1. VATSAL SHAH
22 Moody St vatsal.a.shah@gmail.com
Chestnut Hill, MA – 02467 Phone: 607-206-9101
SKILL SETS
• Advanced working knowledge of SMT and Electronic Manufacturing, Semiconductor, Quality Control, Digital and
Analog Electronics
• Experienced in Design of Experiment (DOE), Statistical Process Control (SPC), Toyota Production System,
Continuous Improvement Principles, Kaizen Principles, Six Sigma Methodology and Lean Manufacturing
• Demonstrated success in developing, implementing and managing New Concepts and Processes to improve quality
and productivity
• Experience in selection, procurement and installation of SMT assembly lines
• Experienced in New Product Development, GAP analysis, Failure Mode and Effect Analysis (FMEA) and Root
Cause Analysis (RCA)
• Strong understanding of different IPC, ROHS and ISO standards
• Strong communication, analytical and organizational skills with the ability to prioritize multiple tasks in a time
sensitive environment
• Trained technical team as needed to build knowledge base
• Assisted customers and sales team with technical questions and issues
• Attended internal and external training courses to maintain and enhance skills and knowledge
• Self-motivated; able to set effective priorities and implement decisions to meet operational deadlines
• Demonstrated strong Interdepartmental Coordination and Collaboration and Staff Supervision and Training.
COMPUTER SKILLS
Statistical Packages: JMP, Minitab R15/R14/ R13, SAS, QC CALC, STATA.
Modeling and Analysis Softwares: Arena 7.0, CimLITE Quality Simulator, MAPICS system.
Desktop Applications: MS Word, Excel, PowerPoint, Access, Visio, Project.
Languages: C, C++, VC++, Linux, HTML, Matlab, Visual Basic and VB .Net.
Design Tools: SolidWorks and AutoCAD
Database Systems: SQL.
PROFESSIONAL EXPERIENCE
Applications Engineer Apr 09 – Aug 09
IDS Imaging Development Systems Inc., Woburn, MA
• Responsible for construction of test units for feasibility studies for customer requirements;
• Responsible for replication of customer problem scenarios and solutions thereof;
• Resolving technical questions from direct customers and distributors both from USA and rest of the world;
• Working with development division concerning bug fixing and software validation of IDS products;
• Assisting customers in their software development during camera integration;
• Providing customers with advice related to optics selection and trigger/strobe connection;
• Writing of sample code to show customers usage of SDK/Drivers;
• Modification and creation of new demo programs to be added to SDK;
Accomplishment:
• Increased company’s revenue by 25% by providing support to the new and existing customers globally.
• Developed production solutions for multiple customers in various markets.
• Worked with Marketing to edit technical documents and marketing materials.
• Strengthened the company’s knowledge base by writing an FAQ section.

2. Advanced Process Development Engineer March 06 – Feb 09
Speedline Technologies Inc., Franklin, MA
• Developed completely new processes for emerging technologies;
• Identified the process requirements and the critical parameters for new and existing process;
• Designed and executed formal experiments and perform data analysis;
• Responsible for setting up and automating entire SMT assembly line;
• Worked with Sales, Applications, Software and Manufacturing groups to customize the equipments based on
customer requirements and processes;
• Involved in software testing and vision systems testing;
• Responsible for board design, components and equipment selections for emerging technologies;
• Team leader in researching and developing reliable process for component assemblies;
• Team leader in developing and publishing design review to customer following new process development;
• Interfaced with internal and external customers to review new and existing designs for manufacturing issues and
concerns on SMT and electronics assemblies;
• Provided complete documentation of the findings and formal presentations;
• Provided input into industry standards (IPC, NEMI and SMTA);
• Created programs for formal training programs and implement the new process at customer sites;
Accomplishment:
• Developed a Sales modeling tool that helped the sales/marketing initiatives to obtain new business opportunities by
20%;
• Improved the productivity of the manufacturing line by 30% by implementing 5S and 80/20 principles;
• Participated in inventory management program to optimize the inventory levels and reduced the inventory levels by
15%;
• Identified important cost saving opportunities in the current manufacturing process;
• Leveraged acceptance sampling techniques for inspection and quality controls;
• Developed and optimized new assembly processes in support of our customers and industry process implementation
strategy using the principles of Six Sigma and Lean Manufacturing;
• Strengthened company’s technical leadership position through publications, trainings, webinars and workshops.
INTEGRATED ELECTRONICS ENGINEERING CENTER (IEEC), May 04 – Jan 06
Graduate Research Assistant Binghamton, NY
Project for Amphenol Aerospace Operations, Sidney, NY May 04 – Jan 06
• Reduced the set up time by implementing changes in the process;
• Studied the effect of different process parameters on the quality of the solder joints;
• Used Minitab and Excel to estimate the content of tin mixed in the solution and its effect on reliability and quality of
the joint;
Accomplishment:
• Reduced the process cycle time by 25% streamlining the workflow.
Project for Analog Devices Inc., Boston, MA Feb 05 – Mar 05
• Determined the presence of solder on lid surface and in castellations after lid reflow process;
• Investigated and analyzed different conditions of reflow parameters and different combinations of die attach
adhesives;
Accomplishment:
• Suggested the cause and effects of solder on lid surface and in castellations based on the testing.
Project for Endicott Coil Company Inc., Binghamton, NY July 04 – Aug 04

3. • Developed an experimental procedure for determining the maximum operating temperature of the components in the
control unit of a light fixture;
• Conducted time based analysis of the components at different temperatures and different atmospheric conditions.
Accomplishment:
• Developed an experimental procedure for determining the maximum operating temperature of the components in the
control unit of a light fixture.
BHARATI CELLULAR LTD., Sept 02 – May 03
Quality Assurance Engineer Mumbai, India
• Worked with Quality Control Department to evaluate the performance of the customer service representatives;
• Used control charts to monitor their performances and identify performance improvement activities;
• Used design of experiments (DOE) to identify the factors affecting their performance.
Accomplishment:
• Recommended methods of improvement to the customer service representatives;
• Improved the performance of the customer service representatives by 20%.
EDUCATION
BINGHAMTON UNIVERSITY 2003 – 2006
Master of Science in Industrial and Systems Engineering Binghamton, NY
MUMBAI UNIVERSITY, INDIA 1997 – 2002
Bachelors of Science in Electrical Engineering Mumbai, India
PUBLICATIONS
1. “Broadband Printing: The New SMT Challenge”, Rita Mohanty, Vatsal Shah, Gary Nicholls, Ron Tripp, To appear:
Proceedings of the APEX Conference, April 2009.
2. “Assembly Process Challenges For 01005 Components”, Rita Mohanty, Vatsal Shah, Proceedings of the SMTA
International, August 2008.
3. “Effect of Solder Paste Printing Defects on End of Line Defects”, Vatsal Shah, Proceedings of the SMTA
International, August 2008.
4. “Investigating the 01005 – Component Assembly Process Requirements”, Rita Mohanty, Vatsal Shah, Arun Ram,
Bill Coleman, Ron Lasky, Proceedings of the APEX Conference, April 2008.
5. “Solder Paste Inspection Technologies: 2D-3D Correlation”, Rita Mohanty, Vatsal Shah, Paul Haugen, Laura Holte,
Proceedings of the APEX Conference, April 2008.
6. “Process Capability Indices for 01005 Stencil Printing Process”, Krishnan Vishwanathan, Sudeep Nambiar, Daryl
Santos, Arun Ramasubramanian, Rita Mohanty, Vatsal Shah, Proceedings of the IMAPS Conference, November
2007.
7. “Correlating Print Process Defects to End of Line Defects”, Vatsal Shah, Rita Mohanty, Arun Ramasubramanian,
Proceedings of the SMTA International, September 2007.
8. “Process Development for 01005 Lead – Free Passive Assembly: Stencil Printing”, Vatsal Shah, Dr. Rita Mohanty,
Joe Belmonte, Tim Jensen, Ron Lasky and Jeff Bishop, Proceedings of the APEX conference, February 2007.
9. “Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste”, Joe Belmonte, Vatsal Shah, Rita Mohanty, Tim
Jensen and Ron Lasky, Proceedings of the APEX conference, February 2007.
10. “From Printing to Reflow: Process Development for 01005 Assembly”, Sudeep Nambiar, Daryl Santos, Vatsal
Shah, Rita Mohanty and Joe Belmonte, Proceedings of the SMTA PanPacific Microelectronics Symposium, January
2007.
11. “Investigating the Lead Free Manufacturing”, Vatsal Shah, Rita Mohanty and Joe Belmonte, Proceedings of the
IMAPS conference, October 2006.
12. “Process Development of 01005 Lead-Free Passive Assembly: Stencil Printing”, Joe Belmonte, Vatsal Shah, Dr.
Rita Mohanty, Tim Jensen, Ron Lasky and Jeff Bishop; Proceedings of the SMTA International, September 2006.
13. “Pb-Free BGA Solder Ball Attach Assembly Research: A Retrospective of 5 Years of Study”, Daryl Santos, Amol
Kane and Vatsal Shah; Proceedings of the SMTA Pan Pacific Microelectronics Symposium, January 2006.

4. 14. “Transition to Pb-Free Alloys in Filter Assemblies”, Vatsal Shah, Amol Kane, Daryl Santos, Mike DiPietro,
Lawrence Lehman and Leonard Krantz; Proceedings of the SMTA PanPacific Microelectronics Symposium,
January 2006.
15. “Pb-Free Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Solder
Performs”, Vatsal Shah, Amol Kane, Ali Shakir, Daryl Santos, Mike DiPietro, Lawrence Lehman and Leonard
Krantz; Proceedings of SMTA International, September 2005.
PRESENTATIONS
• “Process Development for 01005 Lead-Free Passive Assembly: Printing and Inspection”, IMAPS NE Chapter,
Boxborough, MA, May 2007.
• “Process Development for 01005: Printing and Inspection”, Speedline Technologies, Franklin, MA, September
2006.
• “Pb-Free Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Solder
Preforms”, Binghamton University, Binghamton, NY, December 2005.
• “Pb-Free BGA Solder Ball Attach Assembly Research: A Retrospective of 5 Years of Study”, SMTA PanPacific
Microelectronics Symposium, Pittsburg, PA, January 2006.
PROFESSIONAL MEMBERSHIPS
• The Surface Mount Technology Association (SMTA).
• International Microelectronics and Packaging Society (IMAPS) – New England Chapter.
• The Materials Information Society (ASM International).