This is a company products presentation by IDEAS - Integrated Detector Electronics AS, Norway. Presentation given at the IEEE NSS/MIC 2018.
The company designs integrated circuits, radiation detectors and imaging systems.
1. Radiation Detection and
Imaging
dirk.meier@ideas.no, http://www.ideas.no 2018-11-01 1
Integrated Detector Electronics AS
Dirk Meier, Research Director
Dirk.meier@ideas.no
The company designs
integrated circuits, radiation
detectors and imaging systems.
5. Amplifier, e.g., LNA for FPA Readout
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 5
Artistic rendering of ESO’s
European Extremely Large Telescope, E-ELT.
Image: ESO.
8 programmable gains 2, 4, 6, 8, 10, 12, 14, 16
Noise 1Hz to 50MHz 33μVrms, 4.3nV/ 𝐻𝑧 at 10kHz
GBW >50MHz at 200pF output load
Power 20mW at 3.5V
IDE1060 EARL
in CQFP
Low Noise Amplifier (LNA) for Focal Plane Array (FPA)
readout of infrared image sensors (e.g., HAWAII-2RG, NGP)
Ackermann et al., AMICSA 2018
6. 2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 6
Amplifier, e.g., CSA for GEM Readout
3240um x 3735um
IDE1162,
IDE1163
IDE1163 has 32 charge sensing amplifiers (CSA), for GEM
readout in Baryonic Matter at Nuclotron (BM&N), JINR/Dubna
Parameter IDE1162 IDE1163
CSA inputs 32 32
MUX outputs 1 1
Input charge range -1500fC to +1500fC -750fC to +750fC
Shaping time 2us 0.5us
ENC 2000e at 50pF 1797e at 120pF
Power 66mW 77mW
7. Amplifiers - Silicon Tracker Readout
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 7
DAMPE – Dark Matter Particle Explorer
launched 2015-12-17
IDEAS designed readout for Flight Model
• Silicon-Tungsten Tracker, 1152 chips
• PMT BGO calorimeter & plastic
scintillator
8. ADC – Analog to Digital Converters
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 8
• Different ADC architectures have different performance trade-offs (speed, resolution, area and power)
• IDEAS has SAR and Pipeline architectures.
• …and, e.g., Wilkinson, Flash and Sigma-delta.
Source: www.design-reuse.com
IDEAS ADCs
9. ADC - SAR
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 9
ID NIR_ADC_SA12B2M SIP_ADC_SA12B50k
Process AMS 350 nm AMS 350 nm
Resolution 12-bit 12-bit
Sampling rate
(max)
2.22 Msps 100 ksps
DNL ± 0.3 LSB ± 0.2 LSB
INL < ± 0.5 LSB * + 0.1 LSB/ - 0.6 LSB
ENOB 11.5 @ fin=50kHz, 10.6 @ fin=800 kHz * 11.5
Power 50 mW at 2.2Msps, rad tolerant
10 mW at 2.2Msps, terrestrial, estimate
1 mW@50ksps, 1
µW@power down
Temperature - 196 °C to +50°C - 20 °C to +60°C
Size 3000 µm by 280 µm (radhard version)
1500 µm by 280 µm (terrestrial version,
estimated)
3000 µm by 280 µm (rad
hard version)
1500 µm by 280 µm
(terrestrial version,
estimated)
SAR – Successive Approximation Register
• Internal or external references
• Offset cancellation
• Configurable sample duration
• Handshake interface
• Power-down
10. 12-bit SAR ADC at 50ksps and at 2.2Msps
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 10
50ksps 2.2Msps
No missing codes and good linearity
11. ADC - Pipeline
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 11
ID TBD(3) TBD(4)
Process UMC 180nm Magna Chip 180 nm
Resolution 14-bit 14-bit
Sampling rate
(max)
12 Msps 20 Msps
DNL ± 0.5 LSB ± 0.5 LSB
INL ± 1 LSB ± 1 LSB
ENOB 13 12.7
Power 250 mW @ 12Msps 350 mW@20Msps
Temperature - 40 °C to 85 °C
Size TBD TBD
Features
• Foreground calibration
• Internal or external references
• Power-down
12. ROIC - SIPHRA IDE3380 SiPM
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 12
Chip active area: 7.6 mm×6.8 mm
Package TBD: LFBGA 12x12 mm2
DOI: 10.13140/RG.2.1.1460.8882
http://www.ideas.no/products/ide3380/
Bare chips and BGA from stock
13. LaBr/SiPM/IDE3380
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 13
LaBr/SiPM housing
LaBr crystal
SiPM carrier
board
connectors
IDE3380 ASICN-03-010 – Using the SIPHRA ASIC with an SiPM array and scintillators for gamma spectroscopy
A. Ulyanov, D. Murphy, A. Fredriksen, J. Ackermann, D. Meier, S. McBreen, L. Hanlon
Session: N-03 - NSS Poster Session I
14. IDEAS Radiation
Tolerant Standard
Cell Libray
2018-11-01dirk.meier@ideas.no, http://www.ideas.no 14 of 18
• 0.35µm AMS CMOS
• Small Library (<50 cells)
• Synthesis and Implementation
with Cadence tools
• TID 100krad(Si)
• SEE tests at UCL HIF
• SEU LETth 22 MeVcm
2
/mg
• SEL LETth ≥ 135 MeVcm
2
/mg
15. Current Integrator and Shaper
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 15
Current Integrator Shaper
16. IR Imagers for EO and Astronomy
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 16
EO - Earth Observation, ESA/Sentinels ARIEL - Atmospheric Remote-sensing Exoplanet
Large-survey
Infrared (IR) wavelength 40µm to 1µm, to study chemical composition in atmosphere.
17. IR Imagers for EO and Astronomy
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 17
• Sensor material, e.g., mercury cadmium telluride (MCT).
• Sensor hybridized on read-out integrated circuit (ROIC).
• Cryogenic operation (20K to 77K).
• The FPA need clock and reference voltages to operate.
FPA
(MCT)
Flex
cable
NIRCA
Flex
cable
18. FPA Readout Controllers
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 18
NIRCA – Near Infrared Readout Controller ASIC
• 10 to 100 times reduction in mass and volume.
• Significant reduction in power consumption.
• Small enough to fit inside cryostat, reduce cable length.
• Increased reliability from fewer interconnects.
Large & Heavy FPA RO Controller
small
19. 2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 19
NIRCA Mk2
FPA Readout & Controller
Programmable sequencer, SPI interface
ECC RAM (Error correcting code)
16 x 14-bit, 12Msps ADCs, high speed 4.5Gbit/s output
Programmable gain/offset
Programmable bias & supplies for FPA ROIC
Radhard by design and process
A single-chip solution to interface between a master controller
(FPGA / µC) and focal plane array (FPA) with analog outputs
and digital control.
20. Galao ROIC Development Kit
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 20
IDEAS Test Software
Galao Hardware
ROIC Test Board
22. How you can work with us
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 22
Ideas
•You/Customer: needs, desires
•Requirements
•Budgets
•Constraints, feasibility, risks
…
•Process (sweat, blood, tears, pain,
pleasure, and all that)
•ECSS-Q-ST-60-02 ASIC/FPGA
development standard
•Review milestones
•Payment milestones
Technology
Product
•Documents
•Chips (samples, LAT,
wafers, KGD)
•OEM modules/systems
Research, Innovation, Development, Engineering, etc.
23. Space Radiation Monitors
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 23
https://www.ruag.com/fileadmin/ruag/Divisions/Space/Products/Satellite_Instrumen
ts/Radiation_Monitors/PDF/NGRM_datasheet.pdf
Norway Radiation Monitor
(NORM) concept proposal
N-23-017 – Characterisation of an ASIC for Small Satellite Space Radiation
Monitors, T. A. Stein, D. Meier, K. Røed, Session: N-23 - NSS Poster Session II
24. CZT-based Gamma Camera
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 24
Detector CZT, 5mm thick, 6400 pixels
Pixel pitch 1.6 mm
Sensitive area 12.7 cm x 12.7 cm
Power 18 W
Weight 2 kg (without tungsten shield)
Gamma ray energies 18 keV to 700 keV
Energy resolution 6 keV FWHM
Input rate max 100 kcps per camera
Output rate max 100 kcps list mode
Interface Ethernet, API
< 3 months lead time
Possible to configure number
and placement of modules
26. XCS – Xray Counting System
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 26
Detector CZT, 900 pixels
Pixel pitch 0.4, 0.8, 1.6 mm
Sensitive area 18.2 cm x 1.28 cm
Power 12 W
Weight 3 kg
Energy 30 keV to 130 keV
Erg. Res. 6 keV FWHM
Input rate 1000 kcps per pixel
Output rate 10 kHz per frame
I/F Ethernet, API
< 6 months lead time
Optional: 3 or 6 energy bins
27. XCS in Flow Tomograph
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 27
5 XCS units
assembled in the
flow tomograph
Image from phantom
http://prototech.no/projects/10503/gamma-ray-tomographer/
Images: University of Bergen
28. CZT-based SRE3020 – VAST
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 28
Detector CZT, 242 pixels
Pixel pitch 1.72 mm
Sensitive area 18.2 cm x 1.28 cm
Power 10 W
Weight 0.3 kg
Energy 40 keV to 3 MeV
Erg. Res. <2% FWHM at 662keV
Input rate 20 kcps
Output rate 20 kcps
I/F Ethernet, API
< 4 months lead time
30. SoNDe SKADI Neutron at ESS
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 30
Detector Li-Glass scintillator/H8500
Sensitive area per
module
5 x 5 cm2
Power 3W per module
Weight 100g w/o detector
Input charge -80 pC max., -200pC, -1000pC
Erg. Res. 6keV FWHM Li-glass
Input rate 200kcps per pixel, 80kcps 64ch
Output rate 1000Hz frames or
50kps list mode
I/F Ethernet, API
https://europeanspallationsource.se/article/skadi-diffractometer-enlarging-field-small-angle-neutron-scattering
DOI: 10.1016/j.nima.2014.04.024 RO modules < 3 month lead time
31. Thank You
2018-11-01 dirk.meier@ideas.no, http://www.ideas.no 31
IDEAS develops integrated circuits and systems.
Please contact us at www.ideas.no
Dirk Meier, Research Director
Dirk.meier@ideas.no
Editor's Notes
Here you can see the pinout and floorplan for the SIPHRA ASIC. Analog inputs connect at the left middle, go through the channel, and outputs are at the right. The ASIC normally has up to 103 bonded pins, and we plan to deliver plastic PQFP package and bare-die.
This slide shows in very simple steps how signal acquistion works in the front-end of the ASIC. Since the charge event from the SiPM may be very large charge – we might see charge up to 16nC in a few ns, or currents are up to 75mA – therefore we need to attenuate the signal. We do this with a current mirror with a regulated input voltage. The next step is the current integrator, which converts the charge input signal to a voltage step, and the final step is the shaper which acts a band-pass filter.