Laser micromachining is a high-precision manufacturing technique that uses lasers to cut materials at a micrometer scale. It works by focusing a laser beam onto a workpiece to remove material via melting, vaporizing, or ablating. It can be used for machining plastics, metals, and other materials. Applications include microelectronics, medical devices, optics, and precision engineering. Advantages are high precision, versatility in materials used, and a non-contact process. Disadvantages include high costs, potential for heat damage, limited material selection, and safety concerns from the high-intensity laser.

1. Laser
Micromachining
and
Applications
Presented By:
ASHISH KUMAR CHAURASIYA
214122007
Lasers in Manufacturing (PR615)
M. Tech, 2nd Semester, Jan-2023
Manufacturing Technology
Department of Production Engineering
National Institute of Technology Tiruchirappalli,
Tamil Nadu - 620015

2. CONTENTS
Introduction
Working Principal
Laser Micromachining Challenges
Classification
Applications
Advantages of Laser Micromachining
Disadvantages of Laser Micromachining

3. Laser Micromachining
 Laser micromachining is a high-precision manufacturing technique that uses lasers to cut, drill,
ablate, or mark materials at a micrometer or sub-micrometer scale..
 Laser micromachining is a versatile process and is used widely for machining plastic, glass,
metal as well as preparing thin foils. The process comprises different mechanisms like cutting,
drilling, marking, turning, threading, etc.
 Uses a power source (FS laser, Excimer laser) that emits a beam with very high quantum energy

4. Working Principal
 The laser beam is focused onto the work piece and can be moved relative to it.
 laser micromachining involves using a laser beam to remove material from a workpiece by melting,
vaporizing, or ablating it
 The laser machining process is controlled by switching the laser on and off, changing the laser pulse
energy and other laser parameters and by positioning either the work piece or the laser focus.
 A laser machine consists of the laser, mirrors for beam guidance, a focusing optic and a positioning
system.

5. Laser Micromachining Challenges
 As laser micromachining is thermally induced process, it comes with different problems and research challenges
 Formation of heat affected zone, alteration of material properties and generation of thermal stress are the
problems because The laser pulse duration is longer than the heat diffusion time.
 Others include formation of machining debris from solidified molten material, generation of that requires
involvement of additional methodologies for removal, etc.
 Though ultra short pulse laser can be utilized to prevent pile up of machining debris and generation of heat
effected zone, it cannot completely protect against the formation of recast layer.
.

6. Classification
laser micromachining can be classified into different types based on the mode of laser operation,
the wavelength of the laser, and the type of material being machined.
 Pulsed laser micromachining: In this type of micromachining, a laser beam is emitted in pulses
of very short duration, typically in the nanosecond or femtosecond range.like Microelectronics,
Jewelry
 Continuous-wave laser micromachining: In this type of micromachining, a laser beam is emitted
continuously over a longer period of time. This technique is used for applications that require
higher throughput and less precise machining.like Solar cells, Photonics
 UV laser micromachining: UV lasers operate at shorter wavelengths and can be used to
machine a wide range of materials, including those that are difficult to machine with other types
of lasers. Used for machining glass and other transparent materials.like Textiles, Aerospace

7. Types of laser micromachining based on the technique used
1. Direct writing: In this technique, the laser beam is directly focused onto the material surface to create the desired
pattern or structure. This is commonly used for prototyping and small-scale production of microdevices and
microstructures.
2. Mask projection: In this technique, a mask is placed between the laser beam and the material surface, allowing
only certain areas of the material to be exposed to the laser beam. This is commonly used for high-volume
production of microdevices and microstructures with a high degree of precision and accuracy.
3. Interference: In this technique, two or more laser beams are overlapped on the material surface, creating an
interference pattern that can be used to create complex and precise microstructures. This is commonly used for
creating holographic patterns, diffractive optical elements, and other microscale optical devices.

8. Applications
Microelectronics: Laser micromachining is used to create complex patterns on semiconductor chips, including
micro via drilling, cutting, and scribing of thin films.

9. Precision engineering
 Laser micromachining is used to create intricate parts for precision engineering
applications, drilling microholes , cutting, grooving.

10. Femtosecond Laser Cutting Metal Tub Ultrafast

11. Laser Micro Welding

12. Medical device manufacturing
 Laser micromachining is used to manufacture small and intricate medical devices such as catheters,
stents, and implants.
 stent is a metal or plastic tube inserted into the lumen of an anatomic vessel.
 a flexible tube inserted through a narrow opening into a body cavity, particularly the bladder, for

13. Laser Atherectomy Catheter Mechanisms of Action

14. Optics
 Laser micromachining is used to create complex optical components, such as
diffraction gratings, micro lenses, and micro mirrors.

15. Advantages of Laser Micromachining
1. High Precision: Laser micromachining provides high precision and accuracy. The laser beam
can be focused down to a small spot size, allowing for precise material removal.
1. Versatility: Laser micromachining can be used on a variety of materials, including metals,
polymers, ceramics, and composites.
1. Non-Contact Process: Laser micromachining is a non-contact process, which means that there
is no physical contact between the laser and the material being machined. This helps to
prevent damage to delicate or fragile parts.
2. Reduced Tool Wear: Because laser micromachining is a non-contact process, there is no tool
wear, unlike traditional machining techniques, which can cause wear and tear on tools.
1. High Processing Speed: Laser micromachining is a high-speed process that can quickly and
efficiently remove material from the workpiece.

16. Disadvantages of Laser Micromachining
1. Cost: Laser micromachining can be an expensive process, especially for high-volume
production runs. The cost of the equipment, maintenance, and energy consumption can be
significant.
2. Heat damage: Laser micromachining generates a lot of heat, which can cause thermal damage
to the material being machined. This can lead to structural changes in the material, affecting its
mechanical properties.
3. Limited material selection: Laser micromachining may not be suitable for all materials. Some
materials, such as certain polymers, may not be able to withstand the high heat generated by
the laser, leading to melting or other forms of damage.
4. Limited cutting depth: Laser micromachining is generally limited to shallow cuts, as the laser
beam may not be able to penetrate deep into the material.
5. Safety concerns: Laser micromachining can be hazardous if proper safety precautions are not
taken. The high-intensity laser beam can cause eye damage and skin burns if not handled
properly.

17. References
 Advancements in Laser Micro machining Techniques- By Nadeem Rizvi and Paul Apte.
 Laser Micromachining- By Udo Klotzbach, Andres Fabian Lasagni, Michael Panzner and Volker Franke.
 Crafer, R. C. and Oakley, P.J. (eds.) Laser Processing in Manufacturing (Chapman & Hall).
 Harvey, E. C., Rumsby, P. T., Gower, M. C. and Remnant, J. L. SPIE Conference on Micromachining and
Microfabrication Process Technology , vol. 2639 (1995) 266-277.
 Dubreucq, G. M., Zahorsky, D. "KrF excime rlaser as a future deep UV source for projection printing"
Proceedings of International Conference on Microcircuits Engineering (1982) 73-78
 Rizvi, N. H. "Production of novel 3D microstructures using excimer laser mask projection techniques" SPIE
Conference on Design, Test and Microfabrication of MEMS and MOEMS, Vol. 3680 (1999) 546-552.
 Rowan, C. "Excimer lasers drill precise holes with higher yields" Laser Focus World (August 1995).
 Harvey, E. C. and Rumsby, P. T. "Fabrication techniques and their application to produce novel
micromachined structures and devices using excimer laser projection" SPIE Conference on
Micromachining and Microfabrication Process Technology III, vol. 3223 (1997) 26-33

18. Thank You