead-free product Advantage working temperature 3. High device 3. Lead-free product thermal stability 4. High thermal stability 1. Not well known 1. High material 1. High material 1. High process 1. High device yet cost cost control cost working temperature 2. High human 2. High human 2. Longer lead time 2. Poor soldering source request source request especially at small Disadvantage for the assembling for the assembling size device. 3. Weak overcoating