1. EGNC105MK
GaN-HEMT 105W
High Voltage - High Power GaN-HEMT
FEATURES
・High Voltage Operation : VDS=50V
・High Power : 51dBm (typ.) @ Psat
・High Efficiency: 70%(typ.) @ Psat
・Linear Gain : 20dB(typ.) @ f=0.9GHz
・Proven Reliability
DESCRIPTION
SEDI's GaN-HEMT offers high efficiency, ease of matching, greater
consistency and broad bandwidth for high power L-band amplifiers with
50V operation, and gives you higher gain.
This new product is ideally suited for use in 0.9GHz LTE design
requirements as it offers high gain, long term reliability and ease of use.
ABSOLUTE MAXIMUM RATINGS (Case Temperature Tc=25oC)
Item Symbol Condition Rating Unit
Operating-Voltage VDS 55 V
Drain-Source Voltage VDS VGS=-8V 160 V
Gate-Source Voltage VGS -15 V
Total Power Dissipation Pt 97.8 W
Storage Temperature Tstg oC
-65 to +175
oC
Channel Temperature Tch 250
RECOMMENDED OPERATING CONDITION
Item Symbol Condition Limit Unit
DC Input Voltage VDS < 55 V
Forward Gate Current IGF RG=10Ω < 102 mA
Reverse Gate Current IGR RG=10Ω > -3.9 mA
Channel Temperature Tch < 180 oC
Average Output Power Pave. < 48.0 dBm
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25oC)
Item Symbol Condition Limit Unit
min. Typ. Max.
Pinch-Off Voltage Vp VDS=50V IDS=27mA -1.0 -1.5 -2.0 V
Saturated Power Psat *1 VDS=50V 50.0 51.0 - dBm
Drain Efficiency ηd *2 IDS(DC)=400mA - 35 - %
Power Gain Gp *2 f=0.9GHz 19 20 - dB
oC/W
Thermal Resistance Rth Channel to Case - 2.0 2.3
at 52.5W PDC
*1 : 10%-duty RF pulse (DC supply constant)
*2 : Pout = 43dBm, CW modulation Signal (W-CDMA)
Edition 1.2
Mar. 2010 1
2. EGNC105MK
GaN-HEMT 105W
High Voltage - High Power GaN-HEMT
RF characteristics @f=0.9GHz fine tuned
Output Power vs. Frequency Output Power and Drain Efficiency vs. Input Power
VDS=50V, IDS(DC)=400mA VDS=50V, IDS(DC)=400mA, f=0.9GHz
54 54 100
52 52 90
50 50 80
48 48 70
Output Power [dBm]
Drain Efficiency [%]
Output Power [dBm]
46 46 60
44 44 50
42 42 40
40 40 30
38 38 20
36 36 10
34 34 0
0.75 0.80 0.85 0.90 0.95 1.00 1.05 19 21 23 25 27 29 31 33 35 37 39
Frequency [GHz] Input Power [dBm]
Pin=20dBm Pin=24dBm Pin=28dBm
Pout (class AB) Pout (class B) Nd (class B)
Pin=32dBm Pin=36dBm
(10%-
Pulse Signal (10%-duty, DC : constant)
Test Fixture
VGS VDS
Edition 1.2
Mar. 2010 2
3. EGNC105MK
GaN-HEMT 105W
High Voltage - High Power GaN-HEMT
MTTF Calculation
– Estimated MTTF –
1.0E+10
Ea=1.6eV
Confidence Level=90%
1.0E+09
Channel Temp MTTF
1.0E+08 (deg-C) (Hours)
160 4.05 x 107
MTTF (Hour)
1.0E+07 180 6.07 x 106
200 1.07 x 106
1.0E+06
AF=exp[(-Ea/k)(1/Tstress-1/Tuse)
1.0E+05 MTTFuse=MTTFstress*AF
Where;
AF: acceleration factor
1.0E+04 Ea: activation energy (1.6 eV)
k: Boltzman’s constant (8.62 x 10-5 eV/K)
Tstress: stress temperature (K)
1.0E+03
Tuse: use temperature (K)
120 140 160 180 200 220 240 260
Channel Temerature (deg-C)
ESD characteristic
Test Methodology Class
Human Body Model
1B
(per JESD22-A114)
Machine Model
A
(per JEIA/ESD22-A115)
Edition 1.2
Mar. 2010 3