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R07DS0160EJ0400 Rev.4.00 Page 1 of 9
Apr 19, 2012
Preliminary Datasheet
RJH60D2DPP-M0
600V - 12A - IGBT
Application: Inverter
Features
 Short circuit withstand time (5 s typ.)
 Low collector to emitter saturation voltage
VCE(sat) = 1.7 V typ. (at IC = 12 A, VGE = 15 V, Ta = 25°C)
 Built in fast recovery diode (100 ns typ.) in one package
 Trench gate and thin wafer technology
 High speed switching
tf = 80 ns typ. (at VCC = 300 V, VGE = 15 V, IC = 12 A, Rg = 5 , Ta = 25°C, inductive load)
Outline
RENESAS Package code: PRSS0003AF-A
(Package name: TO-220FL)
1
2 3
1. Gate
2. Collector
3. Emitter
C
G
E
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
Collector to emitter voltage / diode reverse voltage VCES / VR 600 V
Gate to emitter voltage VGES ±30 V
Tc = 25°C IC 25 ACollector current
Tc = 100°C IC 12 A
Collector peak current ic(peak)
Note1
50 A
Collector to emitter diode forward current iDF 12 A
Collector to emitter diode forward peak current iDF(peak)
Note1
50 A
Collector dissipation PC
Note2
34 W
Junction to case thermal resistance (IGBT) j-c
Note2
3.7 °C/W
Junction to case thermal resistance (Diode) j-cd
Note2
4.9 °C/W
Junction temperature Tj 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW  10 s, duty cycle  1%
2. Value at Tc = 25C
R07DS0160EJ0400
Rev.4.00
Apr 19, 2012
RJH60D2DPP-M0 Preliminary
R07DS0160EJ0400 Rev.4.00 Page 2 of 9
Apr 19, 2012
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Collector to emitter breakdown
voltage
VBR(CES) 600 — — V IC =10 A, VGE = 0
Zero gate voltage collector current
/ Diode reverse current
ICES / IR — — 5 A VCE = 600 V, VGE = 0
Gate to emitter leak current IGES — — ±1 A VGE = ±30 V, VCE = 0
Gate to emitter cutoff voltage VGE(off) 4.0 — 6.0 V VCE = 10 V, IC = 1 mA
VCE(sat) — 1.7 2.2 V IC = 12 A, VGE = 15 V
Note3
Collector to emitter saturation voltage
VCE(sat) — 2.2 — V IC = 25 A, VGE = 15 V
Note3
Input capacitance Cies — 430 — pF
Output capacitance Coes — 40 — pF
Reveres transfer capacitance Cres — 12 — pF
VCE = 25 V
VGE = 0
f = 1 MHz
Total gate charge Qg — 19 — nC
Gate to emitter charge Qge — 4 — nC
Gate to collector charge Qgc — 7 — nC
VGE = 15 V
VCE = 300 V
IC = 12 A
Turn-on delay time td(on) — 32 — ns
Rise time tr — 13 — ns
Turn-off delay time td(off) — 85 — ns
Fall time tf — 80 — ns
Turn-on energy Eon — 0.10 — mJ
Turn-off energy Eoff — 0.16 — mJ
Total switching energy Etotal — 0.26 — mJ
VCC = 300 V
VGE = 15 V
IC = 12 A
Rg = 5 
Inductive load
Short circuit withstand time tsc 3.0 5.0 — s VCC  360 V, VGE = 15 V
FRD Forward voltage VF — 1.2 1.6 V IF = 12 A
Note3
FRD reverse recovery time trr — 100 — ns
FRD reverse recovery charge Qrr — 0.2 — C
FRD peak reverse recovery current Irr — 5.0 — A
IF = 12 A
diF/dt = 100 A/s
Notes: 3. Pulse test.
RJH60D2DPP-M0 Preliminary
R07DS0160EJ0400 Rev.4.00 Page 3 of 9
Apr 19, 2012
Main Characteristics
50
40
30
20
10
IGBT Output Characteristics (Typical)
CollectorCurrentIC(A)
Collector to Emitter Voltage VCE (V)
CollectorCurrentIC(A)
Case Temperature Tc (°C)
Maximum DC Collector Current vs.
Case Temperature
30
20
15
10
5
0
0 25 50 10075 125 150 175
CollectorCurrentIC(A)
Collector to Emitter Voltage VCE (V)
Turn-off SOA
0 200 400 600 800
CollectorDissipationPc(W)
Case Temperature Tc (°C)
Collector Dissipation vs.
Case Temperature
25
60
50
40
30
20
10
0
IGBT Output Characteristics (Typical)
Collector to Emitter Voltage VCE (V)
CollectorCurrentIC(A)
Collector to Emitter Voltage VCE (V)
Maximum Safe Operation Area
100
10
0.1
1
0.01
1 10010 1000
Tc = 25°C
Single pulse
100 μs
PW
=
10 μs
0
50
40
30
20
10
0 1 2 43 5 0 1 2 43 5
Tc = 25°C
Pulse Test
VGE = 8 V
10 V
12 V
15 V
18 V
CollectorCurrentIC(A)
Tc = 150°C
Pulse Test
VGE = 8 V
10 V
12 V
15 V
18 V
0 25 50 10075 125 150 175
50
40
30
20
10
0
RJH60D2DPP-M0 Preliminary
R07DS0160EJ0400 Rev.4.00 Page 4 of 9
Apr 19, 2012
0
50
40
30
20
10
Gate to Emitter Voltage VGE (V)
CollectorCurrentIC(A)
Gate to Emitter Voltage VGE (V)
Transfer Characteristics (Typical)
0 4 8 12 2016
VCE = 10 V
Pulse Test
Tc = 25°C
150°C
Collector to Emitter Satularion Voltage vs.
Gate to Emitter Voltage (Typical)
Collector to Emitter Satularion Voltage vs.
Gate to Emitter Voltage (Typical)
CollectortoEmitterSatularionVoltage
VCE(sat)(V)
CollectortoEmitterSatularionVoltage
VCE(sat)(V)
Gate to Emitter Voltage VGE (V)
5
4
3
2
1
5
4
3
2
1
4 8 12 2016
Tc = 150°C
Pulse Test
4 8 12 2016
Tc = 25°C
Pulse Test
IC = 12 A
IC = 12 A 25 A
25 A
8
6
4
2
0
Frequency Characteristics (Typical)
CollectorCurrentIC(RSM)(A)
Frequency f (kHz)
1 10010 1000
Tj = 150°C, Tc = 100°C
VCE = 300 V, VGE = 15 V
Rg = 5 Ω, duty = 50%
0
Collector current wave
(Square wave)
4.0
3.5
2.5
2.0
3.0
1.5
1.0
−25 0 25 75 12550 100 150
12 A
6 A
IC = 25 A
VGE = 15 V
Pulse Test
10
8
6
4
2
0
Collector to Emitter Saturation Voltage
vs. Case Temparature (Typical)
CollectortoEmitterSaturationVoltage
VCE(sat)(V)
Case Temparature Tc (°C)
Gate to Emitter Cutoff Voltage
vs. Case Temparature (Typical)
−25 0 25 75 12550 100 150
GatetoEmitterCutoffVoltageVGE(off)(V)
VCE = 10 V
Pulse Test
Case Temparature Tc (°C)
1 mA
IC = 10 mA
RJH60D2DPP-M0 Preliminary
R07DS0160EJ0400 Rev.4.00 Page 5 of 9
Apr 19, 2012
0.01
1
0.1
10
SwithingEnergyLossesE(mJ)
Collector Current IC (A)
(Inductive load)
VCC = 300 V, VGE = 15 V
Rg = 5 Ω, Tc = 150°C
Eoff
Eon
1
100
10
1000
Switching Characteristics (Typical) (1) Switching Characteristics (Typical) (2)
Collector Current IC (A)
(Inductive load)
SwitchingTimest(ns)
VCC = 300 V, VGE = 15 V
Rg = 5 Ω, Tc = 150°C
td(off)
td(on)
tf
tr
0.01
0.1
1
1 10 100
Gate Registance Rg (Ω)
(Inductive load)
Eoff
Eon
SwithingEnergyLossesE(mJ)
Switching Characteristics (Typical) (4)
VCC = 300 V, VGE = 15 V
IC = 12 A, Tc = 150 °C
1 10 100
1 10 100 1 10 100
Switching Characteristics (Typical) (3)
td(on)
Gate Resistance Rg (Ω)
(Inductive load)
SwitchingTimet(ns)
10
100
1000
VCC = 300 V, VGE = 15 V
IC = 12 A, Tc = 150°C
tf
td(off)
tr
10
100
1000
5025 15075 125100
Switching Characteristics (Typical) (5)
td(on)
Case Temperature Tc (°C)
(Inductive load)
SwitchingTimest(ns)
VCC = 300 V, VGE = 15 V
IC = 12 A, Rg = 5 Ω
tf
td(off)
tr
0.01
0.1
1
5025 15075 125100
Case Temperature Tc (°C)
(Inductive load)
Switching Characteristics (Typical) (6)
Eoff
Eon
SwithingEnergyLossesE(mJ)
VCC = 300 V, VGE = 15 V
IC =12 A, Rg = 5 Ω
RJH60D2DPP-M0 Preliminary
R07DS0160EJ0400 Rev.4.00 Page 6 of 9
Apr 19, 2012
1.0
0.8
0.6
0.4
0.2
Diode Current Slope diF/dt (A/μs)
ReverseRecoveryTimetrr(ns)
Reverse Recovery Time vs.
Diode Current Slope (Typical)
100
50
300
250
200
150
0
0 40 80 200120 160
0 40 80 200120 160
0 40 80 200120 160
VCC = 300 V
IF = 12 A
Tc = 150°C
25°C
Diode Current Slope diF/dt (A/μs)
ReverseRecoveryCurrentIrr(A)
Reverse Recovery Current vs.
Diode Current Slope (Typical)
Diode Current Slope diF/dt (A/μs)
ReverseRecoveryChargeQrr(μC)
Reverse Recovery Charge vs.
Diode Current Slope (Typical)
0
VCC = 300 V
IF = 12 A
12
8
4
16
0
VCC = 300 V
IF = 12 A
Tc = 150°C
25°C
C-E Diode Forward Voltage VCEF (V)
Forward Current vs. Forward Voltage (Typical)
ForwardCurrentIF(A)
0
50
40
30
20
10
0 1 2 43
Tc = 25°C
150°C
VCE = 0 V
Pulse Test
CapacitanceC(pF)
1
10
100
1000
0 10050 150 200 250 300
Cies
Coes
Cres
Gate Charge Qg (nc)
Dynamic Input Characteristics (Typical)
Typical Capacitance vs.
Collector to Emitter Voltage
800
600
400
200
0
0
16
12
8
4
0
4 8 12 16 20
VGE
VCE
VGE = 0 V
f = 1 MHz
Tc = 25°C
Collector to Emitter Voltage VCE (V)
CollectortoEmitterVoltageVCE(V)
GatetoEmitterVoltageVGE(V)
VCC = 300 V
IC = 12 A
Tc = 25°C
Tc = 150°C
25°C
RJH60D2DPP-M0 Preliminary
R07DS0160EJ0400 Rev.4.00 Page 7 of 9
Apr 19, 2012
0.01
1
0.1
10
100 μ 1 m 10 m 100 m 1 10
PDM
PW
T
D =
PW
T
θj – c(t) = γs (t) • θj – c
θj – c = 4.9°C/W, Tc = 25°C
0.2
0.1
0.5
D = 1
Tc = 25°C
Pulse Width PW (s)
NormalizedTransientThermalImpedanceγs(t)
Normalized Transient Thermal Impedance vs. Pulse Width (IGBT)
Pulse Width PW (s)
NormalizedTransientThermalImpedanceγs(t)
Normalized Transient Thermal Impedance vs. Pulse Width (Diode)
0.01
0.1
10
1
100 μ 1 m 10 m 100 m 1 10
100
100
PDM
PW
T
D =
PW
T
θj – c(t) = γs (t) • θj – c
θj – c = 3.7°C/W, Tc = 25°C
Tc = 25°C
0.05
0.02
0.05
0.2
0.1
0.5
D = 1
0.01
1 shot pulse
0.01
0.02
1 shot pulse
RJH60D2DPP-M0 Preliminary
R07DS0160EJ0400 Rev.4.00 Page 8 of 9
Apr 19, 2012
Switching Time Test Circuit
Diode Reverse Recovery Time Test Circuit
Waveform
Waveform
Diode clamp
D.U.T
D.U.T
Rg
L
VCC
VCC
trr
Irr
diF/dt
0.9 Irr
IF
IF
Rg
td(off) td(on)tf tr
90%
90% 90%
10%
10%10%
VGE
IC
0.5 Irr
L
0
RJH60D2DPP-M0 Preliminary
R07DS0160EJ0400 Rev.4.00 Page 9 of 9
Apr 19, 2012
Package Dimension
Unit: mm
Previous Code
PRSS0003AF-A TO-220FL
MASS[Typ.]
1.5g⎯
RENESAS CodeJEITA Package CodePackage Name
TO-220FL
3.6±0.3
15.0±0.312.5±0.5
10.0 ± 0.3
6.5±0.3
φ 3.2 ± 0.2
0.75 ± 0.15
1.15 ± 0.2
2.54 ± 0.252.54 ± 0.25
2.6±0.2
4.5±0.2
0.40 ± 0.15
2.8 ± 0.2
1.15 ± 0.2
3.0±0.3
Ordering Information
Orderable Part No. Quantity Shipping Container
RJH60D2DPP-M0#T2 600 pcs Box (Tube)
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas
Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to
be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and
regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to
the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations.
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assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
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(Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
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Refer to "http://www.renesas.com/" for the latest and detailed information.
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Original IGBT IRG4BC20KD-S G4BC20KD 600V 9A TO-263 New
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Original IGBT IRGP4068DPBF GP4068D 4068 600V 96A 330W TO-247 New Infineon
Original IGBT IRGP4068DPBF GP4068D 4068 600V 96A 330W TO-247 New InfineonOriginal IGBT IRGP4068DPBF GP4068D 4068 600V 96A 330W TO-247 New Infineon
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Original IGBT SGF23N60UFD G23N60UF G23N60 23N60 600V 23A New
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Original IGBT FGP20N60 20N60 FGP20N60UFD 20A 600V TO-220 New
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Original IGBT TGPF30N43P TGPF30N43 30N43 30N43P 450V 60A TO-220F New TRinno
Original IGBT TGPF30N43P TGPF30N43 30N43 30N43P 450V 60A TO-220F New TRinnoOriginal IGBT TGPF30N43P TGPF30N43 30N43 30N43P 450V 60A TO-220F New TRinno
Original IGBT TGPF30N43P TGPF30N43 30N43 30N43P 450V 60A TO-220F New TRinnoAUTHELECTRONIC
 
Original Mosfet AOD5B60D D5B60D 600V 5A TO-252 New
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Original IGBT IRFR4615TRLPBF IRFR4615 4615 150V 33A TO-252 New IR
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Original Opto TLP620GB TLP620 P620 620 DIP-4 New ToshibaOriginal Opto TLP620G...
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Original IGBT STGP6NC60HD 6N60 600V 15A TO-220 New STMicroelectronics
Original IGBT STGP6NC60HD 6N60 600V 15A TO-220 New STMicroelectronicsOriginal IGBT STGP6NC60HD 6N60 600V 15A TO-220 New STMicroelectronics
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Original IGBT STGP6NC60HD GP6NC60 6N60 600V 15A TO-220 New STMicroelectronics
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Original IGBT IKA10N60T K10T60 10T60 600V 10A TO-220 New Infineon
Original IGBT IKA10N60T K10T60 10T60 600V 10A TO-220 New InfineonOriginal IGBT IKA10N60T K10T60 10T60 600V 10A TO-220 New Infineon
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Original IGBT N-CHANNEL STGP7NC60HD GP7NC60HD 7NC60 14A 600V TO-220 New
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Original IGBT IRG4BC20KD-S G4BC20KD 600V 9A TO-263 New
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Original IGBT AOTF15B60D2 TF15B60D2 TF15B60 15B60 TO-220F IGBT 600V 15A New
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Original IGBT IRGP4068DPBF GP4068D 4068 600V 96A 330W TO-247 New Infineon
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Original IGBT RJH60D2DPP RJH60D2 12A 600V TO-220 New Renesas

  • 1. R07DS0160EJ0400 Rev.4.00 Page 1 of 9 Apr 19, 2012 Preliminary Datasheet RJH60D2DPP-M0 600V - 12A - IGBT Application: Inverter Features  Short circuit withstand time (5 s typ.)  Low collector to emitter saturation voltage VCE(sat) = 1.7 V typ. (at IC = 12 A, VGE = 15 V, Ta = 25°C)  Built in fast recovery diode (100 ns typ.) in one package  Trench gate and thin wafer technology  High speed switching tf = 80 ns typ. (at VCC = 300 V, VGE = 15 V, IC = 12 A, Rg = 5 , Ta = 25°C, inductive load) Outline RENESAS Package code: PRSS0003AF-A (Package name: TO-220FL) 1 2 3 1. Gate 2. Collector 3. Emitter C G E Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Collector to emitter voltage / diode reverse voltage VCES / VR 600 V Gate to emitter voltage VGES ±30 V Tc = 25°C IC 25 ACollector current Tc = 100°C IC 12 A Collector peak current ic(peak) Note1 50 A Collector to emitter diode forward current iDF 12 A Collector to emitter diode forward peak current iDF(peak) Note1 50 A Collector dissipation PC Note2 34 W Junction to case thermal resistance (IGBT) j-c Note2 3.7 °C/W Junction to case thermal resistance (Diode) j-cd Note2 4.9 °C/W Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Notes: 1. PW  10 s, duty cycle  1% 2. Value at Tc = 25C R07DS0160EJ0400 Rev.4.00 Apr 19, 2012
  • 2. RJH60D2DPP-M0 Preliminary R07DS0160EJ0400 Rev.4.00 Page 2 of 9 Apr 19, 2012 Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Collector to emitter breakdown voltage VBR(CES) 600 — — V IC =10 A, VGE = 0 Zero gate voltage collector current / Diode reverse current ICES / IR — — 5 A VCE = 600 V, VGE = 0 Gate to emitter leak current IGES — — ±1 A VGE = ±30 V, VCE = 0 Gate to emitter cutoff voltage VGE(off) 4.0 — 6.0 V VCE = 10 V, IC = 1 mA VCE(sat) — 1.7 2.2 V IC = 12 A, VGE = 15 V Note3 Collector to emitter saturation voltage VCE(sat) — 2.2 — V IC = 25 A, VGE = 15 V Note3 Input capacitance Cies — 430 — pF Output capacitance Coes — 40 — pF Reveres transfer capacitance Cres — 12 — pF VCE = 25 V VGE = 0 f = 1 MHz Total gate charge Qg — 19 — nC Gate to emitter charge Qge — 4 — nC Gate to collector charge Qgc — 7 — nC VGE = 15 V VCE = 300 V IC = 12 A Turn-on delay time td(on) — 32 — ns Rise time tr — 13 — ns Turn-off delay time td(off) — 85 — ns Fall time tf — 80 — ns Turn-on energy Eon — 0.10 — mJ Turn-off energy Eoff — 0.16 — mJ Total switching energy Etotal — 0.26 — mJ VCC = 300 V VGE = 15 V IC = 12 A Rg = 5  Inductive load Short circuit withstand time tsc 3.0 5.0 — s VCC  360 V, VGE = 15 V FRD Forward voltage VF — 1.2 1.6 V IF = 12 A Note3 FRD reverse recovery time trr — 100 — ns FRD reverse recovery charge Qrr — 0.2 — C FRD peak reverse recovery current Irr — 5.0 — A IF = 12 A diF/dt = 100 A/s Notes: 3. Pulse test.
  • 3. RJH60D2DPP-M0 Preliminary R07DS0160EJ0400 Rev.4.00 Page 3 of 9 Apr 19, 2012 Main Characteristics 50 40 30 20 10 IGBT Output Characteristics (Typical) CollectorCurrentIC(A) Collector to Emitter Voltage VCE (V) CollectorCurrentIC(A) Case Temperature Tc (°C) Maximum DC Collector Current vs. Case Temperature 30 20 15 10 5 0 0 25 50 10075 125 150 175 CollectorCurrentIC(A) Collector to Emitter Voltage VCE (V) Turn-off SOA 0 200 400 600 800 CollectorDissipationPc(W) Case Temperature Tc (°C) Collector Dissipation vs. Case Temperature 25 60 50 40 30 20 10 0 IGBT Output Characteristics (Typical) Collector to Emitter Voltage VCE (V) CollectorCurrentIC(A) Collector to Emitter Voltage VCE (V) Maximum Safe Operation Area 100 10 0.1 1 0.01 1 10010 1000 Tc = 25°C Single pulse 100 μs PW = 10 μs 0 50 40 30 20 10 0 1 2 43 5 0 1 2 43 5 Tc = 25°C Pulse Test VGE = 8 V 10 V 12 V 15 V 18 V CollectorCurrentIC(A) Tc = 150°C Pulse Test VGE = 8 V 10 V 12 V 15 V 18 V 0 25 50 10075 125 150 175 50 40 30 20 10 0
  • 4. RJH60D2DPP-M0 Preliminary R07DS0160EJ0400 Rev.4.00 Page 4 of 9 Apr 19, 2012 0 50 40 30 20 10 Gate to Emitter Voltage VGE (V) CollectorCurrentIC(A) Gate to Emitter Voltage VGE (V) Transfer Characteristics (Typical) 0 4 8 12 2016 VCE = 10 V Pulse Test Tc = 25°C 150°C Collector to Emitter Satularion Voltage vs. Gate to Emitter Voltage (Typical) Collector to Emitter Satularion Voltage vs. Gate to Emitter Voltage (Typical) CollectortoEmitterSatularionVoltage VCE(sat)(V) CollectortoEmitterSatularionVoltage VCE(sat)(V) Gate to Emitter Voltage VGE (V) 5 4 3 2 1 5 4 3 2 1 4 8 12 2016 Tc = 150°C Pulse Test 4 8 12 2016 Tc = 25°C Pulse Test IC = 12 A IC = 12 A 25 A 25 A 8 6 4 2 0 Frequency Characteristics (Typical) CollectorCurrentIC(RSM)(A) Frequency f (kHz) 1 10010 1000 Tj = 150°C, Tc = 100°C VCE = 300 V, VGE = 15 V Rg = 5 Ω, duty = 50% 0 Collector current wave (Square wave) 4.0 3.5 2.5 2.0 3.0 1.5 1.0 −25 0 25 75 12550 100 150 12 A 6 A IC = 25 A VGE = 15 V Pulse Test 10 8 6 4 2 0 Collector to Emitter Saturation Voltage vs. Case Temparature (Typical) CollectortoEmitterSaturationVoltage VCE(sat)(V) Case Temparature Tc (°C) Gate to Emitter Cutoff Voltage vs. Case Temparature (Typical) −25 0 25 75 12550 100 150 GatetoEmitterCutoffVoltageVGE(off)(V) VCE = 10 V Pulse Test Case Temparature Tc (°C) 1 mA IC = 10 mA
  • 5. RJH60D2DPP-M0 Preliminary R07DS0160EJ0400 Rev.4.00 Page 5 of 9 Apr 19, 2012 0.01 1 0.1 10 SwithingEnergyLossesE(mJ) Collector Current IC (A) (Inductive load) VCC = 300 V, VGE = 15 V Rg = 5 Ω, Tc = 150°C Eoff Eon 1 100 10 1000 Switching Characteristics (Typical) (1) Switching Characteristics (Typical) (2) Collector Current IC (A) (Inductive load) SwitchingTimest(ns) VCC = 300 V, VGE = 15 V Rg = 5 Ω, Tc = 150°C td(off) td(on) tf tr 0.01 0.1 1 1 10 100 Gate Registance Rg (Ω) (Inductive load) Eoff Eon SwithingEnergyLossesE(mJ) Switching Characteristics (Typical) (4) VCC = 300 V, VGE = 15 V IC = 12 A, Tc = 150 °C 1 10 100 1 10 100 1 10 100 Switching Characteristics (Typical) (3) td(on) Gate Resistance Rg (Ω) (Inductive load) SwitchingTimet(ns) 10 100 1000 VCC = 300 V, VGE = 15 V IC = 12 A, Tc = 150°C tf td(off) tr 10 100 1000 5025 15075 125100 Switching Characteristics (Typical) (5) td(on) Case Temperature Tc (°C) (Inductive load) SwitchingTimest(ns) VCC = 300 V, VGE = 15 V IC = 12 A, Rg = 5 Ω tf td(off) tr 0.01 0.1 1 5025 15075 125100 Case Temperature Tc (°C) (Inductive load) Switching Characteristics (Typical) (6) Eoff Eon SwithingEnergyLossesE(mJ) VCC = 300 V, VGE = 15 V IC =12 A, Rg = 5 Ω
  • 6. RJH60D2DPP-M0 Preliminary R07DS0160EJ0400 Rev.4.00 Page 6 of 9 Apr 19, 2012 1.0 0.8 0.6 0.4 0.2 Diode Current Slope diF/dt (A/μs) ReverseRecoveryTimetrr(ns) Reverse Recovery Time vs. Diode Current Slope (Typical) 100 50 300 250 200 150 0 0 40 80 200120 160 0 40 80 200120 160 0 40 80 200120 160 VCC = 300 V IF = 12 A Tc = 150°C 25°C Diode Current Slope diF/dt (A/μs) ReverseRecoveryCurrentIrr(A) Reverse Recovery Current vs. Diode Current Slope (Typical) Diode Current Slope diF/dt (A/μs) ReverseRecoveryChargeQrr(μC) Reverse Recovery Charge vs. Diode Current Slope (Typical) 0 VCC = 300 V IF = 12 A 12 8 4 16 0 VCC = 300 V IF = 12 A Tc = 150°C 25°C C-E Diode Forward Voltage VCEF (V) Forward Current vs. Forward Voltage (Typical) ForwardCurrentIF(A) 0 50 40 30 20 10 0 1 2 43 Tc = 25°C 150°C VCE = 0 V Pulse Test CapacitanceC(pF) 1 10 100 1000 0 10050 150 200 250 300 Cies Coes Cres Gate Charge Qg (nc) Dynamic Input Characteristics (Typical) Typical Capacitance vs. Collector to Emitter Voltage 800 600 400 200 0 0 16 12 8 4 0 4 8 12 16 20 VGE VCE VGE = 0 V f = 1 MHz Tc = 25°C Collector to Emitter Voltage VCE (V) CollectortoEmitterVoltageVCE(V) GatetoEmitterVoltageVGE(V) VCC = 300 V IC = 12 A Tc = 25°C Tc = 150°C 25°C
  • 7. RJH60D2DPP-M0 Preliminary R07DS0160EJ0400 Rev.4.00 Page 7 of 9 Apr 19, 2012 0.01 1 0.1 10 100 μ 1 m 10 m 100 m 1 10 PDM PW T D = PW T θj – c(t) = γs (t) • θj – c θj – c = 4.9°C/W, Tc = 25°C 0.2 0.1 0.5 D = 1 Tc = 25°C Pulse Width PW (s) NormalizedTransientThermalImpedanceγs(t) Normalized Transient Thermal Impedance vs. Pulse Width (IGBT) Pulse Width PW (s) NormalizedTransientThermalImpedanceγs(t) Normalized Transient Thermal Impedance vs. Pulse Width (Diode) 0.01 0.1 10 1 100 μ 1 m 10 m 100 m 1 10 100 100 PDM PW T D = PW T θj – c(t) = γs (t) • θj – c θj – c = 3.7°C/W, Tc = 25°C Tc = 25°C 0.05 0.02 0.05 0.2 0.1 0.5 D = 1 0.01 1 shot pulse 0.01 0.02 1 shot pulse
  • 8. RJH60D2DPP-M0 Preliminary R07DS0160EJ0400 Rev.4.00 Page 8 of 9 Apr 19, 2012 Switching Time Test Circuit Diode Reverse Recovery Time Test Circuit Waveform Waveform Diode clamp D.U.T D.U.T Rg L VCC VCC trr Irr diF/dt 0.9 Irr IF IF Rg td(off) td(on)tf tr 90% 90% 90% 10% 10%10% VGE IC 0.5 Irr L 0
  • 9. RJH60D2DPP-M0 Preliminary R07DS0160EJ0400 Rev.4.00 Page 9 of 9 Apr 19, 2012 Package Dimension Unit: mm Previous Code PRSS0003AF-A TO-220FL MASS[Typ.] 1.5g⎯ RENESAS CodeJEITA Package CodePackage Name TO-220FL 3.6±0.3 15.0±0.312.5±0.5 10.0 ± 0.3 6.5±0.3 φ 3.2 ± 0.2 0.75 ± 0.15 1.15 ± 0.2 2.54 ± 0.252.54 ± 0.25 2.6±0.2 4.5±0.2 0.40 ± 0.15 2.8 ± 0.2 1.15 ± 0.2 3.0±0.3 Ordering Information Orderable Part No. Quantity Shipping Container RJH60D2DPP-M0#T2 600 pcs Box (Tube)
  • 10. Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. http://www.renesas.com Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics America Inc. 2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A. 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