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Qualcomm SnapDragon 800 Mobile Device
- 4. Snapdragon 800 Snapdragon 600 Snapdragon 400 Snapdragon 200 CPU Up to 2.3 GHz Quad Krait 400 CPU Up to 1.9 GHz Quad Krait 300 CPU Up to 1.7 GHz Dual Krait 300 CPU Up to 1.4 GHz Quad Cortex A5 CPU GPU Adreno 330 GPU Adreno 320 GPU Adreno305 GPU Adreno 203 GPU DSP Hexagon, QDSP6V5A, 600MHz Hexagon, QDSP6V4, 500MHz Hexagon, QDSP6V4, 500MHz QDSP5, 384MHz Video 4k x 2k UHD video capture/playback 1080p HD video 1080p HD video 720p HD Video (30/15 fps) Modem 3G/4G World/multimode LTE on select processors No modem 3G/4G World/multimode LTE on select processors 3G CDMA/UMTS/GSM on select processors Camera Up to 55MP, Stereoscopic 3D, Dual ISP Up to 21MP, Stereoscopic 3D Up to 13.5MP, Stereoscopic 3D on select processors Up to 8MP GPS IZat Gen8B IZat Gen8A IZat Gen8A IZat Gen7A USB USB 3.0/2.0 USB 2.0 USB 2.0 USB 2.0 Bluetooth BT4.0 Integrated digital core† BT4.0 Integrated digital core† BT4.0 Integrated digital core† BT4.0 Integrated digital core† WiFi 802.11n/ac (2.4/5GHz) Integrated digital core† 802.11n/ac (2.4/5GHz) Integrated digital core† 802.11n/ac (2.4/5GHz) Integrated digital core† 802.11n/ac (2.4/5GHz) Integrated digital core† Process Technology 28nm HPm 28nm LP 28nm LP 45nm LP Individual Chipsets 8974(LTE) • 8274 (HSPA+) • 8674 (CDMA) • 8074 (No Modem) 8064T 8930 (LTE) • 8230 (HSPA+) • 8630 (CDMA) • 8930AB (LTE) • 8230AB (HSPA+) • 8630AB(CDMA) • 8030AB(No Modem) • 8226 (UMTS) • 8626 (CDMA) 8225Q 8625
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- 8. Snapdragon 800 Specs Processing 28nm HPm quad core Krait 400 CPU at up to2.3GHz per core LP‐DDR3 memory for high performance and low latency GPU Updated Adreno 330 GPU delivers up to 50% increase in graphics performance. Support for advanced graphic and compute APIs, including OpenGL ES 3.0, DirectX, OpenCL, RenderscriptCompute and FlexRender™ Power Management Energy efficient High Performance for Mobile (HPm) technology aSMP dynamic CPU power control for sustained peak performance New Quick Charge 2.0 integrated for up to 75% faster battery charging DSP Hexagon, QDSP6V5A, 600MHz Hexagon DSP enables ultra‐low power operation for a variety of applications like music playback, enhanced audio and advanced editing applications Modem True 4G LTE World Mode, supporting LTE FDD, LTE TDD, WCDMA, CDMA1x, EV‐DO, TD‐SCDMA and GSM1 4G LTE with Carrier Aggregation for speeds up to 150 Mbps USB USB 3.0/2.0 New USB 3.0 for ultra‐fast transfers Bluetooth BT4.0 + Integrated digital core WiFi 802.11ac Wi‐Fi for peak Wi‐Fi performance + Integrated digital core GPS IZat GNSS location technology combines multiple location services into a single high performance navigation system for auto and pedestrian applications Video Capture, playback and display in UltraHD video (with four times 1080p pixel density) Camera Up to 21 Megapixel, stereoscopic 3D Dual Image Signal Processors for Snapdragon Camera support simultaneous camera/video, ultrafast 640 Megapixel/second capture speeds and computational camera Display Higher display resolutions (up to 2560x2048) and Miracast 1080p HD support 1080p and 4K external displays Process Technology 28nm HPm
- 9. FEATURES MSM8974 Part Numbers MSM8974 Process Tech. 28nm HPm Package 994 BDP 15x15mm (0.4mm pitch) Processor Quad Core Krait 2.2GHz / L2 2MB QDSP6 V5A – 680 MHz +256KL2 (Apps) QDSP6 V5H (Modem) Memory 2x800 MHz LPDDR3 USB 1x USB 3.0 SS 5 Gbps, 1xUSB 2.0 HS MODEM 1X Advanced, 1xEV‐DO Rev. A/B, GSM/GPRS/EDGE Release 10 HSPA+, TD‐SCDMA Release 9 LTE Cat 4, Rel 10 LTE CA CnE(WiFi offload) NSRM (signaling optimizations) Peak Data Rates UL/DL 1x ‐ FL/RL: 307.2 / 307.2 kbps DO ‐ FL/RL: 14.7 / 5.4 Mbps DC‐HSPA+ ‐ FL/RL: 42 / 11 Mbps 3C HSDPA+ ‐ FL/RL: 63 / 11 Mbps LTE ‐ FL/RL: 150 / 50 Mbps (Cat 4) Modem Enhancements 1xAdv, QLIC, 4GV (EVRC‐B, EVRC‐WB), EVRC‐NW, HDOn, Q‐ICE (Type 3i), SVDO, SVLTE, Rx Div, DARP ph1, Envelope Tracking Frequency Support LTE: B1/2/4/5/13/17/7/19/21/11/12/18/3/8/20 CDMA: 800MHz(BCO/BC10&JCDMA), 1700MHz(KPCS), 1900MHz(PCS+Block G), 1700MHz/2100MHz (AWS), 2100MHz (IMT) UMTS: 800/850/900/1700/1900/2100/AWS GSM: QB 850/900/1800/1900 RF+PMIC Chipset WTR1625L / WTR1605/L + WCD9320 + PM8941 + PM8841 (SVLTE + 1625/1605 ) Quickcharge 2.0 Bluetooth BT3.x , BT4.0/LE, FM Rx/Tx (WCN3660) WLAN 802.11a/b/g/n/ac WCN3660/80 GPS Gen 8A with Glonass Standalone, Assisted, XTRA, 3dB sens. imprv. vs. Gen 7 Proximity P2P Networking AllJoyn
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- 16. Manufacture Device Function Qualcomm Qualcomm Snapdragon 800, MSM8974AB . 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx . Rel 10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE SAMSUNG KQF7F&0DM‐QGCE Dual channel, 24Gb LPDDR3, PoPPackage KLMB4GEAC‐B0001 SAMSUNG 32GB eMMC WTR1605L Multi‐band* plus 700/1500/2600/B41 GPS+Glonass QFE1100 LTE Envelope Tracking IC BCM4339 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.0 ‧FM Receiver BCM20794 NFC controller ACPM‐7600 Multi‐mode/Multi‐band power amplifier ACMD‐6207 LTE Band VII FBAR duplxer RF1119 Antenna control module PM8941 PMIC for Qualcomm MSM8974AB PM8921 PMIC for Qualcomm MSM8974AB WCD9320 SLIMbus/I2S Audio codec; 6+ channel ▼Processor ▼Memory ▼Radio Frequency Qualcomm Broadcom Avago RF Micro ▼PMIC Qualcomm ▼Audio Qualcomm
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- 22. Kindle Fire HDX 7” Qualcomm SnapDragon 800, MSM8974, PoPPackage SAMSUNG K3QF2F200B‐XGCE, Dual‐channel, 16Gb LPDDR3 Qualcomm PM8841 PMIC Qualcomm SMB349 battery charger
- 23. Kindle Fire HDX 7” Toshiba THGBMAG7A2JBAIR 128Gb e‐MMC Qualcomm PM8941 PMIC Qualcomm WCD9320 audio Codec Invensense MPU‐6500 Maxim MAX97236Audio Amplifier Qualcomm QCA6234XH WiFi/BT combo module
- 24. Kindle Fire HDX 7” 7” 1920x1200 LG LD070WU2‐SM01 ALS Synaptics S7301B MIPI LPDDR3 LPDDR3 InvenSense SAMSUNG K3QF2F200B‐XGCE 16Gb LPDDR3 PoP Package eMMC I2C Toshiba THGBMAG7A2JBAIR 16GB eMMC MPU‐6500 QualcommQualcomm Maxim Qualcomm SLIMbus MAX97236 WCD9320 PM8941 Qualcomm PM8921 USB BOM Option for 4G connectivity UART SDIO Qualcomm Qualcomm WTR1605L QCA6234XH SMB349
- 25. Kindle Fire HDX 7” Manufacture Device Function Qualcomm Qualcomm Snapdragon 800, MSM8974 . 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx . Rel10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE SAMSUNG K3QF2F200B‐XGCE Dual channel, 16Gb LPDDR3, PoP Package Toshiba KLMB4GEAC‐B0001 . 16/32/64GB eMMC . 16GB: Toshiba THGBMAG7A2JBAIR WTR1605L Multi‐band* plus 700/1500/2600/B41 GPS+Glonass (BOM Option for 4G connectivity) QCA6234XH . AR6004+AR3002(SDIO WiFi/UART BT) . 2x2 DB 802.11a/b/g/n . BT4.0(Dual mode) PM8941 PMIC for Qualcomm MSM8974 PM8921 PMIC for Qualcomm MSM897 SMB349 Programmable, 4A Switching Li+ Battery Charger with TurboCharge Mode*, CurrentPath™, AICL*, AFVC*, USB On‐The‐Go and JISC8714/JEITA Support ▼Processor ▼Memory ▼Radio Frequency Qualcomm ▼PMIC Qualcomm
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- 28. nexus 5 Speed and power to spare on a stunning 5” display. Powered by Android™ 4.4, KitKat®. It’s a 5”phone, and so much more. Built with precision, Nexus 5 delivers an intelligently simple design and showcases a stunning full HD display. Plus it comes in black and white. All‐new photo and video features help you capture moments in fresh new ways. And thanks to the latest from Android, Nexus 5 is fast, powerful and truly yours.
- 29. nexus 5 Qualcomm PM8941 PMIC Texas Instruments BQ24192 Avago A5805 Qualcomm QFE1100 Qualcomm SnapDragon800, MSM8974, PoP Package SK Hynix, H9CKNNNBPTMRLR, Dual‐channel, 16Gb LPDDR3 Qualcomm WCD9320 audio Codec Analogix AX7808 SlimPort transmitter
- 30. nexus 5 RFMD RF1119 Qualcomm PM8841 PMIC AKM AK8963 Invensense MPU‐6515 16GB/32GB storage 16GB: SandiskSDIK8DE4‐16G Qualcomm WTR1605L Avago RF1335 Broadcom BCM4339 WiFi/BT SoC
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- 32. nexus 5 SlimPort 4.95” 1920x1080 Analogix ANX7808 ALS Synaptics S3350B InvenSense IDG‐2020 MIPI LPDDR3 LPDDR3 I2C AKM SK Hynix H9CKNNNBPTMRLR 16Gb LPDDR3 PoP Package AK8963 InvenSense eMMC I2C Sandisk SDIN8DE4 16GB eMMC MPU‐6515 Texas QualcommInstruments Qualcomm SLIMbus PM8941 BQ24192 Qualcomm Texas Instruments BQ51013B WCD9320 PM8921 USB Qualcomm QFE1100 UART SDIO AVAGO RFI335 RFMD AVAGO 6093 A5805 AVAGO Qualcomm Broadcom Broadcom ACPM‐7600 WTR1605L BCM20793M BCM4339
- 33. nexus 5 Manufacture Device Function Qualcomm Snapdragon 800, MSM8974 . 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx . Rel10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE H9CKNNNBPTMRLR‐NTM Dual channel, 16Gb LPDDR3, PoP Package 16/32GB eMMC . 16GB/32GB eMMC . 16GB : Sandisk SDIN8DE4 WTR1605L Multi‐band* plus 700/1500/2600/B41 GPS+Glonass QDE1100 LTE Envelope Tracking IC BCM4339 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.0 ‧FM Receiver BCM20793M NFC controller Avago ACPM‐7600 Multi Mode, Multi Band RF power amplifier RFMD RF1119 antenna control PM8941 PMIC for Qualcomm MSM8974 PM8921 PMIC for Qualcomm MSM8974 BQ24192 I2C controlled 4.5 A USB/adapter charger BQ51013B WPC 1.1 Compatible Fully Integrated Wireless Power Receiver ▼Processor Qualcomm ▼Memory SK Hynix Main Storage ▼Radio Frequency Qualcomm Broadcom ▼PMIC Qualcomm Texas Instruments
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