The document describes the process of creating a sample for transmission electron microscopy (TEM) using a focused ion beam (FIB). Key steps include:
1) Protecting the area of interest with a platinum coating to prevent ion damage during milling.
2) Milling trenches around the area and cutting it into a rectangular sample attached by a thin section.
3) Plucking the sample from the bulk material using a probe and welding it to a TEM grid.
4) Polishing the sample to a thin, uniform thickness of around 100nm for atomic resolution TEM imaging of features like grain boundary complexions.
2. How it works?
Reasons for one electron beam
and one ion beam
Viewing three dimensions
SEM provides view of x- and y-directions
FIB provides view of y- and z-directions
Monitoring sample fabrication with non-
destructive SEM
Determining if the final sample is of uniform
thickness
Brightness of sample should be consistent
3. How it works?
Eucentric height adjustments
Sample holder is tilted back and forth
Height (z-direction) is adjusted until the area of interest
remains centered at all tilts
Both FIB and SEM can view the same area
Eucentric height is
typically around 5mm in
most FIBs
4. How it works?
Sample protection (Pt deposition)
Wetting of tungsten tip to make Ga+
ions
Injection of Pt-based metallorganic gas
Pt is deposited and organics leave
Pt coating protects the area of interest
from further ion damage
5. How it works?
Ion milling
Trenches are created around the area of interest
Milling is monitored by the SEM beam
Sample cutting
Rectangular sample is cut so
that it is barely attached
Pt
7. How it works?
Sample Plucking
Pt gas probe reinserted
Sample plucker is inserted
Plucker is microwelded to the
sample
TEM sample is lifted from the bulk
material
8. How it works?
Welding to the TEM grid
Eucentric height of grid is found
Sample is moved against the grid
Sample is microwelded to the grid
Plucker is ion milled off
10. How it works?
Sample polishing
Needed for atomic resolution in TEM
Eliminates ion impurities from milling (surface damage)
Low current is used to prevent impurities and surface damage
Final sample is ~100nm thick
Final sample must have parallel surfaces and consistent
thickness
Final sample will be bright due to electron transparency
11. What we are looking for
Grain boundary complexions
12. What we are looking for
A good high resolution TEM image of complexions