POLYTEDA LLC, a provider of semiconductor design software and PV-services announced the general availability of PowerDRC/LVS version 2.2.
This release is dedicated to delivering fill layer generation for multi-CPU mode, new KLayout integration functionality and other significant improvements for multi-CPU mode
2. PV background2
Physical verification is a step in microchip design. A layout of new device is checked
to find and fix errors before actual manufacturing
The check is done by special EDA software - Design Rule Check (DRC) tool
An error missing at this stage may lead to creating a malfunctioning microchip and
cost multi-million dollar losses for semiconductor manufacturers
Another major factor is time. Physical verification is one of the longest stages in the
designing process It could takes several days for DRC tool to make just one iteration
on modern super large microchips.
3. Corporate background
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Fastest & most accurate DRC technology and cloud-ready PV-flow
Founded in 2009. Privately held by KM Core (www.kmcore.com)
World-wide presence:
Headquarters, R&D and technical support team resides in Kiev, Ukraine
Sales & Marketing provided by TEKSTART LLC ( US, Taiwan, Israel, Japan)
4. PowerDRC/LVS capabilities
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DRC - design rules checking in layout
LVS – layout vs schematic verification
NVN – schematic vs schematic netlists comparison
XOR – layout vs layout by layer comparison
QuickDiff – diffing of layout versions to ensure ECO (engineering change order)
Filler layers generation
Support of antenna rules, density rules, pads, latches and other special rules
Graphical diagnostics with visualization of violations, discrepancies and shorted nets
6. PowerDRC™6
The main idea of PowerDRC/LVS is to speed up the process of physical verification
by using One-Shot™ processing that delivers maximum CPU efficiency per one rule
check
Silicon-proven: 250nm, 180nm, 130nm, 90nm, 65nm, 40nm
Fastest and most accurate native flat DRC engine on the market
Predictable performance and behavior
Multi-CPU and hierarchical operations for linear performance gain
7. Parallel processing7
PowerDRC benefits from parallel processing of:
independent groups of rules (blocks)
independent parts of layout (strips)
Parallel tasks may be run in multi-CPU mode on:
a single host
multi host grids like Platform LSF or SGE/OGE
NEFELUS cloud service
custom cloud platform
Scalability proven on 2, 4, 6, 8, 12, 16, 24, 32, 48 CPUs
8. QuickDiff purpose
When a small change is made to a design near tapeout (often called ECO - engineering change order),
the design team may want to make sure - by means of XOR - that that was the only change made.
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13. PowerLVS™
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Supports 7 effective comparison algorithms applied automatically and dynamically
depending on the type of encountered blocks to ensure accuracy at the highest level
of performance
Silicon-proven: 250nm, 180nm, 130nm, 90nm, 65nm, 40nm
Predictable performance and behavior
Supports extraction of array instances to get up to 10x performance increase
Provides Multi-label, Floating-label, Hier cells and Open nets reports
Graphical debug is provided by PowerRDE and Short Finder utility
14. PowerLVS performance
Process node: 40nmLP; Hard IP: analog, logic gates and memory cells, ~ 380 million physical gates
Extraction of all devices: 11 hrs + 5 more hrs for output
Comparison: 12.5 hrs
Total LVS time: 28.5 hrs using 1 CPU core and 128 GB of RAM
Process node: 4um Hard IP: LCD 1280x960: analog IP and pixel cell array, ~ 50 million physical gates
Extraction of all devices: 2 min
Comparison: 1 hr and 50 min
Total LVS time: 1 hr and 52 min using 1 CPU and 8 GB of RAM
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15. Unique features
Advantages from using efficient FLAT engine natively
Extremely efficient usage of hardware resources (RAM, cache, CPU load)
Predictable performance
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16. Run and Debug Environment (PowerRDE™)
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Allows user to:
Adjust DRC and LVS run parameters
Save them in a run configuration file
Read a saved configuration
Run PowerDRC/LVS
View run progress
Review results
Debug violations, etc.
17. 17
Short Finder utility (graphical LVS debug component)
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Suggests a short location
Shorted net polygons in a
table format
Allows to assign label for
selected polygon
Allows to mark a polygon as
‘deleted’
Recalculates the shortest path
Interactive work in KLayout
editor
18. PowerDRC/LVS integration
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PowerDRC/LVS has interoperability with:
Cadence Virtuoso – CDBA and OA
SpringSoft Laker – Native
AWR Analog Office - Native
KLayout – Native
Symica DE – Native
19. Synergic Partnership (AWR)
AWR Corporation has been POLYTEDA OEM partner since 2009.
PowerDRC/LVS was integrated with Analog Office suite and is available for all Analog
Office customers.
More information and demo video are available at:
www.polyteda.com/products-demo
www.awrcorp.com/products/analog-office
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20. Supported technology nodes
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Sign-off
Available
upon request
UMC IHP Silanna AMS L Foundry
40nm: G & LP
65nm: LL, LP & SP
180nm: G & LL
250nm
130nm 250nm (GX, FX) S35 150nm
MOSIS SCMOS
500-180nm
To check availability of othe
please contact POLYTEDA
21. To get hand-on experience
Order trial version of PowerDRC/LVS online at:
www.polyteda.com/contact-us/submitrequest
PowerDRC/LVS 2.2 – is officially available from POLYTEDA since Dec 21, 2015
• Try cloud version of PowerDRC/LVS as SaaS on NEFELUS Cloud - www.nefelus.com
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22. Licensing details
• PowerDRC/LVS is licensed on per-CPU basis separately for DRC and LVS
• PowerRDE GUI cockpit requires its own license (PowerRDE)
• Filler layers generation feature (PowerFIL) requires its own license
• XOR and QuickDiff operations (PowerLVL) require their own license
• Licensing employs FlexLM license manager
• Licenses are bound either to hostID (MAC-address) or disk serial number or dongle flexID
• Usual license duration is 1 year
• Licenses are valid for all minor version updates but not for major ones, i.e. license for 2.2 is
valid for 2.2.1 but not for 2.3
• Short-term licenses may be granted for trial purposes
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23. Support policy
• POLYTEDA is ready to provide offline (email) technical support based on
additional Support and Maintenance Agreement (available).
• In urgent cases a hot fix version may be sent to the customer as soon as the issue is
solved.
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