To this date, fingerprint sensing technology is the most reliable and widespread biometric technology and fingerprint sensors are well developed. This patent landscape focuses on fingerprint sensors using capacitive sensing technology. The domain of capacitive fingerprint sensors is closely linked to the development of electronic devices, especially smartphones and the like, and the growing demand for security. Capacitive fingerprint sensors of a new generation have been incorporated in the most recent smartphones of companies like Apple or Samsung. The capacitive fingerprint sensing technologies involve more than 100 different applicants, mainly semiconductor and electronics companies. The main IP holders in the domain are Seiko Epson, AuthenTec, Sony and STMicroelectronics. The pioneer patents on capacitive fingerprint sensing technology are no longer in force and more than 200 granted patents are expected to expire by 2020. However, the number of new patent publications is increasing again since 2012, underlying a new enthusiasm for capacitive fingerprint sensors.
KEY FEATURES OF THE REPORT
The report provides essential patent data for fingerprint sensors of the capacitive type including:
- Time evolution of patent publications and countries of patent filings.
- Current legal status of patents.
-Ranking of main patent applicants.
- Joint developments and IP collaboration network of main patent applicants.
- Key patents.
- Granted patents near expiration.
- Relative strength of main companies IP portfolio.
- Overview of patent litigations
- Capacitive fingerprint sensor IP profiles of 15+ major companies with key patents, partnerships, and IP strength and strategy.
- The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
- Understand the IP landscape for capacitive fingerprint sensors.
- Identify key patents.
- Understand trends in capacitive fingerprint sensors IP.
- Identify the major players in capacitive fingerprint sensors IP and the relative strength of their patent portfolio.
- Identify new players in capacitive fingerprint sensors IP.
- Identify IP collaboration networks between key players.
- Identify main patent litigations.
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Our patent landscape reports have multidimensional technical insights backed by analytics which is valuable for diverse background of people from R & D Industries, Universities and Institutes, Legal and Business personals.
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Our patent landscape reports have multidimensional technical insights backed by analytics which is valuable for diverse background of people from R & D Industries, Universities and Institutes, Legal and Business personals.
Organic Thin Film Transistor 2016: Flexible Displays and Other Applications 2...Yole Developpement
Are OTFTs ready to disrupt the display industry and enable fully-flexible devices?
ORGANIC TFTS ARE ENTERING THE FAB BY THE BACK DOOR
When trying to build a flexible display panel, the Thin Film Transistor (TFT) matrix is one of the most challenging and fragile functional layers.
Interest in OTFT emerged in the mid-2000s when mobility reached values similar to amorphous silicon (a-Si), the dominant display backplane technology. This triggered a flurry of activity at leading display manufacturers, and prototypes rapidly emerged. Besides fast-improving electrical performance, OTFT’s intrinsic flexibility made the technology ideal for the realization of flexible displays. In 2007, the first ever flexible AMOLED panel was demonstrated by Sony and featured an organic TFT.
However, interest waned as performance and homogeneity issues persisted, and other TFT technologies like LTPS and metal oxide emerged.
Nevertheless, organic semiconductor companies kept perfecting their molecules and ink formulations, gaining a better understanding of the interaction between the materials, the transistor structure, and the manufacturing process. Consequently, performance in the lab improved by another order of magnitude. Combined with the explosive growth of flexible displays and the promise of a cost-efficient, solution-based manufacturing process, interest in OTFT has renewed.
Panel makers remain cautious, but a handful in Taiwan and China are currently attempting to retrofit older Gen 2.5 - 4.5 fabs with OTFT. These first attempts to move OTFT into mass production will be critical for the technology’s future. Failure in these initial industrialization attempts could be fatal for the OTFT industry, or, at the very least, set it back many years. However, if OTFT proves that it can be mass produced and enables panel makers to revive those obsolete fabs with high-margin flexible displays, there are no fundamental barriers prohibiting the technology from being quickly scaled up to fabs Gen 8 or above, and possibly challenge the vast market for traditional a-Si based panels like LCD TV, monitors, etc. In the long-term, because they are inherently solution-processable, OTFTs are also an ideal backplane candidate for additive manufacturing and fully printed displays.
More information on that report at http://www.i-micronews.com/reports.html
LED Lighting Module Technology Industry and Market Trends 2017 Report by Yole...Yole Developpement
After wide use in general lighting applications, LED module manufacturers are now looking for new applications with higher margins.
LED LIGHTING MODULE MARKET VALUE WILL TREBLE IN THE NEXT FIVE YEARS, DRIVEN BY MID-POWER MODULES
Light Emitting Diode (LED) technology is increasingly penetrating general lighting applications, thanks to how easily integrators can use it. The LED lighting module market will therefore deliver a 22.6% compound annual growth rate from 2017-2022.
Mid-power LEDs can be used in almost all applications. Mid-power LED modules are therefore driving the market, providing 60% of 2016’s market revenues. High power LEDs are used only in applications requiring high luminous flux in a small module. As a result, the number of applications using high power LED modules is limited and associated revenues represent about 7% of market revenues.
Chip-on-board (COB) LED modules provide a compromise on size, light emitting surface (LES) area, luminous flux and power consumption. COB LED modules can therefore be used in many applications, and lead the total LED module market in volumes shipped. But as these modules are relatively easy to manufacture in few steps the associated average selling price is low. Consequently, COB LED modules represent only 20% of market revenue.
Flexible LED strips can be directly used as LED lighting systems, mostly in indirect lighting applications. These modules can be easily implemented for residential and commercial lighting. Recent developments, like using LED chips instead of packaged LEDs on a flexible substrate, allow much higher efficiency, opening doors to new applications such as linear lighting.
In this context, Yole Développement estimates that the LED lighting module market, including flexible LED strips, reached nearly $4B in 2016 and will grow to $13.8B by 2022.
This report provides an in-depth analysis of each type of LED module, including technology, trends and market sizes. It covers the whole landscape of LED modules and their potential use in general lighting applications.
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Which companies own patents in microLED display? What are their major thrust areas and
portfolio strength?
Yole Développement has identified close to 1,500
patents filed by 125 companies and organizations
relevant to the microLED display field. Among
these are multiple startups, display makers, OEMs,
semiconductor companies, LED makers, and
research institutions.
More information on that report at http://www.i-micronews.com/reports.html
ams’ Multi-Spectral Sensor in the Apple iPhone X 2017 teardown reverse costi...system_plus
The most advanced multispectral 6-channel ambient light sensor, supplied and produced by ams for its biggest customer, Apple.
For the semiconductor industry, the smartphone is a gold mine. Each component inside every OEM’s flagship phone holds substantial value for the component supplier, which sometimes gains a significant portion of the phone’s sales revenue too. Apple is one of the major OEMs that every supplier fights to work with, and for many years ams AG has been the world’s leading ambient light sensor (ALS) producer, due to its presence in every Apple iPhone.
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
LED phosphor patent investigation 2013 Report by Yole DeveloppementYole Developpement
Phosphor related intellectual property has been and remains a major driving force with strong impact on the shape of the LED industry.
LED phosphor IP is shaping the industry
The first commercial GaN-based blue LEDs were produced in Japan in the mid 90’s after researchers Shuji Nakamura at Nichia and Professor Akasaki at Nagoya University (IP assigned to Toyoda Gosei) succeeded in removing some of the major remaining roadblocks associated with this technology (p-doping, epitaxy quality…).
Quickly leveraging on this success, some fundamental patents describing the use of a blue LED combined with a phosphor to produce white LEDs were filed by Nichia, Osram, ATMI and others. Those fundamental patents were rapidly followed by a fast growing number of applications through 2005 as an increasing number of companies started to compete in the LED market and new applications in cell phone, laptop and LCD TV display, and general lighting were being addressed.
Phosphor IP is a major force in the LED industry. With more than 40 litigation cases, it is also used as leverage by companies which have negotiated close to 70 licensing and supply agreements to date. It can also be argued that in the first half of the 2000 decade, the strict enforcement and lack of license grants for some fundamental IP related to the design and manufacturing of white LEDs might also have slowed down the progress of the industry by preventing more efficient competition that would allow prices to decrease.
The report identifies the key players with the most relevant IP. It provides an overview, of phosphor related IP litigation and licensing, that has shaped the industry since the mid 90s, as well as a detailed analysis for the major players involved.
A vast number of relevant patents
Our search strategy combines automated and manual screenings that have led to the selection of more than 4,500 relevant patent families. Those have been segmented by type (composition patent or phosphor configuration patents) and organized in various technology segments that are analyzed in detail: garnets, silicates, nitrides and oxynitrides, quantum dots. The report also includes a special focus on the emerging LED phosphor IP in China.
For each segment, the report provides a detailed analysis including the time evolution of patent filings, identification of the key players, collaborations and citation networks, as well as the identification of the key patents based-on citation and impacts in litigations.
The report also includes a companion excel database with all patents of the company profiled in the report. This database includes abstracts and hyperlinks to the original documents and allows multi-criteria searches (patent publication number, priority date, title, applicants, technological segments…)
More information on the report at http://www.i-micronews.com/reports/LED-Phosphors-Down-Converters-Patent-Investigation/14/392/
High-end Inertial Sensors for Defense, Aerospace, and Industrial Applications...Yole Developpement
Fueled by geopolitical risks rising defense investments, commercial aerospace and fast-growing applications, this new prosperous cycle of the high end inertial business will bring the market to new heights.
INCREASING GEOPOLITICAL RISKS, THE ENDING OIL CRISIS AND THE UPCOMING ROBOTIC ERA ARE FACTORS FUELING THE HIGH-END INERTIAL SYSTEM MARKET
Defense and commercial aerospace markets have always been the backbone of the high-end inertial system market, and that is still true today. The traditional markets, like defense, commercial aerospace and space applications, have returned to growth after a big slowdown from 2010 2015. For the last two years, the market has been evolving positively thanks to increasing geopolitical risks, and benefiting from the reinvigoration of the commercial aerospace business. And the end of the oil crisis in 2015, combined with increasing purchasing power coming from eastern regions, especially China, has definitely benefited this market. The space market is still evolving at its own pace, with the increasingly important robotic approach coming from players like SpaceX, Blue Origin enabling reusable rocket launchers, democratizing the space market.
In other words, the high-end inertial system market is recovering from a lean period that could bring it, in the long term, into a prosperous time with higher volumes. At long term, the market should be propelled by two major trends: the robotic approach and the growth of industrial applications. Yole Développement estimates that the high-end inertial system market has reached the $3B milestone in 2017. Defense makes up 36 % of this, with commercial aerospace comprising 33 %. Industrial, offshore and maritime applications account for the remaining 31 %. With a compound annual growth rate (CAGR) estimated to be 5% for the five next years, the high-end inertial system market is on a good track. The industry is now looking for emerging opportunities to sustain its growth, and this is what we highlight in this report.
More information on that report at http://www.i-micronews.com/reports.html
Ainstein T-79: Automotive 79GHz Short Range Radarsystem_plus
A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
Comparative packaging analysis of over 100 inertial, environmental, acoustic, optical and radio-frequency MEMS components from major manufacturers
MEMS device manufacturers have to choose between shrinking their products, or and adding functionality. This leads to certain categories of components slowing down packaging integration and evolution.
To complement Yole Développe-ment’s MEMS Packaging 2017 Market report, System Plus Consulting has conducted a comparative technology review to provide insights into the packaging structure and technology of around 80 consumer and 20 automotive MEMS products from leading suppliers, including Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…
Several types of device are compared: Environmental sensors, including pressure, humidity, gas and combo sensors; Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS including microbolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters and oscillators.
More information on that report at http://www.i-micronews.com/reports.html
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...Yole Developpement
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...Yole Developpement
How inkjet is building a success story drop by drop within 2.5D and 3D manufacturing?
More information on that report at https://www.i-micronews.com/report/product/inkjet-functional-and-additive-manufacturing-for-electronics.html
Nano-Imprint Technology Trends for Semiconductor Applications 2019 report by ...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Wolfson WM7121 & WM7132 Top & Bottom Port MEMS Microphones teardown reverse c...Yole Developpement
Wolfson WM7121 & WM7132 Top & Bottom Port MEMS Microphones
Discover two innovative silicon microphones of Wolfson integrated in Motorola products
Before its acquisition by Cirrus Logic for $467M in April 2014, Wolfson Microelectronics released a series of analog and digital MEMS microphones with revenues growing 70% from 2012 to 2013.
Teardowns of Motorola moto X smartphone and moto 360 smartwatch revealed that microphone solutions integrate two Wolfson Microelectronics silicon microphones. Wolfson’s WM7121 and WM7132 are respectively top and bottom port analog MEMS microphones.
Assembled in specific LGA cavity packages, the microphones use a capacitive sensing principle based on Wolfson proprietary MEMS technology. This set of 2 reports highlight MEMS and Packaging technologies of Wolfson microphones with a comparison between the two references.
One of the main interest of Wolfson’s MEMS technology is the use of silicon nitride (SiN) instead of polysilicon for the transducer element. According to Wolfson, silicon nitride delivers lower stress and strain coefficients, leading to higher reliability. Discover the impact of this material choice on the manufacturing cost and a comparison with technologies from Knowles and Infineon.
More information on that report at
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
KEY FEATURES OF THE REPORT
• IP trends including time evolution of patent publications and patent filings countries
• Current legal status of patents (granted, pending application, abandoned, expired)
• Main patent assignees (ranking, time evolution, geographical coverage) • Joint developments and IP collaboration network of main patent assignees
• Profile of 5 key players (Samsung, Toshiba, Micron Technology, SK Hynix, Intel), including:
- Technology and market data for TSV stacked memory
- Key patents
- Cross link analysis between teardown analysis, process flow and patents
- Technical challenges and relevant solutions found in the patents
- Patent litigations (ELM 3DS vs SK Hynix/Micron/Samsung)
• Excel database with all patents analyzed for the 5 key players, including technology segmentation
Non invasive Glucose Patent Landscape sampleKnowmade
The report provides essential patent data for non-invasive glucose monitoring including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents
• Granted patents near expiration
• Relative strength of main companies IP portfolio
• Non-invasive glucose monitoring IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy
The report also provides an extensive Excel database with all patents analyzed in the study
Organic Thin Film Transistor 2016: Flexible Displays and Other Applications 2...Yole Developpement
Are OTFTs ready to disrupt the display industry and enable fully-flexible devices?
ORGANIC TFTS ARE ENTERING THE FAB BY THE BACK DOOR
When trying to build a flexible display panel, the Thin Film Transistor (TFT) matrix is one of the most challenging and fragile functional layers.
Interest in OTFT emerged in the mid-2000s when mobility reached values similar to amorphous silicon (a-Si), the dominant display backplane technology. This triggered a flurry of activity at leading display manufacturers, and prototypes rapidly emerged. Besides fast-improving electrical performance, OTFT’s intrinsic flexibility made the technology ideal for the realization of flexible displays. In 2007, the first ever flexible AMOLED panel was demonstrated by Sony and featured an organic TFT.
However, interest waned as performance and homogeneity issues persisted, and other TFT technologies like LTPS and metal oxide emerged.
Nevertheless, organic semiconductor companies kept perfecting their molecules and ink formulations, gaining a better understanding of the interaction between the materials, the transistor structure, and the manufacturing process. Consequently, performance in the lab improved by another order of magnitude. Combined with the explosive growth of flexible displays and the promise of a cost-efficient, solution-based manufacturing process, interest in OTFT has renewed.
Panel makers remain cautious, but a handful in Taiwan and China are currently attempting to retrofit older Gen 2.5 - 4.5 fabs with OTFT. These first attempts to move OTFT into mass production will be critical for the technology’s future. Failure in these initial industrialization attempts could be fatal for the OTFT industry, or, at the very least, set it back many years. However, if OTFT proves that it can be mass produced and enables panel makers to revive those obsolete fabs with high-margin flexible displays, there are no fundamental barriers prohibiting the technology from being quickly scaled up to fabs Gen 8 or above, and possibly challenge the vast market for traditional a-Si based panels like LCD TV, monitors, etc. In the long-term, because they are inherently solution-processable, OTFTs are also an ideal backplane candidate for additive manufacturing and fully printed displays.
More information on that report at http://www.i-micronews.com/reports.html
LED Lighting Module Technology Industry and Market Trends 2017 Report by Yole...Yole Developpement
After wide use in general lighting applications, LED module manufacturers are now looking for new applications with higher margins.
LED LIGHTING MODULE MARKET VALUE WILL TREBLE IN THE NEXT FIVE YEARS, DRIVEN BY MID-POWER MODULES
Light Emitting Diode (LED) technology is increasingly penetrating general lighting applications, thanks to how easily integrators can use it. The LED lighting module market will therefore deliver a 22.6% compound annual growth rate from 2017-2022.
Mid-power LEDs can be used in almost all applications. Mid-power LED modules are therefore driving the market, providing 60% of 2016’s market revenues. High power LEDs are used only in applications requiring high luminous flux in a small module. As a result, the number of applications using high power LED modules is limited and associated revenues represent about 7% of market revenues.
Chip-on-board (COB) LED modules provide a compromise on size, light emitting surface (LES) area, luminous flux and power consumption. COB LED modules can therefore be used in many applications, and lead the total LED module market in volumes shipped. But as these modules are relatively easy to manufacture in few steps the associated average selling price is low. Consequently, COB LED modules represent only 20% of market revenue.
Flexible LED strips can be directly used as LED lighting systems, mostly in indirect lighting applications. These modules can be easily implemented for residential and commercial lighting. Recent developments, like using LED chips instead of packaged LEDs on a flexible substrate, allow much higher efficiency, opening doors to new applications such as linear lighting.
In this context, Yole Développement estimates that the LED lighting module market, including flexible LED strips, reached nearly $4B in 2016 and will grow to $13.8B by 2022.
This report provides an in-depth analysis of each type of LED module, including technology, trends and market sizes. It covers the whole landscape of LED modules and their potential use in general lighting applications.
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Which companies own patents in microLED display? What are their major thrust areas and
portfolio strength?
Yole Développement has identified close to 1,500
patents filed by 125 companies and organizations
relevant to the microLED display field. Among
these are multiple startups, display makers, OEMs,
semiconductor companies, LED makers, and
research institutions.
More information on that report at http://www.i-micronews.com/reports.html
ams’ Multi-Spectral Sensor in the Apple iPhone X 2017 teardown reverse costi...system_plus
The most advanced multispectral 6-channel ambient light sensor, supplied and produced by ams for its biggest customer, Apple.
For the semiconductor industry, the smartphone is a gold mine. Each component inside every OEM’s flagship phone holds substantial value for the component supplier, which sometimes gains a significant portion of the phone’s sales revenue too. Apple is one of the major OEMs that every supplier fights to work with, and for many years ams AG has been the world’s leading ambient light sensor (ALS) producer, due to its presence in every Apple iPhone.
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
LED phosphor patent investigation 2013 Report by Yole DeveloppementYole Developpement
Phosphor related intellectual property has been and remains a major driving force with strong impact on the shape of the LED industry.
LED phosphor IP is shaping the industry
The first commercial GaN-based blue LEDs were produced in Japan in the mid 90’s after researchers Shuji Nakamura at Nichia and Professor Akasaki at Nagoya University (IP assigned to Toyoda Gosei) succeeded in removing some of the major remaining roadblocks associated with this technology (p-doping, epitaxy quality…).
Quickly leveraging on this success, some fundamental patents describing the use of a blue LED combined with a phosphor to produce white LEDs were filed by Nichia, Osram, ATMI and others. Those fundamental patents were rapidly followed by a fast growing number of applications through 2005 as an increasing number of companies started to compete in the LED market and new applications in cell phone, laptop and LCD TV display, and general lighting were being addressed.
Phosphor IP is a major force in the LED industry. With more than 40 litigation cases, it is also used as leverage by companies which have negotiated close to 70 licensing and supply agreements to date. It can also be argued that in the first half of the 2000 decade, the strict enforcement and lack of license grants for some fundamental IP related to the design and manufacturing of white LEDs might also have slowed down the progress of the industry by preventing more efficient competition that would allow prices to decrease.
The report identifies the key players with the most relevant IP. It provides an overview, of phosphor related IP litigation and licensing, that has shaped the industry since the mid 90s, as well as a detailed analysis for the major players involved.
A vast number of relevant patents
Our search strategy combines automated and manual screenings that have led to the selection of more than 4,500 relevant patent families. Those have been segmented by type (composition patent or phosphor configuration patents) and organized in various technology segments that are analyzed in detail: garnets, silicates, nitrides and oxynitrides, quantum dots. The report also includes a special focus on the emerging LED phosphor IP in China.
For each segment, the report provides a detailed analysis including the time evolution of patent filings, identification of the key players, collaborations and citation networks, as well as the identification of the key patents based-on citation and impacts in litigations.
The report also includes a companion excel database with all patents of the company profiled in the report. This database includes abstracts and hyperlinks to the original documents and allows multi-criteria searches (patent publication number, priority date, title, applicants, technological segments…)
More information on the report at http://www.i-micronews.com/reports/LED-Phosphors-Down-Converters-Patent-Investigation/14/392/
High-end Inertial Sensors for Defense, Aerospace, and Industrial Applications...Yole Developpement
Fueled by geopolitical risks rising defense investments, commercial aerospace and fast-growing applications, this new prosperous cycle of the high end inertial business will bring the market to new heights.
INCREASING GEOPOLITICAL RISKS, THE ENDING OIL CRISIS AND THE UPCOMING ROBOTIC ERA ARE FACTORS FUELING THE HIGH-END INERTIAL SYSTEM MARKET
Defense and commercial aerospace markets have always been the backbone of the high-end inertial system market, and that is still true today. The traditional markets, like defense, commercial aerospace and space applications, have returned to growth after a big slowdown from 2010 2015. For the last two years, the market has been evolving positively thanks to increasing geopolitical risks, and benefiting from the reinvigoration of the commercial aerospace business. And the end of the oil crisis in 2015, combined with increasing purchasing power coming from eastern regions, especially China, has definitely benefited this market. The space market is still evolving at its own pace, with the increasingly important robotic approach coming from players like SpaceX, Blue Origin enabling reusable rocket launchers, democratizing the space market.
In other words, the high-end inertial system market is recovering from a lean period that could bring it, in the long term, into a prosperous time with higher volumes. At long term, the market should be propelled by two major trends: the robotic approach and the growth of industrial applications. Yole Développement estimates that the high-end inertial system market has reached the $3B milestone in 2017. Defense makes up 36 % of this, with commercial aerospace comprising 33 %. Industrial, offshore and maritime applications account for the remaining 31 %. With a compound annual growth rate (CAGR) estimated to be 5% for the five next years, the high-end inertial system market is on a good track. The industry is now looking for emerging opportunities to sustain its growth, and this is what we highlight in this report.
More information on that report at http://www.i-micronews.com/reports.html
Ainstein T-79: Automotive 79GHz Short Range Radarsystem_plus
A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
Equipment and Materials for 3D TSV Applications - 2017 Report by Yole Develop...Yole Developpement
Driven today mostly by BSI CIS, the 3D TSV equipment & materials business will be supported by 3D stacked memory’s expansion
Technology and application drivers will change over the years, but TSV integration will continue growing
Currently supported mostly by 3D stacked BSI CIS, TSV integration growth will be led mainly by 3D memory applications and new products integrating TSV interconnects in the imaging segment.
Indeed, 3D stacked BSI has been the TSV market’s real driver for a couple of years now. However, with the entrance of 3D hybrid technology (which does not require any TSV interconnects), we expect a decrease of 3D stacked BSI in the TSV market by 2019.
This potential TSV decrease within BSI CIS could be hastened by the 3D single-photon avalanche diodes (SPAD) developed by STMicroelectronics. This is a new approach in time-of-flight that will benefit from 3D hybrid technology by moving the digital pixel into the secondary chip.
While Sony is the current CIS leader and the pioneer of the hybrid stacking method (which was adopted for the first time in the Samsung Galaxy S7 rear camera module), it is too early to fully describe the strategy of other key actors like TSMC/Omnivision and ON Semiconductor, and whether their path will lead to 3D stacked BSI or 3D hybrid stacked.
Another scenario could happen in the next few years and impact the TSV market in a different way. With more complex structures in the BSI CIS field being considered today, some CIS manufacturers might remain on 3D stacked BSI by combining this technology with 3D hybrid stacked for the next generation of products based on multi-stack structure. In this case, 3D hybrid stacked will not compete with 3D stacked BSI, leading to a continuous increase of 3D stacked BSI and 3D hybrid stacked.
For more information please visit our website: http://www.i-micronews.com/reports.html
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
Comparative packaging analysis of over 100 inertial, environmental, acoustic, optical and radio-frequency MEMS components from major manufacturers
MEMS device manufacturers have to choose between shrinking their products, or and adding functionality. This leads to certain categories of components slowing down packaging integration and evolution.
To complement Yole Développe-ment’s MEMS Packaging 2017 Market report, System Plus Consulting has conducted a comparative technology review to provide insights into the packaging structure and technology of around 80 consumer and 20 automotive MEMS products from leading suppliers, including Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…
Several types of device are compared: Environmental sensors, including pressure, humidity, gas and combo sensors; Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS including microbolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters and oscillators.
More information on that report at http://www.i-micronews.com/reports.html
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...Yole Developpement
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...Yole Developpement
How inkjet is building a success story drop by drop within 2.5D and 3D manufacturing?
More information on that report at https://www.i-micronews.com/report/product/inkjet-functional-and-additive-manufacturing-for-electronics.html
Nano-Imprint Technology Trends for Semiconductor Applications 2019 report by ...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Wolfson WM7121 & WM7132 Top & Bottom Port MEMS Microphones teardown reverse c...Yole Developpement
Wolfson WM7121 & WM7132 Top & Bottom Port MEMS Microphones
Discover two innovative silicon microphones of Wolfson integrated in Motorola products
Before its acquisition by Cirrus Logic for $467M in April 2014, Wolfson Microelectronics released a series of analog and digital MEMS microphones with revenues growing 70% from 2012 to 2013.
Teardowns of Motorola moto X smartphone and moto 360 smartwatch revealed that microphone solutions integrate two Wolfson Microelectronics silicon microphones. Wolfson’s WM7121 and WM7132 are respectively top and bottom port analog MEMS microphones.
Assembled in specific LGA cavity packages, the microphones use a capacitive sensing principle based on Wolfson proprietary MEMS technology. This set of 2 reports highlight MEMS and Packaging technologies of Wolfson microphones with a comparison between the two references.
One of the main interest of Wolfson’s MEMS technology is the use of silicon nitride (SiN) instead of polysilicon for the transducer element. According to Wolfson, silicon nitride delivers lower stress and strain coefficients, leading to higher reliability. Discover the impact of this material choice on the manufacturing cost and a comparison with technologies from Knowles and Infineon.
More information on that report at
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
KEY FEATURES OF THE REPORT
• IP trends including time evolution of patent publications and patent filings countries
• Current legal status of patents (granted, pending application, abandoned, expired)
• Main patent assignees (ranking, time evolution, geographical coverage) • Joint developments and IP collaboration network of main patent assignees
• Profile of 5 key players (Samsung, Toshiba, Micron Technology, SK Hynix, Intel), including:
- Technology and market data for TSV stacked memory
- Key patents
- Cross link analysis between teardown analysis, process flow and patents
- Technical challenges and relevant solutions found in the patents
- Patent litigations (ELM 3DS vs SK Hynix/Micron/Samsung)
• Excel database with all patents analyzed for the 5 key players, including technology segmentation
Non invasive Glucose Patent Landscape sampleKnowmade
The report provides essential patent data for non-invasive glucose monitoring including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents
• Granted patents near expiration
• Relative strength of main companies IP portfolio
• Non-invasive glucose monitoring IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy
The report also provides an extensive Excel database with all patents analyzed in the study
Photoacoustic imaging technologies in the biomedical domain are in full growth from an IP point of view, and have began to move in the clinical field. If Japanese companies Canon and Fujifilm are the main IP holder, the market is held by US actors : ENDRA Life Sciences, VisualSonics, Seno Medical Instruments, OptoSonics or TomoWave Laboratories.
This patent landscape focuses on photoacoustic imaging in biomedicine. Photoacoustic imaging is a safe, non-invasive, non-ionizing imaging technique. The technique offers several advantages and represents a great alternative to traditional medical imaging approaches. The innovation of photoacoustic imaging for biomedical purposes is mainly driven by the need to enhance the efficiency of the detection and diagnostic of cancer.
KEY FEATURES OF THE REPORT
The report provides essential patent data for biomedical photoacoustic imaging including:
Time evolution of patent publications and countries of patent filings.
Current legal status of patents.
Ranking of main patent applicants.
Joint developments and IP collaboration network of main patent applicants.
Key patents.
Granted patents near expiration.
Relative strength of main companies IP portfolio.
Photoacoustic imaging IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
Microfluidic technologies for diagnostic applications - SampleKnowmade
The report provides essential patent data for microfluidic technologies for diagnostic applications including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network
• Key patents and granted patents near expiration
• Relative strength of main companies IP portfolio
• IP profiles of 15 major companies
Capsule Endoscopy Patent Landscape 2014 Sample
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
KEY FEATURES OF THE REPORT
The report provides essential patent data for capsule endoscopy. It identifies more than 30 major holders of capsule endoscopy related intellectual property. It provides in-depth IP analysis and industrial key players including:
-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 15+ companies.
The “capsule endoscopy IP” profiles of 15+ major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the report.
OBJECTIVE OF THE REPORT
•Understand the IP landscape for capsule endoscopy.
•Identify key patents.
•Understand trends in capsule endoscopy IP.
•Identify the major players in capsule endoscopy IP and the relative strength of their patent portfolio.
•Identify new players in capsule endoscopy IP.
•Identify IP collaboration networks between key players (industrial and academics).
•Identify main patent litigations.
The report provides essential patent data, technology analysis and market forecasts for 7 selected Emerging MEMS (eMEMS) technologies that we believe will soon reach the marketplace: autofocus, AOC MEMS, chemical sensors, micro-speakers, scanning micro-mirrors, Si microfluidic and ultrasonic MEMS. The market for emerging MEMS covered in this report is expected to grow from US$171M in 2013 to US$2.8B in 2019, corresponding to a 58.2% CAGR.
Miniaturized Gas Sensors Patent Landscape 2016 SampleKnowmade
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by gas sensor technology: Electrical detector (FET, CMOS, MOS/MIS), chemical sensor, optical detector, acoustic detector, gas chromatography, electro-chemical gas sensor, thermal gas sensor, gas sensor with CNTs/Graphene, electro-mechanical gas sensors
• IP position vs. market positions for each key players
• MEMS gas sensor IP profiles of 19 key companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (2000+ patents), including technology segmentation
Sample MEMS Microphone Technology and Patent Infringement Risk AnalysisKnowmade
The MEMS Microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. According to Yole Développement, the market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing new players. Knowles is the dominant player with 61% market shares in 2013 and 58% in 2014. A decrease is again expected in the next years with new challengers entering the market: STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies and InvenSense(Analog Devices).
The global market share of these 6 players account for more than 80% of MEMS Microphone market in 2014. These players are all developing innovative technical and manufacturing solutions and, in parallel of course, the right patents to protect their inventions.
In a patent infringement action, the potential sales volume plays a major role for assessing the damage award. Thereby, this study is naturally focused on the last MEMS Microphone components supplied by these market leaders and challengers: Knowles (S1157, iPhone 5S/6), ST/OMRON (MP45DT01), AAC/Infineon (SR595, iPhone 5S/6), InvenSense/ADI (ICS-43432).
This raises interesting questions: What are the similarities and the differences in term of technical and manufacturing choices at the devices level? What is the related patent situation? Knowmade and System Plus Consulting are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks
of patent infringement between Knowles, STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies, Analog Devices and InvenSense in the field of MEMS Microphone. As the MEMS Microphone market is growing very fast, it is the right time now to understand what could happen between these companies and how to differentiate patents and claims compared to the other players.
KEY FEATURES OF THE REPORT
• Deep insight on technology data and manufacturing processes
• Comparative studies of product features
• Key patents related to the target product features per company
• Cross analysis of potential patent infringement risks
• Excel database with all patents analyzed in the report
OBJECTIVES OF THE REPORT
• Find the technical and manufacturing process similarities and differences of S1157, MP45DT01, SR595 and ICS-43432 MEMS Microphones.
• Identify key patents held by Knowles,STMicroelectronics, OMRON, AAC
Technologies, Infineon Technologies,Analog Devices and InvenSense, and
related to the target product features.
• Find the link between patentedtechnological solutions and marketed products.
• Discover the potential infringing parties and help to find evidence of use.
• Understand potential risks of patent infringement and identify the patents
which require a more in depth legal assessment.
3D Cell Culture technologies Patent Landscape Sample 2016 Knowmade
The patent landscape related to 3D cell technologies is very open, involving important academic applicants as well as small companies. It includes over 2,500 patent families and involves over 1,000 patent applicants.
The report provides essential patent data for 3D cell culture technologies including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents
• Granted patents near expiration.
• Relative strength of main companies IP portfolio
• 3D cell culture IP profiles of 10+ major companies with key patents, partnerships, and IP strength and strategy
Patent Licensing Companies in the Semiconductor Market SampleKnowmade
KEY FEATURES OF THE REPORT
• Ranking of PLCs according to their recent patent acquisitions in the semiconductor field
• Dynamics of patent acquisitions and patented technology including memory, transistor, sensor, manufacturing and packaging
• Expected expiration date of patents and remaining lifetime of PLCs’ patent portfolios
• Dynamics of US patent litigation filed by PLCs in the semiconductor market and more broadly
• Details on the latest patent litigation filed by PLC in the semiconductor field, including defendants, accused products and current status of the litigation cases
• Aggressiveness of PLCs in the semiconductor market and more broadly
• Litigation risk assessment from PLCs and potential targeted companies in the semiconductor field
• IP profiles of main PLCs
GaN Devices for Power Electronics: Patent InvestigationKnowmade
This report provides essential patent and market data on GaN power electronics, with in-depth analysis of key technology segments and key players:
• IP trends including time evolution and countries of filing
• Power GaN market data and forecasts
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and patented technologies
• Segmentation of patents:
- by technology levels, including epi-wafers, devices, modules and packaging,
- by technical challenges, including current collapse, E-mode and cascode,
- and by type of substrate including SiC, silicon, sapphire and bulk GaN.
• A special focus is provided on power semiconductor devices (transistors and diodes at the semiconductor level) and power components (discrete components, power modules and packaging).
• Power GaN IP profiles of 9 major companies, with key patents, technological issues, litigation, licenses, partnerships, IP strength, IP strategy and latest market news: International Rectifier (IR), Infineon, Transphorm, Fujitsu, Efficient Power Conversion (EPC), Power Integrations, GaN Systems, Panasonic and Mitsubishi Electric.
The report also provides an extensive Excel database with all patents analyzed in the report, including technology segmentation.
This Patent Investigation allows understanding the technology & market from a patent perspective. The report provides a clear link between the IP situation and market evolutions. It enables you to anticipate changes, harvest business opportunities, mitigate risks and make strategic decisions to strengthen your market position and maximize return on your IP portfolio.
GaN Technology Top-100 IP profiles - SampleKnowmade
The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, more than 76,200 patents and patent applications related to over 39,700 inventions on GaN technology have been published worldwide through November 2016. This fact is correlated with a rapid growth of the industrial activity related to GaN, mainly due to light-emitting diodes, but also to the emergence of lasers and high-power/high-frequency electronics. Moreover, the current diversification of GaN-related research activities is remarkable, ranging from advanced optical sources and single-electron devices to physical, chemical, and biological sensors, optical detectors, and energy converters. In this dynamic and large context, it is necessary to have a clear overview of main companies and research laboratories involved in this technology domain.
The report provides essential patent data for IP players related to GaN technology. It identifies 100 major patent holders involved in GaN technology, and its provides in a single slide the IP profile of each main patent holder including: time evolution of patent publications, geographic map of patenting activity, technical segments, highly cited patents, main IP competitors and IP collaborators.
Motion sensing combo sensor is a very hot topic, both in terms of market potential and competition among the players. The growth of the applications of 6 and 9 degrees of freedom (DoF) devices is both pushing the leaders (STMicroelectronics, Bosch Sensortec and InvenSense) and their challengers (AKM, Kionix, mCube, Freescale, Alps, Kionix…) to develop innovative technical and manufacturing solutions, and, in parallel of course, to have the right patents to protect their inventions. What are the similarities and the differences in term of technical and manufacturing choices at the devices level ? What is the related patent situation?
OBJECTIVES OF THE REPORT
• Find the technical and manufacturing process similarities and differences of LSM9DS0, BMX055 and MPU-9250 9-axis IMU components.
• Identify key patents held by STMicroelectronics, Bosch Sensortec and InvenSense, and related to the target product features.
• Find the link between patented technological solutions and marketed products.
• Identify the potential infringing parties and help to find evidence of use.
• Identify potential risks of patent infringement and identify the patents which require a more in depth legal assessment.
KEY FEATURES OF THE REPORT
• Deep insight on technology data and manufacturing processes
• Comparative studies of product features (similarities & differences)
• Key patents related to the target product features per company
• Cross analysis of potential patent infringement risks
• Excel database with all patents analyzed in the report
Emerging LTE standards for IoT lack a networking stack for true real-time, low power networking. A simple add-on to the existing TCP/IP stack makes a difference.
KnowMade is specialized in analysis of patents and scientific information. We provide patent search, IP landscape, patent valuation, IP due diligence, scientific literature landscape, identification of technologies available for transfer/licensing/sale, alerts and updates.
Our service offer consists of custom studies, analysis reports, on-demand tracking and strategy consulting. Knowmade combines information search services, scientific expertise, powerful analytics and visualization tools, and proprietary methodologies for analyzing patents and scientific information.
With a solid focus on Microelectronics, Nanotechnology and Biotechnology, KnowMade supports research laboratories, industrial companies and investors in their business development.
Capsule Endoscopy Patent Landscape Flyer 2014
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
KEY FEATURES OF THE REPORT
The report provides essential patent data for capsule endoscopy. It identifies more than 30 major holders of capsule endoscopy related intellectual property. It provides in-depth IP analysis and industrial key players including:
-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 15+ companies.
The “capsule endoscopy IP” profiles of 15+ major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the report.
OBJECTIVE OF THE REPORT
•Understand the IP landscape for capsule endoscopy.
•Identify key patents.
•Understand trends in capsule endoscopy IP.
•Identify the major players in capsule
endoscopy IP and the relative strength of
their patent portfolio.
•Identify new players in capsule endoscopy IP.
•Identify IP collaboration networks between key players (industrial and academics).
•Identify main patent litigations.
MEMS microphone Patent Infringement April 2015 report published by Yole Devel...Yole Developpement
MEMS Microphone
Knowles, STMicroelectronics/OMRON, AAC Technologies/Infineon Technologies, InvenSense/Analog Devices
Market growth, challenged leader : patent battle can start
NOW IT’S TIME FOR PATENT BATTLE IN MEMS MICROPHONE BUSINESS
The MEMS Microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. According to Yole Développement, the market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing new players. Knowles is the dominant player with 61% market shares in 2013 and 58% in 2014. A decrease is again expected in the next years with new challengers entering the market: STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies and InvenSense(/ Analog Devices).
The global market share of these 6 players account for more than 80% of MEMS Microphone market in 2014. These players are all developing innovative technical and manufacturing solutions and, in parallel of course, the right patents to protect their inventions.
In a patent infringement action, the potential sales volume plays a major role for assessing the damage award. Thereby, this study is naturally focused on the last MEMS Microphone components supplied by these market leaders and challengers: Knowles (S1157, iPhone 5S/6), ST/OMRON (MP45DT01), AAC/Infineon (SR595, iPhone 5S/6), InvenSense/ADI (ICS-43432).
This raises interesting questions: What are the similarities and the differences in term of technical and manufacturing choices at the devices level? What is the related patent situation? Knowmade (specialized in patent analysis) and System Plus Consulting (specialized in reverse engineering and reverse costing) are joining their unique added value in order to combined technology and manufacturing analysis with patent claims understanding to highlight the risks of patent infringement between Knowles, STMicroelectronics, OMRON, AAC Technologies, Infineon Technologies, Analog Devices and InvenSense in the field of MEMS Microphone. As the MEMS Microphone market is growing very fast, it is the right time now to understand what could happen between these companies and how to differentiate patents and claims compared to the other players.
This report provides an overview of technology data and manufacturing process of S1157, MP45DT01, SR595 and ICS-43432 MEMS Microphone components.
A comparative study of the technology and manufacturing process of these MEMS Microphone components has been performed in order to highlight the technical similarities and differences of the product features.
More information on that report at http://www.i-micronews.com/reports.html
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
JavaOne 2015 - CON6489 - Smart Open Spaces Powered by Low Cost ComputersJorge Hidalgo
By Jorge Hidalgo & Julio Palma. San Francisco Oct 27th, 2015.
Single-board computers such as the Raspberry Pi are cheap, small, and cute, but they have also shown that they are powerful enough to drive interesting ideas at a fraction of the cost of other, more “traditional” hardware solutions. This session covers how Java ME and Java SE technologies can power solutions for managing open spaces (such as museums, department stores, hypermarkets, airports, train stations, and offices) in a cost-effective manner. Combining Java, the Raspberry Pi, and Bluetooth LE and other sensors makes it easy to build a platform to track personal devices as they are carried through an area and analyze movement patterns, hot zones, and real-time 3-D information to help drive better visitor/customer/user interactions.
Cancer diagnostics startup identification 2020 sampleKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Patent landscape efforts can get hampered either by voluminous patent search results or the perceived need to manually tag every single feature. It can increase uncertainty, costs, and complexity. Like chemical structure, biosequence, or freedom-to-operate patent searches, patent landscape searches have unique challenges. Delivering custom patent landscape analysis for effective decisions is beyond the skills of most end users. The final patent landscape report can vary depending on the allocated time and the optimal usage of advanced patent analytics tools by professional patent analysts (or by end-users). Many “state of the art” reports only provide patent search results with minimal analysis. Similarly, many automated “instant reports” only provide canned analysis and visuals that are too broad for POV analysis or corporate decision-making. This presentation describes the use of an efficient accelerated, intentional, and multifaceted (AIM™) patent landscape to alleviate these issues. The goal of an AIM™ patent landscape is to intentionally align scope with pending decisions. The results are delivered with appropriate level of analysis, including supporting charts, within an accelerated timeline of 2-3 weeks. AIM™ patent landscape analysis uses experienced patent analysts, a well-defined workflow process, and multiple best-in class patent data search, processing, and visualization tools. AIM™ patent landscapes are ideal in patent portfolio benchmarking efforts and delineating white space opportunities for well-defined projects.
The integration limit of flash memories is approaching, and emerging Non-Volatile Memories (eNVM) to replace conventional Flash Memories have been proposed. Ferroelectric RAMs (FeRAMs), Magnetoresistive RAMs (MRAMs), Resistive-change RAMs (ReRAMs) or Phase-Change Random-Access Memories (PCRAMs) are promising to change the memory landscape. The field of eNVM has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Currently, there are more than 8,600 relevant patent families filed all over the world. Patent families were filed by more than 800 patent applicants mainly located in USA, Japan, Taiwan and China. From a quantitative point of view, the most active companies are SK Hynix, Samsung, Toshiba, Micron Technology and IBM. In addition, startup firms do not file many patents and their main strategy is to license or sell their intellectual property. The patents related to MRAM technology account for more than 40% of filings. The main patent applicants are Toshiba, Samsung and Renesas Electronics which represent together almost 30% of the patents. The MRAM technology was growing between 2003-2007 with more than 50% of patents published during these years. Currently, the number of patents filed has remained stable, with about 200 patents filed per year. About 30% of patent families are related to PCRAM technology. They were mainly filed by SK Hynix and Samsung, they represent almost 40% of published patents. The PCRAM technology was increasing between 2002 and 2009, with more than 450 patent families published in 2009. Publication patents is decreasing these last 4 years, however more than 200 patents are still published every year. Patent filings will continue on PCRAM technology to further improve memory applications. The patents dedicated to FeRAM technology represent 20% of filings. They were mainly filed by SK Hynix, Samsung and Seiko Epson which represent almost 50% of published patents. FeRAM is a mature technology, and FeRAM is not an active patent field yet. Patents related to ReRAM technology account for almost 10% of new patent filings. ReRAM is the newest patented technology and the number of patent publications will continue to increase in the coming years. With over 100 patent families already filed, Samsung will play a significant role in this emerging technology development. Several players are focusing on all types of memories, alone or by joint developments. An overview is given for more than 50 companies. A focus is also realized on main 10 players (SK Hynix, Samsung, Toshiba, Micron Technology, IBM…) to summarize all the data set, such as key patents, expiring patents, acquisitions, joint developments and key industrial applications for each eNVM.
Consumer Physics Inc. develops and distributes molecular sensors, marketing its product under the SCiO brand name. According to Consumer Physics, the SCiO spectrometer is the world’s first pocket size molecular sensor. The company had over 13,000 backers on Kickstarter and ended up raising over $2.7 million. Consumers can use SCiO to scan objects including fruit, vegetables, dairy food, meat, fish and medications. They can even scan their own bodies to measure total body fat. The SCiO app also includes a DIY applet that allows anyone to scan materials of their choosing and analyze the difference between their molecular identities. Consumer Physics has won numerous awards including an ‘Enabled by Optics’ award from OSA, The Optical Society, in 2016, the World Economic Forum Technology Pioneers Award 2015, the United Nations Netexplo Award 2015 and was a CES Innovation Honoree in 2016. SCiO has regularly appeared in top ‘products to watch’ lists on Forbes, CNN, and Fortune, and has been covered numerous times by the media on television, in print and online. But what technologies are behind Consumer Physics’ success and what are the main features claimed by its patents?
Cancer diagnostics startup identification 2020 flyerKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping SampleKnowmade
Founded in 1946, Knowles offers a growing range of micro-acoustic, electro-mechanical, and related technology platforms to support its customers. Knowles was the first to introduce MEMS microphones to the market in 2003 and is now the world-leader in MEMS microphones, with its SiSonic technology. Knowles is Apple’s main MEMS microphone supplier. Yole Développement estimates the sales of Knowles’ MEMS microphones at $360M in 2016, giving the company over 40% of the market. That year, Knowles shipped over 1.55 billion MEMS microphones. Moreover, Knowles has filed several patent lawsuits in the last ten years against rival manufacturers. In this context, it is important to understand the links between Knowles’ MEMS microphones and their related patents. Our partner, System Plus Consulting, analyzed the MEMS microphone components included in the iPhone 7 Plus, which was launched by Apple in September 2016. The smartphone contains four MEMS microphones: one front-facing top microphone, two front-facing bottom microphones and one rear-facing top microphone. Two different MEMS microphones from Knowles have been found in the iPhone 7 Plus, the KSM microphones, KSM1 or KSM2, and the KMM microphone, KMM1. The models are very similar and the study focuses mainly on the KSM format. Based on the features revealed by the microphone teardowns, we have identified the closest Knowles patents to these technologies, and describe the main claimed features. This helps understand the core technologies developed by Knowles in their MEMS microphones. Knowles microphones in the iPhone 7 Plus include technologies claimed in patents published in the early 2000s and in the mid-2010s. We have also observed new IP activity linked to these microphones. The technologies currently being developed could represent a new angle of attack for infringement litigation from Knowles after the wave of suits the company initiated over the last decade.
Combining the data obtained by System Plus Consulting’s teardown of Knowles microphones in the Apple iPhone 7 Plus with Knowmade’s IP analysis, this report highlights IP related to these MEMS microphones. Moreover, it analyzes Knowles’ related patent portfolio in order to understand the company’s IP strategy and to identify main IP competitors.
Similar to Capacitive Fingerprint Sensors Sample (20)
Since 2017, Knowmade has been following the intellectual property (IP) trends related to RF front-end devices and their packaging. Recently, Knowmade witnessed increasing patenting activity related to PAMiD modules, RF front-end modules, RF filters and switch integration, and antennas for 5G and their packaging. Packaging of 5G systems requires the integration of RF, analog and digital functions along with passives and other system components in a single module. These systems exemplify the heterogeneous integration trend which becomes more important for 5G. Proximity of the transceiver and front-end module is also important, to reduce size and loss. This is achieved by integrating antennas with the RF module as well as simultaneous modeling of a heat dissipation solution to keep active components in acceptable thermal conditions. In the mm-wave antenna-in-package solutions, interconnections between transceiver ICs and antennas should result in low insertion loss and acceptable return loss over the frequency range of interest. The other key requirement is the form factor, and to meet it the industry is progressively moving from conventional interconnect techniques such as wire-bonding and flip-chip interconnections to emerging techniques referred to as Fan-Out packaging or ICembedding. Flip-chip and Fan-out interconnections were originally developed for highperformance computing or mobile processor applications, but their fine pitch and low electrical parasitic have pushed RF players to use them in their RF/mm-wave modules. Today, these approaches are getting more and more critical for the RF industry and are used in antenna-integrated modules. In this report, Knowmade analyzes the patent landscape related to antenna integrated in package (AiP, AoP). The AiP patent landscape is led by major semiconductor foundries and OSATs, SJ Semiconductor (SJSemi) being the main patent assignee, and it includes any links in the supply chain. Foundries/OSATs (SJSemi/SMIC, TSMC, SEMCO, ASE, SPIL) as well as IDMs/fabless (MediaTek, Qualcomm, Murata, TI, Skyworks) and OEMs (Huawei, Vivo mobile, Oppo mobile) have filed AiP-related patents to protect their structures/designs or manufacturing methods
Next generation power modules - patent landscape 2021 - sampleKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Report’s Key Features
• PDF with > 230 slides
• Excel file > 3,000 patent families
• Main IP dynamics and key trends.
• IP leaders, most active players and newcomers.
• IP portfolio strength of key players, and their technology/application focus.
• Time evolution of patents filings by company, countries, and technology.
• IP collaborations and IP transfers between key organizations.
• Insights into the status of RF GaN patented technologies, identifying trends for each technology and application.
• Extensive Excel database of over 3,000 patent families with all patent information and technology segmentation.
Microneedles for drug delivery patent landscape 2020 flyerKnowmade
Report’s Key Features
• PDF with > 140 slides
• Excel file > 2,450 patent families
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to applications: Cancer therapy, Cosmetic, Diabetes, Ophthalmic, Pain management and Vaccine.
• Summary of the IP related to technologies: Applicators, housing, Coated, Hollow, Porous, Soluble, Hydrogel and Solid microneedles.
• Analysis of patent oppositions (Europe) and review of key patents.
• Excel database containing all patents analyzed in the report, including applications and technologies segmentations
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 160 slides
• Excel file > 5,500 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to the physical isolation: size, deformability, electrical charges or density.
• Summary of the IP related to the biological isolation: positive or negative enrichment.
• Summary of the IP related to the CTC detection: nucleic acid, protein or functional assay.
• Analysis of patent litigations and review of key patents.
• Excel database containing all patents analyzed in the report, including biological and physical isolation and detection segmentations
Report’s Key Features
• PDF with > 200 slides
• Excel file > 2,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Patent segmentation per application: Optoelectronics and Photonics, Power, RF, PV and Sensors
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Established players and new entrants
• IP profile of key players, their key patents and their recent IP activity
• Patents recently expired and patents near expiration date
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Report’s Key Features
• PDF with > 80 slides
• Excel file > 1,000 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation per application:
– CMOS image sensor (CIS)
– Memory
– MEMS
– LED
• Key patent identification and details
• IP profile of key players: Xperi, TSMC, YMTC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Solid electrolytes for lithium ion solid state batteries patent landscape 201...Knowmade
Report’s Key Features
• PDF with > 250 slides
• Excel file > 5,800 patents
• IP trends, including time-evolution of published patents, legal status, countries of patent filings, etc.
• Ranking of main patent assignees
• Patent categorization by type of electrolyte (polymer, inorganic, inorganic/polymer) and inorganic electrolyte materials (sulfide glass ceramics, Thio-LISICON, argyrodite, oxide glass ceramics, NASICON, perovskite, garnet, anti-perovskite, hydride)
• For each technical segment: IP dynamics, ranking of main patent assignees, newcomers, key IP players (leadership, blocking potential, portfolio strength), key patents, and recent development trends
• For each key IP player (100+ companies): Time-evolution of patenting activity, legal status of patents and countries of patent filings, patent segmentation by electrolyte material, IP strengths and weaknesses by electrolyte material
• Excel database containing all patents analyzed in this report, including technology and material segmentations
Report’s Key Features
• PDF >160 slides
• Excel file >18,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Main technologies IP analysis:
– Temperature-compensated acoustic wave filters
– Packaging (flip-chip, wafer-level packaging
– Functions and modules (duplexers, multiplexers)
• IP players’ key patents
• Key players’ IP position and relative strength of their patent portfolios
• IP profile of key players: Murata, TDK, Taiyo Yuden, Skyworks, Qualcomm, Broadcom, Qorvo, Samsung Electro Mechanics, Akoustis, Resonant, Infineon, CETC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape sampleKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape flyerKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Antenna for 5G patent landscape 2019 flyerKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Building RAG with self-deployed Milvus vector database and Snowpark Container...Zilliz
This talk will give hands-on advice on building RAG applications with an open-source Milvus database deployed as a docker container. We will also introduce the integration of Milvus with Snowpark Container Services.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
Goodbye Windows 11: Make Way for Nitrux Linux 3.5.0!SOFTTECHHUB
As the digital landscape continually evolves, operating systems play a critical role in shaping user experiences and productivity. The launch of Nitrux Linux 3.5.0 marks a significant milestone, offering a robust alternative to traditional systems such as Windows 11. This article delves into the essence of Nitrux Linux 3.5.0, exploring its unique features, advantages, and how it stands as a compelling choice for both casual users and tech enthusiasts.
GridMate - End to end testing is a critical piece to ensure quality and avoid...ThomasParaiso2
End to end testing is a critical piece to ensure quality and avoid regressions. In this session, we share our journey building an E2E testing pipeline for GridMate components (LWC and Aura) using Cypress, JSForce, FakerJS…
UiPath Test Automation using UiPath Test Suite series, part 6DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Sudheer Mechineni, Head of Application Frameworks, Standard Chartered Bank
Discover how Standard Chartered Bank harnessed the power of Neo4j to transform complex data access challenges into a dynamic, scalable graph database solution. This keynote will cover their journey from initial adoption to deploying a fully automated, enterprise-grade causal cluster, highlighting key strategies for modelling organisational changes and ensuring robust disaster recovery. Learn how these innovations have not only enhanced Standard Chartered Bank’s data infrastructure but also positioned them as pioneers in the banking sector’s adoption of graph technology.
Alt. GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using ...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
Dr. Sean Tan, Head of Data Science, Changi Airport Group
Discover how Changi Airport Group (CAG) leverages graph technologies and generative AI to revolutionize their search capabilities. This session delves into the unique search needs of CAG’s diverse passengers and customers, showcasing how graph data structures enhance the accuracy and relevance of AI-generated search results, mitigating the risk of “hallucinations” and improving the overall customer journey.
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
Maruthi Prithivirajan, Head of ASEAN & IN Solution Architecture, Neo4j
Get an inside look at the latest Neo4j innovations that enable relationship-driven intelligence at scale. Learn more about the newest cloud integrations and product enhancements that make Neo4j an essential choice for developers building apps with interconnected data and generative AI.