The process of making a chip begins with sand. Sand contains 25% silicon by mass. Sand especially Quartz contains high percentage of Silicon dioxide which is the basic ingredient of semiconductor manufacturing. Silicon is purified in multiple stages to obtain the quality called Electronic Grade Silicon in the form of Ingots. Ingots are big mono crystals. Mono crystal Silicon Ingots have highly pure silicon of purity 99.99%. The Ingots are cut into individual silicon discs or slices called wafers. These wafers are polished untile mirror smooth surfaces are obtained. A photo resis layer is applied by rotating the wafers. Wafers are rotated for an even finish. The photo resist finish is exposed to ultra violet light which triggers a chemical reaction which transforms the photo resist to a soluble . UV light exposure is for creating various circuit patterns on the wafer. Solvents are used to clean out the Photo resist to reveal the patterns. made using UV light. Unwanted material is removed by etching. Ion implantation is done by bombarding the various chemical impurities called Ions. Ions are implanted by shooting them onto the surface with a very high speed of over 3 x 10^5 km/h. The wafers are put into a copper sulphate solution . As a result the copper ions are deposited onto the transistor through a process called electroplating. The copper ions settle as a thin layer of copper and the excess material is polished off. Multiple metal layers are created to interconnect. the architecture and design is dependent on the functionality of the transistor or part in which the chip has to work. Functionality tests are done to evaluate the response of every single chip. Wafers are cut into pieces. Furthermore , the defaulty pieces are discarded off. Groups of pieces are arranged to cater for the respective functionality. Hence , the procedure for sand to chip Solution The process of making a chip begins with sand. Sand contains 25% silicon by mass. Sand especially Quartz contains high percentage of Silicon dioxide which is the basic ingredient of semiconductor manufacturing. Silicon is purified in multiple stages to obtain the quality called Electronic Grade Silicon in the form of Ingots. Ingots are big mono crystals. Mono crystal Silicon Ingots have highly pure silicon of purity 99.99%. The Ingots are cut into individual silicon discs or slices called wafers. These wafers are polished untile mirror smooth surfaces are obtained. A photo resis layer is applied by rotating the wafers. Wafers are rotated for an even finish. The photo resist finish is exposed to ultra violet light which triggers a chemical reaction which transforms the photo resist to a soluble . UV light exposure is for creating various circuit patterns on the wafer. Solvents are used to clean out the Photo resist to reveal the patterns. made using UV light. Unwanted material is removed by etching. Ion implantation is done by bombarding the various chemical impurities called Ions. Ions ar.

1. The process of making a chip begins with sand. Sand contains 25% silicon by mass. Sand
especially Quartz contains high percentage of Silicon dioxide which is the basic ingredient of
semiconductor manufacturing.
Silicon is purified in multiple stages to obtain the quality called Electronic Grade Silicon in the
form of Ingots. Ingots are big mono crystals. Mono crystal Silicon Ingots have highly pure
silicon of purity 99.99%.
The Ingots are cut into individual silicon discs or slices called wafers. These wafers are polished
untile mirror smooth surfaces are obtained. A photo resis layer is applied by rotating the wafers.
Wafers are rotated for an even finish. The photo resist finish is exposed to ultra violet light which
triggers a chemical reaction which transforms the photo resist to a soluble . UV light exposure is
for creating various circuit patterns on the wafer.
Solvents are used to clean out the Photo resist to reveal the patterns. made using UV light.
Unwanted material is removed by etching.
Ion implantation is done by bombarding the various chemical impurities called Ions. Ions are
implanted by shooting them onto the surface with a very high speed of over 3 x 10^5 km/h. The
wafers are put into a copper sulphate solution . As a result the copper ions are deposited onto the
transistor through a process called electroplating. The copper ions settle as a thin layer of copper
and the excess material is polished off.
Multiple metal layers are created to interconnect. the architecture and design is dependent on the
functionality of the transistor or part in which the chip has to work. Functionality tests are done
to evaluate the response of every single chip. Wafers are cut into pieces. Furthermore , the
defaulty pieces are discarded off. Groups of pieces are arranged to cater for the respective
functionality. Hence , the procedure for sand to chip
Solution
The process of making a chip begins with sand. Sand contains 25% silicon by mass. Sand
especially Quartz contains high percentage of Silicon dioxide which is the basic ingredient of
semiconductor manufacturing.
Silicon is purified in multiple stages to obtain the quality called Electronic Grade Silicon in the
form of Ingots. Ingots are big mono crystals. Mono crystal Silicon Ingots have highly pure
silicon of purity 99.99%.
The Ingots are cut into individual silicon discs or slices called wafers. These wafers are polished
untile mirror smooth surfaces are obtained. A photo resis layer is applied by rotating the wafers.
Wafers are rotated for an even finish. The photo resist finish is exposed to ultra violet light which

2. triggers a chemical reaction which transforms the photo resist to a soluble . UV light exposure is
for creating various circuit patterns on the wafer.
Solvents are used to clean out the Photo resist to reveal the patterns. made using UV light.
Unwanted material is removed by etching.
Ion implantation is done by bombarding the various chemical impurities called Ions. Ions are
implanted by shooting them onto the surface with a very high speed of over 3 x 10^5 km/h. The
wafers are put into a copper sulphate solution . As a result the copper ions are deposited onto the
transistor through a process called electroplating. The copper ions settle as a thin layer of copper
and the excess material is polished off.
Multiple metal layers are created to interconnect. the architecture and design is dependent on the
functionality of the transistor or part in which the chip has to work. Functionality tests are done
to evaluate the response of every single chip. Wafers are cut into pieces. Furthermore , the
defaulty pieces are discarded off. Groups of pieces are arranged to cater for the respective
functionality. Hence , the procedure for sand to chip