The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
To this date, fingerprint sensing technology is the most reliable and widespread biometric technology and fingerprint sensors are well developed. This patent landscape focuses on fingerprint sensors using capacitive sensing technology. The domain of capacitive fingerprint sensors is closely linked to the development of electronic devices, especially smartphones and the like, and the growing demand for security. Capacitive fingerprint sensors of a new generation have been incorporated in the most recent smartphones of companies like Apple or Samsung. The capacitive fingerprint sensing technologies involve more than 100 different applicants, mainly semiconductor and electronics companies. The main IP holders in the domain are Seiko Epson, AuthenTec, Sony and STMicroelectronics. The pioneer patents on capacitive fingerprint sensing technology are no longer in force and more than 200 granted patents are expected to expire by 2020. However, the number of new patent publications is increasing again since 2012, underlying a new enthusiasm for capacitive fingerprint sensors.
KEY FEATURES OF THE REPORT
The report provides essential patent data for fingerprint sensors of the capacitive type including:
- Time evolution of patent publications and countries of patent filings.
- Current legal status of patents.
-Ranking of main patent applicants.
- Joint developments and IP collaboration network of main patent applicants.
- Key patents.
- Granted patents near expiration.
- Relative strength of main companies IP portfolio.
- Overview of patent litigations
- Capacitive fingerprint sensor IP profiles of 15+ major companies with key patents, partnerships, and IP strength and strategy.
- The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
- Understand the IP landscape for capacitive fingerprint sensors.
- Identify key patents.
- Understand trends in capacitive fingerprint sensors IP.
- Identify the major players in capacitive fingerprint sensors IP and the relative strength of their patent portfolio.
- Identify new players in capacitive fingerprint sensors IP.
- Identify IP collaboration networks between key players.
- Identify main patent litigations.
This document provides an analysis of Honeywell's microbolometer patent portfolio. It includes information on the technology overview, market forecast, intellectual property overview including statistics on patent publications, granted patents and applications by country and over time, main technical issues addressed, inventors, most cited patent families, and competitive intellectual property landscape. The analysis also discusses Honeywell's key patents, strengths and weaknesses, and provides conclusions on Honeywell's leadership position in microbolometer technology.
KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
FOWLP Patent Analysis 2012 Report by Yole DeveloppementYole Developpement
dopted for both mobile phone and consumer electronics applications, Fan-Out Wafer Level Packaging (FO-WLP) is the most innovative, advanced packaging technology today. Analysing patent status is the key to understanding the business situation.
ANALYSIS OF THE PATENT PORTFOLIO’S TECHNICAL CONTENT
After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis concerning the technical contents of patents. This first study focuses on the FO-WLP area, a new packaging technology which is changing the patent landscape for semiconductor packaging across a wide range of application spaces. Yole Développement has developed a specific methodology to conduct this analysis (described below), mixing our technical and business knowledge with classical access to the patent database...
More information on that report at http://www.i-micronews.com/advanced-packaging-report/product/fowlp-patent-analysis.html
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Technology market trends in LED downconverters presentation held by Eric Vire...Yole Developpement
Phosphor volumes to grow +/-at the same pace for “on-chip”
Surface blue LED chips combined with a downconverter Surface blue LED chips combined with a downconverter
Phosphor volumes to essentially double by 2020
Silicates could essentially disappear unless significant cost reduction and further performance improvement are achieved.
Increasing demand for high CRI in lighting broad band green and yellow + narrow band red.
Wider color gamut display: increasing demand for narrow band green and red.
No more room for ASP decrease.
Yet, YAG is not a commodity!
Overall flat revenue means pain and suffering + attrition (20+ suppliers in China only!)
But even in a difficult environment, some companies will grow and thrive
The most dramatic picture improvements come from higher dynamic contrast and extended color gamut!
More information on that report at http://www.i-micronews.com/reports.html
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
To this date, fingerprint sensing technology is the most reliable and widespread biometric technology and fingerprint sensors are well developed. This patent landscape focuses on fingerprint sensors using capacitive sensing technology. The domain of capacitive fingerprint sensors is closely linked to the development of electronic devices, especially smartphones and the like, and the growing demand for security. Capacitive fingerprint sensors of a new generation have been incorporated in the most recent smartphones of companies like Apple or Samsung. The capacitive fingerprint sensing technologies involve more than 100 different applicants, mainly semiconductor and electronics companies. The main IP holders in the domain are Seiko Epson, AuthenTec, Sony and STMicroelectronics. The pioneer patents on capacitive fingerprint sensing technology are no longer in force and more than 200 granted patents are expected to expire by 2020. However, the number of new patent publications is increasing again since 2012, underlying a new enthusiasm for capacitive fingerprint sensors.
KEY FEATURES OF THE REPORT
The report provides essential patent data for fingerprint sensors of the capacitive type including:
- Time evolution of patent publications and countries of patent filings.
- Current legal status of patents.
-Ranking of main patent applicants.
- Joint developments and IP collaboration network of main patent applicants.
- Key patents.
- Granted patents near expiration.
- Relative strength of main companies IP portfolio.
- Overview of patent litigations
- Capacitive fingerprint sensor IP profiles of 15+ major companies with key patents, partnerships, and IP strength and strategy.
- The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
- Understand the IP landscape for capacitive fingerprint sensors.
- Identify key patents.
- Understand trends in capacitive fingerprint sensors IP.
- Identify the major players in capacitive fingerprint sensors IP and the relative strength of their patent portfolio.
- Identify new players in capacitive fingerprint sensors IP.
- Identify IP collaboration networks between key players.
- Identify main patent litigations.
This document provides an analysis of Honeywell's microbolometer patent portfolio. It includes information on the technology overview, market forecast, intellectual property overview including statistics on patent publications, granted patents and applications by country and over time, main technical issues addressed, inventors, most cited patent families, and competitive intellectual property landscape. The analysis also discusses Honeywell's key patents, strengths and weaknesses, and provides conclusions on Honeywell's leadership position in microbolometer technology.
KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
FOWLP Patent Analysis 2012 Report by Yole DeveloppementYole Developpement
dopted for both mobile phone and consumer electronics applications, Fan-Out Wafer Level Packaging (FO-WLP) is the most innovative, advanced packaging technology today. Analysing patent status is the key to understanding the business situation.
ANALYSIS OF THE PATENT PORTFOLIO’S TECHNICAL CONTENT
After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis concerning the technical contents of patents. This first study focuses on the FO-WLP area, a new packaging technology which is changing the patent landscape for semiconductor packaging across a wide range of application spaces. Yole Développement has developed a specific methodology to conduct this analysis (described below), mixing our technical and business knowledge with classical access to the patent database...
More information on that report at http://www.i-micronews.com/advanced-packaging-report/product/fowlp-patent-analysis.html
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment and materials business will be supported by the expansion of 3D TSV stack platforms.
TSV integration is creating growth and significant interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year....
More information on that report at: http://www.i-micronews.com/advanced-packaging-report/product/equipment-materials-for-3dic-wafer-level-packaging-applications.html#description
Technology market trends in LED downconverters presentation held by Eric Vire...Yole Developpement
Phosphor volumes to grow +/-at the same pace for “on-chip”
Surface blue LED chips combined with a downconverter Surface blue LED chips combined with a downconverter
Phosphor volumes to essentially double by 2020
Silicates could essentially disappear unless significant cost reduction and further performance improvement are achieved.
Increasing demand for high CRI in lighting broad band green and yellow + narrow band red.
Wider color gamut display: increasing demand for narrow band green and red.
No more room for ASP decrease.
Yet, YAG is not a commodity!
Overall flat revenue means pain and suffering + attrition (20+ suppliers in China only!)
But even in a difficult environment, some companies will grow and thrive
The most dramatic picture improvements come from higher dynamic contrast and extended color gamut!
More information on that report at http://www.i-micronews.com/reports.html
The report analyzes the patent landscape related to antenna integrated in package (AiP). Over 140 entities have filed AiP patents, with the main assignees being SJ Semiconductor, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. The report provides a detailed analysis of these players' patent portfolios, technologies, strategies, and key patents. It also includes an Excel database of over 1,500 analyzed AiP patents. The report finds the IP landscape is dominated by foundries/OSATs and major companies, with newcomers being Chinese firms focusing on wafer-level packaging for integrated antennas. The IP
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
1) The Internet of Things (IoT) market is projected to grow significantly from $120 billion in 2016 to $253 billion in 2021. Patent activity and acquisitions in IoT are also increasing substantially.
2) Samsung, Qualcomm, Microsoft, and Intel are the top patent holders in key IoT technologies such as sensors, processors, and network infrastructure. China is the largest source of IoT patent applications.
3) Major acquisitions in IoT have involved companies in applications such as home automation, wearables, and industrial automation technologies. These acquisitions are helping companies expand into new IoT business areas.
The document provides an overview of the technology landscape and patent analysis for organic photodiodes applicable to sensors and detectors. It introduces the objective of analyzing the technology segmentation, trends, key players, and illustrative patents. The summary identifies that most patenting activity is in the US, with applications in optical sensing, imaging, radiation detection, and other areas. Patent filings increased until 2013, with over 70 key players identified.
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
The FS100R12PT4 from Infineon is the 6 - IGBT4 generation high-voltage power module in EconoPACK™ package. With a breakdown voltage of 1200V for a current of 100A, the module is optimized for high power converters and motor drivers. The power module integrates in a new generation of power packaging the improved IGBT4 and the optimized EMCON4 diodes from Infineon.
The EconoPACKTM IGBT4 offers a very low on-resistance (1.4 mΩ) and a higher operating temperature (up to 150 °C) in a 130.0 x 103.0 x 20.55 mm package. The IGBT4 differs from the IGBT3 for an adjusted backside, a different gate dimensions to obtain lower switching losses and increase softness for the same robustness.
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Infineon FS100R12PT4, a technological comparison between Infineon IGBT3 and IGBT4 and EconoPACK4 and HybridPACK2.
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
Photoacoustic imaging technologies in the biomedical domain are in full growth from an IP point of view, and have began to move in the clinical field. If Japanese companies Canon and Fujifilm are the main IP holder, the market is held by US actors : ENDRA Life Sciences, VisualSonics, Seno Medical Instruments, OptoSonics or TomoWave Laboratories.
This patent landscape focuses on photoacoustic imaging in biomedicine. Photoacoustic imaging is a safe, non-invasive, non-ionizing imaging technique. The technique offers several advantages and represents a great alternative to traditional medical imaging approaches. The innovation of photoacoustic imaging for biomedical purposes is mainly driven by the need to enhance the efficiency of the detection and diagnostic of cancer.
KEY FEATURES OF THE REPORT
The report provides essential patent data for biomedical photoacoustic imaging including:
Time evolution of patent publications and countries of patent filings.
Current legal status of patents.
Ranking of main patent applicants.
Joint developments and IP collaboration network of main patent applicants.
Key patents.
Granted patents near expiration.
Relative strength of main companies IP portfolio.
Photoacoustic imaging IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
Capsule Endoscopy Patent Landscape 2014 Sample
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
KEY FEATURES OF THE REPORT
The report provides essential patent data for capsule endoscopy. It identifies more than 30 major holders of capsule endoscopy related intellectual property. It provides in-depth IP analysis and industrial key players including:
-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 15+ companies.
The “capsule endoscopy IP” profiles of 15+ major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the report.
OBJECTIVE OF THE REPORT
•Understand the IP landscape for capsule endoscopy.
•Identify key patents.
•Understand trends in capsule endoscopy IP.
•Identify the major players in capsule endoscopy IP and the relative strength of their patent portfolio.
•Identify new players in capsule endoscopy IP.
•Identify IP collaboration networks between key players (industrial and academics).
•Identify main patent litigations.
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
The first MMIC FEM targeting 5G base stations and terminals using a 0.15µm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
GaN Power Device Market by Device Type (Power, RF Power), Voltage Range, Application (Power Drives, Supply & Inverter, and RF), Vertical (Telecommunications, Consumer, Automotive, Military, Defense, Aerospace), and Geography
3D Embedded Substrate Technologies Increase Density and Performance of Power ...Design World
This webinar discussed significant developments and trends in 3D packaging with a focus on embedded substrate technologies. A technology report commissioned by PSMA found that embedded substrate technology can increase power density by embedding active components and passives directly into substrate layers. The webinar covered various embedded substrate manufacturing technologies from companies like AT&S, TDK, Infineon, and Semikron. It discussed the benefits of embedded substrates including improved performance, reliability, thermal management and reduced size. Standards for embedded components and a variety of embedded passive and active components were also reviewed.
This document provides a summary of an emerging MEMS patent investigation report by Knowmade and Yole Développement. The report analyzes over 1,300 patent families related to 7 types of emerging MEMS technologies: AOC MEMS, Autofocus, Chemical Sensors, Micro-Speakers, Scanning Micro-Mirrors, Si Microfluidics, and Ultrasonic MEMS. For each technology, the report provides an overview of the market and key patents, including rankings of major patent applicants and analysis of their patent portfolios and networks. It also includes timelines of patent publications and key findings on the leading IP holders for each emerging MEMS technology.
Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays 201...Yole Developpement
Traditional phosphors on the verge of commoditization due to expected strong push from China after YAG patents fall into public domain. But Quantum Dots are finally ready for prime time.
Strong price pressure stalls revenue growth and pressures margins but masks a more complex picture
While volumes are expected to more than double between 2015 and 2020, LED Phosphor prices have declined dramatically, leading to a flat revenue outlook. Low technology barriers of entrance on the most mature compositions have prompted companies to procure turnkey manufacturing equipment and enter the market. With little to no quality control and R&D expenses, some have achieved low cost comparable to that of the tri-phosphors used in fluorescent lamps. In a bid to capture market shares, they triggered an intense price war. With major YAG IP expiring from 2017, leading domestic vendors such as Yuji, Grirem, YT Shield, Illuma or Sunfor will finally access overseas markets, further increasing YAG commoditization. Phosphor makers are therefore shifting their efforts toward higher added value materials such as nitrides, which, while price have also decreased significantly during the period, have maintained better margins.
This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points:
- It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package.
- It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs.
- The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
The report analyzes the patent landscape related to antenna integrated in package (AiP). Over 140 entities have filed AiP patents, with the main assignees being SJ Semiconductor, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. The report provides a detailed analysis of these players' patent portfolios, technologies, strategies, and key patents. It also includes an Excel database of over 1,500 analyzed AiP patents. The report finds the IP landscape is dominated by foundries/OSATs and major companies, with newcomers being Chinese firms focusing on wafer-level packaging for integrated antennas. The IP
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
1) The Internet of Things (IoT) market is projected to grow significantly from $120 billion in 2016 to $253 billion in 2021. Patent activity and acquisitions in IoT are also increasing substantially.
2) Samsung, Qualcomm, Microsoft, and Intel are the top patent holders in key IoT technologies such as sensors, processors, and network infrastructure. China is the largest source of IoT patent applications.
3) Major acquisitions in IoT have involved companies in applications such as home automation, wearables, and industrial automation technologies. These acquisitions are helping companies expand into new IoT business areas.
The document provides an overview of the technology landscape and patent analysis for organic photodiodes applicable to sensors and detectors. It introduces the objective of analyzing the technology segmentation, trends, key players, and illustrative patents. The summary identifies that most patenting activity is in the US, with applications in optical sensing, imaging, radiation detection, and other areas. Patent filings increased until 2013, with over 70 key players identified.
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
The FS100R12PT4 from Infineon is the 6 - IGBT4 generation high-voltage power module in EconoPACK™ package. With a breakdown voltage of 1200V for a current of 100A, the module is optimized for high power converters and motor drivers. The power module integrates in a new generation of power packaging the improved IGBT4 and the optimized EMCON4 diodes from Infineon.
The EconoPACKTM IGBT4 offers a very low on-resistance (1.4 mΩ) and a higher operating temperature (up to 150 °C) in a 130.0 x 103.0 x 20.55 mm package. The IGBT4 differs from the IGBT3 for an adjusted backside, a different gate dimensions to obtain lower switching losses and increase softness for the same robustness.
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Infineon FS100R12PT4, a technological comparison between Infineon IGBT3 and IGBT4 and EconoPACK4 and HybridPACK2.
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
Photoacoustic imaging technologies in the biomedical domain are in full growth from an IP point of view, and have began to move in the clinical field. If Japanese companies Canon and Fujifilm are the main IP holder, the market is held by US actors : ENDRA Life Sciences, VisualSonics, Seno Medical Instruments, OptoSonics or TomoWave Laboratories.
This patent landscape focuses on photoacoustic imaging in biomedicine. Photoacoustic imaging is a safe, non-invasive, non-ionizing imaging technique. The technique offers several advantages and represents a great alternative to traditional medical imaging approaches. The innovation of photoacoustic imaging for biomedical purposes is mainly driven by the need to enhance the efficiency of the detection and diagnostic of cancer.
KEY FEATURES OF THE REPORT
The report provides essential patent data for biomedical photoacoustic imaging including:
Time evolution of patent publications and countries of patent filings.
Current legal status of patents.
Ranking of main patent applicants.
Joint developments and IP collaboration network of main patent applicants.
Key patents.
Granted patents near expiration.
Relative strength of main companies IP portfolio.
Photoacoustic imaging IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
Capsule Endoscopy Patent Landscape 2014 Sample
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
KEY FEATURES OF THE REPORT
The report provides essential patent data for capsule endoscopy. It identifies more than 30 major holders of capsule endoscopy related intellectual property. It provides in-depth IP analysis and industrial key players including:
-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 15+ companies.
The “capsule endoscopy IP” profiles of 15+ major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the report.
OBJECTIVE OF THE REPORT
•Understand the IP landscape for capsule endoscopy.
•Identify key patents.
•Understand trends in capsule endoscopy IP.
•Identify the major players in capsule endoscopy IP and the relative strength of their patent portfolio.
•Identify new players in capsule endoscopy IP.
•Identify IP collaboration networks between key players (industrial and academics).
•Identify main patent litigations.
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
The first MMIC FEM targeting 5G base stations and terminals using a 0.15µm GaN-on-SiC process.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/qorvo-qpf4006-39ghz-gan-mmic-front-end-module/
GaN Power Device Market by Device Type (Power, RF Power), Voltage Range, Application (Power Drives, Supply & Inverter, and RF), Vertical (Telecommunications, Consumer, Automotive, Military, Defense, Aerospace), and Geography
3D Embedded Substrate Technologies Increase Density and Performance of Power ...Design World
This webinar discussed significant developments and trends in 3D packaging with a focus on embedded substrate technologies. A technology report commissioned by PSMA found that embedded substrate technology can increase power density by embedding active components and passives directly into substrate layers. The webinar covered various embedded substrate manufacturing technologies from companies like AT&S, TDK, Infineon, and Semikron. It discussed the benefits of embedded substrates including improved performance, reliability, thermal management and reduced size. Standards for embedded components and a variety of embedded passive and active components were also reviewed.
This document provides a summary of an emerging MEMS patent investigation report by Knowmade and Yole Développement. The report analyzes over 1,300 patent families related to 7 types of emerging MEMS technologies: AOC MEMS, Autofocus, Chemical Sensors, Micro-Speakers, Scanning Micro-Mirrors, Si Microfluidics, and Ultrasonic MEMS. For each technology, the report provides an overview of the market and key patents, including rankings of major patent applicants and analysis of their patent portfolios and networks. It also includes timelines of patent publications and key findings on the leading IP holders for each emerging MEMS technology.
Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays 201...Yole Developpement
Traditional phosphors on the verge of commoditization due to expected strong push from China after YAG patents fall into public domain. But Quantum Dots are finally ready for prime time.
Strong price pressure stalls revenue growth and pressures margins but masks a more complex picture
While volumes are expected to more than double between 2015 and 2020, LED Phosphor prices have declined dramatically, leading to a flat revenue outlook. Low technology barriers of entrance on the most mature compositions have prompted companies to procure turnkey manufacturing equipment and enter the market. With little to no quality control and R&D expenses, some have achieved low cost comparable to that of the tri-phosphors used in fluorescent lamps. In a bid to capture market shares, they triggered an intense price war. With major YAG IP expiring from 2017, leading domestic vendors such as Yuji, Grirem, YT Shield, Illuma or Sunfor will finally access overseas markets, further increasing YAG commoditization. Phosphor makers are therefore shifting their efforts toward higher added value materials such as nitrides, which, while price have also decreased significantly during the period, have maintained better margins.
This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points:
- It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package.
- It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs.
- The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
The document provides contact information for various embassies and diplomatic missions located in Jakarta, Indonesia. It lists the addresses, phone numbers, fax numbers and websites of embassies from over 40 countries including Australia, Canada, China, Japan, South Korea, United States and many European and Southeast Asian countries. The contact details are organized alphabetically by country name.
Euroconsult is a global expert in satellite market consulting and analysis that has been in business for 30 years. It has over 560 customers in 50 countries and advises leading businesses and governments. Euroconsult provides consulting services, research reports, and summits on topics related to the satellite industry. Its team of experts conduct independent research and analysis to support strategic decision making for its public and private sector clients.
This document provides a summary of a report on women's economic empowerment in Afghanistan between 2002 and 2012. It begins with an introduction to the report and methodology. The next section provides an information mapping of key developments, including improvements in education and health indicators for women, as well as increases in political and public participation. However, safety issues remain a challenge. The mapping also examines women's growing participation in various economic sectors and small-to-medium enterprises. The final section presents a situation analysis of selected economic projects involving women, exploring the impacts on participants and their communities as well as ongoing barriers. The report concludes with recommendations to strengthen policies supporting women's long-term economic empowerment and equal rights.
El documento presenta una empresa de salud y bienestar que busca crear productos nutricionales para combatir problemas de salud como obesidad, enfermedades crónicas, etc. Ofrece varios suplementos alimenticios como cápsulas de células madre, jugo de aloe vera y un desayuno/cena balanceado. También describe su visión de ser una compañía internacional de calidad y su sistema de membresía y negocio de red de mercadeo para duplicar ingresos.
Sara Ruffer
Imago Relationships International:
Board of Directors, Faculty & Staff
Imago Relationships International is a global non-profit organization dedicated to transforming
relationships worldwide. The organization oversees the Imago International Institute, a professional
training program, and Imago Relationships International, a membership association.
The Imago International Institute offers comprehensive training programs for mental health profes-
sionals and others interested in learning Imago Relationship Therapy. The Institute is overseen by a
Board of Directors and led by Harville Hendrix, Ph.D., Chancellor of the Institute.
The Master Trainers are senior faculty members who have extensive experience training others in
Imago.
Este documento presenta la revista Línea Sur número 5 publicada por el Ministerio de Relaciones Exteriores y Movilidad Humana del Ecuador. El dossier se titula "Regímenes jurídicos internacionales: perspectivas desde el Sur" y contiene artículos sobre temas como el sistema mundial, derechos de la naturaleza, fortalecimiento del sistema interamericano de derechos humanos, y desafíos de empresas transnacionales. El mensaje del Canciller introduce el dossier discutiendo cómo Línea Sur busca generar un debate político-ac
L'Éco Actu est la revue économique du Pays de Lorient
Son objectif : parler des hommes, des entreprises, des structures, des filières qui façonnent et animent le paysage économique du Pays de Lorient
The document discusses a collective called CitiZen that brings together various expert consultants to provide placemaking services. It involves evaluating opportunities through rigorous analysis and citizen engagement to deliver economic, environmental, and social benefits. Member consultants like Javelin Group and Portland specialize in areas like retail strategy, design, transportation planning, and data analysis to take a holistic approach to placemaking.
This document analyzes toxic air pollution data from the EPA's Toxic Release Inventory for Virginia. It finds that total toxic air emissions in Virginia increased 7.8% from 2012 to 2013, one of the largest single-year increases on record. It identifies the top 25 facilities responsible for the largest increases in emissions during this period. Several facilities nearly doubled or more than doubled their emissions, including paper mills, power plants, and chemical manufacturers. The document examines the geographic distribution of toxic air pollution and its disproportionate impact on low-income communities and communities of color.
Foncier économique et locaux d’activités dans le Pays de Lorient. Évolution 2...AudéLor
Document présenté lors de la Matinale AudéLor du 11 juin 2014 "Foncier économique et immobilier d'entreprise au Pays de Lorient : évolution 2010-2013".
À partir de relevés de terrains et de l'analyse des données de permis de construire, AudéLor vous présente un état des lieux fin 2013 du foncier économique et de l'immobilier d'entreprise dans le Pays de Lorient : disponibilités foncières, rythme de consommation, secteurs d'activités concernés ... ainsi qu'un zoom sur le marché des bureaux.
In todays paced technological landscape organizations and industries heavily rely on timely information to make well informed decisions. Data acquisition systems play a role in this process by enabling companies to gather, track and analyze data from sources. This article explores the benefits and features of data acquisition systems emphasizing their importance, in enhancing performance and accuracy across sectors.
safety_critical_applications_and_customer_concernsRufino Olay III
This document discusses safety critical applications and functional safety standards. It provides an overview of IEC 61508 functional safety requirements and safety integrity levels. Examples are given of Microsemi FPGA deployments in flight control systems and laser safety curtains. Design techniques for safety such as redundancy, diversity, and secure manufacturing processes are covered. Certifications for quality management and device reliability are also summarized.
The document discusses a digital pulse width modulation (DPWM) modulator using VLSI technology. Traditionally, PWM control schemes have used analog or microprocessor-based approaches, but these have disadvantages like complex circuitry and limited flexibility. Digital PWM converters using digital signal processors are becoming more popular for motor drives and power conditioning due to their simple circuitry, software control and flexibility. However, generating PWM signals requires high sampling rates and developing software takes time. VLSI technology allows for a cheaper, more reliable and less time-consuming design process compared to microprocessors. The document proposes a novel DPWM integrated circuit realization scheme using VLSI that can serve as the switching circuit for AC-DC converters.
Smart Real Time Patient Reception Management SystemIRJET Journal
This document describes a smart real-time patient reception management system that uses telecommunication technologies to improve efficiency. The system allows patients to schedule appointments via SMS from anywhere. When a patient sends an SMS, the server verifies the information and sends a confirmation message with the appointment time. It then relays the information to a microcontroller connected to an LED display board in the hospital reception area. The system aims to reduce the time wasted in traditional manual appointment systems and allow patients to schedule from a distance. It uses a GSM module to send and receive SMS messages connected to a microcontroller, server, and LED display for outputs. The hardware and software designs are described along with the components and flow.
Felidae Systems is an upcoming engineering consultancy company engaged in multifarious activities ranging from Energy Consultancy, Energy Management Services, Industry Automation, Panel Manufacturing, And Supplying, etc.
We are manufacturer, trader, and supplier of a qualitative assortment of HT Panel, LT Panel, PLC Panel, VFD Panel, and SCADA Automation System. We are supported by State-of-the-art infrastructural base that comprises various units such as Procurement, Production, Quality Testing, R&D, Warehousing & Packaging, Sales & Marketing, etc. The production unit is outfitted with cutting-edge production technology that helps us in manufacturing panels in compliance with global quality standards. By functioning in synchronize manner, our professionals help us to cater to diverse requirements of clients efficiently.
We have experienced consultants (BEE Accredited Energy Auditor, BEE Certified Energy Auditors, Lead Auditor for EnMS), supported by technically qualified staff for field study. We not only give suggestions for energy saving but also support for energy management & post audit implementation of saving proposals.
Slides from the online webinar on automated thermal imaging for remote substation monitoring. Learn more about how automated thermal imaging can help you implement condition based maintenance for critical substation assets.
Watch the webinar here - http://bit.ly/2ncYaxd
The document discusses energy profiling and management in a smart microgrid system. It involves monitoring all distributed energy resources and autonomous loads to determine their energy consumption and generation profiles. This includes collecting statistical data on energy usage and generating energy profiles that show power outputs over time. Various technologies can be used for energy management including SCADA, JADE and MATLAB. The team reported installing solar panels and collecting temperature data to analyze energy generation profiles. Future recommendations include enabling net metering through buying and selling of energy and using hybrid generation sources.
Messung is a Leading Industrial Technology Expert in India, seeking to be a dynamic organisation driven by pioneering zeal, a passion for new ideas and pursuit for excellence to bring progressive solutions that deliver the competitive edge for customers. Continuing its legacy of innovations in Industrial Automation, the Messung Group has diversified into various businesses.
Messung empowers businesses and industries with the foremost technologies and high performance products backed by deep domain knowledge and reliable support.
We work closely with customers, understand their needs and challenges; identifying opportunities and technologies to bring the most relevant solutions that contribute to their success. Even in business, our social consciousness and sense of environmental responsibility remain firm and uncompromising.
Our competencies are as diverse as our portfolio - which today spans the fields of Automation & Controls, Electrical Engineering and Workplace Technology. In these, and many more emerging fields, we are constantly expanding and enhancing our market expertise to achieve - and deliver - the Leading Edge in the Food & Beverage (F&B) industry.
barcode scanner, wireless barcode scanner, DC5112_1D WIRELESSBest Barcode System
From the distribution centre to the point-of-sale, you need convenient, precise data capture. Regardless of your industry or the kind of barcode scanner, wirelaess barcode scanner you need, you'll be able to find it in our vast porVolio. Our technology and constant innovation enhances customer experience, improves overall productivity/profitability and amplifies supply chain efficiency.
#barcodetechnologyinIndia #portablebarcodescanner #wirelessbarcodescanner #Scanner #barcodesolutions #usbbarcodescanner #wirelessbarcodescanner #bestbarcodescanner #barcodelabels #barcodesoftware #barcodescannersuppliers #barcodesystem #WarehouseManagement #SupplyChain #WMS #dcode #inventorycontrol #PurchasingManagement #barcode #postek #rfid #logistics #warehouse #healthcare #antimetaltags #assettags #assetmanagement #inventorymanagement
Sensor-based, Data-driven Optimization of Composites Manufacturing.pptxmarketingnxp
This is the presentation of the speech of Dr. Nicholas Ecke at SAMPE Europe Conference Madrid 2023.
Plastics manufacturing can be unpredictable. Deviations in material batches, moisture content, machine calibration, among other variables, lead to issues in manufacturing quality and final part properties.
New technology has been developed to combine dielectric analysis with machine learning and material models, allowing for dynamic adjustments to machine settings, removing uncertainty from your process, and optimizing cycle times.
HOW DRY ELECTRODE COATING CAN CHANGE GIGAFACTORIESiQHub
LiCAP Technologies offers dry electrode coating solutions that reduce battery manufacturing costs and improve performance. Their patented Activated Dry Electrode process eliminates toxic solvents and energy-intensive drying, reducing capital and operating expenses by 20-30% compared to wet electrode methods. It also increases energy density, power density, and sustainability by lowering carbon emissions by 70% and energy usage by 70%. LiCAP aims to empower the battery industry through licensing their technologies, manufacturing premium dry electrodes, and providing turnkey dry electrode production systems.
Feeder protection applications can be handled by various Sepam relays including the S20, S24, S40, S44, S50, S54, S60 and S80 models. These relays provide short-circuit and overload protection for feeders in impedance earthed or solidly earthed neutral systems, with options for voltage and frequency monitoring on some models. Relays like the S41, S43, S51, and S53 can provide more specific protection for high-capacitance feeders in systems with impedance earthed, compensated, or isolated neutrals.
This document provides an overview of testing high voltage circuit breakers. It discusses why breaker testing is important for ensuring reliability of the power system. The document outlines various measurements that can be taken as part of breaker testing, including timing, coil current, travel motion, and contact resistance. It also reviews maintenance strategies like preventative maintenance and condition-based maintenance. Safety is emphasized as the top priority when testing live high voltage equipment.
Sachu Technologies provides thermography inspection services in India to identify electrical, mechanical, and other issues. They conduct thermography surveys using state-of-the-art equipment to detect problems like loose connections, overheating, insulation issues, and faults in equipment. Thermography allows issues to be identified before failures or accidents occur, extending equipment life and improving safety. Sachu Technologies also offers related services like power quality analysis, vibration monitoring, and energy audits to support preventative maintenance programs.
VEGA Pressure & Level Measurement - Renewable Energy Industry ApplicationsThorne & Derrick UK
The document discusses renewable energy measurement technology from VEGA, including:
- VEGA provides sensors for level, limit level, and pressure measurement in renewable energy applications like solar, biogas, wind, and hydroelectric plants.
- Their plics modular instrument system allows custom sensor, fitting, electronics, and housing combinations to meet application needs.
- Sensors like radar, ultrasonic, and capacitive devices provide reliable measurement in varying process conditions for applications such as solar heat transfer fluid tanks and biogas fermenters.
This document discusses transformative trends in cybersecurity for industrial internet of things and process automation systems. It covers key aspects of industrial network design like interconnectivity, real-time communication, and security. The document then discusses securing different parts of industrial networks like the edge, data center core, and interconnects. It also discusses traditional and modern security architectures, firewall design requirements, and considerations for securing branch offices and wireless networks.
This document discusses transformative trends in cybersecurity for industrial networks and the Internet of Things. It covers several key topics:
Industrial networks have benefited from transitioning to modern Ethernet and IP technologies, but require features like reliability and security. Securing these networks involves ensuring confidentiality, integrity and availability at the edge, in the WAN, for internet-facing systems and through interconnects. Modern security also segments networks and provides consistent policy control and high performance. The document provides guidance on traditional and modern firewall design and considerations for securing wireless networks and branch offices.
COMMON PROBLEMS AND CHALLENGES IN DATA CENTRESKamran Hassan
in this paper common problems and challenges of data center have been identified and methods have been explained to improve the efficiency and reliability of data center
Innovative Medical Devices: Developing Multidisciplinary Safety & Efficacy Te...UBMCanon
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Innovative non-volatile memory for medical devices sterilized using Gamma irradiation
1. Innovative Non-volatile
Memory for Medical Devices
Sterilized using
Gamma Irradiation
Emily Craven, Nordion
Bård M. Pedersen, Adesto Technologies
www.nordion.com
2. Gamma Centre of Excellence
Our Mission: Expand and enhance the use
of gamma through outreach
and education
2
4. Collaboration Goals
• Enhance the use of gamma for high value devices
• Expand the use of gamma to new industries
• Research into gamma effects on new and unique materials
• Range of collaboration partners:
– Medical Device manufacturers, Polymer manufacturers,
Universities, Research Institutions, Laboratories
Adesto – a new generation of
medical device capability
4
5. Gamma -Tolerant Electronic Data Storage
Solution for Medical Devices
12 February 2014
www.adestotech.com/
6. Convergence of growth in Medical Devices & Sterilization Modalities
Medical Device market valued at $228B by 2017 with a healthy growth rate of 7%
Utilization of embedded electronics for intelligent medical devices forecasted at >$11B
40% of Single-Use
Wider applications growth
7% CAGR
$228B
$11B
$65B
7. Storage of data is the ‘MEMORY’ backbone in intelligent devices
Primary embedded architecture in Consumer, Industrial and Intelligent Medical
equipment and devices
Stored Data
Stored Data used as:
• System boot
• Data log
• Reference values for controller operation
• E-Pedigree/product traceability in RFID applications
• User information
8. Conventional Data Storage Architecture- 1 & 0
MEMORY or data storage semiconductor solutions are based on trapping and
removing electrons from a storage transistor.
Sensing of a charge threshold determines a 1 or a 0 value
If electrons were to escape, the threshold voltage of the cell would change
and therefore the determined value.
Flash memory cell
Floating gate, electrons present
indicating a charged state
9. EEPROM & Flash Susceptible to Sterilization Modalities
Data integrity of the Memory component is critical to device operation
Standard memory solutions are unable to withstand harsh conditions involving radiation, heat and
pressure.
EEPROM/Flash technology can not survive ionizing effects at >50 krads.
Typical gamma dose = 100x greater than the survival threshold of EEPROM memory solutions
Failure Mode- Scramble, Corrupt, Escape
High energy disturbance of the trapped electrons, causing Charge Loss
Stored data is corrupted or no longer present, rendering the system/device inoperable
Internal registers that are critical to the device operation are UNRECOVERABLE
10. As Gamma Adoption Increases, Robust Data Storage is Required
Standard Flash/EEPROM data storage can not support intelligent medical applications
•
Adverse impact to supply chain and manufacturing logistics.
•
Costly manufacturing steps to program the memory component AFTER the sterilization cycle
•
Longer manufacturing cycle time
•
Limitation of the advanced features that could be offered on medical devices.
A data storage solution is needed that can maintain stored data during
exposure to radiation and pressure based sterilization modalities
11. Gamma Tolerant Data Storage Solution for Intelligent Devices
Adesto Technologies CBRAM- Power Conscious, Fast, and Robust
•
Mass production electronic data storage solution for standalone and embedded
memory applications.
•
Ultra Low Power
• Technology demonstration <1.0 volt for energy harvesting applications
•
Fast Read
• Data Storage needs to be able to respond to controller clock cycles
•
Robust
• Retains data in extreme temperature environments
• Qualified to 500 Mrads
12. CBRAM® Gamma Tolerance Study
CBRAM devices exhibited 0 failures at 1.5 Mrad, 2.5 Mrad & 5.0 Mrad (2X normal dose
used in the Gamma Sterilization process)
n=80
Testing performed by Nordion, the leading provider of isotopes
and irradiation therapy services to the medical and healthcare industry
Standard Flash and CBRAM comparison testing:
Flash vs CBRAM Radiation Effect
Device
Technology
DUT ID Gamma Dose (krad Si)
Std by Current mA
Data Loss
# bit errors)
Result
512kbit CMOS Flash
Floating Gate
1
447
101.6
859
FAIL
512kbit CMOS Flash
Floating Gate
2
447
99.21
6519
FAIL
512kbit CMOS Flash
Floating Gate
3
131
51.56
955
FAIL
512kbit CMOS Flash
Floating Gate
4
131
53.7
4
FAIL
RM24EP128KS
CBRAM
1
447
40
0
PASS
RM24EP128KS
CBRAM
2
447
38.8
0
PASS
RM24EP128KS
CBRAM
3
131
39.4
0
PASS
RM24EP128KS
CBRAM
4
131
39.8
0
PASS
GONZALEZ-VELO et al.: TID RETENTION CAPABILITY OF CBRAM – Submitted to IEEE Electron Device Letters
12
13. Data Storage for Medical & Healthcare Applications
CBRAM ultra-low power, fast performance and Gamma compatibility is ideal for:
•
Battery-operated Wearable
•
Ultra-Low Power Embedded Devices
•
Energy-Harvesting Body Monitors
•
Gas flow sensing
•
Fluid management
•
Orthopaedics
•
Surgical- multi-use sterilization
•
RFID applications
Bio containers
Single use ventilation
Smart Syringe
Dose delivery
Manifolds
Ampules
14. Ultra Low-Power Capability of CBRAM® Memory
Wireless body sensor nodes enable inexpensive
continuous monitoring of patients
Information
An embedded
ultra low-power
CBRAM nonvolatile memory
block can operate
without battery power,
on the energy generated
by body heat alone
(2013 Symposia on VLSI Technology and Circuits , Kyoto, Japan)
Assessment,
Treatment
15. Adesto Overview
Adesto Technologies is a leading developer of a broad portfolio of non-volatile
memory solutions, including DataFlash®, Serial Flash and Conductive Bridge
RAM (CBRAM) memory technology.
15
16. Broad Data Storage Portfolio
Differentiated Storage-Centric Solutions
DataFlash
Fusion Family
CBRAM
BIOS Flash
+
Growth Markets
+
Customer Base
16
17. Differentiated Solutions To Address The New Requirements
CBRAM
Technology
Platform
BIOS
Flash
Family
Fusion
Family
Adesto
Data
Storage
Solutions
DataFlash
Family
17
18. Explore
For more information on CBRAM technology, contact:
Bard Pedersen
Paul Fulhorst
Bard.Pedersen@Adestotech.com
Paul.Fulhorst@Adestotech.com
Case Study: Gamma Radiation Tolerant CBRAM Technology
http://www.adestotech.com/news/white-papers /
Adesto DataFlash and BIOS Memory products:
http://www.adestotech.com/
18
19. Thank you for your interest in Adesto Data Storage solutions
Adesto thanks Nordion, the leading provider of isotopes
and irradiation therapy services to the medical and healthcare industry
19