1. PRAVEEN KUMAR Correspondence Address
Semiconductor Test Engineer-Digital and Analog C/o-Vijay Prasad ,
Phone No: +91-7406490263 Vill-Nayadih, PO-Derhgaon
PS-Kashichak,
Dist-Nawada,
Bihar, PIN-805130
Email: praveen5932@gmail.com
Profile
2.5 years experience as a Test engineer in Tessolve Semiconductor Pvt Ltd.
Professional Summary
• Experience in post silicon validation, Characterization and ATE environment.
• Have good experience in AC characteristics, DC characteristics and functional tests
debugging.
• Have good experience in validating of DIGITAL (Micro Controllers) & PMIC (Buck &
Boost Converters) devices.
• Sound knowledge on digital and analog circuit design & concepts and developing the test
programs, test plans as per device specs.
• Experience on hardware design – Schematic capture, lay out and PCB design rules
• Have good experience in designing the validation boards, HIB (Hardware interface board),
PIB (Probe Interface board) and Probe cards, supported to PCB team in Schematic
Placement, Routing stages.
• Working experience on Teradyne Flex ATEs , Handlers , Probers and Complex
test systems
• Good understanding on Reliability engineering, such as HV Screening, ESD/Leakage, Thermal
Cycling etc
• Exposure on data analysis of tested results (eg: Cpk, Cgm, Correlation, Overkill, under kill
Analysis etc.)
• Have good knowledge on SCAN, ATPG, boundary Scan etc.
• Have experience in SOC (Pressure Sensor System) validation.
• Able to develop data analysis scripts using VB.
• Have good programming skills in C language and VHDL.
• Have good knowledge on different type of trimmings (Vbg(band gap), Iref, oscillator, Vref
etc.), communication protocols (SPI,JTAG), Memory blocks (OTP, EEPROM),
Regulators
• Very familiar with oscilloscope, functional generators, logical analyzer etc.
Roles and Responsibilities
• Test List/ Test Plan Development
• Hardware design and development
• Schematic creation and review, Placement review, Layout verification
• Test Vector Creation/ Conversion
• Test Program Development & debug.

2. • Characterization, Correlation
• Support for reliability engineering and Data analysis
• Optimization (Process, Test Time, Test Limits etc), Release to Production
Software or Programming Skills
• Programming languages :C, Assembly Languages 8051, VBA, VHDL
• Software packages : Xilinx, MATLAB, TINA, Allegro
ATE Platforms experience
• Ultra Flex, Integra Flex
• J750
Educational Qualifications
B Tech in Electronics and Communication Engineering, passed with first class with distinction
DETAILED WORK EXPERIENCE
Ι) PROJECT: J750 to Ultra FLEX Conversion for Final Test
ATE: Ultra Flex
DEVICE DESCRIPTION: This is a microcontroller unit for safety application in automobile.
Device having two type of packaging BGA and LQFP with different pin count
ROLES AND RESPONSIBILITIES:
• Involved in test program development , test debug and test time reduction
Involved in critical test debug of module ADC, PMC(Power Management controller), Temp
sensor, OSC.
• Successfully completed debug for multisite x8 and x12 for BGA and LQFP respectively.
• Having knowledge of Instrument like UP1600,UP800, UVI80, UVS256 UPAC80 source
and capture.
ΙΙ) PROJECT: Probe and FT Conversion from Single Site to Octal Site
ATE: Integra Flex
DEVICE DESCRIPTION: Device is Ultrasonic interface controller, Used for communication to
the Ultrasonic Sensors (Protocol Controller and Transceiver).
ROLES AND RESPONSIBILITIES:
• Involved in Design of Load Board, Probe Card and Prober Interface .
• Developed and debugged test program for wafer and package part.
• Worked on JTAG and SPI interface.

3. • Debugged critical test like Bandgap, Oscillator ,Iref, HSS trimming,
• Prepared preliminary Cgm report for data analysis.
• Having knowledge of different IG-XL tools and different Integra Flex instruments.
ΙΙΙ) PROJECT: Probe and FT Conversion from Single Site to Octal Site
DEVICE DESCRIPTION: Device is a sensor which controls the ultrasonic drive pulse and
processes the received echo signal.
ATE: Integra Flex
ROLES AND RESPONSIBILITIES
• Converted customer library function to standard routines to use in our program.
• Involved in Design of Load Board, Probe Card and Prober Interface Board.
• Developed and debugged test program for wafer and package part.
• Debugged critical test like Bandgap, Oscillator, Iref and high current trimming.
Ις) Project: Program audit
ATE: Ultra Flex
PROJECT DESCRIPTION: This is production program review for the 100% compliance for the
test spec, test method and limits
ROLES AND RESPONSIBILITIES
• Compared Spec Vs Production ETS code.
• Found some critical error, limit mismatch and created the report which shared with TE.
Praveen Kumar