1. Juan Caballero
3577 E. Sierra Madre AVE
Gilbert, AZ 85296
(480) 544-4553 Mitzhel1@hotmail.com
SUMMARY
Highly qualified Sr. Product Engineering Manager offering extensive semiconductor experience within
wireless communications and discrete components for Medical industry. Results-focused and
effective leader with proven ability to qualify, launch and enhance the manufacturability of wireless
devices and discrete components used in implantable Medical devices. Track record of proactively
identifying and resolving problems – reversing negative yield trends, maximizing productivity,
establishing procedural improvements and delivering cost reduction, yield improvement and cost
savings.
KEY QUALIFICATIONS AND ACCOMPLISHMENTS
Product launch definition and execution Technical team leadership and collaboration
Cost center management Customer relations and support
Manufacturability improvements Productivity improvements
Gross margin enhancement Staffing, training and retention of talent
DFSS (Design For Six Sigma) Project Management
Inventory Control Strategic Planning
Quality Assurance and Product Reliability Cost Analysis
Technically experienced manufacturing professional. Have extensive experience leading technical
teams and problem solving using Six Sigma Methodologies. Have direct experience leading the
Engineering and Semiconductor manufacturing organizations. Currently responsible for new
component qualification (Component Engineering), sustaining engineering of released components
(Supplier Continuity), Supplier Development, and Supplier Statistical Process Control.
Manufacturing / Assembly Experience
 Project Management experience in scheduling assembly builds, production testing,
qualification and characterization needs to meet total program schedules.
 Thorough knowledge of all back-end manufacturing processes for PA modules.
 Met aggressive sampling schedules by directly supervising engineering builds in global
contract manufacturing locations and arranging necessary material through supply chain.
Product Improvements
 Spearheaded burn-in elimination of Zener and Schottky diodes used in Medical
implantable devices resulting in over $2.5M in savings. All new Zener and Schottky diodes
are now qualified without burn-in resulting in cost avoidance of ~ $500K/year.
 Spearheaded manufacturing improvements in yield methodologies that resulted in 10%
increase in final test yields.
 Management leadership experience in analyzing areas for manufacturing optimization.
 Significantly increased end-to-end yield over the life of the power amplifiers consumer
products through wafer level and final test correlation.
 Reduced ATE test time by 20 – 30% through test program optimizations resulting in ~ $3M
is savings throughout the life cycle of product.

2. JUAN CABALLERO PAGE 2
PROFESSIONAL EMPLOYMENT
Medtronic, Tempe, Arizona 2009 – Present
Principal Product Engineer, Component Engineering
Responsible for new discrete component development and qualification for Medical implantable
devices.
 Released assigned components (Diodes, MOSFETS, Thyristors, IGBTs, SAW resonators,
Varactors and RF transistors) into production; consistently achieved 100% compliance with
budgets and timelines.
 Drove all corrective actions to guarantee 100% component reliability. Collaborated with reliability
and failure analysis labs to ensure components met customer data sheets and reliability needs.
 Responsible for burn-in elimination of legacy Zener and Schottky diodes resulting in over $2.5M in
savings.
 Project manager and component engineer responsible for component second source project
projecting ~$1M in cost savings per year.
FREESCALE/MOTOROLA, Tempe, Arizona 1994 – 2009
Senior Product Engineer, RF Division 2007 - 2009
Managed New Product Introduction (NPI) for the wireless infrastructure. Used LDMOS devices for
GSM/W-CDMA/WiMax base station applications.
 Released product into general market; consistently achieving better than 95% compliance with
budgets and timelines
 Drove all corrective actions to guarantee 100% product reliability. Collaborated with reliability and
failure analysis labs to ensure products met customer data sheets and reliability needs.
Power Amplifier/Modules Senior Product Engineering Manager 2004 - 2007
Managed operations department of 16 engineers in U.S and France that worked on Quad-band GSM,
GPRS EDGE Power Amplifiers Front End Module.
 Performed product qualification, standard cost modeling and performance, and external
manufacturing. Reported directly to Vice President and GM of Radio Products Division.
 Implemented a gross margin improvement and tracking process that established and maintained
margin targets for high running Front End Modules in the presence of ASP erosion through
systematic cost reduction activities associated with test time reduction and yield improvements.
Lead RF Product Engineer, Radio Products Division 2002 - 2004
Characterized new devices and generated Advanced Data Sheets (PHEMT, EMODE, LDMOS, and
BiCMOS) for IPAs.
 Increased profit margins by 15 – 20%.
 Managed new product introduction and cost reduction at assembly, wafer fab and yield
enhancement. Examples: Athena1 EU/US and Athena 1A EU/US (Dual band module GSM
850/PCS with integrated couplers, switch, power detector and harmonic filters).
 Sustained legacy products.
 Mentored several Product Engineers and technicians, recognized for strong leadership skills.
RF Product Engineering Manager, Wireless Tx Solutions Operation (WTO) 2000 - 2002
Characterized new devices and generated Advanced Data Sheets (PHEMT, EMODE, LDMOS and
BiCMOS) for IPAs.
 Increased profit margins for new product introduction, reduced costs at assembly, wafer fab and
yield enhancement.
 Managed new product introduction/sustaining of Integrated Power Amplifiers (GaAs /Si based).
 Managed 6 Product Engineers and 2 technicians.

3. JUAN CABALLERO PAGE 3
Senior Device Engineer /Device Section Manager 1997 - 2000
Radio Frequency Division
Managed multiple projects and programs.
 Project manager on a cross functional team that developed and implemented a back grind
process for HV-RFLDMOS technologies.
 Project leader for the qualification/implementation of TiNiVAu back metal process for
RF LDMOS devices and RF1 capacitors.
 Implemented PROMIS tracking system on RFLDMOS devices.
 Product disposition of RFLDMOS, TMOS & Bipolar products.
 Managed 6 Device Engineers and 2 technicians.
Device Engineer MOS2 Die Production Center 1994 - 1997
Microcontroller Technologies Group
Lead Engineer on a cross functional team that increased yields and reduced wafer scrapped at unit
probe for FACT (LICD) product lines (from 85% to 95% yield and scrap from 17% to less than 2%).
 Project leader for the conversion/optimization of track develop process for all Perkin Elmer
(projection scan) parts.
EDUCATION
BACHELOR OF SCIENCE IN ELECTRICAL ENGINEERING
College of Engineering and Mines, The University of Arizona, Tucson Arizona.