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small Mosfet BGA Under fill
CTE induced stress
FEA Structural Evaluation
Don Blanchet
3B Associates
3 Jan 2005
• The FET package is a 3.1 x 3.1 mm Ball Grid Array with 36 solder
balls.
• The assumed process temperature excursion is +180C , through
the glass transition temperature of the under fill material.
• The solder is lead free , 96.5 Sn – 3.0 Ag – 0.5 Cu.
• The substrate is epoxy glass MLB construction.
• The under fill material is flexible and elastomeric for easy repair.
• The objective is to demonstrate the negative effect high
expansion under fills can have on the stress and fatigue failure of
small package BGA corner balls.
Assumptions & Objectives
BGA Package
Solidworks Model
pwb
BGA
Under fill
Shown
transparent
CTE dimensional change vs. temperature “X&Y”
17.0 ppm/C
10.0 ppm/C
CTE dimensional change vs. temperature “Z”
100.0 ppm/C
35.0 ppm/C
24.0 ppm/C
Glass transition 120 C
FEA mesh – for thermal expansion study
400,000 elements 550,000 nodes 1,200,000 degrees of freedom
Shown with
Under fill
Removed
FEA mesh detail views – for thermal expansion study
400,000 elements 550,000 nodes 1,200,000 degrees of freedom
Results – solder ball stress contours from FEA
Results – BGA solder deformation with under fill
(under fill not shown)
Corner balls are under the highest stress
primarily in tension
Results – under fill constrained acting like a fluid
Package is slightly concave up
Under fill bulges at edges , it is almost incompressible like a hydraulic fluid.
• The FET BGA’s with under fill are exposed to significantly more
solder ball stress than a design without under fill.
• The peak strain in the corner balls with under fill is approximately
10X the strain for the assembly without under fill.
• The trapped under fill acts much like a hydraulic fluid and exerts
high pressures as it expands.
• Variables:
– The primary variable is the mismatch between the under fill and
solder CTE’s in the z-axis.
• The under fill glass transition is one underlying cause
• The under fill incompressibility is another significant factor
– A secondary variable is the TCE mismatch between the BGA package
and the multilayer PWB.
Conclusions

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Bga underfill cte mismatch

  • 1. small Mosfet BGA Under fill CTE induced stress FEA Structural Evaluation Don Blanchet 3B Associates 3 Jan 2005
  • 2. • The FET package is a 3.1 x 3.1 mm Ball Grid Array with 36 solder balls. • The assumed process temperature excursion is +180C , through the glass transition temperature of the under fill material. • The solder is lead free , 96.5 Sn – 3.0 Ag – 0.5 Cu. • The substrate is epoxy glass MLB construction. • The under fill material is flexible and elastomeric for easy repair. • The objective is to demonstrate the negative effect high expansion under fills can have on the stress and fatigue failure of small package BGA corner balls. Assumptions & Objectives
  • 5. CTE dimensional change vs. temperature “X&Y” 17.0 ppm/C 10.0 ppm/C
  • 6. CTE dimensional change vs. temperature “Z” 100.0 ppm/C 35.0 ppm/C 24.0 ppm/C Glass transition 120 C
  • 7. FEA mesh – for thermal expansion study 400,000 elements 550,000 nodes 1,200,000 degrees of freedom Shown with Under fill Removed
  • 8. FEA mesh detail views – for thermal expansion study 400,000 elements 550,000 nodes 1,200,000 degrees of freedom
  • 9. Results – solder ball stress contours from FEA
  • 10. Results – BGA solder deformation with under fill (under fill not shown) Corner balls are under the highest stress primarily in tension
  • 11. Results – under fill constrained acting like a fluid Package is slightly concave up Under fill bulges at edges , it is almost incompressible like a hydraulic fluid.
  • 12. • The FET BGA’s with under fill are exposed to significantly more solder ball stress than a design without under fill. • The peak strain in the corner balls with under fill is approximately 10X the strain for the assembly without under fill. • The trapped under fill acts much like a hydraulic fluid and exerts high pressures as it expands. • Variables: – The primary variable is the mismatch between the under fill and solder CTE’s in the z-axis. • The under fill glass transition is one underlying cause • The under fill incompressibility is another significant factor – A secondary variable is the TCE mismatch between the BGA package and the multilayer PWB. Conclusions