The document describes a new manufacturing process called the Occam Process as an alternative to traditional solder-based electronic assembly. The Occam Process involves placing components on a temporary substrate, encapsulating them, removing the substrate, and then using additive processes to interconnect the components without solder. The process aims to address challenges with lead-free solder and provide benefits like reduced costs, improved reliability, and new design possibilities. The document outlines the Occam Process steps, benefits over traditional assembly, and roadmap for further development and industry adoption of the new technology.