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Capabilities Overview
Design & Simulation Expertise
System Engineering & Integration
MFG, Prototype to Production
Fiber Optic Temperature Sensor System
Industries
Semiconductor
Solar
Industrial
Expertise
System Design &
Testing
Simulation
Project Management
Proto-Production
Mfg
Enclosures &
Environ. Control
Assembly &
Integration
Design & Engineering
Concept
Engineering
Detailed
Engineering
Simulation &
Analysis
MFG &
Engineering
Proto
Development
& Testing
• Product Lay-out
Options
• Basic Engineering
• Concept Modelling
• Design
Calculations
• System Level
Design
• DFMA
• 3D Modelling &
Detailing
• Tolerance
Management
• Value Engineering
• Product
Integration
• FE Meshing / Pre-
processing
• Static Structural
• NVH
• Thermal & Heat
Transfer
• Fatigue &
Durability
• CFD
• Multi Body
Dynamics
• Electromagnetic
Simulation
• Process Planning
• Should Costing
• Special Application
Machines
• Jigs & Fixtures
• Robot Integration
• First Article
Inspection
• Industrial
Automation
• Assembly Stations
• Supplier
Collaboration
• Proto
Development
• Noise & Vibration
Testing
• Fatigue &
Reliability Testing
• Material Testing
• Testing for
standards
• Test Rigs
Development
Semiconductor Solar Equip Industrial/Biotech Simulation
Test Rigs &
Fixtures
Industrial
Automation
Vacuum Chamber
Design
Biotech
Automotive
Coupled
Physics
Design
Optimization
• Static/Transient
• Dynamics
• Multi-Body
• Crash/Impact
• Non-Linear
• Fatigue
• Fracture Mechanics
Structural
Electro
Magnetic
Thermal
Acoustic
• Conduction
• Convection
• Radiation
• Thermo-Structural
• Creep
• FSI
• Vibro Acoustic • Design Optimization
• Size, Shape, Topology
Optimization
• FFT
• Transfer Matrices Coefficients
Calculation
• Acoustic radiation
• Fully-coupled Vibro-acoustics
FEA Capabilities
3
Laminar &
Turbulent
Compressible/
Incompressible
Heat
Transfer
Rotor Dynamics/
Turbo Machinery
Multi Phase
Reaction &
Combustion
FSI (Fluid Structure
Interaction)
CFD Capabilities
4
Multi-Giga Hertz Simulation & Modeling
 Package Design
 Board Design
 Signal Integrity Analysis
 Mutiphysics Simulation and Modeling
 Reference Board Designs
 Design Kits
 Interconnect Modeling and Optimization including Connectors
 Power Distribution Network Modeling and Decoupling Analysis
 Lab Measurement and Characterization
5
RF & WIRELESS DESIGN
 Antenna Design, Modeling and Prototyping
 RFID
 EMI/EMC
 Microwave Components
 Model Generation
 100MHz to multi-GHz RF Design
TimingVoltage
Return current path control
SSN / Ground bounce
Cross talk
Via stub effect
Connector/via stubs
Impedance matching across transmission line
Timing variation across all pins
Timing variation between clock and data
Timing variation due to coupling, voltage, and temperature
Reflection/channel resonance control
Intra pair skew
Device I/O capacitance act as LPF
Inter symbol interference
Conductor loss
Dielectric loss
ISI and Random Jitter
High-speed Interface Design Challenges
Increasing Data rate
FEA - Applications
Models 3D geometries
 Connector Models
 IC Packages
 Vias
 Cell Phones
 …
Applications – Coupled Analysis
Current Density Distribution
Voltage Loss Distribution
Electromagnetic Simulation & Modeling
 Field Analysis
 Power Integrity
 Signal Integrity
 EMI
EMI
RFI
Total System Solutions To Promote
Customer Success
13
MFG: Precision Metal & Plastic Fabrication
 Precision Sheetmetal
 SST, Alum, Steel
 Class A finish
 Precision Machining
 Metal, Plastics
 Precision Welded Frames
 SST, Alum, Steel
 CMM inspection
14
System Control & Integration & Testing
 Touchscreen GUI
 Real time system status
 Recipe creation
 Host communication
 Control Modules
 Controller specific
software interface
 PC for process data
collection and tracking
 Endurance testing
 Complete system test
per customer
requirements
System Eng: End to End Solutions for Sub-Systems
 Example: Reticle Flipper & Barcode
reader for EUV systems
 Design-Build-Test all In-House
 Eng: System, ME, EE, SW, Test
 Mfg: Metal, Plastic, Weldments
 System Integration
 Test: Complete design validation
 All done with facilities and resources
in San Jose and India
 Eng, Mfg, Test in SJ
 Simulation, Eng in India
15
16
Automation Systems
Reticle Handling, Inspection, Cleaning
 Fully automated tools
 Robot, Enclosure, Software, etc
17
Environmental Control Systems
 Mature Products since1990:
Semifab brand CD-E & RAM-E.
 High reliability, units run 24/7 for 10 yrs
 Patented temp and humidity control
 Temperature control of +/- .05° C
 Humidity control of +/- .3% RH
 Units from 100 CFM to 5000 CFM
 Single or multiple air outlets
 Class 1 air with appropriate filter
 Customization for specific applications
 CE Certified
 SEM S2, S8 Certified
18
Tool-Specific Enclosures
 Engineered air flow dynamics,
CFD simulations, air flow
testing
 Integrated precision
temperature
and humidity control
 N2 purged enclosures
 OEM identity enhancements
 Industrial design, ergonomics,
maintenance, & safety
 Excellent environmental
control for metrology and
other high precision
processes
 Time Saving
 Product engineering time saved - more than 30 %
 Accelerate integration and implementation
 Reduced time-to-market
 24/7 Work cycle and support
 Reduced customer burden
 Cost Saving
 Project engineering costs saved- more than 33%
 Alignment - Engineering, manufacturing and PLM services
 Reduced integration resource costs- up to 50%
 Integrated electronic boards and system level assembly
 Hardware and Software level tests in production
 Packaging and Shipping Support with warranty
 Maintenance support
 Service oriented business model
 Dedicated program management and service team
 Customer specific numbers for ROI – 6 months or less
Customer Benefits

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Seminet-Capabilities_2015

  • 1. Capabilities Overview Design & Simulation Expertise System Engineering & Integration MFG, Prototype to Production Fiber Optic Temperature Sensor System
  • 2. Industries Semiconductor Solar Industrial Expertise System Design & Testing Simulation Project Management Proto-Production Mfg Enclosures & Environ. Control Assembly & Integration Design & Engineering Concept Engineering Detailed Engineering Simulation & Analysis MFG & Engineering Proto Development & Testing • Product Lay-out Options • Basic Engineering • Concept Modelling • Design Calculations • System Level Design • DFMA • 3D Modelling & Detailing • Tolerance Management • Value Engineering • Product Integration • FE Meshing / Pre- processing • Static Structural • NVH • Thermal & Heat Transfer • Fatigue & Durability • CFD • Multi Body Dynamics • Electromagnetic Simulation • Process Planning • Should Costing • Special Application Machines • Jigs & Fixtures • Robot Integration • First Article Inspection • Industrial Automation • Assembly Stations • Supplier Collaboration • Proto Development • Noise & Vibration Testing • Fatigue & Reliability Testing • Material Testing • Testing for standards • Test Rigs Development Semiconductor Solar Equip Industrial/Biotech Simulation Test Rigs & Fixtures Industrial Automation Vacuum Chamber Design Biotech Automotive
  • 3. Coupled Physics Design Optimization • Static/Transient • Dynamics • Multi-Body • Crash/Impact • Non-Linear • Fatigue • Fracture Mechanics Structural Electro Magnetic Thermal Acoustic • Conduction • Convection • Radiation • Thermo-Structural • Creep • FSI • Vibro Acoustic • Design Optimization • Size, Shape, Topology Optimization • FFT • Transfer Matrices Coefficients Calculation • Acoustic radiation • Fully-coupled Vibro-acoustics FEA Capabilities 3
  • 4. Laminar & Turbulent Compressible/ Incompressible Heat Transfer Rotor Dynamics/ Turbo Machinery Multi Phase Reaction & Combustion FSI (Fluid Structure Interaction) CFD Capabilities 4
  • 5. Multi-Giga Hertz Simulation & Modeling  Package Design  Board Design  Signal Integrity Analysis  Mutiphysics Simulation and Modeling  Reference Board Designs  Design Kits  Interconnect Modeling and Optimization including Connectors  Power Distribution Network Modeling and Decoupling Analysis  Lab Measurement and Characterization 5
  • 6. RF & WIRELESS DESIGN  Antenna Design, Modeling and Prototyping  RFID  EMI/EMC  Microwave Components  Model Generation  100MHz to multi-GHz RF Design
  • 7. TimingVoltage Return current path control SSN / Ground bounce Cross talk Via stub effect Connector/via stubs Impedance matching across transmission line Timing variation across all pins Timing variation between clock and data Timing variation due to coupling, voltage, and temperature Reflection/channel resonance control Intra pair skew Device I/O capacitance act as LPF Inter symbol interference Conductor loss Dielectric loss ISI and Random Jitter High-speed Interface Design Challenges Increasing Data rate
  • 8. FEA - Applications Models 3D geometries  Connector Models  IC Packages  Vias  Cell Phones  …
  • 9. Applications – Coupled Analysis Current Density Distribution Voltage Loss Distribution
  • 10. Electromagnetic Simulation & Modeling  Field Analysis  Power Integrity  Signal Integrity  EMI EMI RFI
  • 11. Total System Solutions To Promote Customer Success
  • 12. 13 MFG: Precision Metal & Plastic Fabrication  Precision Sheetmetal  SST, Alum, Steel  Class A finish  Precision Machining  Metal, Plastics  Precision Welded Frames  SST, Alum, Steel  CMM inspection
  • 13. 14 System Control & Integration & Testing  Touchscreen GUI  Real time system status  Recipe creation  Host communication  Control Modules  Controller specific software interface  PC for process data collection and tracking  Endurance testing  Complete system test per customer requirements
  • 14. System Eng: End to End Solutions for Sub-Systems  Example: Reticle Flipper & Barcode reader for EUV systems  Design-Build-Test all In-House  Eng: System, ME, EE, SW, Test  Mfg: Metal, Plastic, Weldments  System Integration  Test: Complete design validation  All done with facilities and resources in San Jose and India  Eng, Mfg, Test in SJ  Simulation, Eng in India 15
  • 15. 16 Automation Systems Reticle Handling, Inspection, Cleaning  Fully automated tools  Robot, Enclosure, Software, etc
  • 16. 17 Environmental Control Systems  Mature Products since1990: Semifab brand CD-E & RAM-E.  High reliability, units run 24/7 for 10 yrs  Patented temp and humidity control  Temperature control of +/- .05° C  Humidity control of +/- .3% RH  Units from 100 CFM to 5000 CFM  Single or multiple air outlets  Class 1 air with appropriate filter  Customization for specific applications  CE Certified  SEM S2, S8 Certified
  • 17. 18 Tool-Specific Enclosures  Engineered air flow dynamics, CFD simulations, air flow testing  Integrated precision temperature and humidity control  N2 purged enclosures  OEM identity enhancements  Industrial design, ergonomics, maintenance, & safety  Excellent environmental control for metrology and other high precision processes
  • 18.  Time Saving  Product engineering time saved - more than 30 %  Accelerate integration and implementation  Reduced time-to-market  24/7 Work cycle and support  Reduced customer burden  Cost Saving  Project engineering costs saved- more than 33%  Alignment - Engineering, manufacturing and PLM services  Reduced integration resource costs- up to 50%  Integrated electronic boards and system level assembly  Hardware and Software level tests in production  Packaging and Shipping Support with warranty  Maintenance support  Service oriented business model  Dedicated program management and service team  Customer specific numbers for ROI – 6 months or less Customer Benefits