Have an overview of the most conventionally utilized crystal growth techniques: process, diagrams, advantages, and disadvantages. This is the presentation of my "PV cells and materials" course at the MSc Engg. level.
Hot wall reactor is a high temperature chamber in which the substrate is placed for coating. In this reactor including the substrate, all other parts (inlet and outlet tubes) inside the chamber get coated.
A key vacuum deposition technique for making highly homogenous and high-performance solid-state thin films and materials is Chemical vapor deposition. The types of CVD systems and their key applications would also be discussed in this presentation. It is a key bottom-up processing technique, widely used in graphene fabrication, also the fabrication of various oxides, nitrides is possible, with this technique.
Chemical Vaour Deposition & Physical Vapour Deposition techniques.Tapan Patel
This document provides an overview of chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes. CVD involves reacting vapor phase chemicals in a reaction chamber to form a thin solid film on a substrate. Key steps in the CVD process include transporting reactants, adsorption on the substrate surface, and desorption of byproducts. PVD involves vaporizing a solid material using techniques like evaporation, sputtering, or pulsed laser deposition under vacuum conditions. The vaporized material then condenses as a thin film on the substrate. The document compares advantages and applications of the two deposition methods.
The document provides an overview of chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes. CVD involves reacting vapor phase chemicals in a chamber to form a thin solid film on a substrate. It can be used to deposit a variety of materials. PVD physically vaporizes a solid material in a chamber and allows it to condense as a thin film on a substrate. Both processes are used to apply thin coatings with improved properties for applications such as semiconductors, protective coatings, and medical and aerospace components.
Bu sunum; Gazi Üniversitesi İleri Teknolojiler ABD, Prof.Dr. İbrahim USLU' nun sorumluluğunda olan" İnce Film Teknolojileri" adlı derste sunmuş olduğum ince film kaplama tekniklerinden birisi olan Kimyasal Buhar Biriktirme (CVD) tekniğini detaylı bir şekilde anlatılmaktadır.
Synthesis and charaterization of la1 x srxmno3 perovskite nanoparticlesMai Trần
In recent times perovskite materials are extensively studied and have attracted much attention because they exhibit interesting the properties, showing potential applications in commercial, technical and biomedical. In Vietnam, perovskite materials be of interest research and applications are strong but with major research direction is to go deep into the electrical properties and the magnetic properties. The Lanthanum Strontium manganite is a perovskite-based crystal-structured ceramic material with the formula of La1-xSrxMnO3, where x describes the doping ratio. It has attracted much attention due to its good magnetic, electrical, and catalytic properties and is becoming an attractive possibility material in several biomedical applications, particularly with nano-size. In industry, this material is commonly used in as a cathode material in commercially produced solid oxide fuel cells. In this thesis, we present the Perovskite nanoparticles La1-xSrxMnO3 were successfully synthesized of the nanosize La1-xSrxMnO3 at x = 0; 0.1; 0.2; 0.3 and 0.4 which prepared by a modified sol-gel method. Structure and magnetic properties of them were systematically investigated in dependence on doped Sr ratio x. The structure was investigated by XRD and show slightly changed but magnetic properties varied strongly with changing the doping ratio x. Magnetic properties of samples were studied by Vibrating Sample Mode of Physical Properties Measurement System show at the room temperature, the samples show superparamagnetic properties with high saturated magnetization MS of 57 emu/g which strongly dependents on the doped Sr ratio x.
Have an overview of the most conventionally utilized crystal growth techniques: process, diagrams, advantages, and disadvantages. This is the presentation of my "PV cells and materials" course at the MSc Engg. level.
Hot wall reactor is a high temperature chamber in which the substrate is placed for coating. In this reactor including the substrate, all other parts (inlet and outlet tubes) inside the chamber get coated.
A key vacuum deposition technique for making highly homogenous and high-performance solid-state thin films and materials is Chemical vapor deposition. The types of CVD systems and their key applications would also be discussed in this presentation. It is a key bottom-up processing technique, widely used in graphene fabrication, also the fabrication of various oxides, nitrides is possible, with this technique.
Chemical Vaour Deposition & Physical Vapour Deposition techniques.Tapan Patel
This document provides an overview of chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes. CVD involves reacting vapor phase chemicals in a reaction chamber to form a thin solid film on a substrate. Key steps in the CVD process include transporting reactants, adsorption on the substrate surface, and desorption of byproducts. PVD involves vaporizing a solid material using techniques like evaporation, sputtering, or pulsed laser deposition under vacuum conditions. The vaporized material then condenses as a thin film on the substrate. The document compares advantages and applications of the two deposition methods.
The document provides an overview of chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes. CVD involves reacting vapor phase chemicals in a chamber to form a thin solid film on a substrate. It can be used to deposit a variety of materials. PVD physically vaporizes a solid material in a chamber and allows it to condense as a thin film on a substrate. Both processes are used to apply thin coatings with improved properties for applications such as semiconductors, protective coatings, and medical and aerospace components.
Bu sunum; Gazi Üniversitesi İleri Teknolojiler ABD, Prof.Dr. İbrahim USLU' nun sorumluluğunda olan" İnce Film Teknolojileri" adlı derste sunmuş olduğum ince film kaplama tekniklerinden birisi olan Kimyasal Buhar Biriktirme (CVD) tekniğini detaylı bir şekilde anlatılmaktadır.
Synthesis and charaterization of la1 x srxmno3 perovskite nanoparticlesMai Trần
In recent times perovskite materials are extensively studied and have attracted much attention because they exhibit interesting the properties, showing potential applications in commercial, technical and biomedical. In Vietnam, perovskite materials be of interest research and applications are strong but with major research direction is to go deep into the electrical properties and the magnetic properties. The Lanthanum Strontium manganite is a perovskite-based crystal-structured ceramic material with the formula of La1-xSrxMnO3, where x describes the doping ratio. It has attracted much attention due to its good magnetic, electrical, and catalytic properties and is becoming an attractive possibility material in several biomedical applications, particularly with nano-size. In industry, this material is commonly used in as a cathode material in commercially produced solid oxide fuel cells. In this thesis, we present the Perovskite nanoparticles La1-xSrxMnO3 were successfully synthesized of the nanosize La1-xSrxMnO3 at x = 0; 0.1; 0.2; 0.3 and 0.4 which prepared by a modified sol-gel method. Structure and magnetic properties of them were systematically investigated in dependence on doped Sr ratio x. The structure was investigated by XRD and show slightly changed but magnetic properties varied strongly with changing the doping ratio x. Magnetic properties of samples were studied by Vibrating Sample Mode of Physical Properties Measurement System show at the room temperature, the samples show superparamagnetic properties with high saturated magnetization MS of 57 emu/g which strongly dependents on the doped Sr ratio x.
This document provides an overview of thin film deposition methods and thin film characterization techniques. It discusses the objectives of the course, which are to provide an understanding of thin film deposition methods, their capabilities and limitations. Hands-on demonstrations and experiments will help participants understand each deposition method and stimulate discussion. The document then summarizes various thin film deposition techniques like evaporation, sputtering, chemical vapor deposition, their principles and examples of applications. It also summarizes various characterization techniques used to analyze thin films and determine properties like composition, structure, thickness and defects.
If you have any questions, contact me. I would be happy to help.
PLEASE LIKE IT AND GIVE COMMENT
In this presentation,
The author gives the working principle of the PVD and Sputtering methods. But you can also find an information about the thin film and plasma phase of a matter.
Also this is related with Magnetron Sputtering method.
- Grazing incidence X-ray diffraction (GIXRD) is a technique that allows analyzing thin film samples by varying the incident angle of the X-rays to change their penetration depth.
- GIXRD provides enhanced signals from thin film layers compared to conventional XRD and helps distinguish thin film peaks from substrate peaks. It can also be used to analyze phases, stress, and crystal structure as a function of depth.
- Examples showed how GIXRD allowed analyzing phase composition and residual stress at different depths in thin film solar cell structures and revealed surface treatment effects in a stainless steel sample.
As most of modern devices are either getting smaller or requiring tinier components, the demand for plastic micro molding continues growing. Thus it is easy to guess - this presentation is going to dive us in peculiarities of micro injection molding technology.
This was SlideShare adapted from our companies blog post:
https://www.micromolds.eu/micromolding-in-depth-insights
Physical vapor deposition (PVD) involves depositing thin films onto surfaces through the condensation of vaporized material in vacuum conditions. There are various PVD techniques that vaporize material through processes like evaporation, sputtering, and pulsed laser deposition. Common applications of PVD coatings include improving hardness, wear resistance, and oxidation resistance for tools, medical devices, aerospace and automotive components. Magnetron sputtering is a widely used PVD technique that ejects material from a target using energetic ions from a plasma to deposit films for applications like semiconductor manufacturing.
Molecular beam epitaxy (MBE) is a method for growing thin films one layer at a time under ultra-high vacuum conditions. It involves heating solid sources of material in effusion cells to create molecular beams that are deposited on a heated substrate. The absence of carrier gases and ultra-high vacuum environment result in films of the highest purity. MBE is widely used to manufacture semiconductor devices and is considered a fundamental tool for nanotechnology development due to its precise control over layer thickness down to a single atomic layer.
Ic technology- chemical vapour deposition and epitaxial layer growthkriticka sharma
This document discusses chemical vapor deposition (CVD) and epitaxial layer growth techniques used in integrated circuit technology. It begins with an overview of CVD, describing the basic process and steps involved, including transport of reactants, adsorption, surface reactions, and removal of byproducts. It then covers various types of CVD systems like atmospheric pressure CVD, low pressure CVD, and plasma-enhanced CVD. The document also discusses epitaxial growth techniques like vapor phase epitaxy and molecular beam epitaxy. It explains concepts like lattice matching and defects that can occur during heteroepitaxial growth when the film and substrate materials have different lattice constants.
This document discusses molecular beam epitaxy (MBE), a process for depositing thin crystalline films. MBE involves heating pure elements in separate cells under high vacuum and allowing them to condense as a film on a substrate. It allows precise control over film thickness and composition to grow structures like semiconductor lasers. In-situ diagnostics like reflection high-energy electron diffraction (RHEED) are used to monitor growth. Challenges include the Ataro-Tiller-Grinfeld instability that can cause cracking in the film above a critical thickness if the substrate and film have a lattice mismatch.
Creep is the time-dependent deformation of a material under constant load at high temperatures. It occurs when a material is loaded below its yield strength and the load is maintained for an extended period of time, resulting in plastic deformation that increases over time. Creep can cause failure through rupture or excessive plastic deformation beyond a certain limit. The rate of creep deformation and time to rupture depend on factors like temperature, stress, and material microstructure. Creep becomes significant engineering issue at temperatures over 40% of the material's melting point.
Molecular beam epitaxy (MBE) is a technique for growing crystalline thin films one atomic layer at a time by heating a substrate and directing beams of molecules or atoms onto the substrate from various solid sources placed in evaporation cells. The technique allows for precise and pure layering of compound semiconductor materials less than 0.01 nanometers thick. MBE is used to produce complex semiconductor structures that can then be processed into electronic and optoelectronic devices like transistors, light-emitting diodes, solar cells, and lasers used in applications such as fiber optics, phones, satellites, and displays.
The document discusses silicon feedstock for the solar industry. It covers the following key points in 3 sentences:
1) Most PV systems are built using crystalline silicon, which is the second most abundant element in the Earth's crust after oxygen. Metallurgical grade silicon is produced in large quantities but requires further refining for solar cell use.
2) Solar grade silicon is produced through chemical processes using trichlorosilane or silane gases, or through metallurgical upgrading of metallurgical grade silicon. The dominant production technology is the Siemens process using trichlorosilane.
3) The polysilicon industry is consolidating with the largest producers having over 100,000 metric
The document discusses various types of functional materials including oxides, composites, polymers, conducting polymers, nanomaterials, and their properties and applications. It covers topics such as oxide structures of types AB, AB2, and ABO3; types and properties of composites; classes of polymers like thermosetting and thermoplastic and examples including TEFLON and BAKELITE; conducting polymers including polyacetylene and doping; OLED display devices; introduction to nanomaterials comparing bulk vs nano properties with example of quantum dots; top-down and bottom-up synthesis approaches; and properties of gold nanoparticles.
Quantum dots are semiconductors whose excitons are confined in all three dimensions of space, giving them properties between bulk semiconductors and atoms. They can be fabricated through lithography, colloidal synthesis, or epitaxy. Quantum dots have multiple applications including solar cells, biology, LEDs, displays, lasers, and sensors due to their size-dependent energy levels and strong light emission.
The document discusses various topics related to lithography. It begins by describing how a silicon wafer is prepared by polishing, sawing and doping to control its electrical properties. It then explains that photolithography involves coating a wafer with photoresist, exposing it to a photomask under UV light, and developing the resist to transfer the mask pattern. Several types of lithography are listed including photolithography, e-beam lithography and X-ray lithography. The document provides details on the photolithography process and discusses resolution limits of optical lithography.
Spin coating is a process that uses centrifugal force to spread a liquid solution evenly and create a thin film on a surface, such as a semiconductor wafer. It involves depositing fluid onto a substrate that is then spun to evenly distribute the fluid via centrifugal force. The spinning causes the coating to thin at a rate dependent on viscosity and spinning velocity until the solvent evaporates, leaving a uniform thin film of specific thickness. Spin coating is widely used in microelectronics manufacturing to apply coatings like photoresist and insulating layers. Common defects include bubbles, swirling patterns, and streaks caused by issues with deposition uniformity or process parameters.
- Dislocations are line defects in crystalline materials that allow for plastic deformation through slip and twinning. There are three main types of dislocations: edge, screw, and mixed.
- Slip occurs when a dislocation moves through the crystal on a specific slip plane in a slip direction under an applied shear stress. This motion explains how plastic deformation takes place.
- Strengthening mechanisms like decreasing grain size, solid solution strengthening, strain hardening, and precipitation strengthening make it harder for dislocations to slip by introducing obstacles in their path. This increases the critical resolved shear stress required for plastic deformation.
Ceramics materials prop thermal and mechanicaldelcacho
This chapter discusses traditional ceramics and engineering ceramics. Traditional ceramics are made from clay, silica, and feldspar and include structural clay products like bricks. Engineering ceramics contain more pure oxide compounds like Al2O3, Si3N4, SiC, and ZrO2. These ceramics have higher mechanical properties and are used in applications requiring resistance to heat, wear, and corrosion. The chapter also covers the properties, fabrication processes and common applications of glass.
Plasma etching is a key process in microelectronic device manufacturing that uses reactive gases and radio frequency power to chemically etch materials in an anisotropic manner. It offers advantages over wet etching such as better control, reproducibility, selectivity, and ability to produce vertical sidewalls. While more expensive than wet etching, plasma etching became widely adopted in the 1970s and enabled the manufacturing of smaller features needed for advancing microelectronics technology.
Thin film deposition using spray pyrolysisMUHAMMAD AADIL
Spray pyrolysis is a simple and low-cost thin film deposition technique that involves spraying a metal salt solution onto a heated substrate. As the droplets impact and spread on the substrate, thermal decomposition occurs, leaving a film of metal oxides. The substrate temperature is the main parameter that determines the film properties, as it influences processes like precursor decomposition and solvent evaporation. Varying the deposition temperature can control the film morphology and optical/electrical characteristics. The precursor solution composition also affects the film structure, as additives can modify the solution chemistry and change the resulting film morphology.
Editor: Eng. Mohamadreza Govahi
Mentor: Dr. Ehsan Borhani
Date of Presentation: Apr 2016, Semnan PN Univeristy
*Contents
~Introduction to MMCs
~Introduction to Aluminum MMCs (AMMCs)
~Ceramic Reinforcements in AMMCs
~Types and Morphology of Reinforcements
~Aluminum Nano-composites
~Producing Methods
~Comparison in Different Procedures
~Reviews of some Experiments And Researches
This document provides an overview of thin film deposition methods and thin film characterization techniques. It discusses the objectives of the course, which are to provide an understanding of thin film deposition methods, their capabilities and limitations. Hands-on demonstrations and experiments will help participants understand each deposition method and stimulate discussion. The document then summarizes various thin film deposition techniques like evaporation, sputtering, chemical vapor deposition, their principles and examples of applications. It also summarizes various characterization techniques used to analyze thin films and determine properties like composition, structure, thickness and defects.
If you have any questions, contact me. I would be happy to help.
PLEASE LIKE IT AND GIVE COMMENT
In this presentation,
The author gives the working principle of the PVD and Sputtering methods. But you can also find an information about the thin film and plasma phase of a matter.
Also this is related with Magnetron Sputtering method.
- Grazing incidence X-ray diffraction (GIXRD) is a technique that allows analyzing thin film samples by varying the incident angle of the X-rays to change their penetration depth.
- GIXRD provides enhanced signals from thin film layers compared to conventional XRD and helps distinguish thin film peaks from substrate peaks. It can also be used to analyze phases, stress, and crystal structure as a function of depth.
- Examples showed how GIXRD allowed analyzing phase composition and residual stress at different depths in thin film solar cell structures and revealed surface treatment effects in a stainless steel sample.
As most of modern devices are either getting smaller or requiring tinier components, the demand for plastic micro molding continues growing. Thus it is easy to guess - this presentation is going to dive us in peculiarities of micro injection molding technology.
This was SlideShare adapted from our companies blog post:
https://www.micromolds.eu/micromolding-in-depth-insights
Physical vapor deposition (PVD) involves depositing thin films onto surfaces through the condensation of vaporized material in vacuum conditions. There are various PVD techniques that vaporize material through processes like evaporation, sputtering, and pulsed laser deposition. Common applications of PVD coatings include improving hardness, wear resistance, and oxidation resistance for tools, medical devices, aerospace and automotive components. Magnetron sputtering is a widely used PVD technique that ejects material from a target using energetic ions from a plasma to deposit films for applications like semiconductor manufacturing.
Molecular beam epitaxy (MBE) is a method for growing thin films one layer at a time under ultra-high vacuum conditions. It involves heating solid sources of material in effusion cells to create molecular beams that are deposited on a heated substrate. The absence of carrier gases and ultra-high vacuum environment result in films of the highest purity. MBE is widely used to manufacture semiconductor devices and is considered a fundamental tool for nanotechnology development due to its precise control over layer thickness down to a single atomic layer.
Ic technology- chemical vapour deposition and epitaxial layer growthkriticka sharma
This document discusses chemical vapor deposition (CVD) and epitaxial layer growth techniques used in integrated circuit technology. It begins with an overview of CVD, describing the basic process and steps involved, including transport of reactants, adsorption, surface reactions, and removal of byproducts. It then covers various types of CVD systems like atmospheric pressure CVD, low pressure CVD, and plasma-enhanced CVD. The document also discusses epitaxial growth techniques like vapor phase epitaxy and molecular beam epitaxy. It explains concepts like lattice matching and defects that can occur during heteroepitaxial growth when the film and substrate materials have different lattice constants.
This document discusses molecular beam epitaxy (MBE), a process for depositing thin crystalline films. MBE involves heating pure elements in separate cells under high vacuum and allowing them to condense as a film on a substrate. It allows precise control over film thickness and composition to grow structures like semiconductor lasers. In-situ diagnostics like reflection high-energy electron diffraction (RHEED) are used to monitor growth. Challenges include the Ataro-Tiller-Grinfeld instability that can cause cracking in the film above a critical thickness if the substrate and film have a lattice mismatch.
Creep is the time-dependent deformation of a material under constant load at high temperatures. It occurs when a material is loaded below its yield strength and the load is maintained for an extended period of time, resulting in plastic deformation that increases over time. Creep can cause failure through rupture or excessive plastic deformation beyond a certain limit. The rate of creep deformation and time to rupture depend on factors like temperature, stress, and material microstructure. Creep becomes significant engineering issue at temperatures over 40% of the material's melting point.
Molecular beam epitaxy (MBE) is a technique for growing crystalline thin films one atomic layer at a time by heating a substrate and directing beams of molecules or atoms onto the substrate from various solid sources placed in evaporation cells. The technique allows for precise and pure layering of compound semiconductor materials less than 0.01 nanometers thick. MBE is used to produce complex semiconductor structures that can then be processed into electronic and optoelectronic devices like transistors, light-emitting diodes, solar cells, and lasers used in applications such as fiber optics, phones, satellites, and displays.
The document discusses silicon feedstock for the solar industry. It covers the following key points in 3 sentences:
1) Most PV systems are built using crystalline silicon, which is the second most abundant element in the Earth's crust after oxygen. Metallurgical grade silicon is produced in large quantities but requires further refining for solar cell use.
2) Solar grade silicon is produced through chemical processes using trichlorosilane or silane gases, or through metallurgical upgrading of metallurgical grade silicon. The dominant production technology is the Siemens process using trichlorosilane.
3) The polysilicon industry is consolidating with the largest producers having over 100,000 metric
The document discusses various types of functional materials including oxides, composites, polymers, conducting polymers, nanomaterials, and their properties and applications. It covers topics such as oxide structures of types AB, AB2, and ABO3; types and properties of composites; classes of polymers like thermosetting and thermoplastic and examples including TEFLON and BAKELITE; conducting polymers including polyacetylene and doping; OLED display devices; introduction to nanomaterials comparing bulk vs nano properties with example of quantum dots; top-down and bottom-up synthesis approaches; and properties of gold nanoparticles.
Quantum dots are semiconductors whose excitons are confined in all three dimensions of space, giving them properties between bulk semiconductors and atoms. They can be fabricated through lithography, colloidal synthesis, or epitaxy. Quantum dots have multiple applications including solar cells, biology, LEDs, displays, lasers, and sensors due to their size-dependent energy levels and strong light emission.
The document discusses various topics related to lithography. It begins by describing how a silicon wafer is prepared by polishing, sawing and doping to control its electrical properties. It then explains that photolithography involves coating a wafer with photoresist, exposing it to a photomask under UV light, and developing the resist to transfer the mask pattern. Several types of lithography are listed including photolithography, e-beam lithography and X-ray lithography. The document provides details on the photolithography process and discusses resolution limits of optical lithography.
Spin coating is a process that uses centrifugal force to spread a liquid solution evenly and create a thin film on a surface, such as a semiconductor wafer. It involves depositing fluid onto a substrate that is then spun to evenly distribute the fluid via centrifugal force. The spinning causes the coating to thin at a rate dependent on viscosity and spinning velocity until the solvent evaporates, leaving a uniform thin film of specific thickness. Spin coating is widely used in microelectronics manufacturing to apply coatings like photoresist and insulating layers. Common defects include bubbles, swirling patterns, and streaks caused by issues with deposition uniformity or process parameters.
- Dislocations are line defects in crystalline materials that allow for plastic deformation through slip and twinning. There are three main types of dislocations: edge, screw, and mixed.
- Slip occurs when a dislocation moves through the crystal on a specific slip plane in a slip direction under an applied shear stress. This motion explains how plastic deformation takes place.
- Strengthening mechanisms like decreasing grain size, solid solution strengthening, strain hardening, and precipitation strengthening make it harder for dislocations to slip by introducing obstacles in their path. This increases the critical resolved shear stress required for plastic deformation.
Ceramics materials prop thermal and mechanicaldelcacho
This chapter discusses traditional ceramics and engineering ceramics. Traditional ceramics are made from clay, silica, and feldspar and include structural clay products like bricks. Engineering ceramics contain more pure oxide compounds like Al2O3, Si3N4, SiC, and ZrO2. These ceramics have higher mechanical properties and are used in applications requiring resistance to heat, wear, and corrosion. The chapter also covers the properties, fabrication processes and common applications of glass.
Plasma etching is a key process in microelectronic device manufacturing that uses reactive gases and radio frequency power to chemically etch materials in an anisotropic manner. It offers advantages over wet etching such as better control, reproducibility, selectivity, and ability to produce vertical sidewalls. While more expensive than wet etching, plasma etching became widely adopted in the 1970s and enabled the manufacturing of smaller features needed for advancing microelectronics technology.
Thin film deposition using spray pyrolysisMUHAMMAD AADIL
Spray pyrolysis is a simple and low-cost thin film deposition technique that involves spraying a metal salt solution onto a heated substrate. As the droplets impact and spread on the substrate, thermal decomposition occurs, leaving a film of metal oxides. The substrate temperature is the main parameter that determines the film properties, as it influences processes like precursor decomposition and solvent evaporation. Varying the deposition temperature can control the film morphology and optical/electrical characteristics. The precursor solution composition also affects the film structure, as additives can modify the solution chemistry and change the resulting film morphology.
Editor: Eng. Mohamadreza Govahi
Mentor: Dr. Ehsan Borhani
Date of Presentation: Apr 2016, Semnan PN Univeristy
*Contents
~Introduction to MMCs
~Introduction to Aluminum MMCs (AMMCs)
~Ceramic Reinforcements in AMMCs
~Types and Morphology of Reinforcements
~Aluminum Nano-composites
~Producing Methods
~Comparison in Different Procedures
~Reviews of some Experiments And Researches
TEM, Transmission Electron Microscopy & Diffraction Patterns, by Mr. GovahiMohamadreza Govahi
Language: Persian/Farsi
Title: TEM, Transmission Electron Microscopy & Diffraction Patterns
Persian Title: میکروسکوپ الکترونی عبوری و الگوهای پراش
Editor: Eng.Mohamadreza Govahi
Mentor: Dr. Kazem Tahmasebi
Semnan PN University , 2015.