McKinney, Texas
Just like an old friend, we can do it all Microelectronics Medical Glass Bonders Conductive silvers Optically clear Encaps...
<ul><li>Environmental  Responsibility  </li></ul><ul><li>& </li></ul><ul><li>Demonstrable Cost  Savings </li></ul>MicroCoa...
THE 3 MAJOR FACTORS EFFECTING COSTS ARE ……. <ul><li>APPLICATION SPECIFIC COSTS </li></ul><ul><li>TANGIBLE COSTS </li></ul>...
<ul><li>Likely to Increase Product Performance, Durability, & User Safety </li></ul><ul><li>Higher Productivity, as in WIP...
<ul><li>No Solvents and VOC (Volatile Organic Compounds) Treatment </li></ul><ul><li>Less Downtime and Maintenance </li></...
<ul><li>Intangible Costs Can Be More Compelling Than Tangible Costs </li></ul><ul><li>Regulatory Compliant </li></ul><ul><...
Maximizing a Plant's   Real Estate <ul><li>Plant managers (our customers), restructure and reconfigure every square inch o...
SHORTENING CYCLE  TIME <ul><li>WIP (Work in Process) </li></ul><ul><li>Labor per Part </li></ul><ul><li>Overhead per Part ...
The Complete UV/Visible Light      Adhesive Assembly Package <ul><li>Glob Tops and Underfills for COB & Flip Chips (Clear ...
  Conformal Coatings     UV, Dark Cure & Heat Cure MicroCoat Technologies, LLC
  UV Cured  Peelable &  Water Soluble Solder Masks       Fluorescing,  & Non-Fluorescing MicroCoat Technologies, LLC
Wire Tackers MicroCoat Technologies, LLC
The Application of    Conformal Coatings MicroCoat Technologies, LLC
Non-Outgassing UV/Multi-Cure Epoxy Adhesives for the Disc Drive Industry MicroCoat Technologies, LLC
Inductor Encapsulants For Vacuum Pick & Place Air Coil  Molded Surface  “Flat” Over Wires MicroCoat Technologies, LLC Spra...
UV Cure SMD  LED   Encapsulants   MicroCoat Technologies, LLC
Fully Automated, PC Controlled, Inductor Molding Process DISPENSE  BOWL FEED/PLACEMENT  KNOCKOUT UPPER SHIELD GLASS PLATE ...
CLASS VI* MEDICAL    ADHESIVES <ul><li>FACE MASK BONDING </li></ul><ul><li>STYLUS & CANNULA BONDING </li></ul><ul><li>RESE...
UV Cured Hearing Aid   Shells & Forms Hard or Flexible Shells Opaque Glob Top Over IC ITC & CIC Hearing Aid  Shells , Fill...
Moisture Protection for Switches MicroCoat Technologies Electrical/Electronic Equipment  Automotive  Machine Tools  Medica...
Restriction on Hazardous Substances    (RoHS)    Waste Electrical and Electronic Equipment    (WEEE) <ul><li>On July 1, 20...
MicroCoat Technologies
MicroCoat Technologies
Lead Coating To Reduce The Possibility Of Tin Whisker Migration On Fine Pitch IC’s MicroCoat Technologies
  MICROELECTRONICS MicroCoat Technologies, LLC
Optically Clear Glob Tops for     IC’s, LED’s, EPROMS, Etc. Without Silicone <ul><li>Refractive Index 1.49 - 1.91!!!!! </l...
Optically Clear UV Cured    Photo Cell Coatings  MicroCoat Technologies, LLC
Optically Clear Coatings and Adhesives for; MicroCoat Technologies • WADM Modules  • Modulators • Attenuators • Pump Laser...
Smart Card IC Coatings MicroCoat Technologies, LLC
MicroCoat Technologies Epoxy Sealing of Hybrids and Power Devices Non-conductive adhesives for lid sealing, die attach, et...
MicroCoat Technologies
Conductive, Non-Conductive,  and    Thermally Conductive Die Attach    Adhesives Al 2 O 3 AlN BoN Diamond Ag MicroCoat Tec...
Conductive Adhesives <ul><li>SMD Attach To PCB and Ceramic </li></ul><ul><li>Screen Printing Traces </li></ul><ul><li>Die ...
MicroCoat Technologies
Advantages of Conductive    Adhesives Over Solder <ul><li>Low Thermal Processing Stress </li></ul><ul><li>Thermomechanical...
<ul><li>85% Ag – NO ORGANICS </li></ul><ul><li>NO Outgassing – NONE!, NADA!, ZIPPO!, LING!, NULL!, REI! </li></ul>SUPER HI...
MicroCoat Technologies
UV/Thermal Cure Conductive    Adhesive for Die Alignment Adhesive   Die Attach  Align &   Thermal  Perfectly Aligned Devic...
Flip Chip Bumping Using      Conductive Silver <ul><li>Adhesive bumping  is a flip-chip bumping process that stencils elec...
UV Cure Low Temperature Glass    Replacement for Hybrid Circuits 100% Solids <25 Second Cure Time Withstands 230 o C Solde...
LED  DETECTOR MicroCoat Technologies, LLC ? Optoelectronic “ Light Pipe” System Optoelectronic Optoelectronic “ Light Pipe...
An optoelectronic “Light Pipe” System  for Optical Switches MicroCoat Technologies, LLC • Customer Problem Solving
An optoelectronic “Light Pipe” System  for Optical Switches MicroCoat Technologies, LLC Optically clear Coating • Customer...
An optoelectronic “Light Pipe” System  for Optical Switches MicroCoat Technologies, LLC White Reflective Coating • Custome...
An optoelectronic “Light Pipe” System  for Optical Switches MicroCoat Technologies, LLC Optional Black Coating • Customer ...
<ul><li>Customer Problem Solving </li></ul>Optical Switch An optoelectronic “Light Pipe” System  for Optical Switches Micr...
  Thermoelectric Components HOT’N-COLD CO. Moderately Flexible,  High Temperature, UV Cure Coating Peltier Device MicroCoa...
UV and UV/Visible Light      Curing Equipment MicroCoat Technologies, LLC
The Energy Rule  The Waste Disposal Rule The Labor Rule The WIP Rule The Overhead Rule The Capacity Rule The Real Estate R...
SHORTENING CYCLE TIME <ul><li>WIP (Work in Process) </li></ul><ul><li>Labor per Part </li></ul><ul><li>Overhead per Part <...
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  • MicroCoat Technologies MicroCoat Technologies, LLC
  • MicroCoat Technologies MicroCoat Technologies, LLC OTHER THAN THE OBVIOUS, LIKE MATERIALS, THERE ARE 3 MAIN FACTORS THAT HAVE AN EFFECT ON THE PRODUCT COST. THE APPLICATION SPECIFIC COSTS TANGIBLE COSTS AND, THE INTANGIBLE COSTS. LET’S TAKE A LOOK AT EACH ONE OF THESE
  • Presentation 020210

    1. 1. McKinney, Texas
    2. 2. Just like an old friend, we can do it all Microelectronics Medical Glass Bonders Conductive silvers Optically clear Encapsulants Conformal coatings Electronics MicroCoat Technologies, LLC Military
    3. 3. <ul><li>Environmental Responsibility </li></ul><ul><li>& </li></ul><ul><li>Demonstrable Cost Savings </li></ul>MicroCoat Technologies MicroCoat Technologies, LLC µ
    4. 4. THE 3 MAJOR FACTORS EFFECTING COSTS ARE ……. <ul><li>APPLICATION SPECIFIC COSTS </li></ul><ul><li>TANGIBLE COSTS </li></ul><ul><li>INTANGIBLE COSTS </li></ul>MicroCoat Technologies, LLC µ
    5. 5. <ul><li>Likely to Increase Product Performance, Durability, & User Safety </li></ul><ul><li>Higher Productivity, as in WIP (Cycle Time) </li></ul><ul><li>Regulatory Compliant Materials per OSHA, EPA, FDA </li></ul><ul><li>Lower Energy Costs </li></ul>APPLICATION SPECIFIC COSTS MicroCoat Technologies, LLC
    6. 6. <ul><li>No Solvents and VOC (Volatile Organic Compounds) Treatment </li></ul><ul><li>Less Downtime and Maintenance </li></ul><ul><li>Lower Energy Costs </li></ul><ul><li>Less Scrap </li></ul><ul><li>Less Waste & Waste Disposal </li></ul><ul><li>Lower Tooling & Fixturing Costs </li></ul><ul><li>Lower Labor Rates </li></ul><ul><li>Lower Overhead </li></ul><ul><li>May Lower Insurance Rate </li></ul><ul><li>Lower Operating Costs </li></ul>Tangible Costs MicroCoat Technologies, LLC
    7. 7. <ul><li>Intangible Costs Can Be More Compelling Than Tangible Costs </li></ul><ul><li>Regulatory Compliant </li></ul><ul><li>-OSHA (Health) </li></ul><ul><li>-FDA (Safety) </li></ul><ul><li>-EPA (Waste Disposal) </li></ul><ul><li>-No Solvent Handling </li></ul><ul><li>-May Improve Quality </li></ul><ul><li>-Higher Capacity Utilization </li></ul><ul><li>-A Process Not Achieved by Another Method </li></ul>Intangible Costs MicroCoat Technologies, LLC
    8. 8. Maximizing a Plant's Real Estate <ul><li>Plant managers (our customers), restructure and reconfigure every square inch of the &quot;real estate&quot; under their care to increase throughput, output and quality, reducing labor and waste as much as possible in the process. Capital improvements focus not so much on expanding plant size as on wringing as much production as is mechanically and humanly possible from existing capacity. </li></ul><ul><li>One 6-10 foot UV conveyor will replace ~100-500 sq. ft. of conventional ovens and save an enormous amount of energy dollars and real estate </li></ul>MicroCoat Technologies, LLC
    9. 9. SHORTENING CYCLE TIME <ul><li>WIP (Work in Process) </li></ul><ul><li>Labor per Part </li></ul><ul><li>Overhead per Part </li></ul>REDUCES THE RESULT! PRODUCTIVITY INCREASES MicroCoat Technologies, LLC
    10. 10. The Complete UV/Visible Light Adhesive Assembly Package <ul><li>Glob Tops and Underfills for COB & Flip Chips (Clear & Opaque) </li></ul><ul><li>Wire Tacking </li></ul><ul><li>Peelable & Water Soluble Masks </li></ul><ul><li>Potting & Encapsulating </li></ul><ul><li>Conformal Coatings </li></ul><ul><li>Conductive & Resistive Materials </li></ul>MicroCoat Technologies, LLC
    11. 11. Conformal Coatings UV, Dark Cure & Heat Cure MicroCoat Technologies, LLC
    12. 12. UV Cured Peelable & Water Soluble Solder Masks Fluorescing, & Non-Fluorescing MicroCoat Technologies, LLC
    13. 13. Wire Tackers MicroCoat Technologies, LLC
    14. 14. The Application of Conformal Coatings MicroCoat Technologies, LLC
    15. 15. Non-Outgassing UV/Multi-Cure Epoxy Adhesives for the Disc Drive Industry MicroCoat Technologies, LLC
    16. 16. Inductor Encapsulants For Vacuum Pick & Place Air Coil Molded Surface “Flat” Over Wires MicroCoat Technologies, LLC Spray or Dip Coatings
    17. 17. UV Cure SMD LED Encapsulants MicroCoat Technologies, LLC
    18. 18. Fully Automated, PC Controlled, Inductor Molding Process DISPENSE BOWL FEED/PLACEMENT KNOCKOUT UPPER SHIELD GLASS PLATE 8mm TRACK 1 FOCUSED UV SYSTEM COMPONENT CATCH MicroCoat Technologies McKinney, TX MicroCoat Technologies, LLC
    19. 19. CLASS VI* MEDICAL ADHESIVES <ul><li>FACE MASK BONDING </li></ul><ul><li>STYLUS & CANNULA BONDING </li></ul><ul><li>RESERVOIR BONDING </li></ul><ul><li>MOLDED SHELL BONDING </li></ul><ul><li>CATHETER BONDING </li></ul><ul><li>TUBE SET BONDING </li></ul><ul><li>* PASSES MOLD SPORE INITIATION </li></ul>FOR: MicroCoat Technologies, LLC
    20. 20. UV Cured Hearing Aid Shells & Forms Hard or Flexible Shells Opaque Glob Top Over IC ITC & CIC Hearing Aid Shells , Fill, & IC Glob Top MicroCoat Technologies, LLC
    21. 21. Moisture Protection for Switches MicroCoat Technologies Electrical/Electronic Equipment Automotive Machine Tools Medical Equipment and Devices Trucks and Busses Heavy Equipment Lawn and Garden Restaurant Equipment
    22. 22. Restriction on Hazardous Substances (RoHS) Waste Electrical and Electronic Equipment (WEEE) <ul><li>On July 1, 2006, the European Union will begin restricting the material content of electronics products being shipped within and into the EU. Several elements and compounds are involved, but the most common is lead (Pb). “Lead-Free” isn’t just about manufacturing, it is about doing business in Europe, and electronics companies cannot wait until 2006 to get started. </li></ul><ul><li>MicroCoat Technologies has developed both epoxy and acrylic conformal coatings to help alleviate fears of tin whisker contamination floating around your circuitry. MCT also manufactures special harder Dual Cure (UV/Thermal) coatings for coating tight lead space IC’s for protection against tin whisker migration across very small pitch leads </li></ul><ul><li>Call or E-mail us today for more information about these materials </li></ul><ul><li>Tel: +1-972-678-4950 Fax: +1-214-257-8890 or E-Mail to [email_address] </li></ul><ul><li>RoHS Links </li></ul><ul><li>Government Sites http://www.dti.gov.uk/sustainability/pdfs/finalrohs.pdf </li></ul><ul><li> http://www.dti.gov.uk/sustainability/weee/ </li></ul><ul><li>Industry Sites: http://www.leadfree.org/ http://www.nemi.org/ </li></ul><ul><li>Independent Sites: http://www.pb-free.info/ http://www.pb-free.com/ </li></ul>MicroCoat Technologies
    23. 23. MicroCoat Technologies
    24. 24. MicroCoat Technologies
    25. 25. Lead Coating To Reduce The Possibility Of Tin Whisker Migration On Fine Pitch IC’s MicroCoat Technologies
    26. 26. MICROELECTRONICS MicroCoat Technologies, LLC
    27. 27. Optically Clear Glob Tops for IC’s, LED’s, EPROMS, Etc. Without Silicone <ul><li>Refractive Index 1.49 - 1.91!!!!! </li></ul><ul><li>Transmissivity @ 990nm 99% </li></ul><ul><li>R-I 1.9 @ 850 nm </li></ul><ul><li>Operating Temperature Range of -55C to +150C </li></ul><ul><li>UV Curable in < 20 seconds ! </li></ul>MicroCoat Technologies, LLC
    28. 28. Optically Clear UV Cured Photo Cell Coatings MicroCoat Technologies, LLC
    29. 29. Optically Clear Coatings and Adhesives for; MicroCoat Technologies • WADM Modules • Modulators • Attenuators • Pump Lasers • Switches • Amplifiers Picture of Sinclair Manuf. Packages
    30. 30. Smart Card IC Coatings MicroCoat Technologies, LLC
    31. 31. MicroCoat Technologies Epoxy Sealing of Hybrids and Power Devices Non-conductive adhesives for lid sealing, die attach, etc. Passes gross leak, temp cycle, temp shock. Withstands die attach to >340C JOE’S HYBRID COMPANY MCT 3417 Hi Temp Sealing Passes 340C Die Attach 5 minutes Passes 350 Cycles -65C- +150C Passes 85/85 Passes Gross Leak
    32. 32. MicroCoat Technologies
    33. 33. Conductive, Non-Conductive, and Thermally Conductive Die Attach Adhesives Al 2 O 3 AlN BoN Diamond Ag MicroCoat Technologies, LLC In electronics, thermal management is crucial in both the design of circuit-board assemblies and in the production of semiconductor materials. For PC boards a crucial aspect can be the heating or cooling power required to keep a circuit within its specified operating temperature range. In the manufacturing of silicon wafers it is important to maintain a very uniform temperature distribution across the wafer in order to achieve quality production processes and high yields .
    34. 34. Conductive Adhesives <ul><li>SMD Attach To PCB and Ceramic </li></ul><ul><li>Screen Printing Traces </li></ul><ul><li>Die Attach </li></ul><ul><li>Solder Replacement </li></ul><ul><li>Flex Silver Traces </li></ul><ul><li>Flex Carbon Traces </li></ul><ul><li>Anti-Static </li></ul><ul><li>Chip Component Termination </li></ul><ul><li>Tantalum Capacitor Termination </li></ul><ul><li>Static Discharge </li></ul><ul><li>Platable For SMD Components </li></ul><ul><li>Quick-Set PCB Repair </li></ul><ul><li>Bio-Sensors </li></ul><ul><li>Silver Spray-On </li></ul>Low Outgassing Die Attach Adhesives UV/Heat Cure for High Accuracy Placement of Opto Devices MicroCoat Technologies, LLC
    35. 35. MicroCoat Technologies
    36. 36. Advantages of Conductive Adhesives Over Solder <ul><li>Low Thermal Processing Stress </li></ul><ul><li>Thermomechanical Fatigue Resistance </li></ul><ul><li>Low VOC’s </li></ul><ul><li>Eliminates Solder Mask </li></ul><ul><li>Excellent Fine Pitch </li></ul><ul><li>Wide Process Window </li></ul><ul><li>NO Residues, high SIR </li></ul><ul><li>No Clean </li></ul><ul><li>NO LEAD!! </li></ul>MicroCoat Technologies, LLC
    37. 37. <ul><li>85% Ag – NO ORGANICS </li></ul><ul><li>NO Outgassing – NONE!, NADA!, ZIPPO!, LING!, NULL!, REI! </li></ul>SUPER HIGH TEMPERATURE CONDUCTIVE DIE ATTACH ADHESIVE TO >650 o C MicroCoat Technologies DOWN THE HOLE LAUNCH PAD APPROVED FOR A HARD LANDING ON VENUS!!!!!!! Wirebonded Die 394-95 Ni/Moly Tab Eutectic Bond (Sn/Ge) Au Pad Substrate
    38. 38. MicroCoat Technologies
    39. 39. UV/Thermal Cure Conductive Adhesive for Die Alignment Adhesive Die Attach Align & Thermal Perfectly Aligned Devices Dispense UV Cure Cure UV Light Wand MicroCoat Technologies, LLC
    40. 40. Flip Chip Bumping Using Conductive Silver <ul><li>Adhesive bumping is a flip-chip bumping process that stencils electrically conductive adhesive over an under-bump metallization placed over the bond pad.  The stenciled adhesive serves as the bump after it has been cured.  Mounting of adhesive-bumped flip-chips also uses conductive adhesives. </li></ul>MicroCoat Technologies Stenciled Conductive Ag
    41. 41. UV Cure Low Temperature Glass Replacement for Hybrid Circuits 100% Solids <25 Second Cure Time Withstands 230 o C Solder Reflow Print and Cure Before or After Trimming No Post Cure Resistor Drift - None ! MicroCoat Technologies, LLC
    42. 42. LED DETECTOR MicroCoat Technologies, LLC ? Optoelectronic “ Light Pipe” System Optoelectronic Optoelectronic “ Light Pipe” System “ Light Pipe” System • Customer Problem Solving
    43. 43. An optoelectronic “Light Pipe” System for Optical Switches MicroCoat Technologies, LLC • Customer Problem Solving
    44. 44. An optoelectronic “Light Pipe” System for Optical Switches MicroCoat Technologies, LLC Optically clear Coating • Customer Problem Solving
    45. 45. An optoelectronic “Light Pipe” System for Optical Switches MicroCoat Technologies, LLC White Reflective Coating • Customer Problem Solving
    46. 46. An optoelectronic “Light Pipe” System for Optical Switches MicroCoat Technologies, LLC Optional Black Coating • Customer Problem Solving
    47. 47. <ul><li>Customer Problem Solving </li></ul>Optical Switch An optoelectronic “Light Pipe” System for Optical Switches MicroCoat Technologies, LLC
    48. 48. Thermoelectric Components HOT’N-COLD CO. Moderately Flexible, High Temperature, UV Cure Coating Peltier Device MicroCoat Technologies, LLC
    49. 49. UV and UV/Visible Light Curing Equipment MicroCoat Technologies, LLC
    50. 50. The Energy Rule The Waste Disposal Rule The Labor Rule The WIP Rule The Overhead Rule The Capacity Rule The Real Estate Rule The UV Rules of Responsibility MicroCoat Technologies, LLC
    51. 51. SHORTENING CYCLE TIME <ul><li>WIP (Work in Process) </li></ul><ul><li>Labor per Part </li></ul><ul><li>Overhead per Part </li></ul><ul><li>THE RESULT </li></ul><ul><ul><ul><ul><ul><li>Higher Profits </li></ul></ul></ul></ul></ul>MicroCoat Technologies, LLC REDUCES

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