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Lean Six Sigma Project
Scrap Reduction in Electronic Circuit Board Production
Lassi Uusitalo
Lean Six Sigma Green Belt Trainee
Public
Continental Company Presentation
Continental Corporation
Overview 2017
05.09.2018
2Continental AG
Since 1871
with headquarters
in Hanover,
Germany
235,473
employees
worldwide
554 locations in
61 countries
Status: December 31, 2016
Public
Continental Company Presentation
Continental Corporation
Overview 2017
05.09.2018
3
Sales of appr.
€44 billion
ContiTech
14%
Chassis & Safety
22%
Powertrain
18%
Interior
20%
Tires
26%
Sales
by division
in %
Status: December 31, 2016
© Continental AG
For ESTIEMers
Corporate Function Quality&Environment
› Project was conducted on during summer 2017
› In one of the plants in Germany
› Highly standardized serial production
› Data is created based on real world observations for this project presentation
Project Introduction
Scrap Reduction in Electronic Circuit Board Production
5 September 2018
4CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Project Leader: Lassi Uusitalo
Team: Maintenance Specialist
Failure Analysis Specialist
Team Leader in Prodction
IT / Data Specialist
Sponsor: Plant Manager
Project Charter
Scrap Reduction in Electronic Circuit Board Production
5 September 2018
5
Project Goal: Find & eliminate the rootcause of a long standing problem of a
repeated defect which has lead to customer returns.
DMAIC - Time plan:
Define: 06 / 2017
Measure: 06 / 2017
Analyze: 06-07 / 2017
Improve: 07 / 2017
Control: 07-08 / 2017
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
There have been problems with different parts of the
external housing and connectors being
mechanically damaged during the production.
Problem Description:
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
› Since March several customer returns
of defected products from repeated
mechanical damage in circuit boards
› A very specific and systematic
problem with a specific cause
› A range of other unexplained
mechanical damages
Problem Description
Scrap Reduction in Electronic Circuit Board Production
5 September 2018
6
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Amount of Scrap Varies Over Time
Scrap reduction in Electronic Circuit Board production
5 September 2018
7
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
1110987654321
4.0%
3.0%
2.0%
1.0%
0.0%
Observation
IndividualValue
_
X=1.9%
UCL=3.5%
LCL=0.3%
1
I Chart of Scrap rate per week
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Deployment Diagram
Scrap reduction in Electronic Circuit Board production
5 September 2018
8
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Fishbone Diagram
Scrap reduction in Electronic Circuit Board production
5 September 2018
9
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
Machinery Methods Manpower
MeasurementsMother NatureMaterials
Transport Scrap
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Potential Problem Analysis
Scrap reduction in Electronic Circuit Board production
5 September 2018
10
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
Process Step Potential Problems Possible Effects Likely/Possible Causes
Shaking during manual handling
Circuit boards bump into each
other
Loose shelves without up/down
movement prevention mechanism
Circuit boards are not aligned in
the logistics box
The vertical plastic part
touches various areas of the
circuit board above it
Slippery non-fixed shelves
ICT Misplacing the reader
Misread in testing (non-failure
read as failure)
Mechanical and/or calibration
problem
Too hasty handling
Carelesness
The jig is too tight?
Change in equipment pieces
Forgetting reprogramming
Gets stuck midway Too snug fit of the jig
Unwelcome stress on the
hinge between the microchip
and the connector
Handler lifts the
microchip+connectors from one
corner, creating an angle which
causes the microchip+connectors
to slide against the walls of the jig
Parts which should be
pressed end up in scrap
Laser scanning is not suitable for
checking the alignment of pieces?
Parts which scrapped go
through the press
Lhe scanner is dirty?
-> parts get further damaged
down the line
Wrong calibration?
Awkward position of the
operator
The connectors could be set
with a bit of an incorrect angle
The jig is positioned in around 40
degree angle when outside of the
machine
The microchip is taken out
forcefully
Unnecessary stress on
components
Tight schedule, haste
Loading
Pressfit
(connectors)
Misplaced connector in the jig
Pieces are not completely
aligned -> pressfit will merge
them with error/defect
Calibration problem Several types of errors
The assembled
microchip+connectors are taken
out at the wrong angle (not
straight up)
There is a reading error in the
scanner before pressing
› Done for all process steps
› 32 Possible causes identified
› How to get data?
› Where to focus?
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Pareto from Scrap Analysis Results
Scrap reduction in Electronic Circuit Board production
5 September 2018
11
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
Measurement points
ICT test
Check the
alignment and
connectors
Check the
result
Check the seal
EOL testing
ICT Testing Machine
Press Fit Machine 1
Paste Machine
Hand press
EOL Test Machine
Count 928 207 48 60
Percent 74.7 16.7 3.9 4.8
Cum % 74.7 91.3 95.2 100.0
Subscripts OtherICT Testing MachineHand pressEOL Test Machine
1400
1200
1000
800
600
400
200
0
100
80
60
40
20
0
Count
Percent
Pareto Chart of defects per location
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Process Steps for Paste Machine and Press fit
Scrap reduction in Electronic Circuit Board production
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
Place
housing
pieces in
the paste
machine
Place
pasted
housing
pieces on
the pre-
assembly
table
Place
circuit
board in
the
assembly
jig
Place
pasted
upper
housing in
the
assembly
jig
Place the
battery in
its slot
Place &
press the
battery
protector
w/
handpress
Place the
upper+
lower
housing in
the final
(small)
pressfit
Apply
paste
Seal the upper and the
lower housing together
Flash the
tracking
barcode of
the battery
Check
the
seal
Check
the
result
Place the
tracking
label on the
product
Operator 2
Paste
Machine
Hand
Press
Scrap Analysis
CFQ&E, © Continental AG
5 September 2018
12
For ESTIEMers
Corporate Function Quality&Environment
Weeks 14 to 16 Have the Highest Scrap Rate
Scrap reduction in Electronic Circuit Board production
5 September 2018
13
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
Counts EOL 270 152 138 108 93 80 49 38
Percent 29.1 16.4 14.9 11.6 10.0 8.6 5.3 4.1
Cum % 29.1 45.5 60.3 72.0 82.0 90.6 95.9 100.0
Defects in EOL
O
ther
problem
in
Antenna
23
Protocol 1
problem
in
connectors 12-14
Protocol 2
Protocol 3
Protocol 4
problem
in
connectors 1-3
900
800
700
600
500
400
300
200
100
0
100
80
60
40
20
0
CountsEOL
Percent
Pareto Chart of Defects in EOL
Most problems are occurring with connectors
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Weeks 14 to 16 Have the Highest Scrap Rate
Scrap reduction in Electronic Circuit Board production
5 September 2018
14
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
Counts 155 52
Percent 74.9 25.1
Cum % 74.9 100.0
Defects in Hand Press Connector 12Connector 23
200
150
100
50
0
100
80
60
40
20
0
Counts
Percent
Pareto Chart of Defects in Hand Press
Most problems are occurring with connectors
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Closer Look at the Fishbone Diagram
Component Breakages Detected After Hand Press
5 September 2018
15
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
Machinery
Error In Hand Press
Wrong
setting
Mounting
component
incorrectly
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Problem Potentially Caused by Wrong Setting
Problems started occurring after latest maintenance
5 September 2018
16
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
› Handpress has been set to
go lower than the top of
the assembled part
› There is excess force
inflicted on the parts in the
hand press station
› All force that is not used for
clipping the battery cap is
directly transferred to the
circuit board, causing it to
bend
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Improvements
Contact of Antenna and Housing in Hand Press
5 September 2018
17
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
Recalibration of the hand press
Strain gauge measurements
Immediate improvements
Making a new reference block
Additional supports on hand press jig
Long-term improvements
CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
Any Questions?
Thank you!
5 September 2018
18CFQ&E, © Continental AG
For ESTIEMers
Corporate Function Quality&Environment
› Common for all is the structured approach for solving problems
› Always need for data to support the process and validate improvements
› Six Sigma is the most data focus approach
› Tools are used flexibly, no matter how the approach is called!
Lean Six Sigma in Automotive Industry
Need for Structured Problem Solving
5 September 2018
19
DEFINE
MEASURE
ANALYZE
IMPROVE
CONTROL
A3 8D Six Sigma
CFQ&E, © Continental AG

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ESTIEM Lean Six Sigma Green Belt Project at Continental - Scrap Reduction

  • 1. Lean Six Sigma Project Scrap Reduction in Electronic Circuit Board Production Lassi Uusitalo Lean Six Sigma Green Belt Trainee
  • 2. Public Continental Company Presentation Continental Corporation Overview 2017 05.09.2018 2Continental AG Since 1871 with headquarters in Hanover, Germany 235,473 employees worldwide 554 locations in 61 countries Status: December 31, 2016
  • 3. Public Continental Company Presentation Continental Corporation Overview 2017 05.09.2018 3 Sales of appr. €44 billion ContiTech 14% Chassis & Safety 22% Powertrain 18% Interior 20% Tires 26% Sales by division in % Status: December 31, 2016 © Continental AG
  • 4. For ESTIEMers Corporate Function Quality&Environment › Project was conducted on during summer 2017 › In one of the plants in Germany › Highly standardized serial production › Data is created based on real world observations for this project presentation Project Introduction Scrap Reduction in Electronic Circuit Board Production 5 September 2018 4CFQ&E, © Continental AG
  • 5. For ESTIEMers Corporate Function Quality&Environment Project Leader: Lassi Uusitalo Team: Maintenance Specialist Failure Analysis Specialist Team Leader in Prodction IT / Data Specialist Sponsor: Plant Manager Project Charter Scrap Reduction in Electronic Circuit Board Production 5 September 2018 5 Project Goal: Find & eliminate the rootcause of a long standing problem of a repeated defect which has lead to customer returns. DMAIC - Time plan: Define: 06 / 2017 Measure: 06 / 2017 Analyze: 06-07 / 2017 Improve: 07 / 2017 Control: 07-08 / 2017 DEFINE MEASURE ANALYZE IMPROVE CONTROL There have been problems with different parts of the external housing and connectors being mechanically damaged during the production. Problem Description: CFQ&E, © Continental AG
  • 6. For ESTIEMers Corporate Function Quality&Environment › Since March several customer returns of defected products from repeated mechanical damage in circuit boards › A very specific and systematic problem with a specific cause › A range of other unexplained mechanical damages Problem Description Scrap Reduction in Electronic Circuit Board Production 5 September 2018 6 DEFINE MEASURE ANALYZE IMPROVE CONTROL CFQ&E, © Continental AG
  • 7. For ESTIEMers Corporate Function Quality&Environment Amount of Scrap Varies Over Time Scrap reduction in Electronic Circuit Board production 5 September 2018 7 DEFINE MEASURE ANALYZE IMPROVE CONTROL 1110987654321 4.0% 3.0% 2.0% 1.0% 0.0% Observation IndividualValue _ X=1.9% UCL=3.5% LCL=0.3% 1 I Chart of Scrap rate per week CFQ&E, © Continental AG
  • 8. For ESTIEMers Corporate Function Quality&Environment Deployment Diagram Scrap reduction in Electronic Circuit Board production 5 September 2018 8 DEFINE MEASURE ANALYZE IMPROVE CONTROL CFQ&E, © Continental AG
  • 9. For ESTIEMers Corporate Function Quality&Environment Fishbone Diagram Scrap reduction in Electronic Circuit Board production 5 September 2018 9 DEFINE MEASURE ANALYZE IMPROVE CONTROL Machinery Methods Manpower MeasurementsMother NatureMaterials Transport Scrap CFQ&E, © Continental AG
  • 10. For ESTIEMers Corporate Function Quality&Environment Potential Problem Analysis Scrap reduction in Electronic Circuit Board production 5 September 2018 10 DEFINE MEASURE ANALYZE IMPROVE CONTROL Process Step Potential Problems Possible Effects Likely/Possible Causes Shaking during manual handling Circuit boards bump into each other Loose shelves without up/down movement prevention mechanism Circuit boards are not aligned in the logistics box The vertical plastic part touches various areas of the circuit board above it Slippery non-fixed shelves ICT Misplacing the reader Misread in testing (non-failure read as failure) Mechanical and/or calibration problem Too hasty handling Carelesness The jig is too tight? Change in equipment pieces Forgetting reprogramming Gets stuck midway Too snug fit of the jig Unwelcome stress on the hinge between the microchip and the connector Handler lifts the microchip+connectors from one corner, creating an angle which causes the microchip+connectors to slide against the walls of the jig Parts which should be pressed end up in scrap Laser scanning is not suitable for checking the alignment of pieces? Parts which scrapped go through the press Lhe scanner is dirty? -> parts get further damaged down the line Wrong calibration? Awkward position of the operator The connectors could be set with a bit of an incorrect angle The jig is positioned in around 40 degree angle when outside of the machine The microchip is taken out forcefully Unnecessary stress on components Tight schedule, haste Loading Pressfit (connectors) Misplaced connector in the jig Pieces are not completely aligned -> pressfit will merge them with error/defect Calibration problem Several types of errors The assembled microchip+connectors are taken out at the wrong angle (not straight up) There is a reading error in the scanner before pressing › Done for all process steps › 32 Possible causes identified › How to get data? › Where to focus? CFQ&E, © Continental AG
  • 11. For ESTIEMers Corporate Function Quality&Environment Pareto from Scrap Analysis Results Scrap reduction in Electronic Circuit Board production 5 September 2018 11 DEFINE MEASURE ANALYZE IMPROVE CONTROL Measurement points ICT test Check the alignment and connectors Check the result Check the seal EOL testing ICT Testing Machine Press Fit Machine 1 Paste Machine Hand press EOL Test Machine Count 928 207 48 60 Percent 74.7 16.7 3.9 4.8 Cum % 74.7 91.3 95.2 100.0 Subscripts OtherICT Testing MachineHand pressEOL Test Machine 1400 1200 1000 800 600 400 200 0 100 80 60 40 20 0 Count Percent Pareto Chart of defects per location CFQ&E, © Continental AG
  • 12. For ESTIEMers Corporate Function Quality&Environment Process Steps for Paste Machine and Press fit Scrap reduction in Electronic Circuit Board production DEFINE MEASURE ANALYZE IMPROVE CONTROL Place housing pieces in the paste machine Place pasted housing pieces on the pre- assembly table Place circuit board in the assembly jig Place pasted upper housing in the assembly jig Place the battery in its slot Place & press the battery protector w/ handpress Place the upper+ lower housing in the final (small) pressfit Apply paste Seal the upper and the lower housing together Flash the tracking barcode of the battery Check the seal Check the result Place the tracking label on the product Operator 2 Paste Machine Hand Press Scrap Analysis CFQ&E, © Continental AG 5 September 2018 12
  • 13. For ESTIEMers Corporate Function Quality&Environment Weeks 14 to 16 Have the Highest Scrap Rate Scrap reduction in Electronic Circuit Board production 5 September 2018 13 DEFINE MEASURE ANALYZE IMPROVE CONTROL Counts EOL 270 152 138 108 93 80 49 38 Percent 29.1 16.4 14.9 11.6 10.0 8.6 5.3 4.1 Cum % 29.1 45.5 60.3 72.0 82.0 90.6 95.9 100.0 Defects in EOL O ther problem in Antenna 23 Protocol 1 problem in connectors 12-14 Protocol 2 Protocol 3 Protocol 4 problem in connectors 1-3 900 800 700 600 500 400 300 200 100 0 100 80 60 40 20 0 CountsEOL Percent Pareto Chart of Defects in EOL Most problems are occurring with connectors CFQ&E, © Continental AG
  • 14. For ESTIEMers Corporate Function Quality&Environment Weeks 14 to 16 Have the Highest Scrap Rate Scrap reduction in Electronic Circuit Board production 5 September 2018 14 DEFINE MEASURE ANALYZE IMPROVE CONTROL Counts 155 52 Percent 74.9 25.1 Cum % 74.9 100.0 Defects in Hand Press Connector 12Connector 23 200 150 100 50 0 100 80 60 40 20 0 Counts Percent Pareto Chart of Defects in Hand Press Most problems are occurring with connectors CFQ&E, © Continental AG
  • 15. For ESTIEMers Corporate Function Quality&Environment Closer Look at the Fishbone Diagram Component Breakages Detected After Hand Press 5 September 2018 15 DEFINE MEASURE ANALYZE IMPROVE CONTROL Machinery Error In Hand Press Wrong setting Mounting component incorrectly CFQ&E, © Continental AG
  • 16. For ESTIEMers Corporate Function Quality&Environment Problem Potentially Caused by Wrong Setting Problems started occurring after latest maintenance 5 September 2018 16 DEFINE MEASURE ANALYZE IMPROVE CONTROL › Handpress has been set to go lower than the top of the assembled part › There is excess force inflicted on the parts in the hand press station › All force that is not used for clipping the battery cap is directly transferred to the circuit board, causing it to bend CFQ&E, © Continental AG
  • 17. For ESTIEMers Corporate Function Quality&Environment Improvements Contact of Antenna and Housing in Hand Press 5 September 2018 17 DEFINE MEASURE ANALYZE IMPROVE CONTROL Recalibration of the hand press Strain gauge measurements Immediate improvements Making a new reference block Additional supports on hand press jig Long-term improvements CFQ&E, © Continental AG
  • 18. For ESTIEMers Corporate Function Quality&Environment Any Questions? Thank you! 5 September 2018 18CFQ&E, © Continental AG
  • 19. For ESTIEMers Corporate Function Quality&Environment › Common for all is the structured approach for solving problems › Always need for data to support the process and validate improvements › Six Sigma is the most data focus approach › Tools are used flexibly, no matter how the approach is called! Lean Six Sigma in Automotive Industry Need for Structured Problem Solving 5 September 2018 19 DEFINE MEASURE ANALYZE IMPROVE CONTROL A3 8D Six Sigma CFQ&E, © Continental AG