This document discusses micromachining and laser micromachining. It defines micromachining as manufacturing parts between 1 to 500 micrometers in size for miniaturized devices. Laser micromachining uses high power laser beams to precisely remove material without contact or thermal damage. It has advantages over other micromachining methods like high resolution, clean cuts, and ability to machine transparent materials. The document covers the basics of micromachining techniques and processes, as well as applications like manufacturing injection nozzles and micro surgical tools.

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Seminar
On
Micromachining

2.  Introduction
 What is Micromachining?
 Important aspects
 Why Micro Machining?
 Classification According to Machining phenomena
 Laser micro machining
 Laser Micromachining Process
 Conceptual Solid Model of Laser Micromachining Setup
 Advantages of Laser Micromachining
 Conclusion

3.  Implies parts are made to the size of 1 to
999µm
 By the definition micro engg: as the field
where component sizes are a few
millimeters

4.  Micromachining is the basic technology for
fabrication of micro-components of size in the range
of 1 to 500 micrometers.
 Their need arises from miniaturization of various
devices in science and engineering, calling for ultra-
precision manufacturing and micro-fabrication.

5. Unit removal
Equipment precision

6.  Why Micro Machining? Present day High-tech Industries,
Design requirements are stringent.
 Extraordinary Properties of Materials (High Strength,
High heat Resistant, High hardness, Corrosion resistant
etc) Complex 3D Components (Turbine Blades)
Miniature Features (filters for food processing and textile
industries having few tens of microns as hole diameter
and thousands in number) Nano level surface finish on
Complex geometries (thousands of turbulated cooling
holes in a turbine blade) Making and finishing of micro
fluidic channels (in electrically conducting & non
conducting materials, say glass, quartz, &ceramics).

7. 1. Removal by mechanical force
2. Removal by ablation
3. Removal by dissolution
4. Plastic deformation

8. Uses a power source (FS laser,
Excimer laser) that emits a beam
with very high quantum energy.

11.  Non-contact machining
 Very high resolution, repeatability and aspect ratios
 Localized heating, minimal redeposition
 No pre/post processing of material
 Wide range of materials: fragile, ultra-thin and highly
reflective surfaces
 Process can be fully automated

12.  Very high peak powers in the range 1013W/cm2
provide for minimal thermal damage to surroundings
 Very clean cuts with high aspect ratios
 Sub-micron feature resolution
 Minimal redeposition
 Possible to machine transparent materials like glass,
sapphire etc

17. 0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0 10 20 30 40 50
Energy Density (J/cm2
)
Ablation
Rate
(μm/pulse)

18. 0
100
200
300
400
500
600
700
800
900
1000
0 10 20 30 40 50
Energy Density (J/cm2
)
Total
Pulse
Energy
(μJ)

20.  Micro milling
 Micro grinding
 Chemical etching
 Micro punching
 Manufacturing of injection nozzles,
Micro surgical tools, VLSI circuits

21.  As regards micro machining, dimensions of the
product is one of the good indicator of the levels of
technology and request.
 However, the level of request from the industry varies
widely.

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