This document discusses using physics of failure (PoF) methodology to develop optimized test plans that are tailored to a product's specific design, materials, use environment, and reliability needs. It provides an overview of key aspects of test plan development including defining reliability goals and the use environment, identifying failure inducing loads, developing a comprehensive test plan, and ensuring change control processes and ongoing reliability testing are in place. The document also presents a case study of how PoF modeling was used to develop a test plan for microinverters intended for a 25-year lifespan in harsh outdoor solar installations.
Design for reliability (DFR) is an industry-wide practice and a philosophy of considering reliability in an early stage of product design and development, to achieve a highly-reliable product while with sustainable cost. Physical of Failure (PoF) is recognized as a key approach of implementing DFR in a product design and development process. The author will present a case study to illustrate predicting and identifying product failure early in the design phase with the help of a quantitative PoF model based analysis tool.
Physics of Failure (also known as Reliability Physics) is a science-based approach for achieving Reliability by Design. The approach is based on research to identify and understand the processes that initiate and propagate mechanisms that ultimately results in failure. This knowledge when used in Computer Aided Engineering (CAE) durability simulations and reliability assessment can evaluate if a new design, under actual operating is susceptible to the root causes of failure such as fatigue, fracture, wear, and corrosion during the intended service life of the product.
The objective is to identify and eliminate potential failure mechanisms in order to prevent operational failures through stress-strength analysis to produce a robust design and aid in the selection of capable manufacturing practices. This is accomplished by modeling the material strength and architecture of the components and technologies a product is based upon to evaluating their ability to endure the life-cycle usage and environmental stress conditions the product is expected to encounter over its service life in the field or during durability or reliability qualification tests.
The ability to identify and quantify the specific hazard risks timeline of specifics failure risks in a new product while it is still on the drawing board (or CAD screen) enables a product team to design reliability into a product by revising the design to eliminate or mitigate failure risks. This capability results in a form of Virtual Validation and Virtual Reliability Growth during the a product’s design phase that can be implemented faster and at lower costs than the traditional Design-Build-Test-Fixed approach to Reliability Growth during a product’s development and test phase.
This webinar compares classical reliability concepts and relates them to the PoF approach as applied to Electrical/Electronic (E/E) System and technologies. This webinar is intended for E/E Product Engineers, Validation/Test Engineers, Quality, Reliability and Product Assurance Personnel, CAE Modeling Analysts, R&D Staff and their supervisor.
The document discusses inspection methods for shell and tube heat exchangers. It describes various non-destructive testing (NDT) methods used to inspect heat exchanger tubing, including eddy current testing, remote field eddy current testing, segmented eddy current array, internal rotary inspection system, and magnetic flux leakage testing. It also discusses limitations and capabilities of each method and considerations for inspecting U-bend tubing and tube-to-tube sheet joints.
HALT is not just “shake and bake” but a test philosophy, we look at the stressors and the level of overstress used to obtain successful results in a wide variety of products. Modulated Excitation™ is offered as the key to intermittent failure detection; a true breakthrough for “no fault found” field returns. Finally latent failures from vibration are “developed” to where they are patent (visible to test) using moisture to complete the art failure detection.
This document summarizes a presentation on corrosion under insulation (CUI) and coatings for mitigating CUI. It discusses how CUI occurs due to moisture ingress under insulation and temperature cycling. Several coating types are described that can provide barrier protection for steel under insulation, including epoxy phenolic, silicone acrylic, thermal spray aluminum, titanium modified inorganic copolymers, and inert multipolymeric matrix paints. Test methods for evaluating CUI coatings like cyclic pipe tests and CUI chambers are also summarized. Real-world case studies show how some coatings have performed well under long-term cyclic service conditions.
Today, plastic packaged integrated circuits are ubiquitous even for high-reliability applications. Reliability testing and standards play a key role in reliability engineering to achieve the necessary reliability performance. Traditional stress-based standards are easy to use but often over- or under-stress units and don’t focus on key vulnerabilities, particularly moisture-related ones. Knowledge-based standards have evolved to fix this, but rely on knowledge of mechanisms, control of board manufacturing conditions, and understanding and specifying end use conditions. This motivates a survey of plastic package mechanisms and testing with particular focus on moisture-related mechanisms and testing. The moisture-related examples will cover HAST testing, and the “popcorn” mechanism.
Learning Objectives
1.Understand the philosophy and methods behind reliability testing of ICs as applied to plastic-packaged ICs.
2.Learn the historical development of the JEDEC temperature-humidity-bias (HAST) moisture reliability testing standard.
3.Get a practical overview of key thermal, thermo-mechanical, moisture (chemical), and moisture (“popcorn”) mechanisms.
4.Appreciate how transformation of environmental conditions to conditions at the site of failure in the package is used to “scale” reliability models.
CUI (Corrosion Under Insulation) poses a significant risk to chemical plants. The presentation discusses CUI, identifying loops susceptible to CUI, and outlining a strategy to inspect for and manage CUI risks. A four-point strategy is proposed: 1) identify high risk loops, 2) perform inspections and repairs, 3) continue monitoring, and 4) update the strategy based on inspection findings. Implementing a risk-based CUI management program can increase plant reliability.
Design for reliability (DFR) is an industry-wide practice and a philosophy of considering reliability in an early stage of product design and development, to achieve a highly-reliable product while with sustainable cost. Physical of Failure (PoF) is recognized as a key approach of implementing DFR in a product design and development process. The author will present a case study to illustrate predicting and identifying product failure early in the design phase with the help of a quantitative PoF model based analysis tool.
Physics of Failure (also known as Reliability Physics) is a science-based approach for achieving Reliability by Design. The approach is based on research to identify and understand the processes that initiate and propagate mechanisms that ultimately results in failure. This knowledge when used in Computer Aided Engineering (CAE) durability simulations and reliability assessment can evaluate if a new design, under actual operating is susceptible to the root causes of failure such as fatigue, fracture, wear, and corrosion during the intended service life of the product.
The objective is to identify and eliminate potential failure mechanisms in order to prevent operational failures through stress-strength analysis to produce a robust design and aid in the selection of capable manufacturing practices. This is accomplished by modeling the material strength and architecture of the components and technologies a product is based upon to evaluating their ability to endure the life-cycle usage and environmental stress conditions the product is expected to encounter over its service life in the field or during durability or reliability qualification tests.
The ability to identify and quantify the specific hazard risks timeline of specifics failure risks in a new product while it is still on the drawing board (or CAD screen) enables a product team to design reliability into a product by revising the design to eliminate or mitigate failure risks. This capability results in a form of Virtual Validation and Virtual Reliability Growth during the a product’s design phase that can be implemented faster and at lower costs than the traditional Design-Build-Test-Fixed approach to Reliability Growth during a product’s development and test phase.
This webinar compares classical reliability concepts and relates them to the PoF approach as applied to Electrical/Electronic (E/E) System and technologies. This webinar is intended for E/E Product Engineers, Validation/Test Engineers, Quality, Reliability and Product Assurance Personnel, CAE Modeling Analysts, R&D Staff and their supervisor.
The document discusses inspection methods for shell and tube heat exchangers. It describes various non-destructive testing (NDT) methods used to inspect heat exchanger tubing, including eddy current testing, remote field eddy current testing, segmented eddy current array, internal rotary inspection system, and magnetic flux leakage testing. It also discusses limitations and capabilities of each method and considerations for inspecting U-bend tubing and tube-to-tube sheet joints.
HALT is not just “shake and bake” but a test philosophy, we look at the stressors and the level of overstress used to obtain successful results in a wide variety of products. Modulated Excitation™ is offered as the key to intermittent failure detection; a true breakthrough for “no fault found” field returns. Finally latent failures from vibration are “developed” to where they are patent (visible to test) using moisture to complete the art failure detection.
This document summarizes a presentation on corrosion under insulation (CUI) and coatings for mitigating CUI. It discusses how CUI occurs due to moisture ingress under insulation and temperature cycling. Several coating types are described that can provide barrier protection for steel under insulation, including epoxy phenolic, silicone acrylic, thermal spray aluminum, titanium modified inorganic copolymers, and inert multipolymeric matrix paints. Test methods for evaluating CUI coatings like cyclic pipe tests and CUI chambers are also summarized. Real-world case studies show how some coatings have performed well under long-term cyclic service conditions.
Today, plastic packaged integrated circuits are ubiquitous even for high-reliability applications. Reliability testing and standards play a key role in reliability engineering to achieve the necessary reliability performance. Traditional stress-based standards are easy to use but often over- or under-stress units and don’t focus on key vulnerabilities, particularly moisture-related ones. Knowledge-based standards have evolved to fix this, but rely on knowledge of mechanisms, control of board manufacturing conditions, and understanding and specifying end use conditions. This motivates a survey of plastic package mechanisms and testing with particular focus on moisture-related mechanisms and testing. The moisture-related examples will cover HAST testing, and the “popcorn” mechanism.
Learning Objectives
1.Understand the philosophy and methods behind reliability testing of ICs as applied to plastic-packaged ICs.
2.Learn the historical development of the JEDEC temperature-humidity-bias (HAST) moisture reliability testing standard.
3.Get a practical overview of key thermal, thermo-mechanical, moisture (chemical), and moisture (“popcorn”) mechanisms.
4.Appreciate how transformation of environmental conditions to conditions at the site of failure in the package is used to “scale” reliability models.
CUI (Corrosion Under Insulation) poses a significant risk to chemical plants. The presentation discusses CUI, identifying loops susceptible to CUI, and outlining a strategy to inspect for and manage CUI risks. A four-point strategy is proposed: 1) identify high risk loops, 2) perform inspections and repairs, 3) continue monitoring, and 4) update the strategy based on inspection findings. Implementing a risk-based CUI management program can increase plant reliability.
The document provides procedures for well integrity testing of suspended wells. It outlines testing the suspension valve(s) integrity by pressurizing and monitoring for pressure change over 10 minutes. If pressure does not exceed allowable leak rates, the test passes. It also describes testing the downhole plug integrity by bleeding off pressure above the plug and monitoring for returns, failing the test if pressure cannot be bled down or returns exceed storage. The document aims to confirm well suspension and valve integrity for different well types.
Reliability prediction of electronic componentsPRANAY GUPTA
The document discusses reliability prediction for electronics components and products. Reliability prediction should be integrated from the beginning of the design phase to obtain high product reliability. This leads to the concept of reliability prediction. There are three main methods for reliability prediction: life testing, physics of failure analysis, and empirical or standards-based methods. Life testing uses statistical analysis of failures from testing samples at operational stresses. Physics of failure is based on understanding failure mechanisms and material properties. Empirical methods use statistical models developed from historical failure data for similar components. Standards like MIL-HDBK-217F provide empirical models to predict reliability for electronics parts in terms of failure rates.
The document discusses Tan Delta testing of medium voltage cables. It provides basics on cable insulation aging processes, defines Tan Delta as a measurement of the ratio of resistive to capacitive current in a cable, and explains that increasing Tan Delta values indicate worsening cable insulation condition. The document also outlines test parameters, how to interpret results based on IEEE criteria, and how to perform a Tan Delta test.
This document provides an overview of a Design for Reliability (DFR) seminar presented by Mike Silverman of Ops A La Carte LLC. The seminar covers DFR concepts and tools over two days, with sessions on topics like planning for reliability, failure mode analysis, accelerated testing techniques, and root cause analysis. The document includes biographical information about Mike Silverman, the seminar schedule and objectives, an overview of the consulting company Ops A La Carte, and a high-level discussion distinguishing DFR from a "toolbox" approach and outlining the key activities in a structured DFR process.
Reliability engineering deals with studying, evaluating, and managing the reliability of systems and components. It aims to ensure equipment operates reliably under all conditions as required. As systems become more complex with many interconnected parts, the overall reliability decreases unless the reliability of individual components is improved. Reliability engineering applies principles of probability and statistics to analyze failure rates and availability of systems. It is important for fields such as aviation, defense, and healthcare where failure could result in dangerous situations.
This document describes an upcoming webinar on Probabilistic Design for Reliability (PDfR) in Electronics. The webinar will be presented over four sessions from January 3-6, 2011 by Dr. E. Suhir. Session I will introduce PDfR and discuss the role of Failure Oriented Accelerated Testing (FOAT) and its interaction with other accelerated test categories. Session II will cover Predictive Modeling (PM) and an example FOAT case study. Session III will discuss the role and significance of PDfR. Session IV will describe the general PDfR approach and steps to add value to existing practices, as well as discuss whether new qualification testing approaches are needed in
Practical handbook-for-relay-protection-engineersSARAVANAN A
The ‘Hand Book’ covers the Code of Practice in Protection Circuitry including standard lead and device numbers, mode of connections at terminal strips, colour codes in multicore cables, Dos and Donts in execution. Also, principles of various protective relays and schemes including special protection schemes like differential,
restricted, directional and distance relays are explained with sketches. The norms of protection of generators, transformers, lines & Capacitor Banks are also given.
Piping and instrumentation diagrams (P&IDs) are complex diagrams that show the piping, instrumentation, and process flow in chemical plants. The presentation discusses P&IDs in detail, including:
1. The purpose of P&IDs in understanding chemical processes, operations, and maintenance.
2. The various standards and symbols used to represent equipment, piping, instruments, and their interconnectivity.
3. How P&IDs are developed through various stages and used by different engineering departments and industries for design and operations.
4. Examples of software that can be used to create detailed P&IDs.
PLC and Industrial Automation - Technology OverviewNereus Fernandes
The document provides an overview of programmable logic controllers (PLCs) and industrial automation. It discusses PLC types, programming languages, protocols, connectivity to SCADA/HMI systems, and emerging technologies. The document also outlines an agenda covering topics like PLC selection, programming guidelines, industrial automation hierarchies, and the integration of PLCs with technologies like IoT, cloud computing, and augmented reality.
This document provides an overview of piping materials and selection guidelines. It defines key piping terms like pipe and tubing. It describes various types of pipes based on the manufacturing method, such as electric resistance welded pipe, furnace butt welded pipe, seamless pipes, and more. The document outlines factors to consider for material selection like design life, temperature, pressure, corrosion allowance, service conditions, and economics. It provides specific guidelines for material selection for high temperature exposures above 232°C and ambient/intermediate temperatures from 0°C to 232°C. The focus is on selecting materials that will be resistant to various deterioration modes over the design life of the piping system.
EN ISO 9606-1 Kaynakçıların yeterlilik sınavı - MART 2014
EN ISO 9606-1’e göre kaynakçı belgelendirmesi semineri
Kaynak pozisyonu
Ergitme kaynağı
Kaynak malzemeleri
This document provides guidance for carrying out pre-commissioning checks and tests for switchyard equipment at Power Grid Corporation of India Ltd. It outlines the constitution and responsibilities of the commissioning team, general safety procedures, documentation requirements, and pre-commissioning formats for recording test results. Specific guidance is provided for transformers, reactors, and other switchyard equipment such as circuit breakers, current transformers, surge arresters, and more. The aim is to ascertain the correctness and completeness of installation and healthiness of equipment before charging.
Online DGA Monitoring of Power Transformers Vaisala Group
In this webinar, we will review some of the fundamentals of dissolved gas analysis for power transformers. In addition to the topics below, we will also share data from field tests of Vaisala online monitors.
The document provides information for a piping inspector, including:
1. The duties of a piping inspector are to ensure piping activities such as material receiving, fabrication, erection, testing, and re-instatement comply with Saudi Aramco specifications and procedures.
2. Inspection is to be carried out according to Schedule Q, Saudi Aramco standards and specifications, and approved procedures and ITPs.
3. Piping construction drawings include plans, arrangements, supports, details, hook-ups, schedules, P&IDs, and isometrics.
Presentacion asme seccion viii division 2 2013leo040490
This document outlines steps for developing a quality control system manual (QCSM) to meet ASME Section VIII Division 2 regulations for pressure vessel certification. The key steps include:
1. Applying to ASME and the National Board for certification.
2. Developing detailed design calculations, drawings, materials specifications, and fabrication and inspection procedures meeting code requirements.
3. Implementing the QCSM in the shop and warehouses, and distributing it to all relevant personnel, to ensure all code requirements are met during construction.
4. Scheduling audits by the Authorized Inspector to confirm readiness for joint review and certification.
Accelerated life testing plans are designed under multiple objective consideration, with the resulting Pareto optimal solutions classified and reduced using neural network and data envelopement analysis, respectively.
This document provides guidance for inspectors on paints and coatings. It outlines approved coating systems for various applications and services, including internal and external pipe coatings for buried, insulated, and atmospheric exposure conditions. It also provides standards on surface preparation, coating application, thickness measurement, and repair. Inspectors are instructed to follow the coating manufacturer's recommendations and use properly calibrated equipment to ensure coatings meet thickness and cure requirements.
The document discusses potential issues with using MTBF/MTTF as the primary reliability metric for the defense and aerospace industries. It argues that MTBF/MTTF provides an incomplete view of reliability across the entire product lifecycle and can result in overly optimistic assessments. The document proposes using an alternative metric called Bx/Lx, which specifies the life point where no more than a certain percentage (like 10%) of failures have occurred. This provides a more comprehensive view of reliability focused on early failures. Overall, the document advocates updating reliability metrics and practices to better reflect physical failure mechanisms.
Oil and-gas-facilities-and-pipelines-110906055120-phpapp01Philippe Porta
The document summarizes KBR's expertise in designing and executing oil and gas facilities and pipeline projects. It describes a project in Algeria where KBR designed carbon capture and storage facilities. It highlights KBR's ability to deliver projects on schedule and budget while balancing logistics, safety and sustainability even in remote locations. KBR has over 30 years of experience successfully delivering complex projects.
This document provides requirements for the selection and application of protective coatings for industrial plants and equipment. It covers scope, conflicts and deviations, references, definitions, health and safety, general requirements, coating material selection, surface preparation, coating application, inspection and testing, and approved coating systems. The document is intended to establish minimum mandatory requirements for new and existing onshore industrial facilities to properly select and apply coatings for corrosion protection.
Using Nanocoatings: Opportunities & Challenges for Medical DevicesCheryl Tulkoff
There is significant opportunity for improvements in contamination prevention, field performance and cost of medical devices through the use of biocompatible nanocoatings. To be successful using these coatings requires knowledge of the materials and processes on the market, the regulatory status, and the benefits versus risks.
This presentation will provide a clear understanding of the current state of nanocoating technology for medical devices and electronics. There has been an explosion in new coating technologies over the past 24 months. The use of nanocoatings has been driven by the desire for moisture proofing, providing an oxygen barrier ( a hermeticity option) and mitigating tin whiskers. Successful adoption of these coating technologies can lead to improved performance and market differentiation. Inappropriate adoption can drive higher failure rates, recalls and alienation of customers. Obtaining relevant reliability and quality information can be difficult. The information is often segmented for different markets; and, the focus is on the opportunities, not the risks. The primary information sources are either marketing material or confusing, scientific studies. Where is the practical advice?
The document provides procedures for well integrity testing of suspended wells. It outlines testing the suspension valve(s) integrity by pressurizing and monitoring for pressure change over 10 minutes. If pressure does not exceed allowable leak rates, the test passes. It also describes testing the downhole plug integrity by bleeding off pressure above the plug and monitoring for returns, failing the test if pressure cannot be bled down or returns exceed storage. The document aims to confirm well suspension and valve integrity for different well types.
Reliability prediction of electronic componentsPRANAY GUPTA
The document discusses reliability prediction for electronics components and products. Reliability prediction should be integrated from the beginning of the design phase to obtain high product reliability. This leads to the concept of reliability prediction. There are three main methods for reliability prediction: life testing, physics of failure analysis, and empirical or standards-based methods. Life testing uses statistical analysis of failures from testing samples at operational stresses. Physics of failure is based on understanding failure mechanisms and material properties. Empirical methods use statistical models developed from historical failure data for similar components. Standards like MIL-HDBK-217F provide empirical models to predict reliability for electronics parts in terms of failure rates.
The document discusses Tan Delta testing of medium voltage cables. It provides basics on cable insulation aging processes, defines Tan Delta as a measurement of the ratio of resistive to capacitive current in a cable, and explains that increasing Tan Delta values indicate worsening cable insulation condition. The document also outlines test parameters, how to interpret results based on IEEE criteria, and how to perform a Tan Delta test.
This document provides an overview of a Design for Reliability (DFR) seminar presented by Mike Silverman of Ops A La Carte LLC. The seminar covers DFR concepts and tools over two days, with sessions on topics like planning for reliability, failure mode analysis, accelerated testing techniques, and root cause analysis. The document includes biographical information about Mike Silverman, the seminar schedule and objectives, an overview of the consulting company Ops A La Carte, and a high-level discussion distinguishing DFR from a "toolbox" approach and outlining the key activities in a structured DFR process.
Reliability engineering deals with studying, evaluating, and managing the reliability of systems and components. It aims to ensure equipment operates reliably under all conditions as required. As systems become more complex with many interconnected parts, the overall reliability decreases unless the reliability of individual components is improved. Reliability engineering applies principles of probability and statistics to analyze failure rates and availability of systems. It is important for fields such as aviation, defense, and healthcare where failure could result in dangerous situations.
This document describes an upcoming webinar on Probabilistic Design for Reliability (PDfR) in Electronics. The webinar will be presented over four sessions from January 3-6, 2011 by Dr. E. Suhir. Session I will introduce PDfR and discuss the role of Failure Oriented Accelerated Testing (FOAT) and its interaction with other accelerated test categories. Session II will cover Predictive Modeling (PM) and an example FOAT case study. Session III will discuss the role and significance of PDfR. Session IV will describe the general PDfR approach and steps to add value to existing practices, as well as discuss whether new qualification testing approaches are needed in
Practical handbook-for-relay-protection-engineersSARAVANAN A
The ‘Hand Book’ covers the Code of Practice in Protection Circuitry including standard lead and device numbers, mode of connections at terminal strips, colour codes in multicore cables, Dos and Donts in execution. Also, principles of various protective relays and schemes including special protection schemes like differential,
restricted, directional and distance relays are explained with sketches. The norms of protection of generators, transformers, lines & Capacitor Banks are also given.
Piping and instrumentation diagrams (P&IDs) are complex diagrams that show the piping, instrumentation, and process flow in chemical plants. The presentation discusses P&IDs in detail, including:
1. The purpose of P&IDs in understanding chemical processes, operations, and maintenance.
2. The various standards and symbols used to represent equipment, piping, instruments, and their interconnectivity.
3. How P&IDs are developed through various stages and used by different engineering departments and industries for design and operations.
4. Examples of software that can be used to create detailed P&IDs.
PLC and Industrial Automation - Technology OverviewNereus Fernandes
The document provides an overview of programmable logic controllers (PLCs) and industrial automation. It discusses PLC types, programming languages, protocols, connectivity to SCADA/HMI systems, and emerging technologies. The document also outlines an agenda covering topics like PLC selection, programming guidelines, industrial automation hierarchies, and the integration of PLCs with technologies like IoT, cloud computing, and augmented reality.
This document provides an overview of piping materials and selection guidelines. It defines key piping terms like pipe and tubing. It describes various types of pipes based on the manufacturing method, such as electric resistance welded pipe, furnace butt welded pipe, seamless pipes, and more. The document outlines factors to consider for material selection like design life, temperature, pressure, corrosion allowance, service conditions, and economics. It provides specific guidelines for material selection for high temperature exposures above 232°C and ambient/intermediate temperatures from 0°C to 232°C. The focus is on selecting materials that will be resistant to various deterioration modes over the design life of the piping system.
EN ISO 9606-1 Kaynakçıların yeterlilik sınavı - MART 2014
EN ISO 9606-1’e göre kaynakçı belgelendirmesi semineri
Kaynak pozisyonu
Ergitme kaynağı
Kaynak malzemeleri
This document provides guidance for carrying out pre-commissioning checks and tests for switchyard equipment at Power Grid Corporation of India Ltd. It outlines the constitution and responsibilities of the commissioning team, general safety procedures, documentation requirements, and pre-commissioning formats for recording test results. Specific guidance is provided for transformers, reactors, and other switchyard equipment such as circuit breakers, current transformers, surge arresters, and more. The aim is to ascertain the correctness and completeness of installation and healthiness of equipment before charging.
Online DGA Monitoring of Power Transformers Vaisala Group
In this webinar, we will review some of the fundamentals of dissolved gas analysis for power transformers. In addition to the topics below, we will also share data from field tests of Vaisala online monitors.
The document provides information for a piping inspector, including:
1. The duties of a piping inspector are to ensure piping activities such as material receiving, fabrication, erection, testing, and re-instatement comply with Saudi Aramco specifications and procedures.
2. Inspection is to be carried out according to Schedule Q, Saudi Aramco standards and specifications, and approved procedures and ITPs.
3. Piping construction drawings include plans, arrangements, supports, details, hook-ups, schedules, P&IDs, and isometrics.
Presentacion asme seccion viii division 2 2013leo040490
This document outlines steps for developing a quality control system manual (QCSM) to meet ASME Section VIII Division 2 regulations for pressure vessel certification. The key steps include:
1. Applying to ASME and the National Board for certification.
2. Developing detailed design calculations, drawings, materials specifications, and fabrication and inspection procedures meeting code requirements.
3. Implementing the QCSM in the shop and warehouses, and distributing it to all relevant personnel, to ensure all code requirements are met during construction.
4. Scheduling audits by the Authorized Inspector to confirm readiness for joint review and certification.
Accelerated life testing plans are designed under multiple objective consideration, with the resulting Pareto optimal solutions classified and reduced using neural network and data envelopement analysis, respectively.
This document provides guidance for inspectors on paints and coatings. It outlines approved coating systems for various applications and services, including internal and external pipe coatings for buried, insulated, and atmospheric exposure conditions. It also provides standards on surface preparation, coating application, thickness measurement, and repair. Inspectors are instructed to follow the coating manufacturer's recommendations and use properly calibrated equipment to ensure coatings meet thickness and cure requirements.
The document discusses potential issues with using MTBF/MTTF as the primary reliability metric for the defense and aerospace industries. It argues that MTBF/MTTF provides an incomplete view of reliability across the entire product lifecycle and can result in overly optimistic assessments. The document proposes using an alternative metric called Bx/Lx, which specifies the life point where no more than a certain percentage (like 10%) of failures have occurred. This provides a more comprehensive view of reliability focused on early failures. Overall, the document advocates updating reliability metrics and practices to better reflect physical failure mechanisms.
Oil and-gas-facilities-and-pipelines-110906055120-phpapp01Philippe Porta
The document summarizes KBR's expertise in designing and executing oil and gas facilities and pipeline projects. It describes a project in Algeria where KBR designed carbon capture and storage facilities. It highlights KBR's ability to deliver projects on schedule and budget while balancing logistics, safety and sustainability even in remote locations. KBR has over 30 years of experience successfully delivering complex projects.
This document provides requirements for the selection and application of protective coatings for industrial plants and equipment. It covers scope, conflicts and deviations, references, definitions, health and safety, general requirements, coating material selection, surface preparation, coating application, inspection and testing, and approved coating systems. The document is intended to establish minimum mandatory requirements for new and existing onshore industrial facilities to properly select and apply coatings for corrosion protection.
Using Nanocoatings: Opportunities & Challenges for Medical DevicesCheryl Tulkoff
There is significant opportunity for improvements in contamination prevention, field performance and cost of medical devices through the use of biocompatible nanocoatings. To be successful using these coatings requires knowledge of the materials and processes on the market, the regulatory status, and the benefits versus risks.
This presentation will provide a clear understanding of the current state of nanocoating technology for medical devices and electronics. There has been an explosion in new coating technologies over the past 24 months. The use of nanocoatings has been driven by the desire for moisture proofing, providing an oxygen barrier ( a hermeticity option) and mitigating tin whiskers. Successful adoption of these coating technologies can lead to improved performance and market differentiation. Inappropriate adoption can drive higher failure rates, recalls and alienation of customers. Obtaining relevant reliability and quality information can be difficult. The information is often segmented for different markets; and, the focus is on the opportunities, not the risks. The primary information sources are either marketing material or confusing, scientific studies. Where is the practical advice?
Testing modules for potential-induced degradation – a status update of IEC 62804Claudio Liciotti
Testing modules for potential-induced degradation – a status update of IEC 62804
Peter Hacke
National Renewable Energy Laboratory (NREL)
PV Module Reliability Workshop
February 25-26, 2014
Golden, Colorado
• IEC 62804 draft has been revised to be a method for test
TEST METHOD FOR DETECTION OF POTENTIAL INDUCED DEGRADATION OF PHOTOVOLTAIC (PV) MODULES
– No pass/fail criteria
– Contains a foil test and a damp heat test
– Provides details on how to set up tests
– Provides stress conditions for use as baseline allowing for comparisons
– International task group
• M. Koehl (Germany)
• C. Liciotti (Italy)
• F. Rummens (Belgium)
• F. Fabero Spain)
• K. Berger (Austria)
• Y. Eguchi (Japan)
• P. Hacke (USA)
• Comparison of stresses and degradation rate for 25° C / foil and 60°C/85% RH damp heat test
• Illumination factor on PID rate
• Measurement techniques and stress levels
discussion
Semiconductor test engineering is the process of screening semiconductor devices to remove defective parts before shipment. This is done through testing to detect defects rather than prove the devices work as intended. The goal is to ensure high quality by catching manufacturing defects. If untested devices were shipped, many faulty ones could reach customers. Test engineering develops programs and hardware to efficiently test large volumes of devices in parallel while subjecting them to stress conditions to reveal marginal defects. It is important for achieving high yield and low cost.
This document discusses optimal methods for handling data at scale in hard disk drives (HDDs). It addresses two core problems in HDD reliability: avoiding unmanageable failures during warranty periods and developing predictive analytics for failures. The document outlines the classical "bathtub curve" reliability model and limitations, including that mean time to failure alone is insufficient without considering workload and temperature effects. Workload, measured in terabytes transferred, is identified as a critical reliability parameter rather than time, with mean petabytes to failure proposed as a more suitable reliability metric.
The document discusses hazard identification techniques used in process facilities, including:
- Preliminary Hazard Analysis which identifies hazards from raw materials, equipment, facilities, and other factors in early design stages.
- HAZOP (Hazard and Operability Study) which is a systematic technique applied to small parts of a design to identify deviations from design intent, their causes and consequences, and recommendations.
- Guidelines for applying techniques like HAZOP include considering parameters like flow, pressure, temperature, and using guidewords to identify potential deviations from design intent.
Sample rel assement a company -sov reliability assessment criteriaTom Jacyszyn
You know you reviewed a document. You decide you need some leveler, some way to consistently document the Reliability of an item (not just a prediction, various criteria)
(from the What's in your Wallet series - Reliability)
Enhancing & Predicting Auto Reliability Using Physics of Failure Software Mod...Cheryl Tulkoff
Background
A leading U.S. automotive manufacturer initiated an update to their product qualification process to help accelerate development and deliver new products to market sooner. To accomplish this goal, the duration of the accelerated life test was reduced by increasing the severity and decreasing the duration of the temperature cycle.
During an initial trial of this updated qualification test on an electronic module, several components experienced failure. A failure analysis identified the failure mode as solder joint fatigue. Contrary to the original intent, these unexpected failures introduced significant delay as the two parties, customer and supplier, worked to determine the root-cause of these failures and their relevance to actual field environments.
Solution
To help accelerate this process, and provide quantitative findings, an analysis of the module design using Sherlock was performed. Sherlock Automated Design Analysis software uses a Physics of Failure analysis to allow design and reliability engineers to predict and prevent product failure earlier in the design process saving time, money, and improving product performance.
Results
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Test Plan Development using Physics of Failure: The DfR Solutions Approach
1. 1
Test Plan Development using Physics of Failure: The DfR Solutions Approach
Cheryl Tulkoff, ASQ CRE
ctulkoff@dfrsolutions.com
2. 2
Introduction
oAgenda
oIntroduction to Test Plan Development
oIntroduction to Physics of Failure Methodology for Test Plan Development
oVirtual Qualification Option
oAfter Release
oCase Study
Power Cycling
Vibration
Temperature/
Humidity
Mechanical Shock
Temperature Cycling
3. 3
oHow can you be sure that you have the best test plans for your specific need?
oDfR Solutions has worked closely with over 500 OEMs in multiple industries developing hundreds (thousands??) of test plans.
oDfR Solutions experts have written product specs for these organizations.
oThrough close collaboration with industry leading electronics manufacturers and deep industry knowledge, DfR Solutions delivers the right test for the right product every time!
Test Plan Development
4. 4
Test Plan Development
oProduct test plans are critical to the success of a new product or technology
oStressful enough to identify defects
oShow correlation to a realistic environment
oDfR Solutions approach
oIndustry Standards + Physics of Failure
oResults in an optimized test plan that is acceptable to management and customers
•MIL-STD-810,
•MIL-HDBK-310,
•SAE J1211,
•IPC-SM-785,
•Telcordia GR3108,
•IEC 60721-3, etc.
•PoF!
5. 5
oPoF Definition: The use of science (physics, chemistry, etc.) to capture an understanding of failure mechanisms and evaluate useful life under actual operating conditions
oUsing PoF, design, perform, and interpret the results of accelerated life tests
oStarting at design stage
oContinuing throughout the lifecycle of the product
oStart with standard industry specifications
oModify or exceed them
oTailor test strategies specifically for the individual product design and materials, the use environment, and reliability needs
Physics of Failure (PoF)
6. 6
Industry Testing Falls Short
oLimited degree of mechanism-appropriate testing
oOnly at transition to new technology nodes
oMechanism-specific coupons (not real devices)
oTest data is hidden from end-users
oQuestionable JEDEC tests are promoted to OEMs
oLimited duration (1000 hrs) hides wearout behavior
oUse of simple activation energy, with incorrect assumption that all mechanisms are thermally activated, can result in overestimation of FIT by 100X or more
7. 7
oFailure of a physical device or structure (i.e. hardware) can be attributed to the gradual or rapid degradation of the material(s) in the device in response to the stress or combination of stresses the device is exposed to, such as:
oThermal, Electrical, Chemical, Moisture, Vibration, Shock, Mechanical Loads . . .
oFailures May Occur:
oPrematurely
oGradually
oErratically
Physics of Failure Definitions
9. 9
Define Reliability Goals
oIdentify and document two key metrics
oDesired lifetime
oDefined as time the customer is satisfied with
oShould be actively used in development of part and product qualification
oProduct performance
oReturns during the warranty period
oSurvivability over lifetime at a set confidence level
oMTBF or MTTF (try to avoid unless required by customer)
9
10. 10
Test Plan Development – Define Use Environment
oThe critical first step is a good understanding of the shipping and use environment for the product.
oDo you really understand the customer and how they use your product (even the corner cases)?
oHow well is the product protected during shipping (truck, ship, plane, parachute, storage, etc.)?
oDo you have data or are you guessing?
oTemp/humidity, thermal cycling, ambient temp/operating temp.
oSalt, sulfur, dust, fluids, etc.
oMechanical cycles (lid cycling, connector cycling, torsion, etc.)
10
11. 11
Identify Use Environment
o Old School Approach: Use of industry/military specifications
oMilitary, IPC, Telcordia, ASTM…..
oAdvantages
oNo additional cost!
oSometimes very comprehensive
oAgreement throughout the industry
oMissing information? Consider standards from other industries
oDisadvantages
oMost more than 20 years old
oAlways less or greater than actual (by how much, unknown)
IPC SM785
MIL HDBK310
12. 12
Use Environment (cont.)
oBetter Approach: Based on actual measurements of similar products in similar environments
oDetermine average and realistic worst-case
oIdentify all failure-inducing loads
oInclude all environments
oManufacturing
oTransportation
oStorage
oField
13. 13
Examples of Failure Inducing Loads
•Temperature Cycling
–Tmax, Tmin, dwell, ramp times
•Sustained Temperature
–T and exposure time
•Humidity
–Controlled, condensation
•Corrosion
–Salt, corrosive gases (Cl2, etc.)
•Power cycling
–Duty cycles, power dissipation
•Electrical Loads
–Voltage, current, current density
–Static and transient
•Electrical Noise
•Mechanical Bending (Static and Cyclic)
–Board-level strain
•Random Vibration
–PSD, exposure time, kurtosis
•Harmonic Vibration
–G and frequency
•Mechanical shock
–G, wave form, # of events
Reliability Improvement with Design of Experiment, Second Edition, By Lloyd Condra
14. 14
Use Environment: Best Practice
oUse standards when…
oCertain aspects of your environment are common
oNo access to real use environment
oMeasure when…
oCertain aspects of your environment are unique
oStrong relationship with customer
oDo not mistake test specifications for the actual use environment
oCommon mistake
15. 15
Failure-Inducing Load Example: Electrical Environments
oOften very well-defined in developed countries
oIntroduction into developing countries can sometimes cause surprises
oRules of thumb
oChina: Can have issues with grounding (connected to rebar?)
oIndia: Numerous brownouts (several a day)
oMexico: Voltage surges
16. 16
Failure Inducing Temperature: Transport & Storage
Container and Ambient Temperature
15.0
25.0
35.0
45.0
55.0
65.0
75.0
0 50 100 150 200 250 300 350 400 450
Hours
Temperature (°C)
Container Temp (°C)
Outdoor Temp (°C) Temp.
Variation
In a
Trucking
Container
17. 17
Temperature: Long-Term Exposure
o For electronics used outside with minimal power dissipation, the diurnal
(daily) temperature cycle provides the primary degradation-inducing
load
Month Cycles/Year Ramp Dwell Max. Temp (oC) Min. Temp. (oC)
Jan.+Feb.+Dec. 90 6 hrs 6 hrs 20 5
March+November 60 6 hrs 6 hrs 25 10
April+October 60 6 hrs 6 hrs 30 15
May+September 60 6 hrs 6 hrs 35 20
June+July+August 90 6 hrs 6 hrs 40 25
Phoenix, AZ
18. 18
Humidity / Moisture (Rules of Thumb)
oNon-condensing
oStandard during operation, even in outdoor applications
oDue to power dissipation
oCondensing
oCan occur in sleep mode or non-powered
oDriven by mounting configuration (attached to something at lower temperature?)
oDriven by rapid change in environment
oCan lead to standing water if condensation on housing
oStanding water
oIndirect spray, dripping water, submersion, etc.
oOften driven by packaging
19. 19
General Test Plan Development Outline – PCBA Example
oComponent qualification (with end product in mind)
oThermal cycling, high temp, T&H, etc.
oPCBA qualification
oThermal cycling
oHALT/HAST
oDrop/shock
oHeat age
oSystem level qualification
oShock and Vibration
oDust testing
oTorsion
oEtc.
19
20. 20
Test Plan Development – for PCBAs continued…
oDevelop a comprehensive test plan
oAssemble boards at optimum conditions
oRework specified components on some boards
oVisually inspect and electrically test
oC-SAM & X-ray inspect critical components on 5 or more boards (+3 reworked for BGAs)
oUse these boards for further reliability testing (TC, HALT, S&V)
oPerform failure analysis
oCompile results and review
21. 21
21
Assemble at Optimum Conditions 66 pcs
Visual Inspection 66 pcs
Electrical Continuity Test (DC devices) 66 pcs
Send to Intel 10 pcs
X-Section Analysis (Devices ?) 2 pcs
Thermal Cycle Test (0/100C) 12 pcs
X-Section Analysis
(Devices ?)
1 pcs
Non-Op + Cont (S & V)
4 pcs
X-Section Analysis (Devices ?) 1 pcs
Square Wave (S & V) 4 pcs
X-Section Analysis (Devices ?) 1 pcs
2
4
4
1
1
4
HALT (Duration ?) 4 pcs
X-Section Analysis (Devices ?) 1 pcs
4
1
1
Dye / Pry Analysis
(Devices ?)
1 pcs
1
1
4
1
Dye / Pry Analysis (Devices ?) 1 pcs
Dye / Pry Analysis (Devices ?) 4 pcs
Dye / Pry Analysis (Devices ?) 1 pcs
Thermal + Non-Op +Cont (S & V)
4 pcs
X-Section Analysis
(Devices ?)
1 pcs
1
Dye / Pry Analysis (Devices ?) 1 pcs
1
12
10
Example of a Test Plan (Notebooks)
Use for Rework Section*
25 pcs
25
1
2
2
7
2
2
NOTES:
* - Rework should follow the supplier’s standard
process for removing and replacing components
Number in lower right corner of box represents
Remaining quantity from that test element.
22. 22
oEffective failure analysis is critical to reliability!
oWithout identifying the root causes of failure, true corrective action cannot be implemented
oRisk of repeat occurrence increases
oUse a systematic approach to failure analysis
oProceed from non-destructive to destructive methods until all root causes are identified.
oTechniques based upon the failure information specific to the problem.
oFailure history, failure mode, failure site, failure mechanism
Don’t Overlook Failure Analysis!
23. 23
Virtual Qualification (VQ, Modeling)
oThis assessment uses physics-of-failure-based degradation models to predict time-to-failure
oModels include
oInterconnect fatigue (solder joint and plated-through hole)
oCapacitor failure (electrolytic and ceramic)
oIntegrated circuit wearout
oCustomers develop a degree of assurance that their product will survive for the desired lifetime in the expected use environment
24. 24
Sherlock ADA – A Reliability Assurance CAE Tool Suite - the Physics of Failure App.
It is not at the Iphone or Droid App store.
But yes there is now a Physics of Failure Durability Simulation App
24
25. 25
The 4 Parts of a Sherlock PoF Analysis
1)Design Capture - provide industry standard inputs to the modeling software and calculation tools
2)Life-Cycle Characterization - define the reliability/durability objectives and expected environmental & usage conditions (Field or Test) under which the device is required to operate
3)Load Transformation – automated calculations that translates and distributes the environmental and operational loads across a circuit board to the individual parts
4)PoF Durability Simulation/Reliability Analysis & Risk Assessment – Performs a design and application specific durability simulation to calculates life expectations, reliability distributions & prioritizes risks by applying PoF algorithms to the PCBA model
25
26. 26
oLighting products customer was attempting to develop a product qualification plan
oSherlock identified appropriate test time and test condition based on field environment and likely failure mechanism
PoF Modeling & Test Plan Development
27. 27
When to Repeat Testing: Change Control
oInadequate change control is responsible for many (some would say most) field failures.
oExamples would include
oBurning Li notebook batteries
oElectrolytic capacitor leakage
oRecent flip chip underfill problems
oCoin cell battery contact failure
oHeat sink clogging failure
oDDR2 Memory modules
oImAg corrosion
oAll changes need to be evaluated carefully (testing to failure recommended).
27
28. 28
On-Going Reliability Testing
oQualification shows that a limited number of early manufactured products (maybe even from a pilot line) are reliable.
oIt’s often not possible to create every permutation of component suppliers in the qual builds.
oHow do you know the product will remain reliable as you go to high volume and new component suppliers are introduced?
oThere is no perfect answer but an ORT program can help.
28
29. 29
Case Study: Solar Micro-Inverter Reliability
oThe electronic components used in a micro-inverter are commercial off-the-shelf (COTS)
oParts designed for consumer electronics but need to survive 25 years in solar installations
oOutdoor/Partially Protected & Temp Not Controlled
oLack of industry standards for testing
30. 30
What can be done?
oHow can a micro-inverter supplier design the product to meet the requirements AND convince the customer of this?
oOne new method: model the reliability of an electronic assembly in a variety of conditions based on the design (before building anything).
oDesign for Reliability (DfR) concepts and Physics of Failure (PoF) are used.
31. 31
Are there Methods to Model these Failure Mechanisms?
oYes!
oAlgorithms exist to estimate the failure rate from solder joint fatigue for different types of components.
oIPC TR-579 models PTH reliability
oRisk for CAF can be determined
oFinite Element Analysis can be used for Shock & Vibration risk.
oMTBF calculations can be performed to estimate component failure rates.
32. 32
Micro-Inverter Environment
oExtreme hot and cold locations (AZ to AK)
oPossible exposure to moisture/humidity
oLarge diurnal thermal cycle events (daily)
oLargest temp swings occur in desert locations where it can reach 64C in the direct sun down to 23C at night (Δ41C)
33. 33
Potential Inverter Failure Mechanisms
oSolder joint fatigue failure
oPlated through hole fatigue failure
oConductive anodic filament formation (CAF)
oShock or Vibration (during shipping)
oComponent wear out
37. 37
Additional Uses for Modeling
oUse Sherlock to determine thermal cycle test requirements.
oUse to modify mount point locations
oUse to determine ESS conditions
oComponent Replacement
oDetermine impact of changing to Pb-free solder
oDetermine expected warranty costs
38. 38
38
Summary
oProduct test plans are critical to the success of a new product or technology
oStressful enough to identify defects
oShow correlation to a realistic environment
oPoF Knowledge can be used to develop test plans and profiles that can be correlated to the field.
oChange control processes and testing should not be overlooked (reliability engineer needs to stay involved in sustaining).
oOn-going reliability testing can be a useful (but admittedly imperfect) tool.
oPoF Modeling is an excellent tool to help tailor & optimize physical testing plans