Traditional phosphors on the verge of commoditization due to expected strong push from China after YAG patents fall into public domain. But Quantum Dots are finally ready for prime time.
Strong price pressure stalls revenue growth and pressures margins but masks a more complex picture
While volumes are expected to more than double between 2015 and 2020, LED Phosphor prices have declined dramatically, leading to a flat revenue outlook. Low technology barriers of entrance on the most mature compositions have prompted companies to procure turnkey manufacturing equipment and enter the market. With little to no quality control and R&D expenses, some have achieved low cost comparable to that of the tri-phosphors used in fluorescent lamps. In a bid to capture market shares, they triggered an intense price war. With major YAG IP expiring from 2017, leading domestic vendors such as Yuji, Grirem, YT Shield, Illuma or Sunfor will finally access overseas markets, further increasing YAG commoditization. Phosphor makers are therefore shifting their efforts toward higher added value materials such as nitrides, which, while price have also decreased significantly during the period, have maintained better margins.
UV LED - Technology, Manufacturing and Application Trends 2015 Report by Yole...Yole Developpement
Beyond simply replacing mercury lamps, UV LEDs are finding their way into new applications
NOW ESTABLISHED IN UV CURING, UV LEDS WILL FIND GROWTH OPPORTUNITIES IN DISINFECTION AND PURIFICATION AND NEW APPLICATIONS BY 2017 / 2018
Thanks to their compactness and low cost of ownership, UV LEDs continue to make their way in the booming UV curing business, through replacement of incumbent technologies such as mercury lamps. Thanks to this an overall UV LED market that represented only ~$20M in 2008 grew to~$90M in 2014, at a compound annual growth rate (CAGR) of 28.5%...
UV LEDs - Technology, Manufacturing and Application Trends 2016 Report by Yol...Yole Developpement
After fast adoption of UVA LEDs for curing applications, UVC LEDs for purification/disinfection are now ready
FOLLOWING THE UV CURING BOOM, DISINFECTION AND PURIFICATION APPLICATIONS ARE FINALLY READY TO TAKE OFF
The UVC LED industry is still small but strong growth is expected in the next 18 months due to dramatic price reductions. In 2016 prices are 1/8-1/10 of what they were in 2015. This has been triggered by the industry’s development, its transition to mass production and improved device performance. With most of the industry believing that $1-$4/mW is the price that would trigger mass market adoption we are getting close to a UVC LED market boom. Another positive sign is that most UVC LED manufacturers are now focusing on developing cost-effective solutions rather than improving device power output. In parallel, the UVC LED industry continues to work on increasing lifetime and developing lower wavelength devices, below 280nm.
UVA LEDs continue to progress in the UV curing space. Continuous improvement of device performance coupled with price reduction has allowed the technology to be increasingly adopted in UV curing applications. Penetration of UV LEDs is increasing but we observe differences in adoption rates depending on application. Small size and low speed applications like spot adhesive and digital inkjets have the highest adoption rate, and most new developments use UV LEDs. This is due to the small module size and low irradiance level needed that limits the extra cost of integrating UV LEDs compared to the total price of systems like inkjet printers. On the other hand, applications that need high speed processes and/or high levels of irradiance such as screen printing or coating applications have lower adoption rates. This is because UV LED performance is not yet good enough to fully replace traditional mercury lamps.
In this context, we expect the UVC LED market to strongly grow from $7M in 2015 to $610M by 2021. Despite increased penetration rate in all applications, the UVA LED market will grow more slowly, from $107M in 2015 to $357M by 2021, moderated by price pressure.
The report presents a comprehensive review of all UV light applications including analysis of UV curing, UV purification/disinfection and analytical instruments. It highlights the UV LED working principle, market structure, UV LED market drivers and associated challenges, recent trends, new applications created by UV LEDs, UV LED market size split by application, and much more.
More information on that report at http://www.i-micronews.com/reports.html
Sapphire Applications & Market 2015 Report by Yole DeveloppementYole Developpement
After a false start in 2014, will Apple finally use sapphire display covers in 2016?
Investing activities continues in sapphire display cover supply chain? Why?
Apple will represents 20% of 2015 global sapphire consumption with its iPhone and watch sapphire components. But Lens recently announced plans to raise US$942M and invest US$532M of the proceed to further increasing sapphire growth and finishing capacity. In 2014, Apple, its partners and their suppliers spent close to US$2B to set up a sapphire display cover supply chain. GTAT built and installed 2135 ASF furnaces, Biel and Lens deployed close to 200 wire saws and 1000’s of finishing tools and ancillary equipment. But the projects faced many problems and Apple eventually gave up on sapphire for its iPhone 6. Reasons were multiple but can be summarized in “too early, to fast, too much”. The project was ambitious in its timeframe and targeted outputs while many of the necessary processes and technologies in crystal growth and finishing were still at an early stage of development. But the venture still set the stage for the future: the partners have developed an unrivalled expertise on how to work with sapphire in high volumes and cost controlled environment. A lot was also learned with the manufacturing of the complex 3D shaped Apple Watch cover...
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
This document provides an overview and analysis of LED downconverters (phosphors and quantum dots) for lighting and display applications. It discusses key requirements for downconverters, major material families and compositions, as well as trends in applications driving new phosphor needs. The document also includes a competitive analysis of suppliers, price trends, and volume and revenue forecasts for the market from 2015-2022 for both phosphors and quantum dots.
LED Lighting Module Technology Industry and Market Trends 2017 Report by Yole...Yole Developpement
After wide use in general lighting applications, LED module manufacturers are now looking for new applications with higher margins.
LED LIGHTING MODULE MARKET VALUE WILL TREBLE IN THE NEXT FIVE YEARS, DRIVEN BY MID-POWER MODULES
Light Emitting Diode (LED) technology is increasingly penetrating general lighting applications, thanks to how easily integrators can use it. The LED lighting module market will therefore deliver a 22.6% compound annual growth rate from 2017-2022.
Mid-power LEDs can be used in almost all applications. Mid-power LED modules are therefore driving the market, providing 60% of 2016’s market revenues. High power LEDs are used only in applications requiring high luminous flux in a small module. As a result, the number of applications using high power LED modules is limited and associated revenues represent about 7% of market revenues.
Chip-on-board (COB) LED modules provide a compromise on size, light emitting surface (LES) area, luminous flux and power consumption. COB LED modules can therefore be used in many applications, and lead the total LED module market in volumes shipped. But as these modules are relatively easy to manufacture in few steps the associated average selling price is low. Consequently, COB LED modules represent only 20% of market revenue.
Flexible LED strips can be directly used as LED lighting systems, mostly in indirect lighting applications. These modules can be easily implemented for residential and commercial lighting. Recent developments, like using LED chips instead of packaged LEDs on a flexible substrate, allow much higher efficiency, opening doors to new applications such as linear lighting.
In this context, Yole Développement estimates that the LED lighting module market, including flexible LED strips, reached nearly $4B in 2016 and will grow to $13.8B by 2022.
This report provides an in-depth analysis of each type of LED module, including technology, trends and market sizes. It covers the whole landscape of LED modules and their potential use in general lighting applications.
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
UV LED - Technology, Manufacturing and Application Trends 2015 Report by Yole...Yole Developpement
Beyond simply replacing mercury lamps, UV LEDs are finding their way into new applications
NOW ESTABLISHED IN UV CURING, UV LEDS WILL FIND GROWTH OPPORTUNITIES IN DISINFECTION AND PURIFICATION AND NEW APPLICATIONS BY 2017 / 2018
Thanks to their compactness and low cost of ownership, UV LEDs continue to make their way in the booming UV curing business, through replacement of incumbent technologies such as mercury lamps. Thanks to this an overall UV LED market that represented only ~$20M in 2008 grew to~$90M in 2014, at a compound annual growth rate (CAGR) of 28.5%...
UV LEDs - Technology, Manufacturing and Application Trends 2016 Report by Yol...Yole Developpement
After fast adoption of UVA LEDs for curing applications, UVC LEDs for purification/disinfection are now ready
FOLLOWING THE UV CURING BOOM, DISINFECTION AND PURIFICATION APPLICATIONS ARE FINALLY READY TO TAKE OFF
The UVC LED industry is still small but strong growth is expected in the next 18 months due to dramatic price reductions. In 2016 prices are 1/8-1/10 of what they were in 2015. This has been triggered by the industry’s development, its transition to mass production and improved device performance. With most of the industry believing that $1-$4/mW is the price that would trigger mass market adoption we are getting close to a UVC LED market boom. Another positive sign is that most UVC LED manufacturers are now focusing on developing cost-effective solutions rather than improving device power output. In parallel, the UVC LED industry continues to work on increasing lifetime and developing lower wavelength devices, below 280nm.
UVA LEDs continue to progress in the UV curing space. Continuous improvement of device performance coupled with price reduction has allowed the technology to be increasingly adopted in UV curing applications. Penetration of UV LEDs is increasing but we observe differences in adoption rates depending on application. Small size and low speed applications like spot adhesive and digital inkjets have the highest adoption rate, and most new developments use UV LEDs. This is due to the small module size and low irradiance level needed that limits the extra cost of integrating UV LEDs compared to the total price of systems like inkjet printers. On the other hand, applications that need high speed processes and/or high levels of irradiance such as screen printing or coating applications have lower adoption rates. This is because UV LED performance is not yet good enough to fully replace traditional mercury lamps.
In this context, we expect the UVC LED market to strongly grow from $7M in 2015 to $610M by 2021. Despite increased penetration rate in all applications, the UVA LED market will grow more slowly, from $107M in 2015 to $357M by 2021, moderated by price pressure.
The report presents a comprehensive review of all UV light applications including analysis of UV curing, UV purification/disinfection and analytical instruments. It highlights the UV LED working principle, market structure, UV LED market drivers and associated challenges, recent trends, new applications created by UV LEDs, UV LED market size split by application, and much more.
More information on that report at http://www.i-micronews.com/reports.html
Sapphire Applications & Market 2015 Report by Yole DeveloppementYole Developpement
After a false start in 2014, will Apple finally use sapphire display covers in 2016?
Investing activities continues in sapphire display cover supply chain? Why?
Apple will represents 20% of 2015 global sapphire consumption with its iPhone and watch sapphire components. But Lens recently announced plans to raise US$942M and invest US$532M of the proceed to further increasing sapphire growth and finishing capacity. In 2014, Apple, its partners and their suppliers spent close to US$2B to set up a sapphire display cover supply chain. GTAT built and installed 2135 ASF furnaces, Biel and Lens deployed close to 200 wire saws and 1000’s of finishing tools and ancillary equipment. But the projects faced many problems and Apple eventually gave up on sapphire for its iPhone 6. Reasons were multiple but can be summarized in “too early, to fast, too much”. The project was ambitious in its timeframe and targeted outputs while many of the necessary processes and technologies in crystal growth and finishing were still at an early stage of development. But the venture still set the stage for the future: the partners have developed an unrivalled expertise on how to work with sapphire in high volumes and cost controlled environment. A lot was also learned with the manufacturing of the complex 3D shaped Apple Watch cover...
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
This document provides an overview and analysis of LED downconverters (phosphors and quantum dots) for lighting and display applications. It discusses key requirements for downconverters, major material families and compositions, as well as trends in applications driving new phosphor needs. The document also includes a competitive analysis of suppliers, price trends, and volume and revenue forecasts for the market from 2015-2022 for both phosphors and quantum dots.
LED Lighting Module Technology Industry and Market Trends 2017 Report by Yole...Yole Developpement
After wide use in general lighting applications, LED module manufacturers are now looking for new applications with higher margins.
LED LIGHTING MODULE MARKET VALUE WILL TREBLE IN THE NEXT FIVE YEARS, DRIVEN BY MID-POWER MODULES
Light Emitting Diode (LED) technology is increasingly penetrating general lighting applications, thanks to how easily integrators can use it. The LED lighting module market will therefore deliver a 22.6% compound annual growth rate from 2017-2022.
Mid-power LEDs can be used in almost all applications. Mid-power LED modules are therefore driving the market, providing 60% of 2016’s market revenues. High power LEDs are used only in applications requiring high luminous flux in a small module. As a result, the number of applications using high power LED modules is limited and associated revenues represent about 7% of market revenues.
Chip-on-board (COB) LED modules provide a compromise on size, light emitting surface (LES) area, luminous flux and power consumption. COB LED modules can therefore be used in many applications, and lead the total LED module market in volumes shipped. But as these modules are relatively easy to manufacture in few steps the associated average selling price is low. Consequently, COB LED modules represent only 20% of market revenue.
Flexible LED strips can be directly used as LED lighting systems, mostly in indirect lighting applications. These modules can be easily implemented for residential and commercial lighting. Recent developments, like using LED chips instead of packaged LEDs on a flexible substrate, allow much higher efficiency, opening doors to new applications such as linear lighting.
In this context, Yole Développement estimates that the LED lighting module market, including flexible LED strips, reached nearly $4B in 2016 and will grow to $13.8B by 2022.
This report provides an in-depth analysis of each type of LED module, including technology, trends and market sizes. It covers the whole landscape of LED modules and their potential use in general lighting applications.
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
LED phosphor patent investigation 2013 Report by Yole DeveloppementYole Developpement
Phosphor related intellectual property has been and remains a major driving force with strong impact on the shape of the LED industry.
LED phosphor IP is shaping the industry
The first commercial GaN-based blue LEDs were produced in Japan in the mid 90’s after researchers Shuji Nakamura at Nichia and Professor Akasaki at Nagoya University (IP assigned to Toyoda Gosei) succeeded in removing some of the major remaining roadblocks associated with this technology (p-doping, epitaxy quality…).
Quickly leveraging on this success, some fundamental patents describing the use of a blue LED combined with a phosphor to produce white LEDs were filed by Nichia, Osram, ATMI and others. Those fundamental patents were rapidly followed by a fast growing number of applications through 2005 as an increasing number of companies started to compete in the LED market and new applications in cell phone, laptop and LCD TV display, and general lighting were being addressed.
Phosphor IP is a major force in the LED industry. With more than 40 litigation cases, it is also used as leverage by companies which have negotiated close to 70 licensing and supply agreements to date. It can also be argued that in the first half of the 2000 decade, the strict enforcement and lack of license grants for some fundamental IP related to the design and manufacturing of white LEDs might also have slowed down the progress of the industry by preventing more efficient competition that would allow prices to decrease.
The report identifies the key players with the most relevant IP. It provides an overview, of phosphor related IP litigation and licensing, that has shaped the industry since the mid 90s, as well as a detailed analysis for the major players involved.
A vast number of relevant patents
Our search strategy combines automated and manual screenings that have led to the selection of more than 4,500 relevant patent families. Those have been segmented by type (composition patent or phosphor configuration patents) and organized in various technology segments that are analyzed in detail: garnets, silicates, nitrides and oxynitrides, quantum dots. The report also includes a special focus on the emerging LED phosphor IP in China.
For each segment, the report provides a detailed analysis including the time evolution of patent filings, identification of the key players, collaborations and citation networks, as well as the identification of the key patents based-on citation and impacts in litigations.
The report also includes a companion excel database with all patents of the company profiled in the report. This database includes abstracts and hyperlinks to the original documents and allows multi-criteria searches (patent publication number, priority date, title, applicants, technological segments…)
More information on the report at http://www.i-micronews.com/reports/LED-Phosphors-Down-Converters-Patent-Investigation/14/392/
Status of the LED Industry 2013 Report by Yole DeveloppementYole Developpement
This document provides a summary of the LED industry and market analysis. It discusses LED applications, market status, players and main trends. Some key points include:
- LED adoption rates are expected to increase substantially between 2013 and 2020, especially in lighting applications and large displays.
- The LED supply chain has become more regionalized in recent years, with China gaining significant market share since 2010.
- The LED industry experienced overcapacity issues after a surge of new capacity was added in China between 2010-2012. Consolidation is expected to help absorb excess capacity by mid-2014.
- LED prices have declined sharply since 2010 across all package types, though this may limit revenue growth in saturated markets like phones
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
This report provides an overview of panel-level packaging and manufacturing. It examines key panel packaging platforms including fan-out WLP, embedded die, glass interposers, and organic interposers. The report forecasts the panel packaging market to reach $109 million by 2017. It identifies the main applications for each panel technology and assesses the players involved including OSATs, substrate makers, and IDMs. The report also reviews equipment and materials suppliers for panel manufacturing and provides a roadmap for resolution trends in panel packaging.
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
New technologies and new features and functionalities will make automotive lighting a $27.7 billion market by 2021 (and an exciting one at that)!
AUTOMOTIVE LIGHTING IS GROWING FAST ($27.7B IN 2021) BY INCREASING ITS DESIGN USES AND PROVIDING NEW FUNCTIONALITIES
With the recent integration of LED technology, lighting has evolved from a basic, functional feature to a distinctive feature with high-value potential in automotive. Indeed, LED technology has given manufacturers the opportunity for strong differentiation via lighting design and additional functionalities. This is particularly true for exterior lighting, but it is also spreading to interior lighting. These changes are heavily impacting the supply chain, with new suppliers and a new value chain emerging.
In 2015, the automotive lighting market totaled nearly $22.4B, up 5.4% from 2014. This growth was driven by increased lighting system content per vehicle and a more favorable product mix driven by strong adoption of LED-based front lighting systems. Indeed, headlamp and Day Running Light (DRL) systems represented 43% and 28% of total 2015 revenue, respectively. Other lighting systems (i.e. Rear Combination Light/Center High-Mounted Signal Light, interior light, and side turn-signal light) comprised the remaining 29% of 2015 revenue. The automotive lighting market will continue growing, reaching a market size of almost $27.7B by 2021 - +23.7% compared to 2015, and driven by different growth areas:
Short-term: increased LED technology penetration rate into different automotive lighting applications/systems, and increased lighting content per vehicle.
Middle/long-term: potential integration of new lighting technologies like OLED and laser, development of Advanced Front Lighting Systems (AFLS) and other security functions, and incredible developments employing lighting as a new design feature.
This report presents all automotive lighting applications and the associated market revenue for the period 2013 - 2021, with details concerning drivers and challenges, integration status of different lighting technologies and systems, recent trends, and market size per application.
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, and PV ApplicationsYole Developpement
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/category-listing/product/gaas-wafer-and-epiwafer-market-rf-photonics-led-and-pv-applications.html
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Touch screens displays semiconductor defense and consumer applications sapphi...Yole Developpement
Non substrate applications account for 25% of the US$1 billion sapphire industry. But emerging mobile phone applications could bring this total to more than $3 billion by 2018.
Display cover applications could more than triple the size of the industry within the next 5 years
Established applications could generate US$366 million in 2018. But adoption of sapphire for smartphone display covers could generate an additional $1.3 to $2.6 billion depending on the adoption scenario.
Sapphire is currently used in some exotic, luxury phones. However the sapphire price reduction combined with the massive adoption of touch screen in smartphones have stimulated the interest of cell phone OEMS for this material. Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front. Apple is rumored to have conducted an extended due diligence.
Adoption of sapphire in mobile display covers represents the single largest opportunity discussed in this report. It remains, however, uncertain. We see 4 major challenges: technology, supply chain, cost and market acceptance. Crystal growth and finishing technologies still need to be optimized in order to guarantee stable performance and reduce the price gap with chemically strengthened glass like Corning's Gorilla. We estimate that the current cost of manufacturing a sapphire display cover is around $22 but could drop to $12 and ultimately below $10. It remains to be seen if the Bill Of Material increase vs. the $3 glass display cover will be absorbed by the OEM in exchange for increased market share or if the consumer will value the increased durability brought in by the sapphire cover and accept paying a premium.
It is difficult to predict the success of sapphire in this application. However, we expect that some OEMs will probe the market and introduce some models featuring sapphire by late 2013 - early 2014. Initial customer reaction will have a strong influence on the future of the technology. If successful, strong market traction could ease the funding for the more than $1.5 billion in capex needed to serve this industry and set up the supply chain to serve this application.
Glass cover lens manufacturers might seize the opportunity. Because of their vast existing glass finishing capacity that could be converted to process sapphire and their privileged access to leading smartphone OEMs, those companies could beat established sapphire finishing companies into this market. However, another scenario would see collaborations between some leading sapphire and cover lens makers in order to pool technical knowledge, capacity and customer access under the push of some smartphone OEMs.
In any case, if this opportunity materializes, it will transform the sapphire industry with new players emerging...
More information at http://www.i-micronews.com/reports/Sapphire-Applications-Touch-screens-displays-semiconductor/3/372/
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
Organic Thin Film Transistor 2016: Flexible Displays and Other Applications 2...Yole Developpement
Are OTFTs ready to disrupt the display industry and enable fully-flexible devices?
ORGANIC TFTS ARE ENTERING THE FAB BY THE BACK DOOR
When trying to build a flexible display panel, the Thin Film Transistor (TFT) matrix is one of the most challenging and fragile functional layers.
Interest in OTFT emerged in the mid-2000s when mobility reached values similar to amorphous silicon (a-Si), the dominant display backplane technology. This triggered a flurry of activity at leading display manufacturers, and prototypes rapidly emerged. Besides fast-improving electrical performance, OTFT’s intrinsic flexibility made the technology ideal for the realization of flexible displays. In 2007, the first ever flexible AMOLED panel was demonstrated by Sony and featured an organic TFT.
However, interest waned as performance and homogeneity issues persisted, and other TFT technologies like LTPS and metal oxide emerged.
Nevertheless, organic semiconductor companies kept perfecting their molecules and ink formulations, gaining a better understanding of the interaction between the materials, the transistor structure, and the manufacturing process. Consequently, performance in the lab improved by another order of magnitude. Combined with the explosive growth of flexible displays and the promise of a cost-efficient, solution-based manufacturing process, interest in OTFT has renewed.
Panel makers remain cautious, but a handful in Taiwan and China are currently attempting to retrofit older Gen 2.5 - 4.5 fabs with OTFT. These first attempts to move OTFT into mass production will be critical for the technology’s future. Failure in these initial industrialization attempts could be fatal for the OTFT industry, or, at the very least, set it back many years. However, if OTFT proves that it can be mass produced and enables panel makers to revive those obsolete fabs with high-margin flexible displays, there are no fundamental barriers prohibiting the technology from being quickly scaled up to fabs Gen 8 or above, and possibly challenge the vast market for traditional a-Si based panels like LCD TV, monitors, etc. In the long-term, because they are inherently solution-processable, OTFTs are also an ideal backplane candidate for additive manufacturing and fully printed displays.
More information on that report at http://www.i-micronews.com/reports.html
OLED for Lighting - Technology, Industry and Market Trends 2016 Report by Yol...Yole Developpement
THE FUTURE OF OLED LIGHTING COULD BE BRIGHT IF…
OLED revenues are mainly driven by display applications, e.g. smartphones, but the industry has also been trying to target lighting applications for several years, based on the technology specifics in terms of design or form factor and efficiency. On this new battleground, OLEDs are competing with LED technology, which has already paved the way with a revolution in Solid State Lighting (SSL) drawing attention away from OLED over the last 10 years. Added to that, the high cost of OLED technology is not making market penetration easier, current low efficacy is slowing adoption and the advantages claimed by OLED lighting companies are not necessarily perceived by the customers. OLEDs will therefore have to find niche or “spark” markets to develop production scale momentum and create a marketing window allowing them to demonstrate the advantages and possibilities of the technology to customers.
LED phosphor patent investigation 2013 Report by Yole DeveloppementYole Developpement
Phosphor related intellectual property has been and remains a major driving force with strong impact on the shape of the LED industry.
LED phosphor IP is shaping the industry
The first commercial GaN-based blue LEDs were produced in Japan in the mid 90’s after researchers Shuji Nakamura at Nichia and Professor Akasaki at Nagoya University (IP assigned to Toyoda Gosei) succeeded in removing some of the major remaining roadblocks associated with this technology (p-doping, epitaxy quality…).
Quickly leveraging on this success, some fundamental patents describing the use of a blue LED combined with a phosphor to produce white LEDs were filed by Nichia, Osram, ATMI and others. Those fundamental patents were rapidly followed by a fast growing number of applications through 2005 as an increasing number of companies started to compete in the LED market and new applications in cell phone, laptop and LCD TV display, and general lighting were being addressed.
Phosphor IP is a major force in the LED industry. With more than 40 litigation cases, it is also used as leverage by companies which have negotiated close to 70 licensing and supply agreements to date. It can also be argued that in the first half of the 2000 decade, the strict enforcement and lack of license grants for some fundamental IP related to the design and manufacturing of white LEDs might also have slowed down the progress of the industry by preventing more efficient competition that would allow prices to decrease.
The report identifies the key players with the most relevant IP. It provides an overview, of phosphor related IP litigation and licensing, that has shaped the industry since the mid 90s, as well as a detailed analysis for the major players involved.
A vast number of relevant patents
Our search strategy combines automated and manual screenings that have led to the selection of more than 4,500 relevant patent families. Those have been segmented by type (composition patent or phosphor configuration patents) and organized in various technology segments that are analyzed in detail: garnets, silicates, nitrides and oxynitrides, quantum dots. The report also includes a special focus on the emerging LED phosphor IP in China.
For each segment, the report provides a detailed analysis including the time evolution of patent filings, identification of the key players, collaborations and citation networks, as well as the identification of the key patents based-on citation and impacts in litigations.
The report also includes a companion excel database with all patents of the company profiled in the report. This database includes abstracts and hyperlinks to the original documents and allows multi-criteria searches (patent publication number, priority date, title, applicants, technological segments…)
More information on the report at http://www.i-micronews.com/reports/LED-Phosphors-Down-Converters-Patent-Investigation/14/392/
Status of the LED Industry 2013 Report by Yole DeveloppementYole Developpement
This document provides a summary of the LED industry and market analysis. It discusses LED applications, market status, players and main trends. Some key points include:
- LED adoption rates are expected to increase substantially between 2013 and 2020, especially in lighting applications and large displays.
- The LED supply chain has become more regionalized in recent years, with China gaining significant market share since 2010.
- The LED industry experienced overcapacity issues after a surge of new capacity was added in China between 2010-2012. Consolidation is expected to help absorb excess capacity by mid-2014.
- LED prices have declined sharply since 2010 across all package types, though this may limit revenue growth in saturated markets like phones
Radar Technologies For Automotive 2018 report by Yole Développement Yole Developpement
How will radar sensor technology shape the cars of the future? Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
More information on that report at http://www.i-micronews.com/reports.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
This report provides an overview of panel-level packaging and manufacturing. It examines key panel packaging platforms including fan-out WLP, embedded die, glass interposers, and organic interposers. The report forecasts the panel packaging market to reach $109 million by 2017. It identifies the main applications for each panel technology and assesses the players involved including OSATs, substrate makers, and IDMs. The report also reviews equipment and materials suppliers for panel manufacturing and provides a roadmap for resolution trends in panel packaging.
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Emerging semiconductor substrates are expected to grow at a 24% CAGR from 2018 – 2024.
More information on https://www.i-micronews.com/products/emerging-semiconductor-substrates-market-technology-trends-2019/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
New technologies and new features and functionalities will make automotive lighting a $27.7 billion market by 2021 (and an exciting one at that)!
AUTOMOTIVE LIGHTING IS GROWING FAST ($27.7B IN 2021) BY INCREASING ITS DESIGN USES AND PROVIDING NEW FUNCTIONALITIES
With the recent integration of LED technology, lighting has evolved from a basic, functional feature to a distinctive feature with high-value potential in automotive. Indeed, LED technology has given manufacturers the opportunity for strong differentiation via lighting design and additional functionalities. This is particularly true for exterior lighting, but it is also spreading to interior lighting. These changes are heavily impacting the supply chain, with new suppliers and a new value chain emerging.
In 2015, the automotive lighting market totaled nearly $22.4B, up 5.4% from 2014. This growth was driven by increased lighting system content per vehicle and a more favorable product mix driven by strong adoption of LED-based front lighting systems. Indeed, headlamp and Day Running Light (DRL) systems represented 43% and 28% of total 2015 revenue, respectively. Other lighting systems (i.e. Rear Combination Light/Center High-Mounted Signal Light, interior light, and side turn-signal light) comprised the remaining 29% of 2015 revenue. The automotive lighting market will continue growing, reaching a market size of almost $27.7B by 2021 - +23.7% compared to 2015, and driven by different growth areas:
Short-term: increased LED technology penetration rate into different automotive lighting applications/systems, and increased lighting content per vehicle.
Middle/long-term: potential integration of new lighting technologies like OLED and laser, development of Advanced Front Lighting Systems (AFLS) and other security functions, and incredible developments employing lighting as a new design feature.
This report presents all automotive lighting applications and the associated market revenue for the period 2013 - 2021, with details concerning drivers and challenges, integration status of different lighting technologies and systems, recent trends, and market size per application.
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, and PV ApplicationsYole Developpement
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/category-listing/product/gaas-wafer-and-epiwafer-market-rf-photonics-led-and-pv-applications.html
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Touch screens displays semiconductor defense and consumer applications sapphi...Yole Developpement
Non substrate applications account for 25% of the US$1 billion sapphire industry. But emerging mobile phone applications could bring this total to more than $3 billion by 2018.
Display cover applications could more than triple the size of the industry within the next 5 years
Established applications could generate US$366 million in 2018. But adoption of sapphire for smartphone display covers could generate an additional $1.3 to $2.6 billion depending on the adoption scenario.
Sapphire is currently used in some exotic, luxury phones. However the sapphire price reduction combined with the massive adoption of touch screen in smartphones have stimulated the interest of cell phone OEMS for this material. Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front. Apple is rumored to have conducted an extended due diligence.
Adoption of sapphire in mobile display covers represents the single largest opportunity discussed in this report. It remains, however, uncertain. We see 4 major challenges: technology, supply chain, cost and market acceptance. Crystal growth and finishing technologies still need to be optimized in order to guarantee stable performance and reduce the price gap with chemically strengthened glass like Corning's Gorilla. We estimate that the current cost of manufacturing a sapphire display cover is around $22 but could drop to $12 and ultimately below $10. It remains to be seen if the Bill Of Material increase vs. the $3 glass display cover will be absorbed by the OEM in exchange for increased market share or if the consumer will value the increased durability brought in by the sapphire cover and accept paying a premium.
It is difficult to predict the success of sapphire in this application. However, we expect that some OEMs will probe the market and introduce some models featuring sapphire by late 2013 - early 2014. Initial customer reaction will have a strong influence on the future of the technology. If successful, strong market traction could ease the funding for the more than $1.5 billion in capex needed to serve this industry and set up the supply chain to serve this application.
Glass cover lens manufacturers might seize the opportunity. Because of their vast existing glass finishing capacity that could be converted to process sapphire and their privileged access to leading smartphone OEMs, those companies could beat established sapphire finishing companies into this market. However, another scenario would see collaborations between some leading sapphire and cover lens makers in order to pool technical knowledge, capacity and customer access under the push of some smartphone OEMs.
In any case, if this opportunity materializes, it will transform the sapphire industry with new players emerging...
More information at http://www.i-micronews.com/reports/Sapphire-Applications-Touch-screens-displays-semiconductor/3/372/
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
Organic Thin Film Transistor 2016: Flexible Displays and Other Applications 2...Yole Developpement
Are OTFTs ready to disrupt the display industry and enable fully-flexible devices?
ORGANIC TFTS ARE ENTERING THE FAB BY THE BACK DOOR
When trying to build a flexible display panel, the Thin Film Transistor (TFT) matrix is one of the most challenging and fragile functional layers.
Interest in OTFT emerged in the mid-2000s when mobility reached values similar to amorphous silicon (a-Si), the dominant display backplane technology. This triggered a flurry of activity at leading display manufacturers, and prototypes rapidly emerged. Besides fast-improving electrical performance, OTFT’s intrinsic flexibility made the technology ideal for the realization of flexible displays. In 2007, the first ever flexible AMOLED panel was demonstrated by Sony and featured an organic TFT.
However, interest waned as performance and homogeneity issues persisted, and other TFT technologies like LTPS and metal oxide emerged.
Nevertheless, organic semiconductor companies kept perfecting their molecules and ink formulations, gaining a better understanding of the interaction between the materials, the transistor structure, and the manufacturing process. Consequently, performance in the lab improved by another order of magnitude. Combined with the explosive growth of flexible displays and the promise of a cost-efficient, solution-based manufacturing process, interest in OTFT has renewed.
Panel makers remain cautious, but a handful in Taiwan and China are currently attempting to retrofit older Gen 2.5 - 4.5 fabs with OTFT. These first attempts to move OTFT into mass production will be critical for the technology’s future. Failure in these initial industrialization attempts could be fatal for the OTFT industry, or, at the very least, set it back many years. However, if OTFT proves that it can be mass produced and enables panel makers to revive those obsolete fabs with high-margin flexible displays, there are no fundamental barriers prohibiting the technology from being quickly scaled up to fabs Gen 8 or above, and possibly challenge the vast market for traditional a-Si based panels like LCD TV, monitors, etc. In the long-term, because they are inherently solution-processable, OTFTs are also an ideal backplane candidate for additive manufacturing and fully printed displays.
More information on that report at http://www.i-micronews.com/reports.html
OLED for Lighting - Technology, Industry and Market Trends 2016 Report by Yol...Yole Developpement
THE FUTURE OF OLED LIGHTING COULD BE BRIGHT IF…
OLED revenues are mainly driven by display applications, e.g. smartphones, but the industry has also been trying to target lighting applications for several years, based on the technology specifics in terms of design or form factor and efficiency. On this new battleground, OLEDs are competing with LED technology, which has already paved the way with a revolution in Solid State Lighting (SSL) drawing attention away from OLED over the last 10 years. Added to that, the high cost of OLED technology is not making market penetration easier, current low efficacy is slowing adoption and the advantages claimed by OLED lighting companies are not necessarily perceived by the customers. OLEDs will therefore have to find niche or “spark” markets to develop production scale momentum and create a marketing window allowing them to demonstrate the advantages and possibilities of the technology to customers.
Edge Emitting Lasers: Market and Technology Trends 2019 report by Yole Dévelo...Yole Developpement
This document provides an overview and table of contents for a report on edge emitting laser diode market and technology trends from 2019. It includes a 3-page executive summary that analyzes the global EEL market, key applications such as optical communication, sensing, material processing and displays. The report also examines the EEL technology, industry landscape and major players. It aims to give insights into driving forces for the EEL laser source market, technologies and industry in the short, medium and long term.
RECENT DEVELOPMENTS IN LED MANUFACTURING 2016 Presentation by Santosh KUMAR o...Yole Developpement
INTRODUCTION TO YOLE DÉVELOPPEMENT AND LED ACTIVITIES
•LED MARKET OVERVIEW
•RECENT DEVELOPMENTS IN LED MANUFACTURING
•2015 STATUs OF THE LED INDUSTRY (AND FUTURE TRENDS)
•CONCLUSION
•APPENDIX-DETAILLED PRESENTATION OF YOLE DEVELOPPEMENT AND LED ACTIVITIES
Technological reality is piercing the hype for virtual and
augmented realities, reminding everyone about all the challenges that are yet to be overcome.
More information on : https://www.i-micronews.com/report/product/displays-optical-vision-systems-for-vr-ar-mr.html
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Automotive Lighting: Technology, Industry and Market Trends 2018 report by Yo...Yole Developpement
Automotive lighting is becoming the new photonic hub.
More information on https://www.i-micronews.com/category-listing/product/automotive-lighting-technology-industry-and-market-trends-2018.html
MicroLED technology advances enable a credible cost reduction path toward high volume applications.
More info on: https://www.i-micronews.com/report/product/microled-displays-2018.html
LiFi - Technology, Industry, and Market Trends report by Yole DéveloppementYole Developpement
LiFi: Niche or mainstream technology?
More information on : https://www.i-micronews.com/led-report/product/lifi-technology-industry-and-market-trends.html
Yole led phosphor_qd_ip_january_2016_sampleClotilde Fabre
This document provides an overview of the patent landscape report on phosphors and quantum dots for LED applications. The report analyzes over 7,500 relevant patent families and provides an in-depth examination of the major patent holders, key technologies, litigation and licensing activities, and emerging trends. It identifies the leading companies in different patent segments, such as phosphor compositions and quantum dots, and analyzes the strengths and weaknesses of their intellectual property portfolios.
Technology market trends in LED downconverters presentation held by Eric Vire...Yole Developpement
Phosphor volumes to grow +/-at the same pace for “on-chip”
Surface blue LED chips combined with a downconverter Surface blue LED chips combined with a downconverter
Phosphor volumes to essentially double by 2020
Silicates could essentially disappear unless significant cost reduction and further performance improvement are achieved.
Increasing demand for high CRI in lighting broad band green and yellow + narrow band red.
Wider color gamut display: increasing demand for narrow band green and red.
No more room for ASP decrease.
Yet, YAG is not a commodity!
Overall flat revenue means pain and suffering + attrition (20+ suppliers in China only!)
But even in a difficult environment, some companies will grow and thrive
The most dramatic picture improvements come from higher dynamic contrast and extended color gamut!
More information on that report at http://www.i-micronews.com/reports.html
Webinar The Future Of OLEDs For Lighting And Displaysphilwright8800
The document introduces Phillip Wright, who will be today's presenter on the topic of OLEDs for lighting and displays. Dr. Wright has extensive experience in semiconductor and display technology development. He will discuss key findings from a new IntertechPira report on the future of OLEDs, including market forecasts for both OLED displays and lighting. He will also address important trends, challenges, and potential accelerators for the growth of the OLED market.
Global and china led industry report, 2009 2010ResearchInChina
The document discusses the LED market and industry. It notes that LED investment, particularly in MOCVD equipment for epitaxy production, increased dramatically in China in 2010. MOCVD equipment is mainly supplied by German and American companies, and some Chinese manufacturers are ordering equipment through 2012 due to high demand. The summary examines trends in the LED market and industry.
Next Generation TV Panels: New Technologies, Features and Market Impact 2019 ...Yole Developpement
With flat unit-volumes, heavy capex, and low profitability, the TV panel industry is at a crossroads and must prepare for the next generation of TVs.
More information on https://www.i-micronews.com/products/next-generation-tv-panels-new-technologies-features-and-market-impact-2019/
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
MiniLED for Display Applications: LCD and Digital Signage report by Yole Déve...Yole Developpement
MiniLEDs bring new strength to LCD players in the battle against OLED and enable increased LED
adoption on digital signage.
More information on : https://www.i-micronews.com/report/product/miniled-for-display-applications-lcd-and-digital-signage.html
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Similar to Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays 2015 Report by Yole Developpement (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
AppSec PNW: Android and iOS Application Security with MobSFAjin Abraham
Mobile Security Framework - MobSF is a free and open source automated mobile application security testing environment designed to help security engineers, researchers, developers, and penetration testers to identify security vulnerabilities, malicious behaviours and privacy concerns in mobile applications using static and dynamic analysis. It supports all the popular mobile application binaries and source code formats built for Android and iOS devices. In addition to automated security assessment, it also offers an interactive testing environment to build and execute scenario based test/fuzz cases against the application.
This talk covers:
Using MobSF for static analysis of mobile applications.
Interactive dynamic security assessment of Android and iOS applications.
Solving Mobile app CTF challenges.
Reverse engineering and runtime analysis of Mobile malware.
How to shift left and integrate MobSF/mobsfscan SAST and DAST in your build pipeline.
What is an RPA CoE? Session 1 – CoE VisionDianaGray10
In the first session, we will review the organization's vision and how this has an impact on the COE Structure.
Topics covered:
• The role of a steering committee
• How do the organization’s priorities determine CoE Structure?
Speaker:
Chris Bolin, Senior Intelligent Automation Architect Anika Systems
This talk will cover ScyllaDB Architecture from the cluster-level view and zoom in on data distribution and internal node architecture. In the process, we will learn the secret sauce used to get ScyllaDB's high availability and superior performance. We will also touch on the upcoming changes to ScyllaDB architecture, moving to strongly consistent metadata and tablets.
"$10 thousand per minute of downtime: architecture, queues, streaming and fin...Fwdays
Direct losses from downtime in 1 minute = $5-$10 thousand dollars. Reputation is priceless.
As part of the talk, we will consider the architectural strategies necessary for the development of highly loaded fintech solutions. We will focus on using queues and streaming to efficiently work and manage large amounts of data in real-time and to minimize latency.
We will focus special attention on the architectural patterns used in the design of the fintech system, microservices and event-driven architecture, which ensure scalability, fault tolerance, and consistency of the entire system.
The Department of Veteran Affairs (VA) invited Taylor Paschal, Knowledge & Information Management Consultant at Enterprise Knowledge, to speak at a Knowledge Management Lunch and Learn hosted on June 12, 2024. All Office of Administration staff were invited to attend and received professional development credit for participating in the voluntary event.
The objectives of the Lunch and Learn presentation were to:
- Review what KM ‘is’ and ‘isn’t’
- Understand the value of KM and the benefits of engaging
- Define and reflect on your “what’s in it for me?”
- Share actionable ways you can participate in Knowledge - - Capture & Transfer
Connector Corner: Seamlessly power UiPath Apps, GenAI with prebuilt connectorsDianaGray10
Join us to learn how UiPath Apps can directly and easily interact with prebuilt connectors via Integration Service--including Salesforce, ServiceNow, Open GenAI, and more.
The best part is you can achieve this without building a custom workflow! Say goodbye to the hassle of using separate automations to call APIs. By seamlessly integrating within App Studio, you can now easily streamline your workflow, while gaining direct access to our Connector Catalog of popular applications.
We’ll discuss and demo the benefits of UiPath Apps and connectors including:
Creating a compelling user experience for any software, without the limitations of APIs.
Accelerating the app creation process, saving time and effort
Enjoying high-performance CRUD (create, read, update, delete) operations, for
seamless data management.
Speakers:
Russell Alfeche, Technology Leader, RPA at qBotic and UiPath MVP
Charlie Greenberg, host
Your One-Stop Shop for Python Success: Top 10 US Python Development Providersakankshawande
Simplify your search for a reliable Python development partner! This list presents the top 10 trusted US providers offering comprehensive Python development services, ensuring your project's success from conception to completion.
5th LF Energy Power Grid Model Meet-up SlidesDanBrown980551
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
-Insightful presentations covering two practical applications of the Power Grid Model.
-An update on the latest advancements in Power Grid -Model technology during the first and second quarters of 2024.
-An interactive brainstorming session to discuss and propose new feature requests.
-An opportunity to connect with fellow Power Grid Model enthusiasts and users.
"Scaling RAG Applications to serve millions of users", Kevin GoedeckeFwdays
How we managed to grow and scale a RAG application from zero to thousands of users in 7 months. Lessons from technical challenges around managing high load for LLMs, RAGs and Vector databases.
"Choosing proper type of scaling", Olena SyrotaFwdays
Imagine an IoT processing system that is already quite mature and production-ready and for which client coverage is growing and scaling and performance aspects are life and death questions. The system has Redis, MongoDB, and stream processing based on ksqldb. In this talk, firstly, we will analyze scaling approaches and then select the proper ones for our system.
Northern Engraving | Modern Metal Trim, Nameplates and Appliance PanelsNorthern Engraving
What began over 115 years ago as a supplier of precision gauges to the automotive industry has evolved into being an industry leader in the manufacture of product branding, automotive cockpit trim and decorative appliance trim. Value-added services include in-house Design, Engineering, Program Management, Test Lab and Tool Shops.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/temporal-event-neural-networks-a-more-efficient-alternative-to-the-transformer-a-presentation-from-brainchip/
Chris Jones, Director of Product Management at BrainChip , presents the “Temporal Event Neural Networks: A More Efficient Alternative to the Transformer” tutorial at the May 2024 Embedded Vision Summit.
The expansion of AI services necessitates enhanced computational capabilities on edge devices. Temporal Event Neural Networks (TENNs), developed by BrainChip, represent a novel and highly efficient state-space network. TENNs demonstrate exceptional proficiency in handling multi-dimensional streaming data, facilitating advancements in object detection, action recognition, speech enhancement and language model/sequence generation. Through the utilization of polynomial-based continuous convolutions, TENNs streamline models, expedite training processes and significantly diminish memory requirements, achieving notable reductions of up to 50x in parameters and 5,000x in energy consumption compared to prevailing methodologies like transformers.
Integration with BrainChip’s Akida neuromorphic hardware IP further enhances TENNs’ capabilities, enabling the realization of highly capable, portable and passively cooled edge devices. This presentation delves into the technical innovations underlying TENNs, presents real-world benchmarks, and elucidates how this cutting-edge approach is positioned to revolutionize edge AI across diverse applications.
Session 1 - Intro to Robotic Process Automation.pdfUiPathCommunity
👉 Check out our full 'Africa Series - Automation Student Developers (EN)' page to register for the full program:
https://bit.ly/Automation_Student_Kickstart
In this session, we shall introduce you to the world of automation, the UiPath Platform, and guide you on how to install and setup UiPath Studio on your Windows PC.
📕 Detailed agenda:
What is RPA? Benefits of RPA?
RPA Applications
The UiPath End-to-End Automation Platform
UiPath Studio CE Installation and Setup
💻 Extra training through UiPath Academy:
Introduction to Automation
UiPath Business Automation Platform
Explore automation development with UiPath Studio
👉 Register here for our upcoming Session 2 on June 20: Introduction to UiPath Studio Fundamentals: https://community.uipath.com/events/details/uipath-lagos-presents-session-2-introduction-to-uipath-studio-fundamentals/
Main news related to the CCS TSI 2023 (2023/1695)Jakub Marek
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
29. 29
FIELDS OF EXPERTISE
Our 30
analysts
operate in the
following
areas.
MEMS &
Sensors
LED &
OLED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced
Packaging
PV
Power
Electronics
30. 30
4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
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• i-Micronews.com website
• @Micronews e-newsletter
• Technology magazines
• Communication & webcast services
• Events
www.i-Micronews.com
31. 31
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Fundraising
Maturation of companies
IP portfolio management & optimization
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
32. 32
OUR GLOBAL ACTIVITY
Yole
Japan
Yole Inc.
Yole
Korea
40% of our business is
in EU countries
30% of our business is
in North America
30% of our business is
in Asia
33. 33
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plan along the
entire supply
chain.
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
R&D centers
34. 34
CONTACT INFORMATION
o Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
• Japan:Yutaka Katano, General Manager,Yole Japan & President,Yole K.K.
Email: katano@yole.fr
• RoW: Jean-Christophe Eloy, President & CEO,Yole Développement
Email: eloy@yole.fr
o Report business
• North America: Steve LaFerriere, Director of Northern America Business Development,Yole Inc.
Email: laferriere@yole.fr
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
• Japan & Asia:Takashi Onozawa, Sales Asia & General Manager,Yole K.K.
Email: onozawa@yole.fr
• Korea: HaileyYang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
o General
• Email: info@yole.fr
Follow us on
36. 36
FOCUS ON LED, OLED AND SAPPHIRE ACTIVITIES
Yole is active throughout the value chain (LED and Sapphire activities)
We are active
throughout
the value
chain: from
substrates to
systems! And
we interact
with industrial
/ R&D players
from each
level!
Substrate
SiC / Sapphire / Silicon /
Bulk GaN / Engineered
substrates
LED epi-
wafer
Mesa LED, Flip Chip LED,
Vertical LED structures
LED dies-
on-wafer
LED dies
Front-end Level 0 - Epitaxy
• Nucleation layer
• n-type layer
• Active layers (MQW)
• p-type layer
Back-End Level 0 - Packaging
• Substrate separation & Bonding
• Die singulation
• Testing & Binning
LED systems and applications
Front-end Level 1 - Device Production
• Inspection
• Masking / Lithography
• Etching
• Metallization / Contacts / Mirrors
Back-End level 1 - Packaging
• Die Attach & Interconnections
• Phosphors
• Encapsulation & Optics
• Testing & Binning
Packaged LEDs
Module Packaging
• Substrates (PCB)
• Encapsulation & Optics
• Heatsink
• Testing & Binning
LED modules
37. 37
FOCUS ON LED, OLED AND SAPPHIRE ACTIVITIES
Insights on Forecast Methodology
“What’s Behind
the Crystal Ball?”
Only analysts
that follow the
industry on a
daily basis
(trough
interviews and
developed
market modeling
tools based on
discussions with
key players of
the industry.
APPLICATION
Forecast of standard
product market volume
(unit)
Ex.: Smartphone, TVs, lamps (…)
Definition of functions using
LEDs
Ex.: “Flash vs. Keypad” for
smartphone (…)
Definition of technical
requirements
Ex.: Efficacy, size (…)
Definition of LED
penetration rate and
competitiveness with
alternative technologies
Ex.: “OLED vs. LED” in smartphone
(…)
Forecast of LED market volume (unit)
Split by application, power type (low vs. medium vs. high
power), package type (single vs. multi-die…) (… )
Definition of LED
ASP
Per power type, packaged
type (…)
Forecast of LED market size ($)
Split by application, power type, package type
(… )
Definition of manufacturing flows for
front-end and packaging (process,
technologies, materials, yields…)
Split by application, power type, package type (…)
Forecast of LED manufacturing
equipment and material markets
(unit and $)
Ex.: Phosphors, encapsulant, dicing equipment
Definition of LED die
surface (mm²)
Definition of substrate die surface (mm²)
and epiwafer volume (unit)
Split by type of substrate (…)
Forecast of LED substrate
markets (unit and $)
Split by type of substrate (…)
Definition of sale
levels of key
manufacturers ($)
Ex: LED, packaging
materials, epitaxy
materials, manufacturing
equipment, MOCVD
reactor, substrate (…)
System Plus Consulting
expertise in reverse
costing / reverse
engineering
38. 38
FOCUS ON LED, OLED AND SAPPHIRE ACTIVITIES
AboutYole’s AnalystTeam
A team based
on persons
having
complementary
skills and
expertise.
Dr. Hong LIN - Market &Technology Analyst
Hong LIN holds a Ph-D in Physics and Chemistry of Materials from the University Pierre et Marie Curie (France). She
works as Market and Technology Analyst in the fields of Compound Semiconductors, Power Electronic and LED. She is also
responsible for investigation on China as being fluent in Chinese. Before joining Yole Développement, she has worked as R&D
Engineer (at Newstep Technologies SAS - France) and research scientist (at ONERA - French Aerospace lab).
Pars MUKISH - Business Unit Manager
Pars MUKISH holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation
& Technology Management (EM Lyon - France). Since 2015, Pars MUKISH has taken on responsibility for developing LED,
OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing
Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center).
Dr. EricVIREY - Senior Market &Technology Analyst
Eric VIREY holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble (INPG - France). He
works as Market and Technology Analyst in the fields of Sapphire and LED. In the last 12 years, he has held various R&D,
engineering, manufacturing and marketing positions with Saint-Gobain. Most recently, he was Market Manager at Saint-Gobain
Crystals, in charge of Sapphire and Optoelectronic products.
Dr. Milan ROSINA - Senior Market &Technology Analyst
Milan ROSINA holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble (INPG - France). He
works as Market and Technology Analyst in the fields of Energy Conversion, LED / OLED and Emerging Materials. Before
joining Yole Développement, he has worked as research scientist and project manager in PV, microelectronics and LED
industries. He has more than 15 year experience with prominent research institutions and a utility company.
39. 39
FOCUS ON LED, OLED AND SAPPHIRE ACTIVITIES
Report collection
Already published -Yole Développement:
• Status of the LED Industry
• LED in Road and Street Lighting
• LED Packaging
• LED Phosphors IP Investigation
• LED Front End ManufacturingTrends
• LED Front End Equipment Market trends
• GaN-on-SiTechnology and Market
From System Plus Consulting:
• LED CoSim+
• Reverse Engineering / Reverse Costing reports
To be published in 2015 -Yole Développement :
• 2015 UV LED - February 2015
• 2015 LED Phosphors Market andTechnologyTrends - April 2015
• 2015 Sapphire Market - June / July 2015
• Thermal management for LED and Power Electronic - Q3 2015
• 2015 High Purity Alumina (HPA) Market - Q3 2015
• LED Module (Chapter 1: LED Module Substrates) - Q3 2015
• 2015 OLED for Lighting - Q4 2014
A collection
of more than
15 reports on
LED, OLED
and Sapphire.
Our reports are unmatched in quality and technology depth and typically include:
• Technology trends and evolution:costs, barriers, roadmaps (…).
• Supply & value chain analysis:business models, relationships,value flows (…).
• In-depth analysis of applications and market drivers:challenges,inflection points (…).
• Market data ($, units, wafer starts…)
40. ORDER FORM
Phosphors & Quantum Dots 2015: LED Downconverters
for Lighting & Displays
SHIPPING CONTACT
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Email:
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Phone:
PAYMENT
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BANK INFO: HSBC, 1 place de la Bourse,
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Bank code: 30056, Branch code : 00170
Account No: 0170 200 1565 87,
SWIFT or BIC code: CCFRFRPP,
IBAN: FR76 3005 6001 7001 7020 0156 587
RETURN ORDER BY
• FAX: +33 (0)472 83 01 83
• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,
75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France
SALES CONTACTS
• North America: Steve Laferriere - laferriere@yole.fr
• Japan Asia: Takashi Onozawa - onozawa@yole.fr
• Europe RoW: Faycal El Khamassi - khamassi@yole.fr
• Korea: Hailey Yang - yang@yole.fr
• General: info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
April 16th, 2015
/
ABOUT YOLE DEVELOPPEMENT
BILL TO
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Please enter my order for above named report :
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Multi user license: Euro 5,990
For price in dollars, please use the day’s exchange rate. All
reports are delivered electronically at payment reception. For
French customers, add 20% for VAT
I hereby accept Yole Développement’s Terms and Conditions of Sale(1)
Signature:
*One user license means only one person at the company can use the report.
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media
in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or
process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED,
Image Sensors, Optoelectronics, Microfluidics Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics.
The group supports industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology trends
to develop their business.
MEDIA EVENTS
• i-Micronews.com, online disruptive technologies website
• @Micronews, weekly e-newsletter
• Technology Magazines dedicated to MEMS, Advanced Packaging,
LED and Power Electronics
• Communication webcasts services
• Events: Yole Seminars, Market Briefings…
More information on www.i-micronews.com
CONTACTS
For more information about :
• Consulting Services: Jean-Christophe Eloy (eloy@yole.fr)
• Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Report Business: David Jourdan (jourdan@yole.fr)
• Press relations: Sandrine Leroy (leroy@yole.fr)
CONSULTING
• Market data research, marketing analysis
• Technology analysis
• Reverse engineering costing services
• Strategy consulting
• Patent analysis
More information on www.yole.fr
REPORTS
• Collection of technology market reports
• Manufacturing cost simulation tools
• Component reverse engineering costing
analysis
• Patent investigation
More information on www.i-micronews.com/reports
FINANCIAL SERVICES
• Mergers Acquisitions
• Due diligence
• Fundraising
More information on www.yolefinance.com