Bilingual electronic engineer with experience in PCB manufacturing including SMT process engineering. Skilled in failure analysis and implementing process improvements to reduce defects and increase efficiency.

1. Javier Gómez García
4600 Westway Ave, McAllen, Tx
Cel: 956-890-1037
jonuli1505@gmail.com
SUMMARY
Bilingual: English / Spanish, Electronic Engineering degreed, with solid background in PCB manufacturing.
Well deep analysis failure reporting.
EDUCATION / TRAINING
Carrier Electronic Engineer, 1997
Instituto Tecnologico de Reynosa Certified Electronic Engineer, 2002
Siemens Prog & Maint Agile
Basic SAP Wave Solder Process
Autocad AirVac Repair Station
Lead Free Solder paste Router
Lean Manufacturing Conformal
TIMMS (SONY Programming sfw) X Ray Inspection
GREN BELT Stencil Desing
Transferring Leader (NY to Reynosa) (Fort Worth to Reynosa)
EXPERIENCE Work visa H1B
Air Solutions Heating & AC January/11 to present
Responsible to coordinate jobs on site, implement new software to calculate Manual J’s for residence AC
system, analyze mal functions boards, carry out infiltration test for residence to improve energy savings.
Use infrared gun to find leaks for lose energy on residences, install new systems AC system for residence to
improve the energy saving.
Motorola June /10 to Dic/10
Reynosa, Tamps.
Sr SMT Process Engineer.
Responsible to maintain running the SMT lines, keep our process without defects. Review the yield average
for all the models in the final assembly to know the defects that my customers find. Make any change in the
SMT process to fix the problem and improvements for the models, that include improve tools & operations
techniques.
Analyze the defects that our customers find as solder join, with die test performing as a first level analysis. If
the problem is regarding to the solder join under the component I use the X ray inspection to find missing
solder paste or short solder join or component damaged.
Motorola January/00 to April/09
Reynosa, Tamps.
Asist PCB Engineering Manager.
Responsible for all engineering aspects of PCB level, cash management, inventory control spare part.
Arrange and manage all the different shifts to support Production, control and maintain placement programs.

2. Support new technologies introduction, scheduling training to support team, implement lean manufacturing
in the current layout, improve PM program for all the equipments, coordinate run rates to have a Capacity
Model for scheduling. Introduce Lead Free process; re-design profiles according to the LF components, set
all the tools and materials for LF. Under my responsibilities there are 7 engineers and 5 technicians.
Accomplishments:
• Reduce Scrap from $192K to $45K for all PCBA
• Router analysis, calibration machine and new tools added
• Solder shorts under BGA elimination by new apertures on stencil. $20.5 K saved.
• Yield improvement from 95 to 98, PCBA actions taken.
• Re-design stencils.
• Re-design profiles for LF components.
• New pallets for Wave solder process.
• New pallets for conformal coating.
• Improve machines efficiency from 34 % to 55 %, on going.
• Reduce Change Over number
• Grouping setups families.
• Schedule only high placement models in new SMT lines
• Downtime improvement from 224 hrs to 100 hrs, on going.
• Review maintenance task for each machine
• High maintenance performance for lines with major DT.
• CO improvement from 25 sec to 15 sec
• Analysis operations to eliminate no-value operation
• Cascade CO.
• Define task per technician
• 5’s culture improve from 1.8 to 3.9 metric
Kimball 09/97 to 12/99
Reynosa, Tamps.
SMT Process Engineer
Responsible for maintain running the machines; establish a schedule maintenance for all the SMT
equipments. Improve the performance of the machines doing analysis for placement optimization, buy spare
parts to reach the goal of performance. Re-active machine without use for new models to run, coordinate
high maintenance for Fuji machines, coordinate transferring model from Jasper Indiana to Reynosa for new
products introduction. Give training to technicians on conformal and silicon machines dispensing and
profiles charts. Coordinate Temporally Change on production according to our customers. Under my
responsibility were 7 technicians.
• Introduce new Microsoft project (re-active CP VI, and GSP Fuji Machines)
• Introduce new GE project (Conformal Included)
Delnosa. 10/91 to 09/97
Reynosa, Tamps.
Product Engineer. Analysis CAR computer from GM. Define process to improve the lead time for
remanufacturing the Car Computers. Coordinate ramp up for new requirements, require tools and spare
parts to support the production, assign human resources for the process. Coordinate EC for new
introductions; validate each test to release to Production.