A wireless sensor network is proposed to monitor a building and assess earthquake damage using custom-developed capacitive micro electro mechanical systems strain and 3-D acceleration sensors with a low power readout application specified integrated circuit providing a battery life of up to 12 years. The strain sensors would be mounted at the base of the building to measure settlement and plastic hinge activation after an earthquake, while accelerometers mounted on each floor would measure the building's seismic response during an earthquake by recording local and cross-building acceleration data. A low power multi-hop network architecture was implemented for data transmission using a custom patch antenna designed for the frequency band to obtain robust links under real world conditions.