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2010 2011 2012 2013 2014
ARM® CortexTM‐A8
SC, 45nm
ARM® CortexTM‐A9
DC, 45nm
ARM® CortexTM‐A9
DC, 32nm HKMG
ARM® ARMv7
DC, 32nm HKMG
ARM® ARMv7a
DC, 32nm HKMG
ARM® CortexTM‐A9
SC, 32nm HKMG
APL2498APL0498
APL0398
APL5498
APL0598
APL5598
APL0698 APL5698
ARM® ARMv8
DC, 28nm HKMG
M7 Motion Coprocessor
ARM® CortexTM‐A9
DC, 45nm
APL7498
2014 2015 2016
APL1011
ARM® ARMv8a
DC/TC, 20nm HKMG
M8 Motion Coprocessor
APL1012
APL1012
APL0898
ARM® ARMv8a
DC, 14/16nm FinFET
M9 Motion Coprocessor
APL1012
M9M9
ARM® v7a
SC, 28nm HKMG
APL0778
ARM® ARMv8a
DC, 16 FinFET
M9 Motion Coprocessor
Apple A9
APL1022/339S00129
TSMC 16nm FinFET process 
Apple A9
APL0898/339S00114
SAMSUNG 14nm FinFET process
Apple A9
APL1022/339S00129
TSMC 16nm FinFET process
104.5mm2
Apple A9
APL0898/339S00114
SAMSUNG 14nm FinFET process
96mm2
M9
APL1022/APL0898
‐ TSMC 16nm FinFET/SAMSUNG 14nm FinFET process
‐ Apple 3rd generation ARM v8a architecture
‐ Integrated M9 motion coprocessor
‐ Imagination PowerVR Series 7 GPU
‐ 4‐channel 16‐bits LPDDR4
‐ MIPI‐DSI/MIPI‐CSI/eDP(?)
‐ PCIe, HSIC, I2C, UART, USB
‐ Fingerprint sensor controller
‐ Apple customized PoP package  
70%
FASTER
339S0030 339S0036
ARM®ARM11
Single Core
339S0073
ARM® CortexTM‐A8
Single Core
ARM® v7 architecture
Dual Core
ARM® v8a architecture
Dual Core
ARM® CortexTM‐A8
Single Core
ARM® CortexTM‐A9
Single Core
ARM® v8 architecture
Dual Core
ARM® v8a architecture
Dual Core
ARM®ARM11
Single Core
CPU Performance
2007 2015
M9
90%
FASTER
339S0030 339S0036 339S0073
Imagination
MBX Lite
Imagination
MBX Lite
Imagination 
PowerVR SGX535
Imagination
PowerVR SGX535
Imagination
PowerVR SGX543MP2
Imagination
PowerVR SGX543MP3
Imagination
PowerVR GX6430
Imagination
PowerVR Series6XT             
4‐Clusters
Imagination
PowerVR Series 7 
GPU
Graphics Performance
2007 2015
M9
M9
338S00120‐A1
338S00122‐A1
PMIC
338S1285
Audio AMP
338S00014
338S00105
Audio Codec
16GB/64GB/128GB
NVMe SSD
The only thing that’s changed is everything.
iPhone 6S A1688
 Apple A9 processor, Apple customized PoP package
4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix
 InvenSense MP‐67B
 Bosch BMA280
 Qualcomm MDM9635M
 SKYWORKS SKY77812‐19
 TriQuint TQF6405
 AVAGO AFEM‐8030 
 Qualcomm QFE1100
 Texas Instruments  57A6CVI 3539
 SKYWORKS RF1347
iPhone 6S A1688
 Main storage, 16GB/64GB/128GB, NVMe SSD
SK Hynix : H230DG8UD1ACS, 16GB
Toshiba  : THGBX5G7D2KLFXG, 16GB
 USI 339S00043 WiFi/BT Module
 Ne G98/Murata(?), RF Front‐End Module
 NXP 66V10
 Apple 338S00105
Apple 338S00120‐A1 
 Texas Instruments 65730AOP
 Qualcomm PMD9635
 Apple 338S1285
 NXP1610A3
 Qualcomm WTR3925
 SKYWORKS SKY77357‐8
 Murata 240 Front‐End Module
 Apple 338S1285
 RFMD RF5150
 Rd G54/Murata(?), RF Front‐End Module
ALPS HSCDTD007
 Bosch BMP280
 Texas Instruments 57A5KXI
Front facing camera
Rear facing camera
I2C/SPI
I2C/SPI
PCIeUART
LPDDR4
LPDDR4
PA chips is model 
dependent
PCIe
I2C
Lightning
4‐channel 
16‐bit
16Gb LPDDR4
USI
339S00043
Qualcomm
QFE1100
Qualcomm
MDM9635M
Qualcomm
WTR3925
Qualcomm
PMD9635
PA 
Chips
16/64/128GB
NVMe SSD
338S00105
Audio Codec
ALPS
HSCDTD007
Bosch
BMA280
Bosch
BMP280
Invensense
MP67B
ALS
NXP
CBTL1610A3
NXP
66V10
4.7”
1334x750
LPDDR4
LPDDR4
338S00120‐A1
PMIC
338S1285
Audio AMP
343S00014
I2C
M9
TAPTIC
ENGINE
M9
iPhone 6S Plus A1687
 Apple A9 processor, Apple customized PoP package
4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix
 InvenSense EMS‐A
 In the iPhone 6s, there is Bosch BMA280 here.                                
But, in the iPhone 6s Plus, there is no chip here but “PCB pad only”
 Qualcomm MDM9635M
 SKYWORKS SKY77812‐19
 TriQuint TQF6405
 Qualcomm QFE1100
 SKYWORKS RF1347
 Avago AFEM‐8030
iPhone 6S Plus A1687
 Skyworks SKY13701
ALPS HSCDTD007
 USI 339S00043 WiFi/BT Module
Apple 338S00122‐A1 
 Apple 338S00105
 Texas Instruments  57A6CVI 3539
 NXP 66V10
 Main storage, 16GB/64GB/128GB, NVMe SSD
SK Hynix : H230DG8UD1ACS, 16GB
 Apple 338S1285
 NXP1610A3
 Qualcomm PMD9635
 Qualcomm WTR3925
 Murata 240 Front‐End Module
 Texas Instruments 57A5KXI
 Bosch BMP280
 Af G54/Murata(?), RF Front‐End Module
 Apple 338S1285
 RFMD RF5150
 SKYWORKS SKY77357‐8
 Texas Instruments TPS65730AOP
Front facing camera
Rear facing camera
PCIeUART
LPDDR4
LPDDR4
PA chips is model 
dependent
PCIe
Lightning
4‐channel 
16‐bit
16Gb LPDDR4
USI
339S00043
Qualcomm
QFE1100
Qualcomm
MDM9635M
Qualcomm
WTR3925
Qualcomm
PMD9635
PA 
Chips
16/64/128GB
NVMe SSD
ALS
NXP
CBTL1610A3
NXP
66V10
5.5”
1920x1080
LPDDR4
LPDDR4
338S00122‐A1
PMIC
343S00014
M9
TAPTIC
ENGINE
M9
I2C/SPI
I2C/SPI
338S00105
Audio Codec
ALPS
HSCDTD007
Bosch
BMP280
Invensense
EMS‐A
338S1285
Audio AMP
I2C
Manufacturer Device Function
▼Processor
Apple
Apple A9 Microprocessor
(APL0898 & APL1022)
‧SAMSUNG 14nm FinFet/TSMC 16nm FinFET process
‧Dual‐core, Apple 3rd generation ARMv8a architecture, 1.8GHz
‧Imagination PowerVR 7 series GPU
‧Apple customized PoP package
▼Memory
Micron
SAMSUNG
SK Hynix
D9SND (MT53B256M64D2NL)
K3RG1G10BM‐BGCH
H9HKNNNBTUMUMR‐NLH
‧16‐bit, Quad‐channel, 16Gb LPDDR4
‧Apple customized PoP package
SK Hynix
Toshiba
‧NAND Flash‐based storage
‧Apple customized package
‧16GB/64GB/128GB
16GB: SK Hynix H230DG8UD1ACS
Toshiba   THGBX5G7D2KLFXG 
▼PMIC
Apple Apple 338S00120‐A1 PMIC for Apple A9 Processor (iPhone 6s)
Apple 338S00122‐A1 PMIC for Apple A9 Processor (iPhone 6s Plus)
Qualcomm PMD9635 PMIC for Qualcomm MDM9635M baseband processor
▼Audio
Apple Apple 338S00105 Audio Codec
Apple 338S1285 Audio AMP
▼Touch Screen Controller
Apple 343S00014 Touch screen controller for 3D Touch
▼Others
Texas Instruments 65730AOP Power management IC
57A6CVI 3539 LED backlight Retina display driver 
57A5KXI Charger IC
NXP 1610A3 USB charging
Manufacturer Device Function
▼Sensors
InvenSense MPU‐6700(MP67B) (iPhone 6s) 6‐Axis Gyro and Accelerometer 
Bosch Sensortech EMS‐A (iPhone 6s Plus) 6‐Axis Gyro and Accelerometer
BMA280(3P 7LA)  (iPhone 6s) 3‐Axis Accelerometer
BMP280 Barometer
ALPS HSCDTD007 Electronic Compass
AMS TSL2586 ALS
▼Radio Frequency
USI 339S00043 ‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.2
NXP 66V10 (PN66V?) NFC controller
Qualcomm MDM9635M baseband processor Baseband Processor:
‧20nm process
‧1.2GHz ARM Cortex‐A7 + 800MHz QDSP
‧Rel 9 LTE Cat 6
‧DC‐HSPA
‧TD‐SCDMA
‧EVDO Rev. B, CDMA 1X
‧GSM
‧QICE, Envelope Tracking
‧Integrated Memory
WTR3925 ‧28nm process
‧ GSM/CDMA/W‐CDMA/LTE Transceiver
QFE1100 Envelope Power Tracker
Manufacturer Device Function
iPhone 6s  Model A1688
Skyworks SKY77812‐19 Power Amplifier Module 
SKY77357‐8 Power Amplifier Module 
Avago AFEM‐8030 Power Amplifier Module 
RFMD RF5150 Antenna Switch 
RF1347 Antenna Switch Module 
TriQuint TQF6405 Power Amplifier Module 
Murata 240 Front End module
Murata(?) Ne G98 RF Front End module
Rd G54 RF Front End module
iPhone 6s Plus Model 
A1687
Skyworks SKY77812‐19 Power Amplifier Module 
SKY77357‐8 Power Amplifier Module 
SKY13701‐17 WLAN front end module
Avago AFEM‐8030 Power Amplifier Module 
RFMD RF5150 Antenna Switch 
TriQuint TQF6405 Power Amplifier Module 
Murata 240 Front End module
Murata(?) Af G54 RF Front End module
▼Processor
Application Processor
‧Dual‐core
‧Apple 3rd  generation ARM v8a architecture
‧Imagination PowerVR Series 7 GPU
‧SAMSUNG 14nm  FinFET process
TSMC 16nm  FinFET process
‧Apple M9 motion coprocessor
Apple M9 Coprocessor
‧ Integrated in the Apple A9 processor
▼Memory
System Memory
‧ Quad‐Channel 16‐bits LPDDR4 controller
‧ 16Gb density LPDDR4
‧ Apple customized PoP package
System Storage
‧Apple NVMe controller inside Apple A9
‧16GB/64GB/128GB capacity NAND Flash
M9
▼Radio Frequency
WiFi/BT
‧ USI WiFi/BT module
Baseband Processor
‧Qualcomm MDM9635M
‧Qualcomm WTR3925
PA Chips
‧Avago
‧Qualcomm
‧RF Micro
‧Skyworks
‧TriQuint
NFC 66V10
▼PMIC
PMIC for AP
‧Apple 338S00120‐A1 (iPhone 6s)
Apple 338S00122‐A1 (iPhone 6s Plus)
PMIC for BP
‧ Qualcomm PMD9635
▼Audio
Audio Codec
‧Apple 338S001285
‧Apple 338S000105
▼Touch Screen Controller
Controller
▼MEMs
Gyroscope
Accelerometer
Barometer
Compass
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ Storage Performance
NVMe SSD
UFS 2.0
M9
A9 ‐ Storage Performance
NVMe SSD
UFS 2.0
M9
A9 ‐ Storage Performance
NVMe SSD
UFS 2.0
NVMe SSD
UFS 2.0
eMMC 5.0
eMMC 5.0
M9
A9 ‐ Storage Performance
NVMe SSD
UFS 2.0
eMMC 5.0
NVMe SSD
UFS 2.0
eMMC 5.0
NVMe SSD
M9
338S00170‐A1
PMIC
338S1285
Audio AMP
338S00105
Audio Codec
16GB/64GB
NVMe SSD
 Apple A9 processor, Apple customized PoP package
4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix
 Qualcomm MDM9635M
 Qualcomm WTR1625L
 Qualcomm QFE1100
 Skyworks SKY77611
ALPS HSCDTD007
 Murata 339S00134 WiFi/BT Module
 Main storage, 16GB/64GBGB, NVMe SSD
SK Hynix : H230DG8UD1ACS, 16GB
 Qualcomm PM8019
 Qualcomm WFR1620
 NXP CBTL1610A3
 TI 5AA56PI SN2400AB0
 Apple 338S1285
 Apple 338S00170‐A1
 NXP 66V10 NFC
 Broadcom BCM5976
 TI 343S0645
 Apple 338S00105
 InvenSense EMS‐A
 TI 5CARCPI 3539
 TI 65730AOP
 Skyworks SKY77357
 Avago ACPM‐8020
 TDK EPCOS D5255
 Skyworks SKY77826
 Qorvo(TriQuint) TQF6410
 Qorvo(RF Micro) RF5159
Front facing camera
Rear facing camera
I2C/SPI
I2C/SPI
PCIeUART
LPDDR4
LPDDR4
PA chips is model 
dependent
HSIC
I2C
Lightning
4‐channel 
16‐bit
16Gb LPDDR4
339S00043
Qualcomm
QFE1100
Qualcomm
MDM9625M
Qualcomm
WTR1625L
Qualcomm
PM8019
PA 
Chips
16/64GB
NVMe SSD
338S00105
Audio Codec
ALPS
HSCDTD007
Bosch
BMA280
Bosch
BMP280
Invensense
EMS‐A
ALS
NXP
CBTL1610A3
NXP
66V10
4”
1136x640
LPDDR4
LPDDR4
338S00170‐A1
PMIC
338S1285
Audio AMP
I2C
M9M9
Broadcom
BCM5976
Qualcomm
WFR1620
PCIe
M
Manufacturer Device Function
▼Processor
Apple
Apple A9 Microprocessor
(APL0898 & APL1022)
‧SAMSUNG 14nm FinFet/TSMC 16nm FinFET process
‧Dual‐core, Apple 3rd generation ARMv8a architecture, 1.8GHz
‧Imagination PowerVR 7 series GPU
‧Apple customized PoP package
▼Memory
SK Hynix
H9HKNNNBTUMUMR‐NLH
‧16‐bit, Quad‐channel, 16Gb LPDDR4
‧Apple customized PoP package
Toshiba
‧NAND Flash‐based storage
‧Apple customized package
‧16GB/64GBGB
16GB: Toshiba   THGBX5G7D2KLFXG 
▼PMIC
Apple Apple 338S00170‐A1 PMIC for Apple A9 Processor (iPhone SE)
Qualcomm PM8019 PMIC for Qualcomm MDM9625M baseband processor
▼Audio
Apple Apple 338S00105 Audio Codec
Apple 338S1285 Audio AMP
▼Touch Screen Controller
Texas Instruments 62ARFKI 343S0645 Line Driver
Broadcom BCM5976 Touch screen controller
▼Others
Texas Instruments 65730AOP Power management IC
5CARCPI 3539 LED backlight Retina display driver 
5AA56PI SN2400AB0 Charger IC
NXP CBTL1610A3 USB charging
Manufacturer Device Function
▼Sensors
InvenSense EMS‐A 6‐Axis Gyro and Accelerometer 
Bosch Sensortech
BMP280 Barometer
ALPS HSCDTD007 Electronic Compass
▼Radio Frequency
USI 339S00043 ‧Broadcom BCM4350
‧ 802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.2
NXP 66V10(PN549/PN66V)) NFC controller
Qualcomm MDM9625M baseband processor Baseband Processor:
‧Rel 9 LTE Cat 4(150Mbps)
‧ Rel 10 LTE‐FDD CA
‧ Rel10 3C HSDPA+ 63Mbps
‧ DC HSUPA
‧ TD‐SCDMA
‧ DOrB
‧ QICE, Envelope Tracking
‧Integrated Memory
WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver
WFR1620 GSM/CDMA/W‐CDMA/LTE Receiver
Manufacturer Device Function
iPhone SE  Model A1662
Skyworks SKY77826 Ultra low‐band Power Amplifier Module 
SKY77357 2G/Edge Power Amplifier Module 
SKY77611 Quad‐band Power Amplifier Module 
Avago AFEM‐8020 Mid‐band Power Amplifier Duplexer
Qorvo(RFMD) RF5159 Antenna Switch 
Qorvo(TriQuint) TQF6410 Low‐band Power Amplifier Duplexer 
TDK EPCOS D5255  Diversity Receive Module 
APL1021/343S00074
‐ TSMC 16nm FinFET process
‐ Apple 3rd generation ARM v8a architecture, 2.26GHz
‐ Integrated M9 motion coprocessor
‐ Imagination PowerVR Series 7 GPU
‐ 8‐channel 16‐bits LPDDR4 memory controller
‐ DisplayPort/MIPI‐CSI
‐ PCIe, HSIC, I2C, UART, USB(?)
‐ Fingerprint sensor controller 
‐ 147mm2
M9
22X
FASTER
CPU Performance
ARM® CortexTM‐A8
SC, 45nm
ARM® CortexTM‐A9
DC, 45nm
ARM® CortexTM‐A9
DC, 45nm
ARM® ARMv7
DC, 32nm HKMG
ARM® ARMv8
DC, 28nm HKMG
ARM® ARMv8a
Tri Core
20nm HKMG
M9
ARM® ARMv8a
Dual Core
16nm FinFET
2010 2015
360X
FASTER
Graphics Performance
Imagination
PowerVR SGX535
Imagination
PowerVR SGX543MP2
Imagination
PowerVR SGX543MP4
Imagination
PowerVR Series 6XT             
8‐Clusters
M9
Imagination
PowerVR Series 7 GPU
Imagination
PowerVR SGX554MP4
Imagination
PowerVR G6430
2010 2015
338S1213
Audio Codec
32GB/128GB
NVMe SSD
338S00025‐A1
PMIC
338S00052‐A1
PMIC
M9
iPad Pro
iPad Pro
Super. Computer.
Now in two sizes.
iPad Pro
 USI 339S00045 WiFi/BT Module
 InvenSense MP67B
 Apple 343S00025‐A1
 Apple 343S00052‐A1
 Fresco Logic FL1100SX
 NXP Semiconductor 1610A3
 Maxim Integrated MAX98721CEWV
 Maxim Integrated MAX98721CEWV
 Apple 343S1213
 AKM AK8963
 SK Hynix H9HCNNNBTUMLNR‐NLH, 16Gb LPDDR4 
 SK Hynix H9HCNNNBTUMLNR‐NLH, 16Gb LPDDR4 
 Apple A9X processor
 Bosch Sensortec BMA280
 NXP Semiconductor 65V10
 Toshiba THGBX5G8D4KLDXG 32GB storage
 NXP Semiconductors LPC11U37
 Fairchild Semiconductor FDMC 6683 
 This area is reserved for 4G modem which is used in the WiFi + Cellular model 
 Bosch Sensortec BMP280
iPad Pro
Front facing camera
Rear facing camera
I2C/SPI
I2C/SPI
PCIeUART
LPDDR4
LPDDR4
This is for WiFi + 
Cellular model
HSIC
I2C
4‐channel 
16‐bit
16Gb LPDDR4
USI
339S00045
Qualcomm
QFE1100 Qualcomm
MDM9625M
Qualcomm
WTR1625L
Qualcomm
PM8019
PA 
Chips
32/128GB
NVMe SSD
338S1213
Audio Codec
AKM
AK8963
Bosch
BMA280
Bosch
BMP280
Invensense
MP67B
ALS
NXP
1610A3
NXP
65V10
LPDDR4
LPDDR4
338S00052‐A1
PMIC
Broadcom
BCM15900
I2C
M9MAXIM
MAX98721CEWV
NXP
8416A1
LPDDR4
LPDDR4 4‐channel 
16‐bit
16Gb LPDDR4
LPDDR4
LPDDR4
338S00025‐A1
PMIC
Broadcom
BCM15900
Parade
DP695
TI
TPS65144
eDP
12.9”
2732x2048
12.9”
2732x2048
Freesco
FL1100SX
PCIe
NXP
LP11U37
M9
Qualcomm
WTR1620
STMSTM
STM32L052x6
iPad Pro
Manufacturer Device Function
▼Processor
Apple
Apple A9X Microprocessor
(APL1021)
‧16nm FinFET process
‧Dual‐core, Apple 3rd generation ARMv8a architecture, 2.25GHz
‧Imagination PowerVR 7 series GPU
▼Memory
SAMSUNG
SK Hynix
K3RG1G1 OBMKGCH
H9HCNNNBTUMLNR‐NLH
‧16‐bit, Octa‐channel, 16Gb LPDDR4
‧Total system memory capacity is 4GB(16Gbx2)
‧Apple customized package
SanDisk
Toshiba
‧NAND Flash‐based storage
‧Apple customized package
‧Apple Proprietary NVMe SSD, 32GB and 128GB capacity
32GB: Toshiba THGBX5G8D4KLDXG 
128GB: SanDisk SDMMSEDF8
▼PMIC
Apple Apple 338S00052‐A1 PMIC for Apple A9X Processor
Apple 338S00025‐A1 PMIC for Apple A9X Processor
Qualcomm PM8019 PMIC for Qualcomm MDM9625M baseband processor (For Wi‐Fi + Cellular model)
▼Audio
Apple Apple 338S1213 Audio Codec
Maxim Integrated MAX98721CEWV Boosted class amplifier
▼Touch Screen Controller
Broadcom BCM15900B0 Touch screen controller
▼MEMs
InvenSense MPU‐6700(MP67B) 6‐Axis Gyro and Accelerometer 
Bosch Sensortech BMA280 3‐Axis Accelerometer
BMP280 Barometer
AKM AK8963 Electronic Compass
iPad Pro
Manufacturer Device Function
▼Others
Texas Instruments TPS65144 LCD Bias with Integrated Gamma
NXP CBTL1610A3 USB charging
LPC11U37 Cortex‐M0 microcontroller
NVT8416A1 Unknown
Parade DP695 LCD timing controller
Fresco Logic FL1100SX PCIe‐to‐USB 3.0 controller
Fairchild Semiconductor FDMC 6683 DC/DC Converter
FXMA2012 Translator
STMicroelectronics STM32L052x6 Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
iPad Pro
Manufacturer Device Function
▼Radio Frequency
USI 339S000045
(Boradcom BCM4350)
‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.2
NXP 65V10 NFC controller
For Wi‐Fi + Cellular model
Qualcomm MDM9625M baseband processor Baseband Processor:
‧Rel 9 LTE Cat 4(150Mbps)
‧Rel 10 LTE‐FDD CA
‧Rel 10 3C HSDPA+ 63Mbps
‧DC HSUPA
‧TD‐SCDMA
‧DOrB
‧QICE, Envelope Tracking
‧Integrated Memory
WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver
WFR1620 GSM/CDMA/W‐CDMA/LTE Receiver
QFE1100 Envelope Power Tracker
Avago A8020 Power Amplifier Module
TriQuint TQF6410 Power Amplifier Module
TQF6430 Power Amplifier Module
RFMD RF5159 Antenna Switch Module 
RF5145 Antenna Switch 
RF5147A Antenna Switch 
343S00089‐A1
32GB/128GB
NVMe SSD
338S00051‐A1
M9
iPad Pro
 Apple A9X processor
 Murata 339S00109 WiFi/BT Module
 Broadcom BCM15900B0
 NXP Semiconductor 66V10
 Apple 343S00051‐A1
 SAMSUNG K3RG1G1 OBMKGCH, 16Gb LPDDR4 
 Apple 343S00089‐A1
 STMicroelectronics STM32L052x6
 NXP Semiconductor CBTL1610A3
 InvenSense EMS‐A
 Maxim Integrated MAX98721BEWV
 Maxim Integrated MAX98721BEWV
 Bosch Sensortec BMA280
 This area is reserved for 4G modem which is used in the WiFi + Cellular model 
 SK Hynix H23QEG8VG1ACA 32GB storage
 This area is reserved for 4G modem which is used in the WiFi + Cellular model 
 Apple A9X processor
 Cirrus Logic CS42L83A
iPad Pro
Front facing camera
Rear facing camera
I2C/SPI
I2C/SPI
PCIeUART
LPDDR4
LPDDR4
This is for WiFi + 
Cellular model
PCIe
4‐channel 
16‐bit
16Gb LPDDR4
Qualcomm
MDM9635M
Qualcomm
WTR3925
Qualcomm
PMD9635
PA 
Chips
32/128/256GB
NVMe SSD
343S00089‐A1
eCompass
Bosch
BMP280
InvenSense
EMS‐A
ALS
NXP
66V10
LPDDR4
LPDDR4
338S00051‐A1
Broadcom
BCM15900
I2C
M9MAXIM
MAX98721BEWV
NXP
8416A3
Broadcom
BCM15900
Parade
DP815
98667A
B5528T
eDP
9.7”
2048x1536
9.7”
2048x1536
M9
Qualcomm
QFE1100
STMSTM
STM32L052x6
PCIe
NXP
1610A3
339S00109
M
CS42L83A
iPad Pro
Manufacturer Device Function
▼Processor
Apple
Apple A9X Microprocessor
(APL1021)
‧16nm FinFET process
‧Dual‐core, Apple 3rd generation ARMv8a architecture, 2.25GHz
‧Imagination PowerVR 7 series GPU
▼Memory
SAMSUNG K3RG1G1 OBMKGCH
‧16‐bit, Quad‐channel, 16Gb LPDDR4
‧Total system memory capacity is 2GB(16Gb)
‧Apple customized package
SK Hynix
‧NAND Flash‐based storage
‧Apple customized package
‧Apple Proprietary NVMe SSD, 32GB, 128GB and 256GB capacity
32GB: SK Hynix H23QEG8VG1ACA
▼PMIC
Apple
Apple 338S00052‐A1                              
Apple 343S00089‐A1
PMIC for Apple A9X Processor
Qualcomm PMD9635 PMIC for Qualcomm MDM9635M baseband processor (For Wi‐Fi + Cellular model)
▼Audio
Cirrus Logic CS42L83A Audio Codec
Maxim Integrated MAX98721BEWV Boosted class amplifier
▼Touch Screen Controller
Broadcom BCM15900B0 Touch screen controller
▼MEMs
InvenSense EMS‐A 6‐Axis Gyro and Accelerometer 
Bosch Sensortech BMA280 Barometer
Unknown Unknown Electronic Compass
iPad Pro
Manufacturer Device Function
▼Others
Texas Instruments TPS65144 LCD Bias with Integrated Gamma
NXP CBTL1610A3 USB charging
NVT8416A1 Unknown
Parade DP815 LCD timing controller
Fairchild Semiconductor FDMC 6683 DC/DC Converter
FXMA2012 Translator
STMicroelectronics STM32L052x6 Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
iPad Pro
Manufacturer Device Function
▼Radio Frequency
Murata 339S00109
(Boradcom BCM4350)
‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.2
NXP 66V10 NFC controller
For Wi‐Fi + Cellular model
Qualcomm MDM9635M baseband processor Baseband Processor:
‧20nm process
‧1.2GHz ARM Cortex‐A7 + 800MHz QDSP
‧Rel 9 LTE Cat 6
‧DC‐HSPA
‧TD‐SCDMA
‧EVDO Rev. B, CDMA 1X
‧GSM
‧QICE, Envelope Tracking
‧Integrated Memory
WTR3925 ‧28nm process
‧ GSM/CDMA/W‐CDMA/LTE Transceiver
QFE1100 Envelope Power Tracker
iPad Pro
 Cambridge Silicon Radio (Qualcomm)CSR1012A05
L05286 QS4 VG Z SGP 528
(STMicroelectronics STM32L052x6)
EWX 01129 
 ST Microelectronics AS5C Y533
 ST Microelectronics STML151UCY6, ARM Cortex‐M3 MCU
 Bosch Sensortec BMA280
 8529043 343S00008‐A1(Customized part for Apple?) 
iPad Pro
Manufacturer Device Function
▼Apple Pencil
ST Microelectronics STML151UCy6 ARM Cortex‐M3 MCU
AS5C Y533 unknown
Bosch Sensortech BMA280 3‐Axis Accelerometer
Qualcomm/CSR CSR1012A05 Bluetooth Smart chip
STMicroelectronics
L05286 QS4 VG Z SGP 528
(STM32L052x6)
Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
Unknown(MAXIM?) EWX 01129 unknown
Unknown
(Customized for Apple?)
8529043 343S00008‐A1 
unknown
▼Smart Keyboard
ST Microelectronics STM32F103VB 72MHz ARM Cortex‐M3 MCU
iPad Pro
▼Processor
Application Processor
‧Dual‐core
‧Apple 3rd  generation ARM v8a architecture
‧Imagination PowerVR Series 7 GPU
‧TSMC 16nm  FinFET process
‧Apple M9 motion coprocessor
Apple M9 Coprocessor
‧ Integrated in the Apple A9X processor
▼Memory
System Memory
‧Eight‐Channel 16‐bits LPDDR4 controller
‧16Gb density LPDDR4
‧Apple customized package
System Storage
‧Apple NVMe controller inside Apple A9
‧16GB/64GB/128GB capacity NAND Flash
M9
iPad Pro
▼Radio Frequency
WiFi/BT ‧Broadcom BCM4350
‧USI WiFi/BT module
Baseband Processor
‧Qualcomm MDM9625M
‧Qualcomm MDM9635M
‧Qualcomm WTR3925
‧Qualcomm WTR1625L
‧Qualcomm WTR1620
‧Qualcomm QFE1100
NFC 65V10
66V10
▼PMIC
PMIC for AP
‧Apple 338S00052‐A1
Apple 338S00025‐A1
Apple 338S00051‐A1
PMIC for BP
‧ Qualcomm PM8019
Qualcomm PMD9635
▼Audio
Audio
‧Apple 338S001213
Apple 338S00089‐A1
‧Maxim MAX98721CEWV
iPad Pro
▼Touch Screen Controller
Controller
▼MEMs
Gyroscope
Accelerometer
Barometer
Compass
iPad Pro
A9X ‐ CPU Performance M9
iPad Pro
M9
A9X ‐ CPU Performance
iPad Pro
M9
A9X ‐ CPU Performance
iPad Pro
M9
A9X ‐ CPU Performance
iPad Pro
M9
A9X ‐ GPU Performance
iPad Pro
M9
A9X ‐ GPU Performance

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